ES384535A1 - Metodo para unir elementos de circuito a un sustrato y pa- ra fabricar un condensador de pelicula delgada. - Google Patents

Metodo para unir elementos de circuito a un sustrato y pa- ra fabricar un condensador de pelicula delgada.

Info

Publication number
ES384535A1
ES384535A1 ES384535A ES384535A ES384535A1 ES 384535 A1 ES384535 A1 ES 384535A1 ES 384535 A ES384535 A ES 384535A ES 384535 A ES384535 A ES 384535A ES 384535 A1 ES384535 A1 ES 384535A1
Authority
ES
Spain
Prior art keywords
substrate
thin film
circuit elements
manufacture
film condenser
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
ES384535A
Other languages
English (en)
Spanish (es)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AT&T Corp
Original Assignee
Western Electric Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Western Electric Co Inc filed Critical Western Electric Co Inc
Publication of ES384535A1 publication Critical patent/ES384535A1/es
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/222—Completing of printed circuits by adding non-printed jumper connections
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/142—Metallic substrates having insulating layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5381—Crossover interconnections, e.g. bridge stepovers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N97/00—Electric solid-state thin-film or thick-film devices, not otherwise provided for
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Combinations Of Printed Boards (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structure Of Printed Boards (AREA)
  • Multi-Conductor Connections (AREA)
ES384535A 1969-10-08 1970-10-03 Metodo para unir elementos de circuito a un sustrato y pa- ra fabricar un condensador de pelicula delgada. Expired ES384535A1 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US86485669A 1969-10-08 1969-10-08

Publications (1)

Publication Number Publication Date
ES384535A1 true ES384535A1 (es) 1974-06-01

Family

ID=25344227

Family Applications (1)

Application Number Title Priority Date Filing Date
ES384535A Expired ES384535A1 (es) 1969-10-08 1970-10-03 Metodo para unir elementos de circuito a un sustrato y pa- ra fabricar un condensador de pelicula delgada.

Country Status (10)

Country Link
JP (1) JPS509342B1 (enExample)
BE (1) BE757162A (enExample)
CH (1) CH528148A (enExample)
DE (1) DE2049163C3 (enExample)
ES (1) ES384535A1 (enExample)
FR (1) FR2065090A5 (enExample)
GB (1) GB1315510A (enExample)
IE (1) IE34642B1 (enExample)
NL (1) NL145718B (enExample)
SE (1) SE365068B (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5377737U (enExample) * 1976-11-26 1978-06-28
DE2823881C3 (de) * 1978-05-31 1982-03-18 Siemens AG, 1000 Berlin und 8000 München Verfahren zur Herstellung von elektrischen Dünnschichtschaltungen für die Herstellung integrierter Leiterbahnüberkreuzungen
DE3064555D1 (en) * 1979-02-26 1983-09-22 Nat Res Dev Method of incorporating a distributed microwave circuit element in a microwave integrated circuit
US5699224A (en) * 1995-10-25 1997-12-16 Rohm Co., Ltd. Thick-film capacitor and chip-type composite electronic component utilizing the same
CN107086095B (zh) * 2017-06-22 2023-05-16 中国船舶重工集团公司第七0三研究所 一种电阻负载导流罩

Also Published As

Publication number Publication date
GB1315510A (en) 1973-05-02
CH528148A (de) 1972-09-15
NL145718B (nl) 1975-04-15
IE34642L (en) 1971-04-08
SE365068B (enExample) 1974-03-11
JPS509342B1 (enExample) 1975-04-11
BE757162A (fr) 1971-03-16
DE2049163C3 (de) 1978-07-06
DE2049163A1 (de) 1971-04-22
FR2065090A5 (enExample) 1971-07-23
IE34642B1 (en) 1975-07-09
NL7014581A (enExample) 1971-04-14
DE2049163B2 (de) 1977-11-10

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