ES2509617T3 - Device and procedure for air separation and gluing of wood chips - Google Patents

Abstract

Device (1, 31) for air separation and gluing of wood chips (S), comprising: - an air separation device (3) for the fractionation of wood chips into at least a fraction of coarse wood chips and a thin one (S1, S2), in which the air separation device comprises at least one drop pit (7) and is configured so that the coarse and fine chip fraction falls into the drop pit through from different gluing areas (12, 13); and - a gluing device (11) for gluing the coarse and fine chip fraction in the gluing areas.

Description

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DESCRIPTION

Device and procedure for air separation and gluing of wood chips

The invention relates to a device according to claim 1 and a method according to claim 9 for air separation and gluing of wood chips.

Wood chip sheets or comparable lignocellulosic materials, in particular flat pressed sheets, are preferably manufactured as multi-layer sheets with a middle layer that mechanically stabilizes comparatively thick chips, as well as upper and lower cover layers of comparatively fine chips. In this case, the chips are placed, unlike the finest wood fibers used in fiber boards, such as MDF boards, in a comparatively large size dispersion.

Then during a glueing set of thick and thin chips there is a problem that thin chips, due to their larger specific surface, tend to absorb more glue than necessary, on the contrary thick chips too little. This causes an unwanted irregular distribution of the amount of glue in the pressed multilayer plate. In addition, a reduction in the amount of glue used in this case would be desirable for reasons of profitability.

Alternatively to the joint gluing, DE 10 2004 033 777 A1 describes a process in which a flow of coarse fiber fractions and a flow of fine fiber fractions are first glued separately, then joined in a mixing ratio defined and finally spread on a flat mat. Depending on the adjusted mixing ratio, some other medium layers and chip sheet covers can be stacked, for example of oriented dispersed chip plates (OSB). In this case it is disadvantageous that for the gluing of the individual chip fractions separate gluing devices must be provided, as well as devices for separating the chips supplied and those already glued. Document DE 10 2007 049 948 describes that the gravel is dispersed by its size in separate parts on the worked belt.

Therefore, there is a need for a device and a procedure for the facilitation of glued wood chip fractions with different chip size, which are improved with a view to the aforementioned problems.

The stated objective is solved with a device for air separation and gluing of wood chips according to claim 1. Therefore, the device according to the invention comprises an air separation device for the fractionation of wood chips into at least a coarse and a fine chip fraction, the air separation device comprising at least one drop pit and being configured so that the coarse and fine chip fraction fall through different gluing zones. In addition, a gluing device is provided for gluing the coarse and fine chip fraction in the gluing areas. The thick chip fraction in this case in particular has an average chip size larger than the fine chip fraction. The gluing zones are configured in particular in the area of the drop pit.

Different gluing zones occur in the drop pit, for example, because chip fractions of different chip size are diverted first laterally at a different distance during air separation, so that they are present in a subsequent phase to the fall as spatially separated chip fractions from each other. With the gluing device, different conditions can then be established for gluing in the gluing areas, in order to adapt the glue absorption of the individual chip fractions to a desired measurement. Therefore, it is possible to perform the separation and gluing together in a common device for at least two different fineness chip fractions and to adjust the amounts of glue for the middle layers and covers of a pressed chip sheet.

The gluing device is preferably configured to introduce at least one glue spray into the gluing areas, so that along another separation path crossed by the coarse chip fraction another amount of glue is provided, in particular a larger quantity of glue, than along at least one separation path crossed by the fine chip fraction. The separation pathway is in this case the flight path of the corresponding chip particles during separation, for example composed of a phase of particle deflection and a subsequent phase of particle fall. Low quantity of glue should be understood as an amount of undiluted glue, with which a particle of a unit size would be contacted on its path through the corresponding gluing zone, that is to say along its separation path. The amount of glue therefore depends in particular on the density of the glue along the separation path and the length of the separation path within the gluing zone.

In the case of a particularly favorable embodiment, the sizing device is configured to introduce at least one tail spray into the sizing areas so that a medium tail density is differentiated from another in the sizing areas. Low glue density should be understood in this case the weight or volume of the glue per unit volume of the gluing areas. In the case of glue sprays can be set

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different tail densities by introducing different volumetric tail fluxes, for example, from stepped spray nozzles with different or similar density, and / or with different size tail drops. It would also be possible to nebulize a concentrated or diluted glue with different intensity. In this way, the respective amount of glue absorbed by the chip fractions can be adjusted easily in the gluing areas.

