ES2166119T3 - Componente para la transmision optica de datos. - Google Patents

Componente para la transmision optica de datos.

Info

Publication number
ES2166119T3
ES2166119T3 ES98110243T ES98110243T ES2166119T3 ES 2166119 T3 ES2166119 T3 ES 2166119T3 ES 98110243 T ES98110243 T ES 98110243T ES 98110243 T ES98110243 T ES 98110243T ES 2166119 T3 ES2166119 T3 ES 2166119T3
Authority
ES
Spain
Prior art keywords
component
chip
radiation
data transmission
optical data
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES98110243T
Other languages
English (en)
Inventor
Werner Dr Schairer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Vishay Semiconductor GmbH
Original Assignee
Vishay Semiconductor GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Vishay Semiconductor GmbH filed Critical Vishay Semiconductor GmbH
Application granted granted Critical
Publication of ES2166119T3 publication Critical patent/ES2166119T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4246—Bidirectionally operating package structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0232—Optical elements or arrangements associated with the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/12—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto
    • H01L31/16—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto the semiconductor device sensitive to radiation being controlled by the light source or sources
    • H01L31/167—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto the semiconductor device sensitive to radiation being controlled by the light source or sources the light sources and the devices sensitive to radiation all being semiconductor devices characterised by potential barriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H01L2924/1815—Shape

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Optics & Photonics (AREA)
  • Optical Communication System (AREA)
  • Light Receiving Elements (AREA)
  • Led Device Packages (AREA)

Abstract

COMPONENTE PARA LA TRANSMISION OPTICA BIDIRECCIONAL ORIENTADA DE DATOS, EN LA CUAL ESTAN DISPUESTOS EN UNA CARCASA DE UNA O VARIAS PIEZAS COMO COMPONENTES UN CHIP EMISOR PARA EMITIR RADIACION IR, UN CHIP DETECTOR PARA RECIBIR RADIACION IR, UN CIRCUITO INTEGRADO PARA AMPLIFICAR LA POTENCIA DE TRANSMISION Y RECEPCION Y UN SISTEMA OPTICO CON UN EJE OPTICO PARA REUNIR EN UN HAZ LA RADIACION EMITIDA Y RECIBIDA. LO CARACTERISTICO ES QUE EL CHIP DETECTOR Y EL CHIP EMISOR ESTEN DISPUESTOS CONCENTRICOS ENTRE SI CON RESPECTO AL EJE OPTICO DEL SISTEMA OPTICO Y SOBRE EL CIRCUITO INTEGRADO.
ES98110243T 1997-06-28 1998-06-05 Componente para la transmision optica de datos. Expired - Lifetime ES2166119T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19727632A DE19727632C2 (de) 1997-06-28 1997-06-28 Sende-/Empfangsgerät zur optischen Datenübertragung

Publications (1)

Publication Number Publication Date
ES2166119T3 true ES2166119T3 (es) 2002-04-01

Family

ID=7834004

Family Applications (1)

Application Number Title Priority Date Filing Date
ES98110243T Expired - Lifetime ES2166119T3 (es) 1997-06-28 1998-06-05 Componente para la transmision optica de datos.

Country Status (6)

Country Link
US (1) US6320686B1 (es)
EP (1) EP0903791B1 (es)
JP (1) JPH1197748A (es)
DE (2) DE19727632C2 (es)
ES (1) ES2166119T3 (es)
PL (1) PL193016B1 (es)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19823213C2 (de) * 1998-05-25 2002-02-21 Infineon Technologies Ag Bidirektionale optische Sende- und Empfangseinrichtung
DE19834090A1 (de) * 1998-07-29 2000-02-03 Heidenhain Gmbh Dr Johannes Optoelektronische Sende- und Empfangseinheit
US6721503B1 (en) * 1998-08-26 2004-04-13 Georgia Tech Research Corporation System and method for bi-directional optical communication using stacked emitters and detectors
US6625036B1 (en) * 1999-08-31 2003-09-23 Rohm Co., Ltd. Infrared data communication module and method of making the same
JP3930710B2 (ja) * 2000-09-13 2007-06-13 シチズン電子株式会社 チップ型発光ダイオード及びその製造方法
DE10058622A1 (de) * 2000-11-15 2002-05-29 Vishay Semiconductor Gmbh Gemouldetes elektronisches Bauelement
DE10058608A1 (de) 2000-11-25 2002-05-29 Vishay Semiconductor Gmbh Leiterstreifenanordnung für ein gemouldetes elektronisches Bauelement und Verfahren zum Moulden
US6661546B1 (en) 2002-03-28 2003-12-09 Terabeam Corporation Multi-aperture holographic optical element for illumination sensing in a free space optical communication system
US6731415B1 (en) 2002-03-28 2004-05-04 Terabeam Corporation Multi-aperture holographic optical element for use in a free space optical communication system
US7978800B2 (en) 2002-10-10 2011-07-12 Finisar Corporation Circuit for converting a transponder controller chip output into an appropriate input signal for a host device
US7023563B2 (en) * 2003-02-14 2006-04-04 Chian Chiu Li Interferometric optical imaging and storage devices
US7397022B2 (en) * 2004-04-01 2008-07-08 Vishay Semiconductor Gmbh Sensor arrangement to prevent reference light incident on side of photodiode
JP4210240B2 (ja) * 2004-06-03 2009-01-14 ローム株式会社 光通信モジュール
US7385175B2 (en) * 2004-09-18 2008-06-10 Chian Chiu Li Bi-directional optical transmission system and method

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2629356C2 (de) * 1976-06-30 1983-07-21 AEG-Telefunken Nachrichtentechnik GmbH, 7150 Backnang Elektrooptischer Wandler zum Senden oder Empfangen
GB2011610A (en) * 1977-12-23 1979-07-11 Elliot Bros Ltd Fibre optic terminal
DE3502634A1 (de) * 1985-01-26 1985-06-20 Deutsche Forschungs- und Versuchsanstalt für Luft- und Raumfahrt e.V., 5000 Köln Optisch-elektronischer entfernungsmesser
JPH04237005A (ja) * 1991-01-22 1992-08-25 Fujitsu Ltd 受光モジュール
US5140152A (en) * 1991-05-31 1992-08-18 The University Of Colorado Foundation, Inc. Full duplex optoelectronic device with integral emitter/detector pair
US5267070A (en) * 1992-05-05 1993-11-30 The United States Of America As Represented By The Secretary Of The Navy Underwater IR communication system
US5506445A (en) 1994-06-24 1996-04-09 Hewlett-Packard Company Optical transceiver module

Also Published As

Publication number Publication date
US6320686B1 (en) 2001-11-20
EP0903791B1 (de) 2001-11-21
DE59802691D1 (de) 2002-02-21
EP0903791A2 (de) 1999-03-24
DE19727632A1 (de) 1999-01-28
EP0903791A3 (de) 1999-12-22
JPH1197748A (ja) 1999-04-09
PL326787A1 (en) 1999-01-04
DE19727632C2 (de) 1999-10-28
PL193016B1 (pl) 2007-01-31

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