ES2268259T3 - MINIATURE INDUCTIVE COMPONENT FOR SMD ASSEMBLY. - Google Patents
MINIATURE INDUCTIVE COMPONENT FOR SMD ASSEMBLY. Download PDFInfo
- Publication number
- ES2268259T3 ES2268259T3 ES03026407T ES03026407T ES2268259T3 ES 2268259 T3 ES2268259 T3 ES 2268259T3 ES 03026407 T ES03026407 T ES 03026407T ES 03026407 T ES03026407 T ES 03026407T ES 2268259 T3 ES2268259 T3 ES 2268259T3
- Authority
- ES
- Spain
- Prior art keywords
- component
- coating material
- component according
- printed circuit
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 230000001939 inductive effect Effects 0.000 title claims abstract description 20
- 239000011248 coating agent Substances 0.000 claims abstract description 25
- 238000000576 coating method Methods 0.000 claims abstract description 25
- 239000000463 material Substances 0.000 claims abstract description 23
- 229910000859 α-Fe Inorganic materials 0.000 claims abstract description 13
- 230000008018 melting Effects 0.000 claims abstract description 8
- 238000002844 melting Methods 0.000 claims abstract description 8
- 238000003466 welding Methods 0.000 claims description 6
- 239000000853 adhesive Substances 0.000 claims description 5
- 230000001070 adhesive effect Effects 0.000 claims description 5
- 230000004927 fusion Effects 0.000 claims description 4
- 230000000087 stabilizing effect Effects 0.000 claims description 4
- 238000004804 winding Methods 0.000 claims description 4
- 239000003292 glue Substances 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 229920006345 thermoplastic polyamide Polymers 0.000 claims description 3
- 239000002313 adhesive film Substances 0.000 claims description 2
- 229920006344 thermoplastic copolyester Polymers 0.000 claims description 2
- 230000008023 solidification Effects 0.000 claims 1
- 238000007711 solidification Methods 0.000 claims 1
- 238000005476 soldering Methods 0.000 abstract description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 230000035945 sensitivity Effects 0.000 description 2
- 229920001169 thermoplastic Polymers 0.000 description 2
- 239000004416 thermosoftening plastic Substances 0.000 description 2
- 239000004020 conductor Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
- H05K3/305—Affixing by adhesive
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/02—Casings
- H01F27/027—Casings specially adapted for combination of signal type inductors or transformers with electronic circuits, e.g. mounting on printed circuit boards
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/24—Magnetic cores
- H01F27/26—Fastening parts of the core together; Fastening or mounting the core on casing or support
- H01F27/266—Fastening or mounting the core on casing or support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/29—Terminals; Tapping arrangements for signal inductances
- H01F27/292—Surface mounted devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/04—Fixed inductances of the signal type with magnetic core
- H01F17/045—Fixed inductances of the signal type with magnetic core with core of cylindric geometry and coil wound along its longitudinal axis, i.e. rod or drum core
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/1003—Non-printed inductor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10954—Other details of electrical connections
- H05K2201/10984—Component carrying a connection agent, e.g. solder, adhesive
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Coils Or Transformers For Communication (AREA)
- Multi-Conductor Connections (AREA)
- Details Of Resistors (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
Description
Componente inductivo en miniatura para montaje SMD.Inductive miniature component for assembly SMD
La invención concierne a un componente inductivo en miniatura para montaje SMD con un núcleo de ferrita de una sola pieza, cuya longitud es mayor que su anchura, y con al menos un devanado de bobina dispuesto alrededor del núcleo y dotado de elementos de conexión eléctrica.The invention concerns an inductive component miniature for SMD mounting with a single ferrite core piece, whose length is greater than its width, and with at least one coil winding arranged around the core and provided with electrical connection elements
En tales componentes, que pueden estar configurados, por ejemplo, en forma de bobinas alargadas con núcleos delgados de ferrita, se ha comprobado que en especial los núcleos de ferrita son extraordinariamente sensibles a la rotura, de modo que, cuando están incorporados en un dispositivo a controlar, por ejemplo en relojes, se rompen fácilmente en pedazos al producirse fuertes golpes como los que pueden presentarse, por ejemplo, al caerse al suelo el dispositivo.In such components, which may be configured, for example, in the form of elongated coils with cores Thin ferrite, it has been found that especially the cores Ferrite are extraordinarily sensitive to breakage, so which, when incorporated into a device to be controlled, by example in watches, they break easily into pieces when produced heavy blows such as those that may occur, for example, at the device falls to the ground.