For example, glue sprays with higher average glue density could be introduced into the gluing zones, the larger the average chip size of the chip fraction associated with the gluing zone. In this way, it is possible in particular to prevent fractions of fine chips with a comparatively large specific surface from absorbing too much glue and fractions of coarse chips with a comparatively small specific surface absorbing too little glue. In this way, the amount of glue needed together for the manufacture of chip sheets can be reduced and profitability increased. In addition, a homogeneous glue distribution in the individual chip fractions and in the ratio of the individual chip fractions to each other is possible.

The air separation device preferably comprises at least one blowing device for the generation of a deflection current oriented obliquely upwards, whose main flow direction in particular forms an angle of 30 to 60 ° with the horizontal. Therefore, the chip fractions can be separated essentially following the tracing of a firing parabola in the following drop pit, whereby different gluing zones can be provided especially easily. With especially large directions of circulation from 30 to 60º, an especially compact construction mode can be carried out, since the flight paths of the thick and fine particles in this angle range are particularly intense and make an especially effective separation possible. In addition, the chip fractions that should not be glued can be separated particularly effectively from the chip fractions to be glued.

In a particularly favorable configuration of the device according to the invention, a collecting device for foreign bodies whose density is greater than the density of the chips supplied, and / or a device is provided upstream of the sizing areas collector for a chip fraction not to be glued that is thicker than the chip fractions to be glued, and / or a collecting device for a chip fraction not to be glued that is thinner than the chip fractions to be glued. In this way, impurities can be removed from wood shavings, such as sand, stones or metal parts, and removed especially easily in a non-glued state. In addition, especially light chip fractions, such as wood dust, can be removed prior to gluing and supplied to a reuse system, for example for obtaining energy and / or thermal oil. This makes possible a considerable preservation of resources and / or an improved use of chips. In addition, chip fractions that are too thick can be removed in the non-glued state for subsequent reuse, for example by fragmentation and reconduction of the product flow. This facilitates the handling and subsequent use of the fractions taken. In addition, it is possible to avoid unnecessarily queuing for the chip fractions to be used otherwise.

A particularly favorable embodiment further comprises at least one collecting device for separate collection of the glued chip fractions. In this way the chip fractions separated during air separation can be easily provided for reuse. In this way the additional devices for chip separation become dispensable.

A particularly favorable embodiment of the invention further comprises at least one other blowing device for generating a protection current along at least one side wall of the drop pit, in order to conduct the glued chip fractions and / or tail sprays outside the side wall. In this way, contamination of the device according to the invention with glue can be avoided or at least reduced. Furthermore, the contact of the wood chips of abrasive effect with the device according to the invention can be avoided or at least reduced. In other words, the separation and gluing of the chip fractions is carried out essentially without contact with the machine parts, so that they are requested as little as possible by the glue and / or the chips. In this way, the wear of the device according to the invention and the need for cleaning can be reduced with the consequence of a temporary production stop.

The collecting device preferably comprises at least one conveyor belt, so that at least the coarse and fine chip fraction falls one after the other on the conveyor belt in the transport direction of the conveyor belt and from it are provided in superimposed layers for further processing. In this way an additional device for stacking the chip fractions becomes dispensable. Consequently, multi-layer chip sheets can be manufactured with a really low space requirement.

The proposed objective is further solved with a method according to claim 9. Then the wood chips are separated into at least two chip fractions of different medium chip size by air separation, and the chip fractions are glued during separation by air. Therefore the chip fractions can be separated and glued without contact with the sensitive machine parts in a joint treatment unit. For this, a phase of falling chip fractions that concludes the separation by air is particularly appropriate. Given that the

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coarse and fine chip fraction are present in separate areas during or after air separation, the gluing of the corresponding chip fraction can be adapted especially easily to its average particle size and / or the average particle surface .

The chip fractions can preferably be glued with glue sprays of different glue density, the chip fractions being particularly glued with higher glue density the thicker the chip fraction. Under glue sprays of different glue density, a glue distribution in the form of glue sprays with a different amount of glue per unit volume of the gluing areas should be understood. That is, the tail could be provided in the form of different sized tail drops, of a different number of tail drops and / or aerosols with different tail concentration.

