ES2084886T3 - Catodo para recubrir un substrato. - Google Patents

Catodo para recubrir un substrato.

Info

Publication number
ES2084886T3
ES2084886T3 ES92111759T ES92111759T ES2084886T3 ES 2084886 T3 ES2084886 T3 ES 2084886T3 ES 92111759 T ES92111759 T ES 92111759T ES 92111759 T ES92111759 T ES 92111759T ES 2084886 T3 ES2084886 T3 ES 2084886T3
Authority
ES
Spain
Prior art keywords
target
coating chamber
coating
catode
fund
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES92111759T
Other languages
English (en)
Inventor
Bernd Wolf
Jurgen Dr Muller
Hans Neudert
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Balzers und Leybold Deutschland Holding AG
Original Assignee
Leybold AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE19914143135 external-priority patent/DE4143135A1/de
Application filed by Leybold AG filed Critical Leybold AG
Application granted granted Critical
Publication of ES2084886T3 publication Critical patent/ES2084886T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3488—Constructional details of particle beam apparatus not otherwise provided for, e.g. arrangement, mounting, housing, environment; special provisions for cleaning or maintenance of the apparatus
    • H01J37/3497—Temperature of target
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
    • H01J37/3405—Magnetron sputtering
    • H01J37/3408—Planar magnetron sputtering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/345—Magnet arrangements in particular for cathodic sputtering apparatus
    • H01J37/3455—Movable magnets
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/345—Magnet arrangements in particular for cathodic sputtering apparatus
    • H01J37/3458—Electromagnets in particular for cathodic sputtering apparatus

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electromagnetism (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

EN UN CATODO PARA EL REVESTIMIENTO DE UN SUBSTRATO (46), EL CUAL ESTA CONECTADO A UNA FUENTE DE CORRIENTE CONTINUA Y/O CORRIENTE ALTERNA (ALTA FRECUENCIA), Y ESTA DISPUESTO EN UNA CAMARA DE REVESTIMIENTO (2) EVACUABLE, Y EN CONTACTO ELECTRICO CON UN TARGET (29), Y QUE EL CATODO ESTA FORMADO ESENCIALMENTE DE UNA CARCASA (3) EN FORMA DE OLLA, CUYO FONDO CERRADO (58) CON SU SUPERFICIE EXTERIOR ESTA UNIDA RIGIDAMENTE CON EL TARGET (29), Y EL EXTREMO ABIERTO ORIENTADO HACIA EL TARGET (29), ESTA FIJADO DE FORMA HERMETICA EN UNA ABERTURA (48) EN LA PARED EXTERIOR (30) DE LA CAMARA DE REVESTIMIENTO (2) DE TAL MODO QUE, EL RECINTO INTERIOR (49) DE LA CARCASA (3) ESTA SIEMPRE SOMETIDO A LA PRESION ATMOSFERICA, MIENTRAS QUE EL TARGET (29) Y LA SUPERFICIE EXTERIOR (62), UNIDA CON LA PARTE DE LA CARCASA (3) EN FORMA DE CASQUILLO, INTRODUCIDA EN LA CAMARA DE REVESTIMIENTO (2), ESTAN SOMETIDOS POR LA RESPECTIVA PRESION EJERCIDA EN LA CAMARA DE REVESTIMIENTO (2), EN EL QUE EN EL RECINTO INTERIOR (49) DE LACARCASA (3), SE HA PREVISTO AL MENOS PARCIALMENTE LA INCORPORACION DE UN SUPLEMENTO (8), EL CUAL FORMA CON EL FONDO (58) UN ESPACIO CASI CILINDRICO CIRCULAR, EN EL CUAL PUEDE SER EMPLAZADO UN JUEGO DE IMANES (5, 4, 61) CON YUGO.
ES92111759T 1991-12-28 1992-07-10 Catodo para recubrir un substrato. Expired - Lifetime ES2084886T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19914143135 DE4143135A1 (de) 1991-11-14 1991-12-28 Kathode zum beschichten eines substrats

Publications (1)

Publication Number Publication Date
ES2084886T3 true ES2084886T3 (es) 1996-05-16

Family

ID=6448213

Family Applications (1)

Application Number Title Priority Date Filing Date
ES92111759T Expired - Lifetime ES2084886T3 (es) 1991-12-28 1992-07-10 Catodo para recubrir un substrato.

Country Status (3)

Country Link
EP (1) EP0549854B1 (es)
DE (1) DE59205763D1 (es)
ES (1) ES2084886T3 (es)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4329155A1 (de) * 1993-08-30 1995-03-02 Bloesch W Ag Magnetfeldkathode
DE19508406A1 (de) * 1995-03-09 1996-09-12 Leybold Ag Kathodenanordnung für eine Vorrichtung zum Zerstäuben eines Target-Paares
US5683560A (en) * 1995-07-08 1997-11-04 Balzers Und Leybold Deutschland Holding Ag Cathode assembly
DE19913382C2 (de) 1998-03-24 2002-08-14 Quantum Corp Mehrkanaliges Magnetbandsystem mit einem optischen Spur-Servo
WO2000049604A1 (fr) 1999-02-16 2000-08-24 Quantum Corporation Procede d'ecriture de signaux d'asservissement sur une bande magnetique
WO2000049605A1 (fr) 1999-02-17 2000-08-24 Quantum Corporation Procede d'ecriture de signaux d'asservissement sur une bande magnetique
US6558774B1 (en) 1999-08-17 2003-05-06 Quantum Corporation Multiple-layer backcoating for magnetic tape
US6264804B1 (en) 2000-04-12 2001-07-24 Ske Technology Corp. System and method for handling and masking a substrate in a sputter deposition system

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4401539A (en) * 1981-01-30 1983-08-30 Hitachi, Ltd. Sputtering cathode structure for sputtering apparatuses, method of controlling magnetic flux generated by said sputtering cathode structure, and method of forming films by use of said sputtering cathode structure
DE3727901A1 (de) * 1987-08-21 1989-03-02 Leybold Ag Zerstaeubungskathode nach dem magnetronprinzip
DE3812379A1 (de) * 1988-04-14 1989-10-26 Leybold Ag Zerstaeubungskathode nach dem magnetron-prinzip
DE4137483A1 (de) * 1991-11-14 1993-05-19 Leybold Ag Kathode zum beschichten eines substrats

Also Published As

Publication number Publication date
EP0549854B1 (de) 1996-03-20
EP0549854A1 (de) 1993-07-07
DE59205763D1 (de) 1996-04-25

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