ES2139253T3 - Piezas moldeadas constituidas por pegamentos termofusibles de pu. - Google Patents

Piezas moldeadas constituidas por pegamentos termofusibles de pu.

Info

Publication number
ES2139253T3
ES2139253T3 ES95942665T ES95942665T ES2139253T3 ES 2139253 T3 ES2139253 T3 ES 2139253T3 ES 95942665 T ES95942665 T ES 95942665T ES 95942665 T ES95942665 T ES 95942665T ES 2139253 T3 ES2139253 T3 ES 2139253T3
Authority
ES
Spain
Prior art keywords
pct
moldings
sec
production
various substrates
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES95942665T
Other languages
English (en)
Inventor
Georg Schubert
Michael Krebs
Karin Jonscher
Roland Heider
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Henkel AG and Co KGaA
Original Assignee
Henkel AG and Co KGaA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Henkel AG and Co KGaA filed Critical Henkel AG and Co KGaA
Application granted granted Critical
Publication of ES2139253T3 publication Critical patent/ES2139253T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/0001—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor characterised by the choice of material
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/08—Processes
    • C08G18/10—Prepolymer processes involving reaction of isocyanates or isothiocyanates with compounds having active hydrogen in a first reaction step
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/40—High-molecular-weight compounds
    • C08G18/42—Polycondensates having carboxylic or carbonic ester groups in the main chain
    • C08G18/4205—Polycondensates having carboxylic or carbonic ester groups in the main chain containing cyclic groups
    • C08G18/4208—Polycondensates having carboxylic or carbonic ester groups in the main chain containing cyclic groups containing aromatic groups
    • C08G18/4211—Polycondensates having carboxylic or carbonic ester groups in the main chain containing cyclic groups containing aromatic groups derived from aromatic dicarboxylic acids and dialcohols
    • C08G18/4216—Polycondensates having carboxylic or carbonic ester groups in the main chain containing cyclic groups containing aromatic groups derived from aromatic dicarboxylic acids and dialcohols from mixtures or combinations of aromatic dicarboxylic acids and aliphatic dicarboxylic acids and dialcohols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/40—High-molecular-weight compounds
    • C08G18/42—Polycondensates having carboxylic or carbonic ester groups in the main chain
    • C08G18/4236—Polycondensates having carboxylic or carbonic ester groups in the main chain containing only aliphatic groups
    • C08G18/4238—Polycondensates having carboxylic or carbonic ester groups in the main chain containing only aliphatic groups derived from dicarboxylic acids and dialcohols
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/302—Polyurethanes or polythiourethanes; Polyurea or polythiourea
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2105/00—Condition, form or state of moulded material or of the material to be shaped
    • B29K2105/0097—Glues or adhesives, e.g. hot melts or thermofusible adhesives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2170/00—Compositions for adhesives
    • C08G2170/20—Compositions for hot melt adhesives

Landscapes

  • Chemical & Material Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Polyurethanes Or Polyureas (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

SE DESCRIBE LA UTILIZACION DE ADHESIVOS TERMOPLASTICOS DE POLIURETANO ENDURECIBLES A LA HUMEDAD COMO COMPUESTO DE MOLDEO PARA PREPARAR PIEZAS MOLDEADAS. EL ADHESIVO TERMOPLASTICO DE POLIURETANO PRESENTA UNA VISCOSIDAD INFERIOR A 100 PA.S EN ESTADO FUNDIDO A UNA TEMPERATURA DE PROCESO ENTRE 70 Y 190 (GRADOS) C. PARA PREPARAR PIEZAS MOLDEADAS SE FUNDE EL COMPUESTO DE MOLDEO A UNA TEMPERATURA ENTRE 70 Y 200 (GRADOS) C, A CONTINUACION SE INYECTA EN MOLDES CERRADOS A UNA SOBREPRESION ENTRE 1 Y 50 BAR Y DESPUES DE UN BREVE TIEMPO SE EXTRAEN LAS PIEZAS MOLDEADAS ENFRIADAS DE LOS MOLDES Y SE EXPONEN A LA HUMEDAD DEL AIRE PARA SU ENDURECIMIENTO. LAS PRINCIPALES VENTAJAS TECNICAS Y ECONOMICAS DE ESTOS COMPUESTOS SON UNA PRESION DE PROCESO CONSIDERABLEMENTE INFERIOR, EQUIPOS Y HERRAMIENTAS MAS SENCILLOS Y UNA BUENA ADHERENCIA A DIFERENTES SUSTRATOS. LAS PIEZAS MOLDEADAS SON RESISTENTES A LA TEMPERATURA, SE ADHIEREN A DIFERENTES SUSTRATOS Y ESTAN ESPECIALMENTE INDICADAS PARA FABRICAR COMPONENTES ELECTRICOS.
ES95942665T 1994-12-23 1995-12-14 Piezas moldeadas constituidas por pegamentos termofusibles de pu. Expired - Lifetime ES2139253T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE4446027A DE4446027A1 (de) 1994-12-23 1994-12-23 Formteile aus PU-Schmelzklebstoffen

