ES2152035T3 - Procedimiento para la fabricacion de placas conductoras con contacto pasante o placas conductoras multicapa. - Google Patents

Procedimiento para la fabricacion de placas conductoras con contacto pasante o placas conductoras multicapa.

Info

Publication number
ES2152035T3
ES2152035T3 ES96927026T ES96927026T ES2152035T3 ES 2152035 T3 ES2152035 T3 ES 2152035T3 ES 96927026 T ES96927026 T ES 96927026T ES 96927026 T ES96927026 T ES 96927026T ES 2152035 T3 ES2152035 T3 ES 2152035T3
Authority
ES
Spain
Prior art keywords
water
driving plates
procedure
rinse
cleared
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES96927026T
Other languages
English (en)
Inventor
Jurgen Hupe
Sabine Fix
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Blasberg Oberflachentechnik GmbH
Original Assignee
Blasberg Oberflachentechnik GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Blasberg Oberflachentechnik GmbH filed Critical Blasberg Oberflachentechnik GmbH
Application granted granted Critical
Publication of ES2152035T3 publication Critical patent/ES2152035T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
    • H05K3/424—Plated through-holes or plated via connections characterised by electroplating method by direct electroplating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0055—After-treatment, e.g. cleaning or desmearing of holes

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Chemically Coating (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Laminated Bodies (AREA)

Abstract

LA INVENCION CONSISTE EN UN PROCEDIMIENTO PARA FABRICAR PLACAS DE CIRCUITOS IMPRESOS METALIZADAS O BIEN PLACAS DE CIRCUITOS IMPRESOS MULTICAPA DE BASE POLIMERICA CON POLIMEROS CONDUCTORES. PARA ELLO SE UTILIZA UN PROCESO COMBINADO DESMEAR Y DE METALIZACION DIRECTA (MULTICAPA), SEGUN EL CUAL LOS MATERIALES PERFORADOS DE BASE POLIMERICA PASAN POR LAS SIGUIENTES ETAPAS DE PROCESO: 1) INMERSION EN UN LIQUIDO DE TRATAMIENTO CONOCIDO Y ACLARADO CON AGUA, 2) TRATAMIENTO CON UNA SOLUCION ALCALINA DE PERMANGANATO (DESMEAR), 3) ACLARADO CON AGUA, 4) LAVADO CON UNA SOLUCION ACUOSA ACIDA (PH APROX. 1, TIEMPO DE LAVADO ENTRE 10 Y 120 SEG., EN FUNCION DE LA ACIDEZ), 5) ACLARADO CON AGUA, 6) LAVADO CON UNA SOLUCION ACUOSA ALCALINA (PH ENTRE 8 Y 9,5), 7) ACLARADO CON AGUA, 8) LAVADO CON UNA MICROEMULSION DE ETILENO 3,4 ACION), 10) ACLARADO CON AGUA, 11) ENCOBRADO, 12) ACLARADO CON AGUA, Y 13) SECADO, 14) ETAPAS DE PROCESO HABITUALES PARA CREAR LA RED CONDUCTORA.
ES96927026T 1995-07-25 1996-07-17 Procedimiento para la fabricacion de placas conductoras con contacto pasante o placas conductoras multicapa. Expired - Lifetime ES2152035T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19527056A DE19527056C1 (de) 1995-07-25 1995-07-25 Verfahren zur Herstellung von durchkontaktierten Leiterplatten oder Mehrlagenleiterplatten (Multilayer)

Publications (1)

Publication Number Publication Date
ES2152035T3 true ES2152035T3 (es) 2001-01-16

Family

ID=7767675

Family Applications (1)

Application Number Title Priority Date Filing Date
ES96927026T Expired - Lifetime ES2152035T3 (es) 1995-07-25 1996-07-17 Procedimiento para la fabricacion de placas conductoras con contacto pasante o placas conductoras multicapa.

