ES270123Y - Mejoras en los conjuntos de circuito impreso de insercion en los bloques ensamblados de portatarjetas. - Google Patents
Mejoras en los conjuntos de circuito impreso de insercion en los bloques ensamblados de portatarjetas.Info
- Publication number
- ES270123Y ES270123Y ES1983270123U ES270123U ES270123Y ES 270123 Y ES270123 Y ES 270123Y ES 1983270123 U ES1983270123 U ES 1983270123U ES 270123 U ES270123 U ES 270123U ES 270123 Y ES270123 Y ES 270123Y
- Authority
- ES
- Spain
- Prior art keywords
- card holders
- insertion circuit
- circuit assemblies
- assembled blocks
- printed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0064—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a polymeric substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/144—Stacked arrangements of planar printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0352—Differences between the conductors of different layers of a multilayer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09118—Moulded substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/096—Vertically aligned vias, holes or stacked vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09754—Connector integrally incorporated in the PCB or in housing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10272—Busbars, i.e. thick metal bars mounted on the PCB as high-current conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2036—Permanent spacer or stand-off in a printed circuit or printed circuit assembly
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1305—Moulding and encapsulation
- H05K2203/1327—Moulding over PCB locally or completely
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
- H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US06/344,426 US4439815A (en) | 1982-02-01 | 1982-02-01 | Printed circuit assembly for a card file packaging system |
Publications (2)
Publication Number | Publication Date |
---|---|
ES270123U ES270123U (es) | 1983-07-16 |
ES270123Y true ES270123Y (es) | 1984-02-01 |
Family
ID=23350503
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ES1983270123U Expired ES270123Y (es) | 1982-02-01 | 1983-02-01 | Mejoras en los conjuntos de circuito impreso de insercion en los bloques ensamblados de portatarjetas. |
Country Status (2)
Country | Link |
---|---|
US (1) | US4439815A (es) |
ES (1) | ES270123Y (es) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4567543A (en) * | 1983-02-15 | 1986-01-28 | Motorola, Inc. | Double-sided flexible electronic circuit module |
US4589057A (en) * | 1984-07-23 | 1986-05-13 | Rogers Corporation | Cooling and power and/or ground distribution system for integrated circuits |
IT1184408B (it) * | 1985-04-09 | 1987-10-28 | Telettra Lab Telefon | Processo per la fabbricazione di piastre e circuiti stampati,e prodotti relativi |
US4771366A (en) * | 1987-07-06 | 1988-09-13 | International Business Machines Corporation | Ceramic card assembly having enhanced power distribution and cooling |
US4914259A (en) * | 1987-09-08 | 1990-04-03 | The Furukawa Electric Co., Ltd. | Molded circuit board |
US5136470A (en) * | 1990-06-29 | 1992-08-04 | Loral/Rolm Mil-Spec Computers | Printed circuit board vibration stiffener |
US5228863A (en) * | 1991-07-30 | 1993-07-20 | International Business Machines Corporation | Connection device for use in an electrical circuitry system |
JPH0746618B2 (ja) * | 1991-07-30 | 1995-05-17 | インターナショナル・ビジネス・マシーンズ・コーポレイション | 回路接続装置およびそれを使用する電気回路システム |
US5610801A (en) * | 1995-03-20 | 1997-03-11 | Intel Corporation | Motherboard assembly which has a single socket that can accept a single integrated circuit package or multiple integrated circuit packages |
US5959847A (en) * | 1996-11-20 | 1999-09-28 | Adtran, Inc. | Form factor-configured channel bank card containing form factor non-conformal printed circuit board |
JP6443632B2 (ja) * | 2015-12-16 | 2018-12-26 | 株式会社オートネットワーク技術研究所 | 回路構成体、及び電気接続箱 |
KR102411445B1 (ko) * | 2017-07-20 | 2022-06-22 | 주식회사 아모그린텍 | 파워 릴레이 어셈블리 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3202869A (en) * | 1965-08-24 | Electrical apparatus with insulated heat conducting members | ||
FR1224964A (fr) * | 1959-02-10 | 1960-06-28 | Le Transistor Ind | Perfectionnements aux montages électroniques en vue de leur application aux jouets |
US3165672A (en) * | 1959-06-15 | 1965-01-12 | Burroughs Corp | Printed circuit baseboard |
US3259805A (en) * | 1963-02-06 | 1966-07-05 | Westinghouse Electric Corp | Metallic based printed circuits |
US3289047A (en) * | 1964-10-16 | 1966-11-29 | Sylvania Electric Prod | Housing for a mechanically alterable memory system |
US3368115A (en) * | 1965-10-19 | 1968-02-06 | Amp Inc | Modular housing for integrated circuit structure with improved interconnection means |
GB1106590A (en) * | 1966-11-29 | 1968-03-20 | Amp Inc | Two-way plugboard |
GB1403371A (en) * | 1972-01-12 | 1975-08-28 | Mullard Ltd | Semiconductor device arrangements |
US3852690A (en) * | 1973-01-02 | 1974-12-03 | Gen Electric | Microwave transmission line to ground plane transition |
US4164071A (en) * | 1977-12-27 | 1979-08-14 | Ford Motor Company | Method of forming a circuit board with integral terminals |
DE2848033A1 (de) * | 1978-11-06 | 1980-05-14 | Siemens Ag | Baugruppe zur aufnahme elektronischer geraete |
JPS55155087U (es) * | 1979-04-24 | 1980-11-08 |
-
1982
- 1982-02-01 US US06/344,426 patent/US4439815A/en not_active Expired - Fee Related
-
1983
- 1983-02-01 ES ES1983270123U patent/ES270123Y/es not_active Expired
Also Published As
Publication number | Publication date |
---|---|
US4439815A (en) | 1984-03-27 |
ES270123U (es) | 1983-07-16 |
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