En el documento EP-A-0 282 646 se revela un componente inductivo en miniatura según el preámbulo de la reivindicación 1.In the document EP-A-0 282 646 reveals a inductive miniature component according to the preamble of the claim 1.
La invención se basa en el problema de configurar un componente inductivo en miniatura de la clase de construcción mencionada más arriba y en el preámbulo de la reivindicación 1 de modo que, en el estado montado, se consiga una estabilización del componente, especialmente del núcleo de ferrita, mediante la cual se reduzca fuertemente la sensibilidad a la rotura.The invention is based on the problem of set up a miniature inductive component of the class of construction mentioned above and in the preamble of the claim 1 so that, in the assembled state, a stabilization of the component, especially the ferrite core, through which the sensitivity to break.
La solución de este problema se obtiene según la invención haciendo que el componente esté provisto, al menos en una superficie que discurre en su dirección longitudinal, de un revestimiento que se extiende al menos sobre un segmento parcial de su longitud y que está constituido por un material cuyo punto de fusión está por debajo de la temperatura que se presenta en el componente al soldar los elementos de conexión eléctrica con las pistas conductoras de una placa de circuito impreso de tal manera que el material de revestimiento se licúe temporalmente y forme una unión estabilizadora del núcleo de ferrita entre el componente y la placa de circuito impreso.The solution of this problem is obtained according to the invention by making the component provided, at least in one surface that runs in its longitudinal direction, of a coating that extends at least over a partial segment of its length and that is constituted by a material whose point of fusion is below the temperature that occurs in the component when welding the electrical connection elements with the conductive tracks of a printed circuit board in such a way that the lining material temporarily liquefies and forms a stabilizing union of the ferrite core between the component and the Printed circuit board.
Esta configuración del componente tiene la ventaja de que, al instalar el componente sobre la placa o la tarjeta de circuito impreso y al soldar los elementos de conexión eléctrica, se licúa el material del revestimiento y, después del nuevo endurecimiento, el componente se fija sólidamente de forma automática a la placa de circuito impreso, con lo que se estabiliza también el núcleo de ferrita.This component configuration has the advantage of that, when installing the component on the board or the printed circuit board and when soldering the connection elements electrical, the coating material is liquefied and, after new hardening, the component is fixed solidly automatic to the printed circuit board, thereby stabilizing also the ferrite core.
Asimismo, mediante la configuración del componente según la invención se consigue un alivio de carga de la unión entre los elementos de conexión eléctrica y la placa de circuito impreso, de modo que se reduce el riesgo de que el componente se suelte de la placa de circuito impreso.Also, by configuring the component according to the invention a load relief of the connection between the electrical connection elements and the plate printed circuit, so that the risk of the component is released from the printed circuit board.
El componente puede estar provisto del material de revestimiento en su lado superior y al menos en una parte de las superficies laterales, pero también puede estar provisto del material de revestimiento en su lado inferior vuelto hacia la placa de circuito impreso durante el montaje. Por último, el componente puede estar rodeado en todo su contorno por el material de revestimiento.The component may be provided with the material of lining on its upper side and at least part of the lateral surfaces, but may also be provided with lining material on its lower side turned towards the plate printed circuit during assembly. Finally, the component it can be surrounded in all its contour by the material of coating.
Particularmente en el caso de un revestimiento dispuesto en el lado inferior del componente, el material de revestimiento puede estar fijado también al componente en forma de una tira de película. En este caso, la tira de película puede estar fijada al componente por medio de una película autoadhesiva o por medio de un adhesivo endurecible.Particularly in the case of a coating arranged on the underside of the component, the material of coating may also be fixed to the component in the form of A strip of film. In this case, the film strip may be fixed to the component by means of a self-adhesive film or by medium of a hardenable adhesive.
El punto de fusión del material de revestimiento está situado preferiblemente entre 130 y 220ºC.The melting point of the coating material It is preferably located between 130 and 220 ° C.
Se ha comprobado que como material de revestimiento se puede emplear, por ejemplo, un pegamento de fusión a base de resinas termoplásticas de copoliéster.It has been proven that as a material coating can be used, for example, a melting glue based on thermoplastic copolyester resins.
