ES2158033T3 - Modulo electronico y soporte de datos con modulo electronico. - Google Patents
Modulo electronico y soporte de datos con modulo electronico.Info
- Publication number
- ES2158033T3 ES2158033T3 ES95119306T ES95119306T ES2158033T3 ES 2158033 T3 ES2158033 T3 ES 2158033T3 ES 95119306 T ES95119306 T ES 95119306T ES 95119306 T ES95119306 T ES 95119306T ES 2158033 T3 ES2158033 T3 ES 2158033T3
- Authority
- ES
- Spain
- Prior art keywords
- leadframe
- section
- electronic module
- central section
- data support
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/0772—Physical layout of the record carrier
- G06K19/07728—Physical layout of the record carrier the record carrier comprising means for protection against impact or bending, e.g. protective shells or stress-absorbing layers around the integrated circuit
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07743—External electrical contacts
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/35—Mechanical effects
- H01L2924/351—Thermal stress
- H01L2924/3511—Warping
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Credit Cards Or The Like (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Mobile Radio Communication Systems (AREA)
Abstract
SE PRESENTA UN MODULO DE ESTRUCTURA DE GUIA PARA MONTAJE EN UN SOPORTE DE DATOS, DE FORMA QUE SE DIVIDE EN DOS ZONAS, ES DECIR UNA ZONA CENTRAL, QUE RECIBE LOS COMPONENTES SENSIBLES DEL MODULO Y UNA ZONA EXTERIOR, QUE SE DISPONE A TRAVES DEL BORDE DE LA ZONA CENTRAL Y SIRVE PARA EL ENLACE DEL MODULO DE ESTRUCTURA DE GUIA CON EL SOPORTE DE DATOS. PARA EVITAR QUE EN CARGAS ELASTICAS DEL SOPORTE DE DATOS PUEDAN TRANSMITIRSE FUERZAS A PARTIR DE LA ZONA EXTERIOR DEL MODULO ELECTRONICO A LA ZONA CENTRAL, SE DESACOPLA MECANICAMENTE LA ZONA EXTERIOR DE LA ZONA CENTRAL. ESTO SE HA PREVISTO POR EJEMPLO MEDIANTE PREVISION DE ESTAMPACIONES DE DESCARGA EN LA ZONA EXTERIOR.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE4443767A DE4443767A1 (de) | 1994-12-08 | 1994-12-08 | Elektronisches Modul und Datenträger mit elektrischem Modul |
Publications (1)
Publication Number | Publication Date |
---|---|
ES2158033T3 true ES2158033T3 (es) | 2001-09-01 |
Family
ID=6535315
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ES95119306T Expired - Lifetime ES2158033T3 (es) | 1994-12-08 | 1995-12-07 | Modulo electronico y soporte de datos con modulo electronico. |
Country Status (7)
Country | Link |
---|---|
US (1) | US5834755A (es) |
EP (1) | EP0716394B1 (es) |
JP (1) | JP4140983B2 (es) |
AT (1) | ATE202866T1 (es) |
DE (2) | DE4443767A1 (es) |
DK (1) | DK0716394T3 (es) |
ES (1) | ES2158033T3 (es) |
Families Citing this family (38)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19512725C1 (de) * | 1995-04-05 | 1996-09-12 | Orga Kartensysteme Gmbh | Ausweiskarte o.dgl. in Form einer Chipkarte |
DE19535989C3 (de) * | 1995-09-27 | 2003-03-27 | Siemens Ag | Chipmodul |
US6072698A (en) * | 1995-09-27 | 2000-06-06 | Siemens Aktiengesellschaft | Chip module with heat insulation for incorporation into a chip card |
FR2749687B1 (fr) * | 1996-06-07 | 1998-07-17 | Solaic Sa | Carte a memoire et procede de fabrication d'une telle carte |
FR2751918B1 (fr) * | 1996-07-30 | 1998-10-02 | Solaic Sa | Carte a memoire, et procede de fabrication d'une telle carte |
US6068191A (en) * | 1996-08-01 | 2000-05-30 | Siemens Aktiengesellschaft | Smart card with card body and semiconductor chip on a leadframe |
DE19632113C1 (de) | 1996-08-08 | 1998-02-19 | Siemens Ag | Chipkarte, Verfahren zur Herstellung einer Chipkarte und Halbleiterchip zur Verwendung in einer Chipkarte |