Country Status (10)

Country Link
US (1) US6007866A (es)
EP (1) EP0840994B1 (es)
JP (1) JP3804981B2 (es)
KR (1) KR100394560B1 (es)
CN (1) CN1083234C (es)
AU (1) AU6700396A (es)
CA (1) CA2227600A1 (es)
DE (2) DE19527056C1 (es)
ES (1) ES2152035T3 (es)
WO (1) WO1997005758A1 (es)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19903108A1 (de) * 1999-01-27 2000-08-03 Bayer Ag Verfahren zur direkten galvanischen Durchkontaktierung von Leiterplatten
DE10124631C1 (de) * 2001-05-18 2002-11-21 Atotech Deutschland Gmbh Verfahren zum direkten elektrolytischen Metallisieren von elektrisch nichtleiteitenden Substratoberflächen
DE10220684B4 (de) * 2002-05-10 2011-12-08 Enthone Inc. Verwendung eines Verfahrens zur Herstellung leitender Polymere mit hoher Metallisierungsfähigkeit zur Durchmetallisierung von kaschierten Basismaterialien zur Leiterplattenherstellung
WO2005092043A2 (en) * 2004-03-22 2005-10-06 Epic Research Company, Inc. Process for fabrication of printed circuit boards
EP1870491B1 (de) * 2006-06-22 2015-05-27 Enthone, Inc. Verbessertes Verfahren zur Direktmetallisierung von elektrisch nicht leitfähigen Substratoberflächen, insbesondere Polyimidoberflächen
CN104018196A (zh) * 2013-02-28 2014-09-03 武汉孟鼎电化学技术有限公司 印制线路板无化学镀直接电镀方法
CN107278056A (zh) * 2016-04-08 2017-10-20 东莞市斯坦得电子材料有限公司 一种用于印制电路板有机导电膜孔金属化的工艺
CN110483819B (zh) * 2019-07-09 2022-05-17 江苏大学 一种基于溶胀-原位聚合反应的形状记忆聚合物基线路板的制备方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4315045A (en) * 1978-12-19 1982-02-09 Crown City Plating Co. Conditioning of polyamides for electroless plating
DE3813362A1 (de) * 1988-04-21 1989-11-02 Bayer Ag Elektrisch leitfaehige polyheteroaromaten und ein verfahren zu ihrer herstellung
DE3843412A1 (de) * 1988-04-22 1990-06-28 Bayer Ag Neue polythiophene, verfahren zu ihrer herstellung und ihre verwendung
DE3928832C2 (de) * 1989-08-31 1995-04-20 Blasberg Oberflaechentech Verfahren zur Herstellung von durchkontaktierten Leiterplatten und Leiterplatten-Halbzeug
DE3931003A1 (de) * 1989-09-14 1991-03-28 Schering Ag Verfahren zur direkten metallisierung von leiterplatten
DE3939676C2 (de) * 1989-11-28 1994-01-27 Schering Ag Metallisierung von Nichtleitern
DE4040226C2 (de) * 1990-12-15 1994-09-29 Hoellmueller Maschbau H Verfahren zur Herstellung von durchkontaktierten Leiterplatten oder Mehrlagenleiterplatten (Multilayern)
DE59206858D1 (de) * 1991-04-26 1996-09-05 Blasberg Oberflaechentech Mittel zur selektiven ausbildung einer dünnen oxidierenden schicht
DE4202337A1 (de) * 1992-01-29 1993-08-05 Bayer Ag Verfahren zur durchkontaktierung von zweilagigen leiterplatten und multilayern
DE4436391A1 (de) * 1994-10-12 1996-04-18 Bayer Ag Verfahren zur direkten galvanischen Durchkontaktierung von zweilagigen Leiterplatten und Multilayern

Also Published As

Publication number Publication date
EP0840994B1 (de) 2000-10-11
AU6700396A (en) 1997-02-26
JPH11509985A (ja) 1999-08-31
WO1997005758A1 (de) 1997-02-13
EP0840994A1 (de) 1998-05-13
DE19527056C1 (de) 1996-11-28
KR19990035945A (ko) 1999-05-25
CN1083234C (zh) 2002-04-17
KR100394560B1 (ko) 2003-10-17
DE59605989D1 (de) 2000-11-16
JP3804981B2 (ja) 2006-08-02
CA2227600A1 (en) 1997-02-13
US6007866A (en) 1999-12-28
CN1196161A (zh) 1998-10-14

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