DK1439551T3 - Inductive miniature component for surface mounting - Google Patents

Inductive miniature component for surface mounting

Info

Publication number
DK1439551T3
DK1439551T3 DK03026407T DK03026407T DK1439551T3 DK 1439551 T3 DK1439551 T3 DK 1439551T3 DK 03026407 T DK03026407 T DK 03026407T DK 03026407 T DK03026407 T DK 03026407T DK 1439551 T3 DK1439551 T3 DK 1439551T3
Authority
DK
Denmark
Prior art keywords
surface mounting
miniature component
inductive miniature
inductive
component
Prior art date
Application number
DK03026407T
Other languages
Danish (da)
Inventor
Eugeniusz Swoboda
Karl-Heinz Hoeller
Original Assignee
Pemetzrieder Neosid
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Pemetzrieder Neosid filed Critical Pemetzrieder Neosid
Application granted granted Critical
Publication of DK1439551T3 publication Critical patent/DK1439551T3/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H05K3/305—Affixing by adhesive
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/02—Casings
    • H01F27/027—Casings specially adapted for combination of signal type inductors or transformers with electronic circuits, e.g. mounting on printed circuit boards
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/24—Magnetic cores
    • H01F27/26—Fastening parts of the core together; Fastening or mounting the core on casing or support
    • H01F27/266—Fastening or mounting the core on casing or support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/29—Terminals; Tapping arrangements for signal inductances
    • H01F27/292—Surface mounted devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/04—Fixed inductances of the signal type  with magnetic core
    • H01F17/045—Fixed inductances of the signal type  with magnetic core with core of cylindric geometry and coil wound along its longitudinal axis, i.e. rod or drum core
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/1003—Non-printed inductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10984—Component carrying a connection agent, e.g. solder, adhesive
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Multi-Conductor Connections (AREA)
  • Details Of Resistors (AREA)

Abstract

The inductive miniature component to be combined with a single-piece ferrite core (1) is provided with a coating (4.1, 4.2, 4.3) which is located at least on a part of its longitudinal surface, and consists of a material with a melting point below the soldering temperature of the electrical connector elements.
DK03026407T 2003-01-16 2003-11-19 Inductive miniature component for surface mounting DK1439551T3 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE20300713U DE20300713U1 (en) 2003-01-16 2003-01-16 Miniature inductive component for SMD assembly

Publications (1)

Publication Number Publication Date
DK1439551T3 true DK1439551T3 (en) 2006-11-20

Family

ID=7979174

Family Applications (1)

Application Number Title Priority Date Filing Date
DK03026407T DK1439551T3 (en) 2003-01-16 2003-11-19 Inductive miniature component for surface mounting

Country Status (6)

Country Link
EP (1) EP1439551B1 (en)
AT (1) ATE334470T1 (en)
DE (2) DE20300713U1 (en)
DK (1) DK1439551T3 (en)
ES (1) ES2268259T3 (en)
PT (1) PT1439551E (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE20318052U1 (en) * 2003-11-21 2004-03-04 Neosid Pemetzrieder Gmbh & Co Kg Miniature inductive component for SMD assembly
DE102005022927A1 (en) * 2005-05-13 2006-11-16 Würth Elektronik iBE GmbH Electrical coil element produced by automatic assembly has coil wound onto a core with increased spacing between sections
DE202005019497U1 (en) * 2005-12-14 2007-04-26 Neosid Pemetzrieder Gmbh & Co Kg Inductive miniature component for SMD assembly, has entrance opening in connection flange extending in direction from upper to lower face of component
DE202005019496U1 (en) * 2005-12-14 2007-04-26 Neosid Pemetzrieder Gmbh & Co Kg Inductive miniature component e.g., for SMD assemblies, has entrance aperture extending to transverse bars normal to the plane of frame
DE102009002288A1 (en) * 2009-04-08 2010-10-14 Endress + Hauser Gmbh + Co. Kg Method for fixing through hole technology component on side of printed circuit board, involves applying molded part made from hot glue on adhesive area provided on printed circuit board for fixing through hole technology components
DE102010006010B4 (en) * 2010-01-27 2014-08-14 Atmel Corp. IC package

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4456900A (en) 1980-05-23 1984-06-26 Tdk Electronics Co., Ltd. High frequency coil
DE3104623A1 (en) * 1981-02-10 1982-08-26 Robert Bosch Gmbh, 7000 Stuttgart METHOD FOR FASTENING COMPONENTS WITH FLAT CONNECTORS AND COMPONENT HERE
DE3615307C2 (en) 1986-05-06 1994-07-07 Johann Leonhard Huettlinger Coil for automatic SMD assembly
DE3708742A1 (en) * 1987-03-18 1988-10-06 Bosch Gmbh Robert FERRITE CORE COILS WITH MORE THAN TWO COIL CONNECTORS FOR REFLOW SOLUTION ON A CIRCUIT BOARD
US4806895A (en) * 1987-10-08 1989-02-21 Zenith Electronics Corporation Toroidal coil mount
JPH0845582A (en) * 1994-08-01 1996-02-16 Sumitomo Electric Ind Ltd Fixing structure for on-vehicle surface mounting connector
DE19523521A1 (en) 1995-06-30 1997-01-02 Licentia Gmbh Electrical transponder coil and circuit assembly
DE19547091B4 (en) 1995-12-16 2005-04-07 Kaschke Kg (Gmbh & Co.) Antenna coil with surface mountable housing and method of making the same
US6084500A (en) 1997-03-28 2000-07-04 Matsushita Electric Industrial Co., Ltd. Chip inductor and method for manufacturing the same
JP4039779B2 (en) 1999-01-28 2008-01-30 太陽誘電株式会社 Manufacturing method of chip-shaped electronic component

Also Published As

Publication number Publication date
DE50304353D1 (en) 2006-09-07
PT1439551E (en) 2006-11-30
ES2268259T3 (en) 2007-03-16
ATE334470T1 (en) 2006-08-15
EP1439551B1 (en) 2006-07-26
EP1439551A1 (en) 2004-07-21
DE20300713U1 (en) 2003-03-27

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