DE19701163C2 (de) * | 1997-01-15 | 2001-12-06 | Siemens Ag | Elektrische Schaltung insbesondere für eine Chipkarte |
DE19732915C1 (de) | 1997-07-30 | 1998-12-10 | Siemens Ag | Verfahren zur Herstellung eines Chipmoduls |
DE19743409A1 (de) * | 1997-10-01 | 1999-04-08 | Bosch Gmbh Robert | Meßvorrichtung zur Messung der Masse eines strömenden Mediums |
WO1999050792A1 (en) * | 1998-03-27 | 1999-10-07 | Koninklijke Philips Electronics N.V. | Data carrier having an implanted module based on a metal lead frame |
DE69937936T2 (de) * | 1998-03-27 | 2009-01-08 | Nxp B.V. | Datenträger mit einem auf leiterrahmen basierten modul mit doppelseitiger chip-abdeckung |
FR2778997B1 (fr) | 1998-05-20 | 2000-06-23 | Bull Cp8 | Support pour un circuit electronique, comprenant des moyens anti-arrachement |
FR2779851B1 (fr) * | 1998-06-12 | 2002-11-29 | Gemplus Card Int | Procede de fabrication d'une carte a circuit integre et carte obtenue |
FR2788882A1 (fr) * | 1999-01-27 | 2000-07-28 | Schlumberger Systems & Service | Dispositif a circuits integres, module electronique pour carte a puce utilisant le dispositif et procede de fabrication dudit dispositif |
US6179210B1 (en) * | 1999-02-09 | 2001-01-30 | Motorola, Inc. | Punch out pattern for hot melt tape used in smartcards |
FR2793330B1 (fr) * | 1999-05-06 | 2001-08-10 | Oberthur Card Systems Sas | Procede de montage d'un microcircuit dans une cavite d'une carte formant support et carte ainsi obtenue |
JP2002544656A (ja) * | 1999-05-14 | 2002-12-24 | ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング | 接点配置及び対応接点モジュール |
DE50015305D1 (de) * | 2000-02-02 | 2008-09-25 | Infineon Technologies Ag | Chipkarte mit Sollbiegestellen |
DE10101280A1 (de) * | 2001-01-12 | 2002-07-25 | Infineon Technologies Ag | Chipträger für Chipmodul |
US6910635B1 (en) * | 2002-10-08 | 2005-06-28 | Amkor Technology, Inc. | Die down multi-media card and method of making same |
JP4437014B2 (ja) * | 2003-04-25 | 2010-03-24 | パナソニック株式会社 | 電子回路装置 |
US20060146271A1 (en) * | 2005-01-04 | 2006-07-06 | Pennaz Thomas J | Universal display module |
US7599192B2 (en) * | 2005-04-11 | 2009-10-06 | Aveso, Inc. | Layered structure with printed elements |
US7821794B2 (en) * | 2005-04-11 | 2010-10-26 | Aveso, Inc. | Layered label structure with timer |
JP4736557B2 (ja) * | 2005-06-15 | 2011-07-27 | 大日本印刷株式会社 | Icカード用icモジュールとその製造方法 |
EP1804200B1 (en) * | 2005-12-30 | 2009-04-08 | Incard SA | IC card with improved printed circuit |
EP1804201B1 (en) * | 2005-12-30 | 2009-05-13 | Incard SA | Module for an IC card |
DE102006028815B3 (de) * | 2006-06-21 | 2007-08-30 | Hansa Tronic Gmbh | Verfahren zur Herstellung eines elektrischen Hybridbauteils |
EP2418608A1 (fr) * | 2010-07-23 | 2012-02-15 | Gemalto SA | Module électronique sécurisé, dispositif à module électronique sécurisé et procédé de fabrication |
US8649820B2 (en) | 2011-11-07 | 2014-02-11 | Blackberry Limited | Universal integrated circuit card apparatus and related methods |
US8936199B2 (en) | 2012-04-13 | 2015-01-20 | Blackberry Limited | UICC apparatus and related methods |
USD703208S1 (en) | 2012-04-13 | 2014-04-22 | Blackberry Limited | UICC apparatus |
USD701864S1 (en) * | 2012-04-23 | 2014-04-01 | Blackberry Limited | UICC apparatus |
USD707682S1 (en) * | 2012-12-05 | 2014-06-24 | Logomotion, S.R.O. | Memory card |
FR2999112B1 (fr) * | 2012-12-12 | 2015-02-06 | Oberthur Technologies | Plaque de lamination a structure double plaque |
CN107111767B (zh) * | 2014-12-23 | 2020-11-20 | 3M创新有限公司 | 柔性射频识别标签 |
