ES2152035T3 - Procedimiento para la fabricacion de placas conductoras con contacto pasante o placas conductoras multicapa. - Google Patents
Procedimiento para la fabricacion de placas conductoras con contacto pasante o placas conductoras multicapa.Info
- Publication number
- ES2152035T3 ES2152035T3 ES96927026T ES96927026T ES2152035T3 ES 2152035 T3 ES2152035 T3 ES 2152035T3 ES 96927026 T ES96927026 T ES 96927026T ES 96927026 T ES96927026 T ES 96927026T ES 2152035 T3 ES2152035 T3 ES 2152035T3
- Authority
- ES
- Spain
- Prior art keywords
- water
- driving plates
- procedure
- rinse
- cleared
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
- H05K3/424—Plated through-holes or plated via connections characterised by electroplating method by direct electroplating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0055—After-treatment, e.g. cleaning or desmearing of holes
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Chemically Coating (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Laminated Bodies (AREA)
Abstract
LA INVENCION CONSISTE EN UN PROCEDIMIENTO PARA FABRICAR PLACAS DE CIRCUITOS IMPRESOS METALIZADAS O BIEN PLACAS DE CIRCUITOS IMPRESOS MULTICAPA DE BASE POLIMERICA CON POLIMEROS CONDUCTORES. PARA ELLO SE UTILIZA UN PROCESO COMBINADO DESMEAR Y DE METALIZACION DIRECTA (MULTICAPA), SEGUN EL CUAL LOS MATERIALES PERFORADOS DE BASE POLIMERICA PASAN POR LAS SIGUIENTES ETAPAS DE PROCESO: 1) INMERSION EN UN LIQUIDO DE TRATAMIENTO CONOCIDO Y ACLARADO CON AGUA, 2) TRATAMIENTO CON UNA SOLUCION ALCALINA DE PERMANGANATO (DESMEAR), 3) ACLARADO CON AGUA, 4) LAVADO CON UNA SOLUCION ACUOSA ACIDA (PH APROX. 1, TIEMPO DE LAVADO ENTRE 10 Y 120 SEG., EN FUNCION DE LA ACIDEZ), 5) ACLARADO CON AGUA, 6) LAVADO CON UNA SOLUCION ACUOSA ALCALINA (PH ENTRE 8 Y 9,5), 7) ACLARADO CON AGUA, 8) LAVADO CON UNA MICROEMULSION DE ETILENO 3,4 ACION), 10) ACLARADO CON AGUA, 11) ENCOBRADO, 12) ACLARADO CON AGUA, Y 13) SECADO, 14) ETAPAS DE PROCESO HABITUALES PARA CREAR LA RED CONDUCTORA.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19527056A DE19527056C1 (de) | 1995-07-25 | 1995-07-25 | Verfahren zur Herstellung von durchkontaktierten Leiterplatten oder Mehrlagenleiterplatten (Multilayer) |
Publications (1)
Publication Number | Publication Date |
---|---|
ES2152035T3 true ES2152035T3 (es) | 2001-01-16 |
Family
ID=7767675
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ES96927026T Expired - Lifetime ES2152035T3 (es) | 1995-07-25 | 1996-07-17 | Procedimiento para la fabricacion de placas conductoras con contacto pasante o placas conductoras multicapa. |
Country Status (10)
Country | Link |
---|---|
US (1) | US6007866A (es) |
EP (1) | EP0840994B1 (es) |
JP (1) | JP3804981B2 (es) |
KR (1) | KR100394560B1 (es) |
CN (1) | CN1083234C (es) |
AU (1) | AU6700396A (es) |
CA (1) | CA2227600A1 (es) |
DE (2) | DE19527056C1 (es) |
ES (1) | ES2152035T3 (es) |
WO (1) | WO1997005758A1 (es) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19903108A1 (de) * | 1999-01-27 | 2000-08-03 | Bayer Ag | Verfahren zur direkten galvanischen Durchkontaktierung von Leiterplatten |
DE10124631C1 (de) | 2001-05-18 | 2002-11-21 | Atotech Deutschland Gmbh | Verfahren zum direkten elektrolytischen Metallisieren von elektrisch nichtleiteitenden Substratoberflächen |
DE10220684B4 (de) * | 2002-05-10 | 2011-12-08 | Enthone Inc. | Verwendung eines Verfahrens zur Herstellung leitender Polymere mit hoher Metallisierungsfähigkeit zur Durchmetallisierung von kaschierten Basismaterialien zur Leiterplattenherstellung |
