ES2161222T3 - Modulo de emision y recepcion con longitud de onda de emision estabilizada en la temperatura. - Google Patents

Modulo de emision y recepcion con longitud de onda de emision estabilizada en la temperatura.

Info

Publication number
ES2161222T3
ES2161222T3 ES93114860T ES93114860T ES2161222T3 ES 2161222 T3 ES2161222 T3 ES 2161222T3 ES 93114860 T ES93114860 T ES 93114860T ES 93114860 T ES93114860 T ES 93114860T ES 2161222 T3 ES2161222 T3 ES 2161222T3
Authority
ES
Spain
Prior art keywords
optical
emission
issuer
wave length
reception module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES93114860T
Other languages
English (en)
Inventor
Hans Ludwig Dr Rer Nat Althaus
Gerhard Dr Rer Nat Kuhn
Klaus Dr-Ing Panzer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Infineon Technologies AG
Original Assignee
Infineon Technologies AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Infineon Technologies AG filed Critical Infineon Technologies AG
Application granted granted Critical
Publication of ES2161222T3 publication Critical patent/ES2161222T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
    • H04B10/40—Transceivers
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4246—Bidirectionally operating package structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding

Landscapes

  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Signal Processing (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Semiconductor Lasers (AREA)

Abstract

LA INVENCION SE REFIERE A UN MODULO DE EMISION Y RECEPCION PARA UNA TRANSMISION DE SEÑAL Y DE MENSAJES OPTICA BIDIRECCIONAL CON AL MENOS UN EMISOR (1) OPTICO, AL MENOS UN RECEPTOR (2) OPTICO, AL MENOS UNA CONEXION (4) DE FIBRA PARA UNA FIBRA OPTICA (6), CON UNA OPTICA (7,9,10) DE ACOPLAMIENTO DE LENTE Y AL MENOS UN DIVISOR (3) DE RADIACION DISPUESTO ENTRE VIAS (11) DE RADIACION, QUE ESTAN DISPUESTAS EN UNA CARCASA (5) CONJUNTA. DEBE CONSEGUIRSE UN EMISOR OPTICO CON UNA LONGITUD DE ONDAS DE EMISION MUY ESTABLE. EL EMISOR (1) OPTICO ES UN DIODO LASER, QUE ESTA UNIDO DE FORMA DIRECTA O INDIRECTA CON UN EQUIPO (12) DE CALENTAMIENTO. UTILIZACION: MODULO EMISOR-RECEPTOR PARA CONEXION DE PARTICIPANTE.
ES93114860T 1993-09-15 1993-09-15 Modulo de emision y recepcion con longitud de onda de emision estabilizada en la temperatura. Expired - Lifetime ES2161222T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP19930114860 EP0644669B1 (de) 1993-09-15 1993-09-15 Sende- und Empfangsmodul mit temperaturstabilisierter Sendewellenlänge

Publications (1)

Publication Number Publication Date
ES2161222T3 true ES2161222T3 (es) 2001-12-01

Family

ID=8213267

Family Applications (1)

Application Number Title Priority Date Filing Date
ES93114860T Expired - Lifetime ES2161222T3 (es) 1993-09-15 1993-09-15 Modulo de emision y recepcion con longitud de onda de emision estabilizada en la temperatura.

Country Status (3)

Country Link
EP (1) EP0644669B1 (es)
DE (1) DE59310201D1 (es)
ES (1) ES2161222T3 (es)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1999057594A1 (de) 1998-04-30 1999-11-11 Infineon Technologies Ag Bidirektionales optisches modul für mehrkanal-anwendung
DE10002521A1 (de) * 2000-01-21 2001-08-09 Infineon Technologies Ag Elektrooptisches Datenübertragungsmodul
DE10037902C2 (de) * 2000-08-03 2002-08-01 Infineon Technologies Ag Optisches bidirektionales Sende- und Empfangsmodul mit einem Stiftkörper mit integriertem WDM-Filter
JP3861816B2 (ja) 2003-01-24 2006-12-27 住友電気工業株式会社 光送受信モジュール及びその製造方法
JP2004354752A (ja) 2003-05-29 2004-12-16 Sumitomo Electric Ind Ltd 一心双方向光モジュールのジョイントフォルダ
CN100397128C (zh) * 2004-12-10 2008-06-25 财团法人工业技术研究院 一种光纤波导式光学次模块
US7570679B2 (en) 2006-02-22 2009-08-04 Optical Communication Products, Inc. Wide temperature range uncooled transceiver module for uncontrolled environments
CN102854584A (zh) * 2012-10-09 2013-01-02 索尔思光电（成都）有限公司 一种单纤双向光收发器

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0463214B1 (de) * 1990-06-27 1995-09-13 Siemens Aktiengesellschaft Sende- und Empfangsmodul für eine bidirektionale optische Nachrichten- und Signalübertragung

Also Published As

Publication number Publication date
EP0644669B1 (de) 2001-08-08
DE59310201D1 (de) 2001-09-13
EP0644669A1 (de) 1995-03-22

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