ES2168763T3 - Caja de disipacion de calor para alojar componentes electricos o electronicos. - Google Patents

Caja de disipacion de calor para alojar componentes electricos o electronicos.

Info

Publication number
ES2168763T3
ES2168763T3 ES98925638T ES98925638T ES2168763T3 ES 2168763 T3 ES2168763 T3 ES 2168763T3 ES 98925638 T ES98925638 T ES 98925638T ES 98925638 T ES98925638 T ES 98925638T ES 2168763 T3 ES2168763 T3 ES 2168763T3
Authority
ES
Spain
Prior art keywords
thermal contact
accommodation
stay
electrical
heat dissipation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES98925638T
Other languages
English (en)
Inventor
Karsten Hubner
Martin Diehl
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lenze GmbH and Co Kg
Original Assignee
Lenze GmbH and Co Kg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lenze GmbH and Co Kg filed Critical Lenze GmbH and Co Kg
Application granted granted Critical
Publication of ES2168763T3 publication Critical patent/ES2168763T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1417—Mounting supporting structure in casing or on frame or rack having securing means for mounting boards, plates or wiring boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/2049—Pressing means used to urge contact, e.g. springs

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

LA INVENCION TRATA DE UN ALOJAMIENTO DISEÑADO PARA ALOJARSE EN UNA PLACA DE CIRCUITO IMPRESO (12) QUE TIENE AL MENOS UN COMPONENTE ELECTRICO O ELECTRONICO (13) CON UN ELEMENTO DE CONTACTO TERMICO (14). EL ALOJAMIENTO COSTA DE UNA SECCION EXTRUIDA DE METAL LIGERO (1) QUE FORMA UNA PIEZA UNICA Y TIENE UNOS CONTORNOS ACOMODADOS (10, 11) EN SU INTERIOR PARA LA PLACA IMPRESA (12), Y UNA SUPERFICIE DE CONTACTO (15) PARA SOPORTAR EL ELEMENTO DE CONTACTO TERMICO (14) DEL COMPONENTE APROPIADO (13). CON EL FIN DE PRODUCIR UN CONTACTO TERMICO AUTOMATICO ENTRE EL ELEMENTO DE CONTACTO TERMICO (14) Y LA SUPERFICIE DE CONTACTO (15) EN EL INTERIOR DEL ALOJAMIENTO, UNA VEZ EQUIPADO ESTE ULTIMO, AL MENOS UNO DE LOS LADOS (3, 4) PUEDE EXPANDIRSE, O SE EXPANDE EN RELACION CON EL LADO DE LA BASE (2) Y/O EL LADO OPUESTO DE LA SECCION EXTRUIDA EN UNA POSICION DE PARTIDA. POR DEFORMACION PLASTICA Y DIRECCION DE DICHO LADO (2) HASTA SU POSICION FINAL EN SU ZONA DE CONEXION, SE EJERCE AUTOMATICAMENTE UNA PRESION SOBRE EL COMPONENTE (13) QUE DEBE ENFRIARSE, CUYA SUPERFICIE DE CONTACTO TERMICO (14) ES ASI PRESIONADA CONTRA LA SUPERFICIE DE CONTACTO (15) DEL ALOJAMIENTO.
ES98925638T 1997-05-30 1998-05-27 Caja de disipacion de calor para alojar componentes electricos o electronicos. Expired - Lifetime ES2168763T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19722602A DE19722602C2 (de) 1997-05-30 1997-05-30 Wärmeableitendes Gehäuse zur Aufnahme von elektrischen oder elektronischen Bauteilen

Publications (1)

Publication Number Publication Date
ES2168763T3 true ES2168763T3 (es) 2002-06-16

Family

ID=7830896

Family Applications (1)

Application Number Title Priority Date Filing Date
ES98925638T Expired - Lifetime ES2168763T3 (es) 1997-05-30 1998-05-27 Caja de disipacion de calor para alojar componentes electricos o electronicos.

Country Status (6)

Country Link
US (1) US6225559B1 (es)
EP (1) EP0927510B1 (es)
DE (2) DE19722602C2 (es)
DK (1) DK0927510T3 (es)
ES (1) ES2168763T3 (es)
WO (1) WO1998054940A1 (es)