WO2005092043A2 (en) * | 2004-03-22 | 2005-10-06 | Epic Research Company, Inc. | Process for fabrication of printed circuit boards |
EP1870491B1 (de) * | 2006-06-22 | 2015-05-27 | Enthone, Inc. | Verbessertes Verfahren zur Direktmetallisierung von elektrisch nicht leitfähigen Substratoberflächen, insbesondere Polyimidoberflächen |
CN104018196A (zh) * | 2013-02-28 | 2014-09-03 | 武汉孟鼎电化学技术有限公司 | 印制线路板无化学镀直接电镀方法 |
CN107278056A (zh) * | 2016-04-08 | 2017-10-20 | 东莞市斯坦得电子材料有限公司 | 一种用于印制电路板有机导电膜孔金属化的工艺 |
CN110483819B (zh) * | 2019-07-09 | 2022-05-17 | 江苏大学 | 一种基于溶胀-原位聚合反应的形状记忆聚合物基线路板的制备方法 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4315045A (en) * | 1978-12-19 | 1982-02-09 | Crown City Plating Co. | Conditioning of polyamides for electroless plating |
DE3813362A1 (de) * | 1988-04-21 | 1989-11-02 | Bayer Ag | Elektrisch leitfaehige polyheteroaromaten und ein verfahren zu ihrer herstellung |
DE3843412A1 (de) * | 1988-04-22 | 1990-06-28 | Bayer Ag | Neue polythiophene, verfahren zu ihrer herstellung und ihre verwendung |
DE3928832C2 (de) * | 1989-08-31 | 1995-04-20 | Blasberg Oberflaechentech | Verfahren zur Herstellung von durchkontaktierten Leiterplatten und Leiterplatten-Halbzeug |
DE3931003A1 (de) * | 1989-09-14 | 1991-03-28 | Schering Ag | Verfahren zur direkten metallisierung von leiterplatten |
DE3939676C2 (de) * | 1989-11-28 | 1994-01-27 | Schering Ag | Metallisierung von Nichtleitern |
DE4040226C2 (de) * | 1990-12-15 | 1994-09-29 | Hoellmueller Maschbau H | Verfahren zur Herstellung von durchkontaktierten Leiterplatten oder Mehrlagenleiterplatten (Multilayern) |
WO1992020204A1 (de) * | 1991-04-26 | 1992-11-12 | Blasberg Oberflächentechnik GmbH | Mittel zur selektiven ausbildung einer dünnen oxidierenden schicht |
DE4202337A1 (de) * | 1992-01-29 | 1993-08-05 | Bayer Ag | Verfahren zur durchkontaktierung von zweilagigen leiterplatten und multilayern |
DE4436391A1 (de) * | 1994-10-12 | 1996-04-18 | Bayer Ag | Verfahren zur direkten galvanischen Durchkontaktierung von zweilagigen Leiterplatten und Multilayern |
-
1995
- 1995-07-25 DE DE19527056A patent/DE19527056C1/de not_active Expired - Fee Related
-
1996
- 1996-07-17 WO PCT/EP1996/003134 patent/WO1997005758A1/de active IP Right Grant
- 1996-07-17 AU AU67003/96A patent/AU6700396A/en not_active Abandoned
- 1996-07-17 US US09/000,473 patent/US6007866A/en not_active Expired - Lifetime
- 1996-07-17 KR KR10-1998-0700606A patent/KR100394560B1/ko not_active IP Right Cessation
- 1996-07-17 ES ES96927026T patent/ES2152035T3/es not_active Expired - Lifetime
- 1996-07-17 JP JP50718097A patent/JP3804981B2/ja not_active Expired - Fee Related
- 1996-07-17 DE DE59605989T patent/DE59605989D1/de not_active Expired - Fee Related
- 1996-07-17 CN CN96196976A patent/CN1083234C/zh not_active Expired - Fee Related
- 1996-07-17 CA CA002227600A patent/CA2227600A1/en not_active Abandoned
- 1996-07-17 EP EP96927026A patent/EP0840994B1/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
CN1083234C (zh) | 2002-04-17 |
AU6700396A (en) | 1997-02-26 |
CA2227600A1 (en) | 1997-02-13 |
JPH11509985A (ja) | 1999-08-31 |
DE19527056C1 (de) | 1996-11-28 |
DE59605989D1 (de) | 2000-11-16 |
US6007866A (en) | 1999-12-28 |
JP3804981B2 (ja) | 2006-08-02 |
WO1997005758A1 (de) | 1997-02-13 |
CN1196161A (zh) | 1998-10-14 |
EP0840994A1 (de) | 1998-05-13 |
KR100394560B1 (ko) | 2003-10-17 |
EP0840994B1 (de) | 2000-10-11 |
KR19990035945A (ko) | 1999-05-25 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
FG2A | Definitive protection |
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