ES324264A1 - Procedimiento para la fabricacion en serie de elementos de construccion electricos, especialmente de microelementos de construccion semiconductores en cajas de material plastico. - Google Patents

Procedimiento para la fabricacion en serie de elementos de construccion electricos, especialmente de microelementos de construccion semiconductores en cajas de material plastico.

Info

Publication number
ES324264A1
ES324264A1 ES0324264A ES324264A ES324264A1 ES 324264 A1 ES324264 A1 ES 324264A1 ES 0324264 A ES0324264 A ES 0324264A ES 324264 A ES324264 A ES 324264A ES 324264 A1 ES324264 A1 ES 324264A1
Authority
ES
Spain
Prior art keywords
electrodes
construction
carrier body
manufactured
elements
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
ES0324264A
Other languages
English (en)
Spanish (es)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens and Halske AG
Siemens AG
Original Assignee
Siemens and Halske AG
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens and Halske AG, Siemens AG filed Critical Siemens and Halske AG
Publication of ES324264A1 publication Critical patent/ES324264A1/es
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67126Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56Encapsulations, e.g. encapsulation layers, coatings
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
ES0324264A 1965-03-18 1966-03-16 Procedimiento para la fabricacion en serie de elementos de construccion electricos, especialmente de microelementos de construccion semiconductores en cajas de material plastico. Expired ES324264A1 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DES0096025 1965-03-18

Publications (1)

Publication Number Publication Date
ES324264A1 true ES324264A1 (es) 1967-02-01

Family

ID=7519772

Family Applications (1)

Application Number Title Priority Date Filing Date
ES0324264A Expired ES324264A1 (es) 1965-03-18 1966-03-16 Procedimiento para la fabricacion en serie de elementos de construccion electricos, especialmente de microelementos de construccion semiconductores en cajas de material plastico.

Country Status (7)

Country Link
BE (1) BE678041A (xx)
DE (1) DE1514418A1 (xx)
ES (1) ES324264A1 (xx)
FR (1) FR1473478A (xx)
GB (1) GB1115105A (xx)
NL (1) NL6601942A (xx)
SE (1) SE318950B (xx)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2535526B1 (fr) * 1982-10-29 1986-03-28 Radiotechnique Compelec Procede d'encapsulation de composants electroniques par extrusion de matiere plastique et applications a la fabrication de voyants lumineux et a l'encapsulation de circuits electroniques
FR2549291B2 (fr) * 1982-10-29 1986-05-09 Radiotechnique Compelec Procede d'encapsulation de composants electroniques par extrusion de matiere plastique et applications a la fabrication de voyants lumineux et a l'encapsulation de circuits electroniques
US10542978B2 (en) * 2011-05-27 2020-01-28 Covidien Lp Method of internally potting or sealing a handheld medical device

Also Published As

Publication number Publication date
FR1473478A (fr) 1967-03-17
BE678041A (xx) 1966-09-19
NL6601942A (xx) 1966-09-19
DE1514418A1 (de) 1969-06-26
GB1115105A (en) 1968-05-29
SE318950B (xx) 1969-12-22

Similar Documents

Publication Publication Date Title
BR7602045A (pt) Elemento construtivo semicondutor
ES417197A1 (es) Perfeccionamientos en la fabricacion de capsulas para pla- cas de circuitos integrados, particularmente del denominado tipo lsi.
JPS5282183A (en) Connecting wires for semiconductor devices
NL174684C (nl) Werkwijze voor het vervaardigen van een halfgeleiderinrichting omvattende het op een deel van een lichaam van halfgeleidermateriaal aanbrengen in een patroon van een laag van een metaal dat is gedoteerd met tenminste een de elektrische geleidingseigenschappen van het halfgeleidermateriaal wijzigende activator, het met handhaving van de maskerlaag aan een warmtebehandeling blootstellen van het halfgeleiderlichaam en de metaallaag, teneinde activatoratomen in het aan de metaallaag grenzende deel van het halfgeleiderlichaam te diffunderen en het aan de metaallaag bevestigen van een uitwendige aansluitgeleider.
AT314662B (de) Stromversorgungsanordnung für mindestens zwei Gleichstromverbraucher
ES326459A1 (es) Un metodo de producir una region de caracteristicas electricas alteradas en una primera oblea semiconductora.
ES324264A1 (es) Procedimiento para la fabricacion en serie de elementos de construccion electricos, especialmente de microelementos de construccion semiconductores en cajas de material plastico.
ES406434A1 (es) Un dispositivo semiconductor.
SE7603784L (sv) Anordning for kontaktering av elektriska komponenter for ingjutning i arbetsstycken
CH541247A (de) Elektrische Steuerschaltung für induktive Verbraucher
JPS5651851A (en) Semiconductor device
ES327183A1 (es) Un metodo de fabricar un canal conductor en un cuerpo semiconductor cristalino.
SE442750B (sv) Kontaktmaterial i pulverform for framstellning av elektriska kontakter
NL7606781A (nl) Halfgeleiderinrichting.
ES437033A1 (es) Perfeccionamientos introducidos en un dispositivo semicon- ductor limitado por carga espacial.
JPS5751928B2 (xx)
ES264695A1 (es) Procedimiento de fabricaciën de cables planos electricos
HK7679A (en) Semiconductor chip for high temperature pressure contact package
SE7604827L (sv) Forfarande for framstellning av en halvledare jemte halvledare framstelld enligt detta forfarande
AT312744B (de) Transistor-Zweipunkt-Steuerschaltung für einen induktiven Verbraucher
JPS5269537A (en) Semiconductor memory
JPS5311816B2 (xx)
JPS5240972A (en) Packaging construction of semiconductor device
JPS5295176A (en) Manufacture of semiconductor apparatus
JPS5283166A (en) Semiconductor device and its production