Asimismo, como material de revestimiento puede emplearse una masa de relleno a base de una poliamida termoplástica o un adhesivo de fusión a base de una resina de poliamida termoplástica.Also, as a coating material, you can a filling mass based on a thermoplastic polyamide or a fusion adhesive based on a polyamide resin thermoplastic
Tales pegamentos de fusión, masas de relleno y adhesivos termoplásticos obtenibles en el mercado poseen puntos de fusión y puntos de reblandecimiento en el intervalo de temperaturas anteriormente indicado y son adecuados de manera excelente como material de revestimiento para el componente en miniatura según la invención.Such melting glues, fillers and thermoplastic adhesives obtainable in the market have points of melting and softening points in the temperature range indicated above and are excellently suitable as coating material for the miniature component according to the invention.
En lo que sigue, se explican con detalle, ayudándose de los dibujos adjuntos, algunos ejemplos de realización de componentes inductivos en miniatura para montaje SMD según la invención.In what follows, they are explained in detail, using the attached drawings, some examples of realization of miniature inductive components for SMD assembly according to the invention.
En los dibujos muestran:In the drawings they show:
La figura 1, un componente inductivo en miniatura en alzado lateral en su dirección longitudinal;Figure 1, an inductive component in miniature in lateral elevation in its longitudinal direction;
La figura 2, el componente inductivo en miniatura según la figura 1 en alzado lateral en su dirección transversal;Figure 2, the inductive component in miniature according to figure 1 in side elevation in its direction cross;
La figura 3, el componente inductivo en miniatura según las figuras 1 y 2 en una vista en planta;Figure 3, the inductive component in miniature according to figures 1 and 2 in a plan view;
La figura 4, en una representación análoga a la figura 1, otra forma de realización de un componente inductivo en miniatura;Figure 4, in a representation analogous to the Figure 1, another embodiment of an inductive component in miniature;
La figura 5, el componente inductivo en miniatura según la figura 4 en una representación análoga a la figura 2;Figure 5, the inductive component in miniature according to figure 4 in a representation analogous to the figure 2;
La figura 6, el componente inductivo en miniatura según la figura 4 en una representación análoga a la figura 3;Figure 6, the inductive component in miniature according to figure 4 in a representation analogous to the figure 3;
La figura 7, en sección transversal, un componente inductivo en miniatura en el estado fijado sobre una placa de circuito impreso; yFigure 7, in cross section, a inductive miniature component in the state set on a Printed circuit board; Y
La figura 8, el componente inductivo en miniatura según la figura 7 en el estado fijado sobre una placa de circuito impreso, en alzado lateral en su dirección transversal.Figure 8, the inductive component in miniature according to figure 7 in the state fixed on a plate printed circuit, side elevation in its transverse direction.
El componente inductivo en miniatura representado en las figuras 1 a 3 posee un núcleo de ferrita 1 con patas añadidas 2.1 y 2.2 en ambos extremos, el cual discurre en la dirección longitudinal de dicho componente y está configurado como una delgada varilla de sección transversal rectangular. Sobre el núcleo está aplicado un devanado de bobina 3 en el que los extremos de su bobina están arrollados alrededor de las patas añadidas 2.1 y 2.2 para formar elementos de conexión eléctrica 3.1 y 3.2.The inductive component in miniature represented in figures 1 to 3 has a ferrite core 1 with added legs 2.1 and 2.2 at both ends, which runs in the longitudinal direction of said component and is configured as a thin rod of rectangular cross section. About him core is applied a coil winding 3 in which the ends of its coil are wrapped around the added legs 2.1 and 2.2 to form electrical connection elements 3.1 and 3.2.
El componente está provisto, en su lado superior y en las dos superficies laterales, de un revestimiento que presenta así un segmento superior 4.1 y, en las paredes laterales, unos segmentos 4,2 y 4.3 que se extienden hacia abajo sobre una parte de la superficie lateral.The component is provided, on its upper side and on the two lateral surfaces, of a coating that it thus presents an upper segment 4.1 and, on the side walls, segments 4.2 and 4.3 that extend down on a part of the lateral surface.