US10817768B1 (en) | 2019-12-20 | 2020-10-27 | Capital One Services, Llc | Systems and methods for preventing chip fraud by inserts in chip pocket |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3153768C2 (de) * | 1981-04-14 | 1995-11-09 | Gao Ges Automation Org | Ausweiskarte |
DE3248385A1 (de) * | 1982-12-28 | 1984-06-28 | GAO Gesellschaft für Automation und Organisation mbH, 8000 München | Ausweiskarte mit integriertem schaltkreis |
JPS6175986A (ja) * | 1984-09-21 | 1986-04-18 | Tokyo Jiki Insatsu Kk | 集積回路素子装着媒体 |
US4586379A (en) * | 1984-09-28 | 1986-05-06 | Virginia Corporation Of Richmond | Ultrasonic pipe inspection system |
FR2579799B1 (fr) * | 1985-03-28 | 1990-06-22 | Flonic Sa | Procede de fabrication de cartes a memoire electronique et cartes obtenues suivant ledit procede |
EP0211360B1 (en) * | 1985-07-27 | 1993-09-29 | Dai Nippon Insatsu Kabushiki Kaisha | Ic card |
JPS62214998A (ja) * | 1986-03-17 | 1987-09-21 | 三菱電機株式会社 | 薄型半導体カ−ド |
DE3639630A1 (de) * | 1986-11-20 | 1988-06-01 | Gao Ges Automation Org | Datentraeger mit integriertem schaltkreis und verfahren zur herstellung desselben |
DE3723547C2 (de) * | 1987-07-16 | 1996-09-26 | Gao Ges Automation Org | Trägerelement zum Einbau in Ausweiskarten |
FR2629236B1 (fr) * | 1988-03-22 | 1991-09-27 | Schlumberger Ind Sa | Procede de realisation d'une carte a memoire electronique et carte telle qu'obtenue par la mise en oeuvre dudit procede |
US5208450A (en) * | 1988-04-20 | 1993-05-04 | Matsushita Electric Industrial Co., Ltd. | IC card and a method for the manufacture of the same |
FR2632100B1 (fr) * | 1988-05-25 | 1992-02-21 | Schlumberger Ind Sa | Procede de realisation d'une carte a memoire electronique et cartes a memoire electronique obtenue par la mise en oeuvre dudit procede |
JPH0230598A (ja) * | 1988-07-20 | 1990-01-31 | Dainippon Printing Co Ltd | Icモジュールおよびicカード |
FR2639763B1 (fr) * | 1988-11-29 | 1992-12-24 | Schlumberger Ind Sa | Procede de realisation d'un module electronique et module electronique tel qu'obtenu par ce procede |
JPH04255260A (ja) * | 1991-02-07 | 1992-09-10 | Fujitsu Ltd | リードフレーム及び半導体装置の製造方法 |
DE9110057U1 (de) * | 1991-08-14 | 1992-02-20 | Orga Kartensysteme GmbH, 6072 Dreieich | Datenträgerkarte mit eingeklebtem Schaltkreisträger |
CH686325A5 (de) * | 1992-11-27 | 1996-02-29 | Esec Sempac Sa | Elektronikmodul und Chip-Karte. |
JP3329073B2 (ja) * | 1993-06-04 | 2002-09-30 | セイコーエプソン株式会社 | 半導体装置およびその製造方法 |
-
1994
- 1994-12-08 DE DE4443767A patent/DE4443767A1/de not_active Withdrawn
-
1995
- 1995-12-05 US US08/567,458 patent/US5834755A/en not_active Expired - Fee Related
- 1995-12-07 ES ES95119306T patent/ES2158033T3/es not_active Expired - Lifetime
- 1995-12-07 DK DK95119306T patent/DK0716394T3/da active
- 1995-12-07 EP EP95119306A patent/EP0716394B1/de not_active Revoked
- 1995-12-07 AT AT95119306T patent/ATE202866T1/de not_active IP Right Cessation
- 1995-12-07 DE DE59509381T patent/DE59509381D1/de not_active Revoked
- 1995-12-08 JP JP34579695A patent/JP4140983B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
DE59509381D1 (de) | 2001-08-09 |
DE4443767A1 (de) | 1996-06-13 |
US5834755A (en) | 1998-11-10 |
EP0716394A2 (de) | 1996-06-12 |
JPH0976680A (ja) | 1997-03-25 |
JP4140983B2 (ja) | 2008-08-27 |
EP0716394A3 (de) | 1997-07-16 |
DK0716394T3 (da) | 2001-12-03 |
EP0716394B1 (de) | 2001-07-04 |
ATE202866T1 (de) | 2001-07-15 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
FG2A | Definitive protection |
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