Publications (1)

Publication Number Publication Date
ES2139253T3 true ES2139253T3 (es) 2000-02-01

Family

ID=6536751

Family Applications (1)

Application Number Title Priority Date Filing Date
ES95942665T Expired - Lifetime ES2139253T3 (es) 1994-12-23 1995-12-14 Piezas moldeadas constituidas por pegamentos termofusibles de pu.

Country Status (10)

Country Link
US (1) US5776406A (es)
EP (1) EP0799286B1 (es)
JP (1) JPH10511716A (es)
AT (1) ATE185585T1 (es)
AU (1) AU4386296A (es)
DE (2) DE4446027A1 (es)
ES (1) ES2139253T3 (es)
TR (1) TR199501612A2 (es)
WO (1) WO1996020252A1 (es)
ZA (1) ZA9510922B (es)

Families Citing this family (39)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6183824B1 (en) 1995-06-07 2001-02-06 Havco Wood Products, Inc. Composite wood flooring
EP0767040A1 (en) * 1995-10-02 1997-04-09 Dow Corning Corporation Substrates containing a molded adhesive layer and method for preparing same
DE19848712A1 (de) * 1998-10-22 2000-04-27 Henkel Kgaa Komponentenschicht für Smart Cards aus Schmelzklebstoffen
JP3718394B2 (ja) 1999-12-09 2005-11-24 矢崎総業株式会社 被覆電線の端末接続部およびその防水処理方法と装置
JP2001167640A (ja) 1999-12-09 2001-06-22 Yazaki Corp 被覆電線の端末接続部およびその防水処理装置
DE10006211C2 (de) * 2000-02-11 2003-11-27 Robert Virant Formgebend umspritzte, elektrische und/oder elektronische Komponente und Verfahren zur Herstellung
DE10040762A1 (de) 2000-08-19 2002-03-07 Henkel Kgaa Formteile aus Dimerfettsäurefreie Polyamiden
US6439438B1 (en) * 2001-03-19 2002-08-27 3M Innovative Properties Company Combination for storing and applying heat softenable moisture curable materials
JP2002322453A (ja) * 2001-04-26 2002-11-08 Sekisui Chem Co Ltd 湿気硬化型ウレタン系ホットメルト接着剤
DE10122437A1 (de) 2001-05-09 2002-11-28 Henkel Kgaa Schmelzklebstoff in Form eines Granulates
DE10229519A1 (de) * 2001-07-10 2003-01-30 Henkel Kgaa Reaktive Polyurethane mit einem geringen Gehalt an monomeren Diisocyanaten
US6765061B2 (en) 2001-09-13 2004-07-20 Inphase Technologies, Inc. Environmentally durable, self-sealing optical articles
WO2004031296A1 (ja) * 2002-10-01 2004-04-15 Ube Industries, Ltd. ポリオール混合物および該混合物より得られる反応性ホットメルト組成物ならびに該組成物を使用して得られる成形品
EP1424728A1 (de) * 2002-11-27 2004-06-02 Abb Research Ltd. Leistungshalbleitermodul
US7972707B2 (en) * 2003-09-04 2011-07-05 Havco Wood Products, LLC. Trailer flooring with hotmelt coating
US20070129523A1 (en) * 2003-11-11 2007-06-07 Ube Industries, Ltd. Crystalline polyester polyol and hot-melt adhesive
FR2869620B1 (fr) * 2004-05-03 2006-06-23 Nexans Sa Composition thermo-adherente pour fil de bobinage
DE102004044614B4 (de) * 2004-09-13 2007-10-25 Hans Huonker Gmbh Verfahren zur Herstellung von mehrfach umspritzten Elektronikbauteilen
US20060179733A1 (en) * 2005-02-11 2006-08-17 Havco Wood Products, L.L.C. Durable wood-plastic composite flooring for trailers
US20070193179A1 (en) * 2006-01-27 2007-08-23 Prolam, Societe En Commandite Wooden laminated floor product to improve strength, water protection and fatigue resistance
US20100249291A1 (en) 2006-08-31 2010-09-30 Ube Industries, Ltd. Reactive hot-melt composition and molded article using the same
US7926524B2 (en) * 2006-10-02 2011-04-19 Prolam, Societe En Commandite Utilization of coloration to improve the detection of “hit or miss” defects when using scanner equipment and an automated saw to remove defects in wood pieces
DE102006056660A1 (de) * 2006-11-29 2008-06-05 Henkel Kgaa Formteile aus Schmelzklebstoffen
CA2671011A1 (en) * 2006-11-29 2008-06-05 Henkel Ag & Co. Kgaa Molded parts from hot melt adhesives
JP2009286941A (ja) * 2008-05-30 2009-12-10 Henkel Japan Ltd 湿気硬化型ホットメルト接着剤
EP2248598B2 (de) * 2009-05-07 2016-06-08 Robatech AG Vorrichtung mit mehreren Trockenluftdüsen sowie Verfahren zum Abgeben eines Klebstoffs
JP2011018318A (ja) * 2009-06-09 2011-01-27 Ricoh Co Ltd 可逆性感熱記録媒体
CA2774490A1 (en) * 2009-09-18 2011-03-24 Union Carbide Chemicals & Plastics Technology Llc Process for making crosslinked injection molded articles
US9659832B2 (en) * 2011-07-22 2017-05-23 H.B. Fuller Company Reactive hot-melt adhesive for use on electronics
US9127153B2 (en) * 2012-11-02 2015-09-08 Henkel IP & Holding GmbH Molding and overmolding compositions for electronic devices
JP6111750B2 (ja) 2013-03-08 2017-04-12 オムロン株式会社 電子機器
JP6094443B2 (ja) * 2013-03-08 2017-03-15 オムロン株式会社 電子機器およびその製造方法
JP6665161B2 (ja) * 2014-08-15 2020-03-13 エイチ．ビー．フラー カンパニー リワーク性湿気硬化型ホットメルト接着剤組成物、これを使用する方法およびこれを含む物品
US10252452B2 (en) * 2014-11-17 2019-04-09 The Boeing Company Method of sealing a fastener
JP7317753B2 (ja) * 2014-12-24 2023-07-31 株式会社アーケム 積層体及びクッション体
GB2567220B (en) * 2017-10-06 2021-01-27 Henkel IP & Holding GmbH Solid cyanoacrylate compositions comprising thermoplastic polyurethane
DE102020216431B4 (de) 2020-12-21 2023-12-14 Leoni Bordnetz-Systeme Gmbh Bordnetzelement sowie Verfahren zur Herstellung eines solchen Bordnetzelements
TWI800050B (zh) * 2021-10-25 2023-04-21 南亞塑膠工業股份有限公司 聚氨酯熱熔膠
US12325108B1 (en) * 2022-02-22 2025-06-10 Robert Everett Ford Supplement support system sleeve for a universal joint improvements / angled flex stop