El revestimiento dispuesto en el componente no ha de extenderse necesariamente por toda la longitud de dicho componente, sino que puede extenderse también sobre un segmento parcial de su longitud, es decir, por ejemplo, sobre un tercio de la longitud total. En las figuras 4 a 6 se representa un ejemplo de realización de esta clase. En las figuras 4 a 6 se han empleado los mismos números de referencia para piezas iguales y estos números están provistos de un apóstrofo. En este ejemplo de realización el revestimiento posee también un segmento superior 4.1' y, en las paredes laterales, unos segmentos 4.2' y 4.3'. Sin embargo, el revestimiento se extiende solamente sobre un segmento parcial de la longitud total que está situado en posición sustancialmente simétrica con respecto al eje longitudinal.The lining arranged in the component does not must necessarily extend over the entire length of said component, but can also extend over a segment partial of its length, that is, for example, about a third of the total length An example of Realization of this class. In figures 4 to 6 the same reference numbers for equal parts and these numbers They are provided with an apostrophe. In this embodiment, the coating also has a 4.1 'upper segment and, in the side walls, segments 4.2 'and 4.3'. However the coating extends only over a partial segment of the total length that is positioned substantially symmetric with respect to the longitudinal axis.
Al asentar estos componentes inductivos en miniatura sobre una placa o tarjeta de circuito impreso se sueldan los terminales eléctricos 3.1 y 3.2 ó 3.1' y 3.2' con pistas conductoras de la placa de circuito impreso. Se calientan entonces en su conjunto el componente y en particular el núcleo de ferrita. El material de revestimiento empleado posee un punto de fusión que se ha elegido de modo que el revestimiento aplicado se funda al menos parcialmente durante la soldadura y el calentamiento inherente de todo el componente, fluya entonces parcialmente hacia abajo hasta la placa de circuito impreso y, después del nuevo enfriamiento y endurecimiento, cree una sólida unión estabilizadora entre el componente y la placa de circuito impreso, mediante la cual se estabilice también el núcleo de ferrita 1, con lo que se reduce considerablemente su sensibilidad a la rotura.By seating these inductive components in miniature on a board or printed circuit board are welded electrical terminals 3.1 and 3.2 or 3.1 'and 3.2' with tracks conductors of the printed circuit board. They warm up then as a whole the component and in particular the ferrite core. The coating material used has a melting point that it has been chosen so that the applied coating is founded on less partially during welding and heating inherent in the whole component, then flow partially towards down to the printed circuit board and, after the new cooling and hardening, create a solid stabilizing bond between the component and the printed circuit board, whereby the ferrite core 1 is also stabilized, thereby reducing considerably its sensitivity to breakage.
En las figuras 7 y 8 se representa el estado de un componente inductivo en miniatura de la clase anteriormente descrita después de su asentamiento sobre una placa de circuito impreso 5 y de la unión de los elementos de conexión 3.1'' y 3.2'' a través de puntos de soldadura 6.1 y 6.2 con las pistas conductoras de la placa de circuito impreso 5. Este componente inductivo en miniatura posee también un núcleo de ferrita 1'' con patas añadidas 2.1'' y 2.2'' en ambos extremos, y sobre el núcleo está aplicado un devanado de bobina 3'' en el que los extremos de su bobina están arrollados alrededor de las patas añadidas 2.1'' y 2.2'' para formar los elementos de conexión eléctrica 3.1'' y 3.2''.In the figures 7 and 8 the state of a miniature inductive component of the class above described after its settlement on a circuit board printed 5 and the connection elements 3.1 '' and 3.2 '' through welding points 6.1 and 6.2 with the conductive tracks of the printed circuit board 5. This inductive component in Miniature also has a 1 '' ferrite core with added legs 2.1 '' and 2.2 '' at both ends, and on the core is applied a 3 '' coil winding in which the ends of your coil are wrapped around the added legs 2.1 '' and 2.2 '' to form the electrical connection elements 3.1 '' and 3.2 ''.
El material de revestimiento 4'' se aplicó al lado inferior del componente, por ejemplo - como se ha mencionado más arriba - en forma de una tira de película. Durante el calentamiento del componente producido por la soldadura se funde parcialmente el revestimiento 4'' y éste, como puede apreciarse en las figuras 7 y 8, forma una unión estable entre el componente y la placa de circuito impreso 5. Mediante esta unión estable se consigue, además, un alivio de carga de los puntos de soldadura 6.1 y 6.2 entre los elementos de conexión eléctrica 3.1'' y 3.2'' en las patas añadidas 2.1'' y 2.2'' y la placa de circuito impreso 5 y se reduce así el riesgo de que el componente se desprenda de la placa de circuito impreso 5 interrumpiendo la unión eléctrica.The coating material 4 '' was applied to the bottom side of the component, for example - as mentioned above - in the form of a film strip. During the heating of the component produced by welding melts partially the coating 4 '' and this one, as can be seen in Figures 7 and 8, form a stable joint between the component and the printed circuit board 5. Through this stable connection, also achieves a load relief of welding points 6.1 and 6.2 between the electrical connection elements 3.1 '' and 3.2 '' in the added feet 2.1 '' and 2.2 '' and the printed circuit board 5 and this reduces the risk of the component detaching from the printed circuit board 5 interrupting the electrical connection.
