ES2134032T3 - Disposicion para la proteccion de elementos modulares electricos y electronicos frente a descargas electrostaticas. - Google Patents
Disposicion para la proteccion de elementos modulares electricos y electronicos frente a descargas electrostaticas.Info
- Publication number
- ES2134032T3 ES2134032T3 ES97100300T ES97100300T ES2134032T3 ES 2134032 T3 ES2134032 T3 ES 2134032T3 ES 97100300 T ES97100300 T ES 97100300T ES 97100300 T ES97100300 T ES 97100300T ES 2134032 T3 ES2134032 T3 ES 2134032T3
- Authority
- ES
- Spain
- Prior art keywords
- provision
- electrical
- protection
- electrostatic discharges
- modular elements
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0254—High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
- H05K1/0256—Electrical insulation details, e.g. around high voltage areas
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01T—SPARK GAPS; OVERVOLTAGE ARRESTERS USING SPARK GAPS; SPARKING PLUGS; CORONA DEVICES; GENERATING IONS TO BE INTRODUCED INTO NON-ENCLOSED GASES
- H01T4/00—Overvoltage arresters using spark gaps
- H01T4/08—Overvoltage arresters using spark gaps structurally associated with protected apparatus
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0067—Devices for protecting against damage from electrostatic discharge
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0254—High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
- H05K1/0257—Overvoltage protection
- H05K1/0259—Electrostatic discharge [ESD] protection
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Structure Of Printed Boards (AREA)
- Elimination Of Static Electricity (AREA)
Abstract
DISPOSICION PARA LA PROTECCION DE ELEMENTOS MODULARES ELECTRICOS Y ELECTRONICOS FRENTE A DESCARGAS ELECTROSTATICAS. LA INVENCION DESCRIBE UNA DISPOSICION PARA PROTECCION DE COMPONENTES ELECTRICOS Y ELECTRONICOS DE DESCARGAS ELECTROSTATICAS, DONDE UNA PLACA DE CIRCUITO IMPRESO QUE PORTA LOS ELEMENTOS COMPONENTES SE UNE A TRAVES DE UNA CAPA AISLANTE CON UNA PLACA METALICA EN ARRASTRE DE MATERIAL, DE FORMA QUE LA CAPA AISLANTE MUESTRA AL MENOS UNA ABERTURA, A TRAVES DE LA CUAL SE GUIAN AL MENOS UNA BANDA CONDUCTORA PARA FORMACION DE UN PRIMER TRAMO DE CHISPAS ENTRE LA BANDA CONDUCTORA Y LA PLACA METALICA Y DONDE LA PLACA METALICA ESTA UNIDA CON UN POTENCIAL FIJO.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19601650A DE19601650A1 (de) | 1996-01-18 | 1996-01-18 | Anordnung zum Schutz elektrischer und elektronischer Bauelemente vor elektrostatischen Entladungen |
Publications (1)
Publication Number | Publication Date |
---|---|
ES2134032T3 true ES2134032T3 (es) | 1999-09-16 |
Family
ID=7783058
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ES97100300T Expired - Lifetime ES2134032T3 (es) | 1996-01-18 | 1997-01-10 | Disposicion para la proteccion de elementos modulares electricos y electronicos frente a descargas electrostaticas. |
Country Status (4)
Country | Link |
---|---|
US (1) | US5818101A (es) |
EP (1) | EP0785708B1 (es) |
DE (2) | DE19601650A1 (es) |
ES (1) | ES2134032T3 (es) |