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JP4415503B2 (ja) * 2000-05-12 2010-02-17 株式会社デンソー 半導体装置
DE20101106U1 (de) * 2001-01-22 2001-04-05 David & Baader Dbk Gmbh Schutzelement in einem elektrischen Schaltkreis
DE20115659U1 (de) 2001-09-24 2002-02-14 Trw Automotive Electron & Comp Gehäuse für ein elektronisches Steuergerät in Fahrzeugen
US6583988B1 (en) * 2002-02-05 2003-06-24 Whelen Engineering Company, Inc. Encapsulated power supply
US6864573B2 (en) * 2003-05-06 2005-03-08 Daimlerchrysler Corporation Two piece heat sink and device package
DE10326458B4 (de) * 2003-06-12 2006-05-04 Phoenix Contact Gmbh & Co. Kg Kühlanordnung für elektronische Bauelemente
DE10334060B3 (de) * 2003-07-25 2005-04-07 Siemens Ag Schaltungsmodul und Verfahren zu dessen Herstellung
DE10334629B3 (de) 2003-07-29 2005-04-07 Siemens Ag Schaltungsmodul und Verfahren zu dessen Herstellung
EP1511368B1 (de) * 2003-08-29 2015-05-20 Hirschmann Car Communication GmbH Sandwich Gehäuse für einen Antennenverstärker
CN100478832C (zh) * 2004-08-19 2009-04-15 富士通株式会社 壳体结构和具有该壳体结构的电子设备
US20060101536A1 (en) * 2004-11-05 2006-05-11 Arborgen, Llc Eucalyptus urophylla transformation and regeneration
TWI247574B (en) * 2004-11-30 2006-01-11 Silicon Integrated Sys Corp Heat dissipation mechanism for electronic device
DE102005015749A1 (de) * 2005-04-06 2006-10-12 Conti Temic Microelectronic Gmbh Kühlvorrichtung für Leiterplatten und Verfahren zur Herstellung derselben
DE102005035378B3 (de) * 2005-06-25 2006-11-23 Lear Corporation Gmbh & Co. Kg Anordung zum Kühlen von auf einer Leiterplatte angeordneten Bauelementen
US7336491B2 (en) 2005-09-06 2008-02-26 Lear Corporation Heat sink
GB2430310A (en) * 2005-09-15 2007-03-21 Tyco Electronics A heat dissipation device
DE102006027104B3 (de) * 2006-06-09 2007-08-23 Fpe Fischer Gmbh Verbindungsbox und Verfahren zum Schutz und Überwachung von einzelnen Solar-Panels vor Überhitzung
DE102006039506B3 (de) * 2006-08-23 2008-01-03 Siemens Ag Österreich Kühlanordnung
JP5044476B2 (ja) 2008-04-11 2012-10-10 ホシデン株式会社 シールドケース及び基板アッセンブリ
JP4548517B2 (ja) * 2008-05-26 2010-09-22 株式会社豊田自動織機 発熱部品の実装構造及び実装方法
US8773864B2 (en) * 2008-06-18 2014-07-08 Lockheed Martin Corporation Enclosure assembly housing at least one electronic board assembly and systems using same
US8189345B2 (en) * 2008-06-18 2012-05-29 Lockheed Martin Corporation Electronics module, enclosure assembly housing same, and related systems and methods
DE202008013766U1 (de) 2008-11-10 2009-01-08 Lear Corporation Gmbh Gehäuse zur Aufnahme mindestens einer mit Bauelementen bestückten Leiterplatte
US8072761B2 (en) 2009-05-14 2011-12-06 American Power Conversion Corporation Power semiconductor heatsinking
US8169781B2 (en) * 2010-04-06 2012-05-01 Fsp Technology Inc. Power supply and heat dissipation module thereof
DE102010030460A1 (de) * 2010-06-24 2011-12-29 Robert Bosch Gmbh Elektronisches Gerät mit Gehäuse aus Profilmaterial
DE102011005890A1 (de) * 2011-03-22 2012-09-27 Robert Bosch Gmbh Elektronikgerät mit Schaltungsträger in einem Einschubgehäuse
JP5883420B2 (ja) * 2013-08-26 2016-03-15 原田工業株式会社 車載用回路基板保持構造
DE102015202142A1 (de) 2015-02-06 2016-08-11 Mahle International Gmbh Elektrische Einrichtung
FR3035266B1 (fr) * 2015-04-17 2017-03-31 Sagemcom Broadband Sas Equipement electronique
US11560101B2 (en) 2020-11-17 2023-01-24 Ford Global Technologies, Llc Headliner-mounted telematics control unit package
KR20220092263A (ko) * 2020-12-24 2022-07-01 현대모비스 주식회사 전력부품의 방열 조립 구조

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Publication number Priority date Publication date Assignee Title
DE8528177U1 (de) * 1985-10-03 1985-11-21 Eberle GmbH, 8500 Nürnberg Kühlkörper in Gehäuseform für einen Regler mit einschiebbarer Leiterplatte
US4809875A (en) * 1987-11-30 1989-03-07 Yazaki Corporation Electrical component container having improved hinge unit
DE8901279U1 (es) * 1989-02-05 1989-03-23 Asea Brown Boveri Ag, 6800 Mannheim, De
DE3912730C2 (de) * 1989-04-19 1993-11-18 Stocko Metallwarenfab Henkels Gehäuse mit Deckel und Filmscharnier
DE9213671U1 (es) * 1991-11-11 1992-12-03 Tridonic-Bauelemente Gmbh, Dornbirn, At
US5321582A (en) * 1993-04-26 1994-06-14 Cummins Engine Company, Inc. Electronic component heat sink attachment using a low force spring
US5402313A (en) * 1993-05-21 1995-03-28 Cummins Engine Company, Inc. Electronic component heat sink attachment using a canted coil spring
US5309979A (en) * 1993-06-08 1994-05-10 Delco Electronics Corp. Self clamping heat sink assembly
US5476699A (en) * 1993-11-02 1995-12-19 Hughes Aircraft Company Extrusion interlock assembly
US5461541A (en) * 1994-02-22 1995-10-24 Dana Corporation Enclosure for an electronic circuit module
DE19543260C2 (de) * 1995-11-20 2001-09-20 Robert Seuffer Gmbh & Co Elektrische Bauelementeanordnung mit mehreren in einem Gehäuse angeordneten elektrischen Bauelementen
US5959839A (en) * 1997-01-02 1999-09-28 At&T Corp Apparatus for heat removal using a flexible backplane

Also Published As

Publication number Publication date
DE59802426D1 (de) 2002-01-24
US6225559B1 (en) 2001-05-01
DK0927510T3 (da) 2002-03-25
DE19722602C2 (de) 2001-03-29
WO1998054940A1 (de) 1998-12-03
EP0927510B1 (de) 2001-12-12
DE19722602A1 (de) 1998-12-03
EP0927510A1 (de) 1999-07-07

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