Claims (10)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE20300713U | 2003-01-16 | ||
| DE20300713U DE20300713U1 (en) | 2003-01-16 | 2003-01-16 | Miniature inductive component for SMD assembly |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ES2268259T3 true ES2268259T3 (en) | 2007-03-16 |
Family
ID=7979174
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| ES03026407T Expired - Lifetime ES2268259T3 (en) | 2003-01-16 | 2003-11-19 | MINIATURE INDUCTIVE COMPONENT FOR SMD ASSEMBLY. |
Country Status (6)
| Country | Link |
|---|---|
| EP (1) | EP1439551B1 (en) |
| AT (1) | ATE334470T1 (en) |
| DE (2) | DE20300713U1 (en) |
| DK (1) | DK1439551T3 (en) |
| ES (1) | ES2268259T3 (en) |
| PT (1) | PT1439551E (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE20318052U1 (en) * | 2003-11-21 | 2004-03-04 | Neosid Pemetzrieder Gmbh & Co Kg | Miniature inductive component for SMD assembly |
| DE102005022927A1 (en) † | 2005-05-13 | 2006-11-16 | Würth Elektronik iBE GmbH | Electrical coil element produced by automatic assembly has coil wound onto a core with increased spacing between sections |
| DE202005019496U1 (en) * | 2005-12-14 | 2007-04-26 | Neosid Pemetzrieder Gmbh & Co Kg | Inductive miniature component e.g., for SMD assemblies, has entrance aperture extending to transverse bars normal to the plane of frame |
| DE202005019497U1 (en) * | 2005-12-14 | 2007-04-26 | Neosid Pemetzrieder Gmbh & Co Kg | Inductive miniature component for SMD assembly, has entrance opening in connection flange extending in direction from upper to lower face of component |
| DE102009002288A1 (en) * | 2009-04-08 | 2010-10-14 | Endress + Hauser Gmbh + Co. Kg | Method for fixing through hole technology component on side of printed circuit board, involves applying molded part made from hot glue on adhesive area provided on printed circuit board for fixing through hole technology components |
| DE102010006010B4 (en) * | 2010-01-27 | 2014-08-14 | Atmel Corp. | IC package |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3104623A1 (en) * | 1981-02-10 | 1982-08-26 | Robert Bosch Gmbh, 7000 Stuttgart | METHOD FOR FASTENING COMPONENTS WITH FLAT CONNECTORS AND COMPONENT HERE |
| DE3708742A1 (en) * | 1987-03-18 | 1988-10-06 | Bosch Gmbh Robert | FERRITE CORE COILS WITH MORE THAN TWO COIL CONNECTORS FOR REFLOW SOLUTION ON A CIRCUIT BOARD |
| US4806895A (en) * | 1987-10-08 | 1989-02-21 | Zenith Electronics Corporation | Toroidal coil mount |
| JPH0845582A (en) * | 1994-08-01 | 1996-02-16 | Sumitomo Electric Ind Ltd | Fixing structure for on-vehicle surface mounting connector |
-
2003
- 2003-01-16 DE DE20300713U patent/DE20300713U1/en not_active Expired - Lifetime
- 2003-11-19 DK DK03026407T patent/DK1439551T3/en active
- 2003-11-19 PT PT03026407T patent/PT1439551E/en unknown
- 2003-11-19 DE DE50304353T patent/DE50304353D1/en not_active Expired - Lifetime
- 2003-11-19 AT AT03026407T patent/ATE334470T1/en active
- 2003-11-19 EP EP03026407A patent/EP1439551B1/en not_active Expired - Lifetime
- 2003-11-19 ES ES03026407T patent/ES2268259T3/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| EP1439551B1 (en) | 2006-07-26 |
| ATE334470T1 (en) | 2006-08-15 |
| DE20300713U1 (en) | 2003-03-27 |
| DK1439551T3 (en) | 2006-11-20 |
| PT1439551E (en) | 2006-11-30 |
| DE50304353D1 (en) | 2006-09-07 |
| EP1439551A1 (en) | 2004-07-21 |
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