In a particularly favorable configuration the chip fractions are glued with different density by spraying a diluted glue with different intensity. In this way, different glue densities can be produced in a particularly simple and flexible way. For example, glue concentrations could be adapted continuously to the respective chip fractions present.

The chip fractions are diverted at a different distance in the lateral direction by the introduction of a deflection current oriented obliquely upwards, and are glued during a fall phase, in particular in an area below the deflection current. In this way, a separation of the chip fractions of different fineness can be obtained in a simple manner, essentially following the development of a firing parabola, in order to glue and capture the chip fractions separately from each other.

During air separation, at least one other chip fraction not to be glued is preferably separated before gluing. In this way, the quality of the chip fractions to be glued can be increased and to ensure that the chip fractions not processed by forming chip sheets can be supplied without gluing to a reuse. In addition, in particular a chip fraction that is too thick for use in chip sheets can be supplied in a non-glued state to fragmentation and redirected back to the product flow, in particular for gluing. In this way the fractions can be supplied to a respective optimal use with preservation of resources and reduce the amount of tail used together.

The chip fractions preferably comprise at least a coarse chip fraction for the manufacture of a middle layer and a fine chip fraction for the manufacture of at least one cover layer of a pressed chip sheet. In the case of similar chip fractions, the process according to the invention can be used especially efficiently. In particular, the advantages of a separation and gluing of wood chips can be combined in an efficient way, saving space and adapting the quantities of glue applied to the corresponding chip fractions.

The stated objective is also achieved with a manufacturing process for a pressed chip plate comprising the method according to the invention, as well as a step for stacking one on top of at least one lower covering layer, the middle layer and a cover layer upper, as well as a stage for compression of the cover layers and the middle layer. Consequently, pressed chip sheets can be manufactured especially economically and with preservation of resources with an especially high quality.

Preferred embodiments of the invention are represented in the drawing. They show:

Fig. 1

a schematic cross section through a first embodiment of the device according to the invention; Y

Fig 2

a schematic cross section through a second embodiment of the device according to the invention.

According to fig. 1, a first embodiment 1 of the device according to the invention for air separation and gluing of wood chips S or the like comprises an air separation device 3 for the fractionation of wood chips S in at least two fractions of S1 and S2 chip to glue different medium chip size.

The air separation device 3 comprises a blowing device 5, which generates a deflection air flow 6 oriented obliquely upwards for the lateral deflection of the wood chips S, as well as a drop pit 7 in which the particles deviated they fall down preferably following different firing parabolas according to the chip size, in order to spatially separate the thickest chip fraction S1 from the finest chip fraction S2. Chip fractions S1, S2 that essentially fall side by side along the associated separation paths S1 ', S2' are collected separately for further processing by a first collecting device 9 for coarse chips and a second device 10 collector for fine chips.

The device 1 according to the invention further comprises in the area of the drop pit 7 a gluing device 11

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with spray devices 14 for the generation of at least one tail spray 15, also commonly referred to as a spray, through which the chip fractions S1, S2 to be glued fall. The spraying devices 14 can be, for example, spray nozzles, such as high pressure nozzles or ultrasonic nozzles and / or rotary sprayers, whose main mode of operation is known respectively and is no longer described. Also for the purpose of spraying or fogging, additional steam could be mixed in the spray devices to obtain a desired aerosol quality.

The gluing device 11 is configured so that at the gluing zones 12, 13 associated with the chip fractions S1, S2 within the drop pit 7 there is provided at least one tail spray 15 with locally different tail density and / or through sections of different length of the separation paths S1 ', S2'. That is, for example, a glue aerosol 15 with a gradient of glue density is generated between the glue zones 12, 13 or several aerosols 15 with glue density different from one another. This can be achieved for example because, as indicated on the left in fig. 1, several spray nozzles with different inclination angles and / or, as indicated on the right in fig. 1, stepped spray nozzles with different density or the like. It would also be possible to atomize a concentrated or diluted glue with different intensity from individual spray devices 14. Obviously it would also be possible to atomize aerosols of glue 15 with different average droplet size and / or different number of drops per unit volume by appropriate spraying devices 14. In each case the chip fractions S1, S2 of different fineness come into contact in the gluing areas 12, 13 along the particle flight paths S1 ', S2' respectively with an amount of aerosol adapted to the fraction of corresponding chip S1, S2.

