ES2934860T3 - Sistema de refrigeración sin ventilador - Google Patents

Sistema de refrigeración sin ventilador Download PDF

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Publication number
ES2934860T3
ES2934860T3 ES18810888T ES18810888T ES2934860T3 ES 2934860 T3 ES2934860 T3 ES 2934860T3 ES 18810888 T ES18810888 T ES 18810888T ES 18810888 T ES18810888 T ES 18810888T ES 2934860 T3 ES2934860 T3 ES 2934860T3
Authority
ES
Spain
Prior art keywords
heat
subrack
module
cooling system
transport body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
ES18810888T
Other languages
English (en)
Spanish (es)
Inventor
Frank Bienek
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens Mobility GmbH
Original Assignee
Siemens Mobility GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Mobility GmbH filed Critical Siemens Mobility GmbH
Application granted granted Critical
Publication of ES2934860T3 publication Critical patent/ES2934860T3/es
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
    • H05K7/20663—Liquid coolant with phase change, e.g. heat pipes
    • H05K7/20681—Liquid coolant with phase change, e.g. heat pipes within cabinets for removing heat from sub-racks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
    • H05K7/20545—Natural convection of gaseous coolant; Heat transfer by conduction from electronic boards
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60R—VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR
    • B60R16/00—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for
    • B60R16/02—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for electric constitutive elements
    • B60R16/023—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for electric constitutive elements for transmission of signals between vehicle parts or subsystems
    • B60R16/0231—Circuits relating to the driving or the functioning of the vehicle
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B61—RAILWAYS
    • B61D—BODY DETAILS OR KINDS OF RAILWAY VEHICLES
    • B61D27/00—Heating, cooling, ventilating, or air-conditioning
    • B61D27/0072—Means for cooling only

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Theoretical Computer Science (AREA)
  • Aviation & Aerospace Engineering (AREA)
  • Human Computer Interaction (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Mechanical Engineering (AREA)
  • Automation & Control Theory (AREA)
ES18810888T 2017-12-07 2018-11-08 Sistema de refrigeración sin ventilador Active ES2934860T3 (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102017222148.8A DE102017222148A1 (de) 2017-12-07 2017-12-07 Lüfterloses Kühlsystem
PCT/EP2018/080551 WO2019110233A1 (de) 2017-12-07 2018-11-08 Lüfterloses kühlsystem

Publications (1)

Publication Number Publication Date
ES2934860T3 true ES2934860T3 (es) 2023-02-27

Family

ID=64500324

Family Applications (1)

Application Number Title Priority Date Filing Date
ES18810888T Active ES2934860T3 (es) 2017-12-07 2018-11-08 Sistema de refrigeración sin ventilador

Country Status (7)

Country Link
US (1) US11678463B2 (de)
EP (1) EP3698611B1 (de)
CN (1) CN111434199B (de)
AU (1) AU2018381805B2 (de)
DE (1) DE102017222148A1 (de)
ES (1) ES2934860T3 (de)
WO (1) WO2019110233A1 (de)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102022202015A1 (de) * 2022-02-28 2023-08-31 Robert Bosch Gesellschaft mit beschränkter Haftung Vorrichtung mit austauschbaren Elektronikbaugruppen eines Kraftfahrzeugs
US11732976B1 (en) * 2022-03-02 2023-08-22 Aic Inc. Rapid heat dissipation device

