ES339806A1 - Metodo de fabricacion de un dispositivo semiconductor. - Google Patents
Metodo de fabricacion de un dispositivo semiconductor.Info
- Publication number
- ES339806A1 ES339806A1 ES339806A ES339806A ES339806A1 ES 339806 A1 ES339806 A1 ES 339806A1 ES 339806 A ES339806 A ES 339806A ES 339806 A ES339806 A ES 339806A ES 339806 A1 ES339806 A1 ES 339806A1
- Authority
- ES
- Spain
- Prior art keywords
- leads
- mould
- bar
- comb
- bars
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000004519 manufacturing process Methods 0.000 title abstract 2
- 239000004065 semiconductor Substances 0.000 title abstract 2
- 238000000034 method Methods 0.000 title 1
- 239000004020 conductor Substances 0.000 abstract 1
- 239000008393 encapsulating agent Substances 0.000 abstract 1
- 239000011810 insulating material Substances 0.000 abstract 1
- 239000007788 liquid Substances 0.000 abstract 1
- 239000002184 metal Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
- B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
- B29C70/68—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts by incorporating or moulding on preformed parts, e.g. inserts or layers, e.g. foam blocks
- B29C70/72—Encapsulating inserts having non-encapsulated projections, e.g. extremities or terminal portions of electrical components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
- H01L23/49562—Geometry of the lead-frame for devices being provided for in H01L29/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
- B29L2031/3406—Components, e.g. resistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Composite Materials (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
NL6605674A NL6605674A (no) | 1966-04-28 | 1966-04-28 |
Publications (1)
Publication Number | Publication Date |
---|---|
ES339806A1 true ES339806A1 (es) | 1968-05-16 |
Family
ID=19796427
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ES339806A Expired ES339806A1 (es) | 1966-04-28 | 1967-04-26 | Metodo de fabricacion de un dispositivo semiconductor. |
Country Status (11)
Country | Link |
---|---|
AT (1) | AT268381B (no) |
BE (1) | BE697849A (no) |
CH (1) | CH470759A (no) |
DE (1) | DE1614242A1 (no) |
DK (1) | DK116949B (no) |
ES (1) | ES339806A1 (no) |
FR (1) | FR1550982A (no) |
GB (1) | GB1125428A (no) |
NL (1) | NL6605674A (no) |
NO (1) | NO120123B (no) |
SE (1) | SE309455B (no) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3210623A1 (de) * | 1982-03-23 | 1983-10-06 | Siemens Ag | Verfahren zum verhindern der bildung von graten bei der umhuellung von bauelementen |
DE3320700A1 (de) * | 1983-06-08 | 1984-12-13 | Siemens AG, 1000 Berlin und 8000 München | Verfahren zum kunststoffumhuellen von elektrischen bauelementen |
JPS60176259A (ja) * | 1984-02-22 | 1985-09-10 | Toshiba Corp | 樹脂封止形半導体装置の製造方法 |
DE3406538A1 (de) * | 1984-02-23 | 1985-08-29 | Bbc Brown Boveri & Cie | Leistungshalbleitermodul und verfahren zur herstellung |
FR2638594B1 (fr) * | 1988-11-03 | 1990-12-21 | Cartier Systemes G | Procede de realisation d'un circuit electrique de puissance monocouche ou multicouches, et circuit obtenu par ce procede |
-
1966
- 1966-04-28 NL NL6605674A patent/NL6605674A/xx unknown
-
1967
- 1967-03-28 DK DK159667AA patent/DK116949B/da unknown
- 1967-04-25 GB GB19035/67D patent/GB1125428A/en not_active Expired
- 1967-04-25 SE SE5845/67A patent/SE309455B/xx unknown
- 1967-04-25 NO NO167881A patent/NO120123B/no unknown
- 1967-04-25 AT AT390767A patent/AT268381B/de active
- 1967-04-25 CH CH585767A patent/CH470759A/de not_active IP Right Cessation
- 1967-04-25 DE DE19671614242 patent/DE1614242A1/de active Pending
- 1967-04-26 ES ES339806A patent/ES339806A1/es not_active Expired
- 1967-04-27 FR FR1550982D patent/FR1550982A/fr not_active Expired
- 1967-04-28 BE BE697849D patent/BE697849A/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
SE309455B (no) | 1969-03-24 |
AT268381B (de) | 1969-02-10 |
NO120123B (no) | 1970-08-31 |
DK116949B (da) | 1970-03-02 |
GB1125428A (en) | 1968-08-28 |
BE697849A (no) | 1967-10-30 |
CH470759A (de) | 1969-03-31 |
FR1550982A (no) | 1968-12-27 |
NL6605674A (no) | 1967-10-30 |
DE1614242A1 (de) | 1970-05-27 |
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