In fig. 1, an additional blowing device 17 is also indicated in the area of the drop pit 7 and the gluing device 11. This comprises in the example several off-center fans indicated schematically. However, at least one central blowing unit with associated air supply lines could also be conceived. For simplicity the associated exhaust air lines are not represented. The additional blowing device 17 is configured to generate, along the side walls 7a of the drop pit 7, in particular in an area of the aerosol sizing, a protective air stream 18. This prevents the tail spray 15 from being fixed to the side walls 7a of the drop pit 7. It also prevents the wood chips S in the form of the chip fractions S1, S2 from hitting the drop pit 7 or others. mechanically sensitive components of the device 1 according to the invention and cause damage there due to the intense known abrasive effect of the wood chips S. The protection current 18 caused by the additional blowing device 17 is preferably configured so that a development of most laminar current in the side wall 7a of the drop pit 7, in order to avoid eddies and unwanted mixtures of the chip fractions S1, S2 to be separated due to turbulence.

Furthermore, the device 1 according to the invention preferably comprises a third collecting device 21 for foreign bodies 33 to be separated from wood chips S, such as sand, stones, metal parts and the like, which are in particular heavier than wood chips S , as well as a fourth collecting device 23 for a light chip fraction S4 not to be glued, such as wood dust. The third and the fourth collecting device 21, 23 are preferably arranged in an area of the diverting current upstream of the sizing device 11. Accordingly, the foreign bodies S3 and the light chip fraction S4 can be separated and separated from the fractions of chip S1, S2 to be glued in the non-glued state. Accordingly, for example, the light chip fraction S4 can be supplied to an unlimited and ecological reuse for combustion or the like. Likewise, the fraction of foreign bodies S3 can be collected and disposed of especially easily. It is understood in itself that by this arrangement, in addition to the simple handling and improved use of the separated fractions, it is further avoided that the tail spray 15 is directed to chip fractions S3, S4 not to be glued, so that it can be reduced Tail consumption altogether.

As clarified in fig. 1, the lighter fractions S2, S4 of the wood chips S are laterally deflected by the air flow 6 even more than the heavier chip fraction S1 or the foreign body fraction S3. In other words, comparatively steep separation paths are produced for heavier and / or thicker fractions. Accordingly, the individual fractions S1 to S4 can be effectively separated before or in the drop pit 7 by the effect of the air flow 6.

Obviously, it could be conceived to fractionate wood chips S even more finely. For example, one could differentiate between more than two chip fractions S1, S2 to be glued. Likewise, another heavier chip fraction S5 could be separated by bypass current 6 before gluing for reconduction to the product flow. For example, a chip fraction that is too thick for the manufacture of chip sheets of a certain quality in the non-glued state could be redirected, fragmented and finally mixed again with the wood chips S. The thick chip fraction to be redirected is It can handle way especially easily in the non-glued state.

Bypass current 6 is especially favorable when its main flow direction 6 ’forms an angle α

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in the range of 30 to 60º with the horizontal. Ideally, the angle α of the main direction of movement 6 ’is in the range of 40 to 50 °. In this range of angles the flight paths of the individual chip fractions S1, S2, S4 can be provided in a particularly favorable manner. With similar angles α, comparatively long shot parabolas are produced, with the consequence of an especially accurate air separation and saving space. Correspondingly, the gluing zones 12, 13 can be spatially separated from one another in a particularly suitable manner and adjust the corresponding glue densities.

Although the gluing areas 12, 13 are drawn at a distance from each other in fig. 1, the gluing zones 12, 13 could also be directly adjacent or become one another. Also the tail density can be configured in the form of a gradient and gradually become converted from a gluing zone 12, 13 in the other. For example, the amount of glue provided with at least one tail spray 15 per volume traversed from the corresponding sizing area 12, 13 could decrease continuously from the sizing area 12 associated with the coarse chip fraction S1 towards the fraction S2 fine chip. In this case it is decisive that for specific chip fractions S1, S2 of different fineness different amounts of glue can be provided, to adapt the respective amount of absorbed glue to a characteristic parameter of chip fractions S1, S2, such as volume, the dimensions and / or the surface of the particles.

For completeness in fig. 1, the dosing and / or deflection rollers 25 are indicated on the inlet side, whose operating mode is essentially known and is therefore not described in more detail. However, a diverter roller 25a mounted directly in front of the blowing device 5 is preferably installed, so that the wood chips S are centrifuged away laterally in the direction of the diverter flow 6 directed obliquely upward. In this way, a separation path S3 ’can be generated on the input side similar to a firing parabola, for heavy particles for the separation of the fraction of foreign bodies S3.