Family Cites Families (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59189519A (ja) 1983-04-12 1984-10-27 富士電機株式会社 しや断器操作用蓄勢器の駆動装置
US5243493A (en) 1992-04-29 1993-09-07 Industrial Technology Research Institute Fanless convection cooling design for personal computers
CN2263403Y (zh) * 1996-05-02 1997-09-24 叶元璋 无风扇式半导体元件散热装置
US6055157A (en) * 1998-04-06 2000-04-25 Cray Research, Inc. Large area, multi-device heat pipe for stacked MCM-based systems
TW446143U (en) * 1999-08-16 2001-07-11 Compal Electronics Inc Rotational heat dissipation module
US6804117B2 (en) * 2002-08-14 2004-10-12 Thermal Corp. Thermal bus for electronics systems
DE10309130A1 (de) * 2003-02-28 2004-09-09 Richard Wöhr GmbH Lüfterloses Kühlsystem mit Wärmerohr und mit isolierender Mehrschichtenkühlwand
CN2731922Y (zh) * 2004-08-11 2005-10-05 威盛电子股份有限公司 具有散热模块的无风扇电子系统
US7345877B2 (en) * 2005-01-06 2008-03-18 The Boeing Company Cooling apparatus, system, and associated method
JP2006245356A (ja) * 2005-03-04 2006-09-14 Hitachi Ltd 電子デバイスの冷却装置
DE102005012350B4 (de) * 2005-03-07 2008-04-03 Asetek A/S Kühlsystem für elektronische Geräte, insbesondere Computer
CN1987728A (zh) * 2005-12-22 2007-06-27 佛山市顺德区顺达电脑厂有限公司 具拆卸装置的散热模块
CN101207110B (zh) * 2006-12-22 2010-05-19 富准精密工业(深圳)有限公司 发光二极管模组
CN201004751Y (zh) * 2007-02-12 2008-01-09 讯凯国际股份有限公司 易拆装的散热装置
US20080237845A1 (en) * 2007-03-28 2008-10-02 Jesse Jaejin Kim Systems and methods for removing heat from flip-chip die
CN101308318A (zh) * 2007-05-17 2008-11-19 中强光电股份有限公司 光阀装置
CN101600325B (zh) * 2009-07-02 2011-12-21 北京东土科技股份有限公司 一种密闭壳体电子设备的组合散热装置
US8223497B2 (en) * 2009-09-10 2012-07-17 Honeywell International Inc. Thermal bridge extensions for a module-chassis interface
CN102065666A (zh) * 2009-11-12 2011-05-18 富准精密工业(深圳)有限公司 散热装置
JP4818429B2 (ja) * 2009-12-28 2011-11-16 株式会社東芝 電子機器
CN102215658B (zh) * 2010-04-08 2015-06-17 富瑞精密组件（昆山）有限公司 散热装置组合及使用该散热装置组合的电子装置
CN103025119A (zh) * 2011-09-22 2013-04-03 富瑞精密组件（昆山）有限公司 散热装置
CN103167779A (zh) * 2011-12-16 2013-06-19 鸿富锦精密工业（深圳）有限公司 电子设备及其散热装置
CN102709262B (zh) * 2012-06-06 2015-09-30 华为技术有限公司 多芯片共用的散热器和设置有该散热器的电路板
JP5527443B1 (ja) 2013-01-22 2014-06-18 株式会社安川電機 発熱体ユニット、制御盤およびロボットシステム
CN203645899U (zh) 2013-11-15 2014-06-11 刘现梅 一种室内无极灯镇流器散热外壳
US9333599B2 (en) * 2013-12-20 2016-05-10 General Electric Company Electronics chassis and method of fabricating the same
JP2015156411A (ja) * 2014-02-20 2015-08-27 株式会社日立製作所 電力変換装置およびそれを搭載した鉄道車両
KR102562149B1 (ko) 2015-07-14 2023-08-01 엘지전자 주식회사 냉장고용 도어 및 냉장고
CN205430864U (zh) 2016-02-03 2016-08-03 大通电子股份有限公司 影音无线传输装置的散热架构
US10136556B2 (en) * 2016-02-24 2018-11-20 Thermal Corp. Electronics rack with selective engagement of heat sink
CN205983369U (zh) * 2016-06-28 2017-02-22 王牧 计算机散热装置
CN206118265U (zh) * 2016-09-05 2017-04-19 珠海格力电器股份有限公司 一种电子设备散热结构
CN206272641U (zh) * 2016-11-17 2017-06-20 国网江苏省电力公司南通供电公司 一种路由器线路板散热结构
CN206350287U (zh) * 2016-12-29 2017-07-21 东莞立华海威网联科技有限公司 高性能无风扇嵌入式通讯管理机
CN206649446U (zh) 2017-03-23 2017-11-17 广东新领域云存储系统有限公司 基于光存储容灾备份的一体散热机箱
CN107371351A (zh) * 2017-08-16 2017-11-21 合肥宗平计算机科技有限公司 显卡背板及其显卡

Also Published As

Publication number Publication date
CN111434199A (zh) 2020-07-17
DE102017222148A1 (de) 2019-06-13
EP3698611B1 (de) 2022-10-05
AU2018381805A1 (en) 2020-05-28
EP3698611A1 (de) 2020-08-26
US11678463B2 (en) 2023-06-13
CN111434199B (zh) 2023-02-03
US20210168971A1 (en) 2021-06-03
WO2019110233A1 (de) 2019-06-13
AU2018381805B2 (en) 2021-03-11

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