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2729247C2 (de) * 1977-06-29 1986-02-13 Rhein-Chemie Rheinau Gmbh, 6800 Mannheim Polyurethan-Bindemittel für die Herstellung von elastischen Schichtstoffen
DE3504805A1 (de) * 1985-02-13 1986-08-14 Henkel KGaA, 4000 Düsseldorf Thermoplastische blockcopolymere
DE3541776A1 (de) * 1985-11-26 1987-05-27 Siemens Ag Optische anzeigevorrichtung fuer elektrische geraete
US5250607A (en) * 1988-01-05 1993-10-05 Norton Company Moisture cured elastomeric interpenetrating network sealants
DE3827224C3 (de) * 1988-08-11 2003-09-25 Degussa Schmelzklebeverfahren
US6136136A (en) * 1992-11-25 2000-10-24 Henkel Corporation Moisture-curable polyurethane hotmelt adhesives with high green strength
JP2733180B2 (ja) * 1993-02-09 1998-03-30 東洋製罐株式会社 フレキシブル包装用ラミネート、その製造方法及びそれに用いる接着剤
DE4320269A1 (de) * 1993-06-18 1994-12-22 Henkel Kgaa Isocyanat/Polyol-Reaktionsharz
DE4321044A1 (de) * 1993-06-25 1995-01-05 Henkel Kgaa Anordnung zur Energieverteilung in einem räumlich begrenzten Umfeld

Also Published As

Publication number Publication date
JPH10511716A (ja) 1998-11-10
DE59507059D1 (de) 1999-11-18
DE4446027A1 (de) 1996-07-04
EP0799286A1 (de) 1997-10-08
AU4386296A (en) 1996-07-19
WO1996020252A1 (de) 1996-07-04
ATE185585T1 (de) 1999-10-15
TR199501612A2 (tr) 1996-07-21
EP0799286B1 (de) 1999-10-13
ZA9510922B (en) 1996-06-24
US5776406A (en) 1998-07-07

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