Families Citing this family (29)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6011299A (en) * | 1996-07-24 | 2000-01-04 | Digital Equipment Corporation | Apparatus to minimize integrated circuit heatsink E.M.I. radiation |
GB2334626B (en) | 1998-02-20 | 2003-01-29 | Mitel Corp | Spark gap for hermetically packaged integrated circuits |
GB2334627B (en) * | 1998-02-21 | 2003-03-12 | Mitel Corp | Vertical spark gap for microelectronic circuits |
GB2335084B (en) * | 1998-02-21 | 2003-04-02 | Mitel Corp | Spark gap for high voltage integrated circuit electrostatic discharge protection |
US6130459A (en) * | 1998-03-10 | 2000-10-10 | Oryx Technology Corporation | Over-voltage protection device for integrated circuits |
SE513667C2 (sv) | 1999-01-22 | 2000-10-16 | Ericsson Telefon Ab L M | Ett elektroniskt mönsterkort samt en anordning innefattande ett isolationsmaterial |
EP1148602B1 (de) * | 2000-04-20 | 2003-11-26 | Siemens Aktiengesellschaft | Überspannungsschutzeinrichtung |
JP2003031710A (ja) * | 2001-07-12 | 2003-01-31 | Mitsumi Electric Co Ltd | モノリシックicパッケージ |
DE10252584A1 (de) * | 2002-11-12 | 2004-06-09 | Siemens Ag | Anordnung zum Schutz elektrischer Schaltungen vor Überspannung |
DE10255337C1 (de) * | 2002-11-27 | 2003-12-24 | Siemens Ag | Anordnung zur Reduzierung der elektromagnetischen Abstrahlung und zur Ableitung von Überspannungen |
US6836397B2 (en) * | 2003-05-21 | 2004-12-28 | Arima Computer Corporation | Electrostatic discharge protection apparatus for a circuit board |
JP3857278B2 (ja) * | 2004-04-06 | 2006-12-13 | Smk株式会社 | タッチパネル入力装置 |
GB2415021B (en) * | 2004-06-11 | 2008-09-10 | Turner Powertrain Systems Ltd | A transmission and shift method |
US7161784B2 (en) * | 2004-06-30 | 2007-01-09 | Research In Motion Limited | Spark gap apparatus and method for electrostatic discharge protection |
US7508644B2 (en) * | 2004-06-30 | 2009-03-24 | Research In Motion Limited | Spark gap apparatus and method for electrostatic discharge protection |
TWI245928B (en) * | 2004-12-30 | 2005-12-21 | Avision Inc | Photo-sensing device |
ATE458392T1 (de) * | 2005-12-13 | 2010-03-15 | B2 Electronic Gmbh | Anordnung mit zumindest einem elektronischen bauteil |
US8064191B2 (en) * | 2006-03-16 | 2011-11-22 | Panasonic Corporation | Capacitor unit, and its manufacturing method |
US7738264B2 (en) * | 2006-03-31 | 2010-06-15 | Lifescan Scotland Ltd. | Devices and methods for protecting handheld electronic devices from electrostatic discharge |
JP4577276B2 (ja) * | 2006-06-07 | 2010-11-10 | トヨタ自動車株式会社 | 車載用電子装置およびそれを搭載する車両 |
DE102006047377A1 (de) * | 2006-10-06 | 2008-04-10 | Robert Bosch Gmbh | Elektrostatischer Entladungsschutz |
US7799448B2 (en) * | 2007-06-19 | 2010-09-21 | Black & Decker Inc. | Battery pack for cordless devices |
US7576414B2 (en) * | 2007-11-02 | 2009-08-18 | Stats Chippac, Ltd. | Electrostatic discharge (ESD) protection structure |
US9408294B2 (en) * | 2014-03-14 | 2016-08-02 | Haier Us Appliance Solutions, Inc. | Printed circuit board assemblies providing fault detection |
CN105407666A (zh) * | 2015-12-14 | 2016-03-16 | 重庆瑞阳科技股份有限公司 | 电子元器件组装结构 |
