ES2125820A1 - Procedimiento de fabricacion de placas de circuito impreso con conexion electrica entre caras. - Google Patents

Procedimiento de fabricacion de placas de circuito impreso con conexion electrica entre caras.

Info

Publication number
ES2125820A1
ES2125820A1 ES09700157A ES9700157A ES2125820A1 ES 2125820 A1 ES2125820 A1 ES 2125820A1 ES 09700157 A ES09700157 A ES 09700157A ES 9700157 A ES9700157 A ES 9700157A ES 2125820 A1 ES2125820 A1 ES 2125820A1
Authority
ES
Spain
Prior art keywords
faces
electrical connection
circuit boards
manufacturing printed
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
ES09700157A
Other languages
English (en)
Other versions
ES2125820B1 (es
Inventor
Arola Juan Llongueras
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EASY HOLE INTERNATIONAL Ltd
Original Assignee
EASY HOLE INTERNATIONAL Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by EASY HOLE INTERNATIONAL Ltd filed Critical EASY HOLE INTERNATIONAL Ltd
Priority to ES9700157A priority Critical patent/ES2125820B1/es
Publication of ES2125820A1 publication Critical patent/ES2125820A1/es
Application granted granted Critical
Publication of ES2125820B1 publication Critical patent/ES2125820B1/es
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Landscapes

  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Combinations Of Printed Boards (AREA)

Abstract

Procedimiento de fabricación de placas de circuito impreso con conexión eléctrica entre caras. Partiendo de una placa (1) de material base con sus caras recubiertas de sendas capas de cobre (2), se define el circuito mediante eliminación parcial del cobre a través de un grabado químico, precediéndose a continuación al troquelado del conjunto para la obtención de los taladros (5) a través de los que se llevará a cabo la conexión eléctrica entre las dos caras del circuito, conexión que se lleva a cabo mediante una fase de metalización química en la que se aplica a los orificios (5) y a la zona circundante a sus embocaduras, una capa metalizada (8) a base de una aleación de níquel-fósforo, quedando la placa, tras la aplicación de una máscara de soldadura y de tinta de identificación y tintas conductoras, en condiciones de paso por la ola de soldadura que rellenará los taladros metalizados (5) con una masa de estaño/plomo. Figura 7.
ES9700157A 1997-01-28 1997-01-28 Procedimiento de fabricacion de placas de circuito impreso con conexion electrica entre caras. Expired - Fee Related ES2125820B1 (es)

Priority Applications (1)

Application Number Priority Date Filing Date Title
ES9700157A ES2125820B1 (es) 1997-01-28 1997-01-28 Procedimiento de fabricacion de placas de circuito impreso con conexion electrica entre caras.

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
ES9700157A ES2125820B1 (es) 1997-01-28 1997-01-28 Procedimiento de fabricacion de placas de circuito impreso con conexion electrica entre caras.

Publications (2)

Publication Number Publication Date
ES2125820A1 true ES2125820A1 (es) 1999-03-01
ES2125820B1 ES2125820B1 (es) 1999-11-16

Family

ID=8298011

Family Applications (1)

Application Number Title Priority Date Filing Date
ES9700157A Expired - Fee Related ES2125820B1 (es) 1997-01-28 1997-01-28 Procedimiento de fabricacion de placas de circuito impreso con conexion electrica entre caras.

Country Status (1)

Country Link
ES (1) ES2125820B1 (es)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4512829A (en) * 1983-04-07 1985-04-23 Satosen Co., Ltd. Process for producing printed circuit boards
US4610758A (en) * 1983-06-01 1986-09-09 Ferranti Plc Manufacture of printed circuit boards
US4808967A (en) * 1985-05-29 1989-02-28 Ohmega Electronics Circuit board material
JPH07122850A (ja) * 1993-10-22 1995-05-12 Totoku Electric Co Ltd 低誘電率プリント基板の製造方法
US5468515A (en) * 1994-10-14 1995-11-21 Macdermid, Incorporated Composition and method for selective plating
ES2114303T3 (es) * 1993-12-03 1998-05-16 Macdermid Inc Metodo de produccion de un panel de circuito impreso.

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4512829A (en) * 1983-04-07 1985-04-23 Satosen Co., Ltd. Process for producing printed circuit boards
US4610758A (en) * 1983-06-01 1986-09-09 Ferranti Plc Manufacture of printed circuit boards
US4808967A (en) * 1985-05-29 1989-02-28 Ohmega Electronics Circuit board material
JPH07122850A (ja) * 1993-10-22 1995-05-12 Totoku Electric Co Ltd 低誘電率プリント基板の製造方法
ES2114303T3 (es) * 1993-12-03 1998-05-16 Macdermid Inc Metodo de produccion de un panel de circuito impreso.
US5468515A (en) * 1994-10-14 1995-11-21 Macdermid, Incorporated Composition and method for selective plating

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
BASE DE DATOS WPI en EPOQUE, Londres: Derwent Publications Ltd., AN 95-210700 & JP 7122850 A (TOKYO TO KUSHU DENSEN KK) 12.05.1995 *

Also Published As

Publication number Publication date
ES2125820B1 (es) 1999-11-16

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Legal Events

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EC2A Search report published

Date of ref document: 19990301

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FD1A Patent lapsed

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