ES270123U - Mejoras en los conjuntos de circuito impreso de insercion en los bloques ensamblados de portatarjetas. - Google Patents

Mejoras en los conjuntos de circuito impreso de insercion en los bloques ensamblados de portatarjetas.

Info

Publication number
ES270123U
ES270123U ES1983270123U ES270123U ES270123U ES 270123 U ES270123 U ES 270123U ES 1983270123 U ES1983270123 U ES 1983270123U ES 270123 U ES270123 U ES 270123U ES 270123 U ES270123 U ES 270123U
Authority
ES
Spain
Prior art keywords
printed circuit
card file
circuit assembly
packaging system
molded
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
ES1983270123U
Other languages
English (en)
Other versions
ES270123Y (es
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nokia Spain SA
Original Assignee
Alcatel Espana SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alcatel Espana SA filed Critical Alcatel Espana SA
Publication of ES270123U publication Critical patent/ES270123U/es
Application granted granted Critical
Publication of ES270123Y publication Critical patent/ES270123Y/es
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0064—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a polymeric substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/144—Stacked arrangements of planar printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0352—Differences between the conductors of different layers of a multilayer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09118—Moulded substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/096—Vertically aligned vias, holes or stacked vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09754—Connector integrally incorporated in the PCB or in housing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10272—Busbars, i.e. thick metal bars mounted on the PCB as high-current conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2036—Permanent spacer or stand-off in a printed circuit or printed circuit assembly
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1327—Moulding over PCB locally or completely
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components

Abstract

Mejoras en los conjuntos de circuito impreso de inserción en los bloques ensamblados de portatarjetas, constituidas por uno de estos conjuntos de circuito impreso, caracterizadas las mejoras porque dicho conjunto de circuito impreso comprende: un miembro dieléctrico flexible plano en el que hay impresos unos conductores de un circuito impreso y un miembro dieléctrico, rígido, moldeado, formado por una sola pieza, en el que está fijado dicho miembro flexible y al cual sirve de soporte, teniendo el miembro moldeado al menos unos orificios producidos en el moldeo para la sujeción de los hilos conductores d los componentes cos de dicho conjunto y para poder establecer las conexiones de dichos hilos conductores con dichos conductores impresos, comprendiendo además unas desliza de ras para ser pasadas por las ranuras de dicho bloque de portatarjetas y de unos conectores eléctricos para la conexión de dicho conjunto a dicho bloque de portatarjetas.
ES1983270123U 1982-02-01 1983-02-01 Mejoras en los conjuntos de circuito impreso de insercion en los bloques ensamblados de portatarjetas. Expired ES270123Y (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/344,426 US4439815A (en) 1982-02-01 1982-02-01 Printed circuit assembly for a card file packaging system

Publications (2)

Publication Number Publication Date
ES270123U true ES270123U (es) 1983-07-16
ES270123Y ES270123Y (es) 1984-02-01

Family

ID=23350503

Family Applications (1)

Application Number Title Priority Date Filing Date
ES1983270123U Expired ES270123Y (es) 1982-02-01 1983-02-01 Mejoras en los conjuntos de circuito impreso de insercion en los bloques ensamblados de portatarjetas.

Country Status (2)

Country Link
US (1) US4439815A (es)
ES (1) ES270123Y (es)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4567543A (en) * 1983-02-15 1986-01-28 Motorola, Inc. Double-sided flexible electronic circuit module
US4589057A (en) * 1984-07-23 1986-05-13 Rogers Corporation Cooling and power and/or ground distribution system for integrated circuits
IT1184408B (it) * 1985-04-09 1987-10-28 Telettra Lab Telefon Processo per la fabbricazione di piastre e circuiti stampati,e prodotti relativi
US4771366A (en) * 1987-07-06 1988-09-13 International Business Machines Corporation Ceramic card assembly having enhanced power distribution and cooling
US4914259A (en) * 1987-09-08 1990-04-03 The Furukawa Electric Co., Ltd. Molded circuit board
US5136470A (en) * 1990-06-29 1992-08-04 Loral/Rolm Mil-Spec Computers Printed circuit board vibration stiffener
JPH0746618B2 (ja) * 1991-07-30 1995-05-17 インターナショナル・ビジネス・マシーンズ・コーポレイション 回路接続装置およびそれを使用する電気回路システム
US5228863A (en) * 1991-07-30 1993-07-20 International Business Machines Corporation Connection device for use in an electrical circuitry system
US5610801A (en) * 1995-03-20 1997-03-11 Intel Corporation Motherboard assembly which has a single socket that can accept a single integrated circuit package or multiple integrated circuit packages
US5959847A (en) * 1996-11-20 1999-09-28 Adtran, Inc. Form factor-configured channel bank card containing form factor non-conformal printed circuit board
JP6443632B2 (ja) * 2015-12-16 2018-12-26 株式会社オートネットワーク技術研究所 回路構成体、及び電気接続箱
KR102411445B1 (ko) * 2017-07-20 2022-06-22 주식회사 아모그린텍 파워 릴레이 어셈블리

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3202869A (en) * 1965-08-24 Electrical apparatus with insulated heat conducting members
FR1224964A (fr) * 1959-02-10 1960-06-28 Le Transistor Ind Perfectionnements aux montages électroniques en vue de leur application aux jouets
US3165672A (en) * 1959-06-15 1965-01-12 Burroughs Corp Printed circuit baseboard
US3259805A (en) * 1963-02-06 1966-07-05 Westinghouse Electric Corp Metallic based printed circuits
US3289047A (en) * 1964-10-16 1966-11-29 Sylvania Electric Prod Housing for a mechanically alterable memory system
US3368115A (en) * 1965-10-19 1968-02-06 Amp Inc Modular housing for integrated circuit structure with improved interconnection means
GB1106590A (en) * 1966-11-29 1968-03-20 Amp Inc Two-way plugboard
GB1403371A (en) * 1972-01-12 1975-08-28 Mullard Ltd Semiconductor device arrangements
US3852690A (en) * 1973-01-02 1974-12-03 Gen Electric Microwave transmission line to ground plane transition
US4164071A (en) * 1977-12-27 1979-08-14 Ford Motor Company Method of forming a circuit board with integral terminals
DE2848033A1 (de) * 1978-11-06 1980-05-14 Siemens Ag Baugruppe zur aufnahme elektronischer geraete
JPS55155087U (es) * 1979-04-24 1980-11-08

Also Published As

Publication number Publication date
ES270123Y (es) 1984-02-01
US4439815A (en) 1984-03-27

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