ES278462A1 - Method for locally assembling metallic parts (Machine-translation by Google Translate, not legally binding) - Google Patents
Method for locally assembling metallic parts (Machine-translation by Google Translate, not legally binding)Info
- Publication number
- ES278462A1 ES278462A1 ES278462A ES278462A ES278462A1 ES 278462 A1 ES278462 A1 ES 278462A1 ES 278462 A ES278462 A ES 278462A ES 278462 A ES278462 A ES 278462A ES 278462 A1 ES278462 A1 ES 278462A1
- Authority
- ES
- Spain
- Prior art keywords
- nickel
- parts
- translation
- machine
- legally binding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000000034 method Methods 0.000 title abstract 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 abstract 10
- 229910052759 nickel Inorganic materials 0.000 abstract 5
- VEQPNABPJHWNSG-UHFFFAOYSA-N Nickel(2+) Chemical compound [Ni+2] VEQPNABPJHWNSG-UHFFFAOYSA-N 0.000 abstract 2
- 229910001453 nickel ion Inorganic materials 0.000 abstract 2
- 239000000126 substance Substances 0.000 abstract 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 abstract 1
- 239000007864 aqueous solution Substances 0.000 abstract 1
- -1 hypophosphite ions Chemical class 0.000 abstract 1
- 239000002184 metal Substances 0.000 abstract 1
- 229910052751 metal Inorganic materials 0.000 abstract 1
- ACVYVLVWPXVTIT-UHFFFAOYSA-M phosphinate Chemical compound [O-][PH2]=O ACVYVLVWPXVTIT-UHFFFAOYSA-M 0.000 abstract 1
- 229910052698 phosphorus Inorganic materials 0.000 abstract 1
- 239000011574 phosphorus Substances 0.000 abstract 1
- 238000007747 plating Methods 0.000 abstract 1
- 239000000243 solution Substances 0.000 abstract 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
- B23K35/3033—Ni as the principal constituent
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
- C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
- C23C18/36—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents using hypophosphites
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemically Coating (AREA)
Abstract
Method for locally joining metal parts in which the parts are first coated with a layer of nickel containing phosphorus with the aid of a chemical nickel bath comprising an aqueous solution containing nickel ions and hypophosphite ions characterized by the fact that the parts are covered with a layer of nickel with the aid of a chemical nickel plating bath in which the ratio expressed in mole% between hypophosphite and nickel is at least 3 and having a pH of 4 to 7, preferably 4 to 5. , the parts being maintained in contact with the bath until the bath substantially no longer contains nickel ions in the solution, after which the parts are locally bonded together by local heat application. (Machine-translation by Google Translate, not legally binding)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| NL266233 | 1961-06-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ES278462A1 true ES278462A1 (en) | 1962-08-16 |
Family
ID=19753105
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| ES278462A Expired ES278462A1 (en) | 1961-06-21 | 1962-06-19 | Method for locally assembling metallic parts (Machine-translation by Google Translate, not legally binding) |
Country Status (4)
| Country | Link |
|---|---|
| CH (1) | CH429359A (en) |
| DK (1) | DK103220C (en) |
| ES (1) | ES278462A1 (en) |
| GB (1) | GB1014742A (en) |
-
1962
- 1962-06-18 DK DK270662A patent/DK103220C/en active
- 1962-06-18 GB GB2337562A patent/GB1014742A/en not_active Expired
- 1962-06-18 CH CH728162A patent/CH429359A/en unknown
- 1962-06-19 ES ES278462A patent/ES278462A1/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| GB1014742A (en) | 1965-12-31 |
| DK103220C (en) | 1965-11-29 |
| CH429359A (en) | 1967-01-31 |
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