The at least one tail spray 15 is preferably provided in the form of a tail curtain that crosses the separation paths S1 ’, S2’. For this, a linear arrangement of the device 1 according to the invention is advantageous, in which the structures of fig. 1 should essentially be interpreted as cross sections of the profiles that protrude in the drawing plane. However, an essentially symmetrical rotating embodiment of the device 1 can also be conceived, in which the tail aerosols 15 could then form an essentially symmetrical rotating curtain of the tail. However, neither an axially symmetrical nor rotationally symmetrical construction mode of the device 1 according to the invention is necessarily necessary.

Fig. 2 shows an alternative embodiment 31 of the device according to the invention, which essentially corresponds to the first embodiment 1 with the exception of the first and second collecting devices 9,

10. The identical or equivalent characteristics are omitted in fig 2 for clarity and / or are not drawn separately. In the second embodiment 31, instead of the first and second annular or funnel collecting device 9, 10, conveyor belts 33 and 34 are provided, which also serve as collecting devices and stack the chip fractions S1 on top of each other, S2 additionally captured and glued as continuous partial product streams, in order to manufacture multi-layer chip sheets in a space-saving manner especially. Against this, the chip fractions S1, S2 captured with the first embodiment 1 are separated again if necessary before stacking one on top of the other and / or evenly distributed on a plate surface to be manufactured to guarantee the layer thicknesses More uniforms possible.

With device 1, 31 according to the invention, it is possible to work as follows:

Wood chips S suitable for the manufacture of multi-layer chip sheets, comprising components of different thickness, are introduced as a continuous product flow through dosing rollers 25 in the device 1, 31 according to the invention. Wood chips S are centrifuged through the deflection rollers 25a essentially horizontally on the air flow 6, so that the heavy foreign bodies S3 contained fall before the diverting current 6 and / or fall through this, to be picked up by the third collecting device 21 and consequently depart from the product flow.

Wood chips S, on the other hand, are dragged obliquely upwards by the diverting current 6. The thin fractions S4 not to be glued from wood chips S, such as wood dust, move away from the product flow through the room collecting device 23 before gluing and are supplied to a separate use, for example to obtain energy.

Faced with that, the chip fractions to be glued, dragged by the air stream, fall into the pit of fall 7 essentially following the development of a parabola of shot S1 ’, S2’ more steep. The separation with the aid of the air stream 6 causes in this case that the fine chip fraction S1 deviates laterally even more than the thick chip fraction S2. Accordingly, the chip fractions S1, S2 essentially fall sideways side by side through the drop pit 7. The gluing zones 12, 13 in the drop pit 7, where different tail densities are preferably provided with at less a tail spray 15 properly distributed or with several different tail aerosols, are essentially limited by the flight curves S1 ',

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S2 ’of the particles of the chip fractions S1, S2. The chip fractions S1, S2, respectively absorb a portion of the aerosols 15 during the fall through the drop pit 7, in particular in the gluing areas 12, 13, and consequently they are glued as they pass through the gluing areas 12 , 13. The glue density of at least one glue spray 15 is adapted in this case in the gluing areas 12, 13 preferably to the average chip size

5 corresponding to the chip fractions S1, S2. In this way the amount of glue in the thin and coarse chip fractions S1, S2 adapts to a ratio of the corresponding average particle surface and the average particle volume.

In the lower area of the drop pit 7, the chip fractions S1, S2 glued by the collecting device 9 are collected separately and provided for further processing by forming a multi-layer chip plate. In this case, the chip fractions S1, S2 can be stacked on top of each other in a manner known as lower cover layer, middle layer and upper cover layer. It can also be conceived to press the chip fractions S1, S2 or other chip fractions (not shown) forming multilayer sheets with a number of layers that deviates from the application example shown. With the chip fractions glued and separated according to the invention, multilayer sheets with improved quality and / or with special use of resources can also be manufactured using

15 conventional pressing devices.