CN105407675A (zh) * | 2015-12-14 | 2016-03-16 | 重庆瑞阳科技股份有限公司 | 电子元器件组装结构 |
CN105407673B (zh) * | 2015-12-14 | 2019-02-15 | 重庆瑞阳科技股份有限公司 | 装饰条 |
WO2020141192A1 (en) * | 2019-01-03 | 2020-07-09 | Signify Holding B.V. | Apparatus with charge dissipation |
CN111736010B (zh) * | 2020-05-09 | 2023-03-14 | 国网山东省电力公司东营供电公司 | 高压带电体电压检测装置 |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3725745A (en) * | 1971-09-23 | 1973-04-03 | Westinghouse Electric Corp | Voltage surge protection device for electric meters |
JPS55126983A (en) * | 1979-03-26 | 1980-10-01 | Hitachi Ltd | Discharge gap |
DE3130324A1 (de) * | 1981-07-31 | 1983-02-17 | GAO Gesellschaft für Automation und Organisation mbH, 8000 München | Traegerelement fuer einen ic-baustein |
FR2524712B1 (fr) * | 1982-03-31 | 1985-06-07 | Radiotechnique Compelec | Circuit hyperfrequence a condensateur integre et application a un circuit d'alimentation |
DE3322679A1 (de) * | 1983-06-23 | 1985-01-03 | Siemens AG, 1000 Berlin und 8000 München | In einer traegeroberflaechenschicht hergestellte zuleitung zu einem ueberspannungsempfindlichen bauelement |
US4586105A (en) * | 1985-08-02 | 1986-04-29 | General Motors Corporation | High voltage protection device with a tape covered spark gap |
DE3538933A1 (de) * | 1985-11-02 | 1987-05-14 | Bbc Brown Boveri & Cie | Leistungshalbleitermodul |
US4725923A (en) * | 1987-01-22 | 1988-02-16 | The Toro Company | Circuitry protection apparatus |
JPH0832494B2 (ja) * | 1990-08-18 | 1996-03-29 | 三菱電機株式会社 | 携帯形半導体記憶装置 |
JPH04256203A (ja) * | 1991-02-07 | 1992-09-10 | Mitsubishi Electric Corp | マイクロ波帯ic用パッケージ |
JP2656416B2 (ja) * | 1991-12-16 | 1997-09-24 | 三菱電機株式会社 | 半導体装置および半導体装置の製造方法、並びに半導体装置に用いられる複合基板および複合基板の製造方法 |
JP2854757B2 (ja) * | 1992-06-17 | 1999-02-03 | 三菱電機株式会社 | 半導体パワーモジュール |
DE4232575A1 (de) * | 1992-09-29 | 1994-03-31 | Bosch Gmbh Robert | Anordnung mit einer Leiterplatte, mindestens einem Leistungsbauelement und einem Kühlkörper |
DE4329251C2 (de) * | 1993-08-31 | 1996-08-14 | Philips Patentverwaltung | Anordnung zum Schutz von gegen Überspannungen empfindlichen Bauelementen auf gedruckten Schaltungsplatten |
JP3157362B2 (ja) * | 1993-09-03 | 2001-04-16 | 株式会社東芝 | 半導体装置 |
US5383097A (en) * | 1993-10-27 | 1995-01-17 | Welch Allyn, Inc. | Conductive path ESD shield |
DE29520176U1 (de) * | 1995-12-20 | 1996-04-18 | Hella Kg Hueck & Co, 59557 Lippstadt | Anordnung mit einer Leiterplatte |
-
1996
- 1996-01-18 DE DE19601650A patent/DE19601650A1/de not_active Withdrawn
- 1996-12-12 US US08/767,030 patent/US5818101A/en not_active Expired - Fee Related
-
1997
- 1997-01-10 EP EP97100300A patent/EP0785708B1/de not_active Expired - Lifetime
- 1997-01-10 DE DE59700218T patent/DE59700218D1/de not_active Expired - Lifetime
- 1997-01-10 ES ES97100300T patent/ES2134032T3/es not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
DE59700218D1 (de) | 1999-07-29 |
DE19601650A1 (de) | 1997-07-24 |
US5818101A (en) | 1998-10-06 |
EP0785708A1 (de) | 1997-07-23 |
EP0785708B1 (de) | 1999-06-23 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
FG2A | Definitive protection |
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