ES2127201T3 - Catodo para el recubrimiento de un sustrato. - Google Patents
Catodo para el recubrimiento de un sustrato.Info
- Publication number
- ES2127201T3 ES2127201T3 ES92111752T ES92111752T ES2127201T3 ES 2127201 T3 ES2127201 T3 ES 2127201T3 ES 92111752 T ES92111752 T ES 92111752T ES 92111752 T ES92111752 T ES 92111752T ES 2127201 T3 ES2127201 T3 ES 2127201T3
- Authority
- ES
- Spain
- Prior art keywords
- objective
- coating chamber
- cathode
- substrate
- coating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3488—Constructional details of particle beam apparatus not otherwise provided for, e.g. arrangement, mounting, housing, environment; special provisions for cleaning or maintenance of the apparatus
- H01J37/3497—Temperature of target
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
- H01J37/3405—Magnetron sputtering
- H01J37/3408—Planar magnetron sputtering
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Analytical Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Abstract
EN UN CATODO PARA REVESTIMIENTO DE UN SUBSTRATO (46), QUE SE ENCUENTRA CONEXIONADO CON UNA FUENTE (FUENTE DE ALTA FRECUENCIA), DE CORRIENTE ALTERNA O DE CORRIENTE CONTINUA Y DISPUESTA EN UNA CAMARA (2) DE RECUBRIMIENTO EVACUABLE Y ENCONTRANDOSE EN UNION ELECTRICA CON UN OBJETIVO (29) QUE ES PULVERIZADO Y CON ELLO LAS PARTICULAR DE PULVERIZACION SE DEPOSITAN SOBRE EL SUBSTRATO (46), DONDE ES POSIBLE LA INTRODUCCION DE UN GAS DE PROCESO EN LA CAMARA (2) DE RECUBRIMIENTO Y EL CATODO ESTA CONFORMADO CON UNA CARCASA (3) EN FORMA ESENCIALMENTE DE OLLA, CUYA PARTE (39) DE FONDO SE ENCUENTRA CERRADA CON EL OBJETIVO (49) Y UNIDA DE FORMA FIJA Y DIRIGIDA HACIA EL OBJETIVO (29), DONDE EL EXTREMO ABIERTO SE ENCUENTRA SUJETO EN UNA ABERTURA (49) EN LA PARED (30) EXTERIOR DE LA CAMARA DE RECUBRIMIENTO, DE FORMA QUE EL ESPACIO (49) INTERIOR DE LA CARCASA (3) ESTA EXPUESTA A LA PRESION ATMOSFERICA, MIENTRAS QUE EL OBJETIVO (39) Y LA SUPERFICIE EXTERIOR DE LA PIEZA EN FORMA DE CASQUILLO UNIDA CON ELLA DE LACARCASA (3) ESTAN IMPULSADAS CON LA PRESION REINANTE EN LA CAMARA (2) DE RECUBRIMIENTO.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE4137483A DE4137483A1 (de) | 1991-11-14 | 1991-11-14 | Kathode zum beschichten eines substrats |
Publications (1)
Publication Number | Publication Date |
---|---|
ES2127201T3 true ES2127201T3 (es) | 1999-04-16 |
Family
ID=6444813
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ES92111752T Expired - Lifetime ES2127201T3 (es) | 1991-11-14 | 1992-07-10 | Catodo para el recubrimiento de un sustrato. |
Country Status (3)
Country | Link |
---|---|
EP (1) | EP0541903B1 (es) |
DE (2) | DE4137483A1 (es) |
ES (1) | ES2127201T3 (es) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE59205763D1 (de) * | 1991-12-28 | 1996-04-25 | Leybold Ag | Kathode zum Beschichten eines Substrats |
US6264804B1 (en) | 2000-04-12 | 2001-07-24 | Ske Technology Corp. | System and method for handling and masking a substrate in a sputter deposition system |
CH695807A5 (de) * | 2001-11-20 | 2006-08-31 | Unaxis Balzers Ag | Quelle für Vakuumbehandlungsprozess. |
US8500973B2 (en) | 2004-08-20 | 2013-08-06 | Jds Uniphase Corporation | Anode for sputter coating |
US7879209B2 (en) * | 2004-08-20 | 2011-02-01 | Jds Uniphase Corporation | Cathode for sputter coating |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3047113A1 (de) * | 1980-12-13 | 1982-07-29 | Leybold-Heraeus GmbH, 5000 Köln | Katodenanordnung und regelverfahren fuer katodenzerstaeubungsanlagen mit einem magnetsystem zur erhoehung der zerstaeubungsrate |
US4500409A (en) * | 1983-07-19 | 1985-02-19 | Varian Associates, Inc. | Magnetron sputter coating source for both magnetic and non magnetic target materials |
DE163445T1 (de) * | 1984-05-17 | 1986-05-22 | Varian Associates, Inc., Palo Alto, Calif. | Magnetron-zerstaeubungs-vorrichtung mit ebenen und konkaven auftreffplatten. |
DE3727901A1 (de) * | 1987-08-21 | 1989-03-02 | Leybold Ag | Zerstaeubungskathode nach dem magnetronprinzip |
DE3738845A1 (de) * | 1987-11-16 | 1989-05-24 | Leybold Ag | Zerstaeubungskatode nach dem magnetronprinzip |
DE3800449A1 (de) * | 1988-01-09 | 1989-07-20 | Leybold Ag | Verfahren und einrichtung zur herstellung magnetooptischer, speicher- und loeschfaehiger datentraeger |
DE3812379A1 (de) * | 1988-04-14 | 1989-10-26 | Leybold Ag | Zerstaeubungskathode nach dem magnetron-prinzip |
JPH04280968A (ja) * | 1990-10-22 | 1992-10-06 | Varian Assoc Inc | 高真空マグネトロンスパッタ装置 |
DE4100291C1 (es) * | 1991-01-08 | 1991-10-02 | Leybold Ag, 6450 Hanau, De |
-
1991
- 1991-11-14 DE DE4137483A patent/DE4137483A1/de not_active Withdrawn
-
1992
- 1992-07-10 EP EP92111752A patent/EP0541903B1/de not_active Expired - Lifetime
- 1992-07-10 ES ES92111752T patent/ES2127201T3/es not_active Expired - Lifetime
- 1992-07-10 DE DE59209599T patent/DE59209599D1/de not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
EP0541903A1 (de) | 1993-05-19 |
DE59209599D1 (de) | 1999-02-04 |
EP0541903B1 (de) | 1998-12-23 |
DE4137483A1 (de) | 1993-05-19 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
FG2A | Definitive protection |
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