The embodiments shown can be combined with each other in any technically reasonable manner. In particular, different gluing devices can be combined. For example it is possible to make glue densities

or different glue gradients in the gluing areas 12, 13 by combining different spray devices 14 or diluted glue aerosols with different intensity. In particular, spray devices 14 can be tilted with different intensity. They can also be arranged next to other spray nozzles and / or rotary sprayers with different density. By different inclinations of the spray nozzles, for example, tail curtains formed differently from the tail spray 15 can be formed, so that the contact areas of the tail spray 15 with the chip fractions S1, S2 of different fineness they differ in the individual gluing zones 12, 13. In this case the variants shown in the figures of the

25 spray devices 14 and their asymmetric combination should only be understood as schematic examples for the explanation of the mode of operation.

Also the chip fractions S1, S2 separated and glued can be collected differently and dispersed in layers forming mats, as indicated by way of example in Figures 1 and 2.

Claims (15)

5 10 fifteen twenty 25 30 35 40 Four. Five fifty E10805212 10-01-2014 1.-Device (1, 31) for air separation and gluing of wood chips (S), comprising: - an air separation device (3) for the fractionation of wood chips into at least a coarse and fine chip fraction (S1, S2), in which the air separation device comprises at least one well of drop (7) and is configured so that the coarse and fine chip fraction fall into the drop pit through different gluing zones (12, 13); Y -a gluing device (11) for gluing the coarse and fine chip fraction in the gluing areas. 2. Device according to claim 1, wherein the gluing device (11) is configured to introduce at least one tail spray (15) into the gluing areas (12), so that along at least one separation path (S1 ') crossed by the coarse chip fraction (S1) another amount of glue is provided, in particular a larger amount of glue, than along at least one separation path (S2') crossed by the fine chip fraction (S2). 3. Device according to claim 1 or 2, wherein the sizing device (11) is configured to introduce at least one glue spray (15) into the sizing areas (12), so that it differs an average tail density of another in the gluing areas. 4. Device according to at least one of the preceding claims, wherein the air separation device (3) comprises at least one blowing device (5) for generating a bypass current (6) oriented obliquely upwards , whose main direction of circulation (6 ') forms in particular an angle (α) of 30 to 60 ° with the horizontal. 5. Device according to at least one of the preceding claims, wherein in the air separation device

(3)

a collecting device (21) for foreign bodies (S3) whose density is greater than the density of the wood chips (S), and / or a collecting device for an upstream is provided upstream of the gluing areas (12, 13). chip fraction (S5) not to be glued that is thicker than chip fractions (S1, S2) to be glued, and / or a collecting device

(2. 3)

for a chip fraction (S4) not to be glued that is thinner than the chip fractions (S1, S2) to be glued.

6. Device according to at least one of the preceding claims, in addition to at least one collecting device (9, 10) for separate collection of the chip fractions (S1, S2) glued. 7. Device according to at least one of the preceding claims, in addition to at least one other blowing device. (17) for the generation of a protection current (18) along at least one side wall (7a) of the drop pit (7), to deflect the chip fractions (S1, S2) glued and / or the tail sprays (15) of the side wall. 8. Device according to claim 6, wherein the collecting device comprises at least one conveyor belt (33, 34), so that at least the coarse and fine chip fraction (S1, S2) fall one after the other on the conveyor belt in the transport direction and are provided by it in superimposed layers for further processing. 9.-Procedure for air separation and gluing of wood chips, in which wood chips are separated into at least two different chip fractions by air separation and the chip fractions are glued during separation by air. 10. Method according to claim 9, wherein the chip fractions are glued with glue aerosols of different glue density, wherein the chip fractions are glued in particular with higher glue density when the fraction is thicker Chip 11. Method according to claim 10, wherein the chip fractions are glued with different density by spraying diluted glue with different intensity. 12. Method according to at least one of claims 9 to 11, wherein the chip fractions are diverted at a different distance in the lateral direction by the introduction of a deflection current oriented obliquely upwards, and glued during a phase of fall, particularly in an area below the diversion current. 13. Method according to at least one of claims 9 to 12, wherein during air separation at least one other chip fraction not to be glued is separated before gluing. 14. Method according to at least one of claims 9 to 13, wherein the chip fractions comprise at least a coarse chip fraction for the manufacture of a middle layer and a fine chip fraction for the manufacture of at least one cover layer of a pressed chip board. 8 E10805212 10-01-2014 15.-Procedure for the manufacture of a pressed chip sheet, with the method according to claim 14 and a step for stacking one on top of at least one lower cover layer, the middle layer and an upper cover layer, as well as with a stage for compression of the cover layers and the middle layer. 9