ES2109297T3 - Soporte de datos con un soporte de circuito pegado en el interior. - Google Patents

Soporte de datos con un soporte de circuito pegado en el interior.

Info

Publication number
ES2109297T3
ES2109297T3 ES92113439T ES92113439T ES2109297T3 ES 2109297 T3 ES2109297 T3 ES 2109297T3 ES 92113439 T ES92113439 T ES 92113439T ES 92113439 T ES92113439 T ES 92113439T ES 2109297 T3 ES2109297 T3 ES 2109297T3
Authority
ES
Spain
Prior art keywords
support
plastics material
adhesive film
glued inside
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES92113439T
Other languages
English (en)
Inventor
Rainer Blome
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Idemia Germany GmbH
Original Assignee
Orga Kartensysteme GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=6870260&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=ES2109297(T3) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Orga Kartensysteme GmbH filed Critical Orga Kartensysteme GmbH
Application granted granted Critical
Publication of ES2109297T3 publication Critical patent/ES2109297T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772Physical layout of the record carrier
    • G06K19/07722Physical layout of the record carrier the record carrier being multilayered, e.g. laminated sheets
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745Mounting details of integrated circuit chips
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)
  • Immobilizing And Processing Of Enzymes And Microorganisms (AREA)
  • Photoreceptors In Electrophotography (AREA)
  • Reduction Or Emphasis Of Bandwidth Of Signals (AREA)

Abstract

TARJETA PORTADATOS COMPUESTA POR UN CUERPO DE TARJETA (1) FORMADO POR UN MATERIAL PLASTICO INICIAL, QUE PRESENTA UN REBAJE (10) CON UN ESCALONAMIENTO (11) EN EL QUE ESTA SELLADA UNA LAMINA PORTADORA (2) COMPUESTA POR UN SEGUNDO MATERIAL PLASTICO, QUE LLEVA UN MODULO DE CIRCUITO INTEGRADO (20), ADHERIDO CON UNA LAMINA DE PEGAMENTO DE FUSION (3), ESTANDO COMPUESTA LA LAMINA DE PEGAMENTO DE FUSION (3) DE DOS LAMINAS DE PEGAMENTO PARCIALES (3A, 3B) UNIDAS SUPERFICIALMENTE ENTRE SI, DE LAS CUALES LA PRIMERA LAMINA DE PEGAMENTO PARCIAL (3A) TIENE UN VALOR DE ADHERENCIA OPTIMO RESPECTO AL PRIMER MATERIAL DE PLASTICO DEL CUERPO DE LA TARJETA (1) Y LA SEGUNDA LAMINA DE PEGAMENTO PARCIAL (3B) PRESENTA UN VALOR DE ADHERENCIA OPTIMO AL SEGUNDO MATERIAL PLASTICO DE LA LAMINA PORTADORA (2).
ES92113439T 1991-08-14 1992-08-06 Soporte de datos con un soporte de circuito pegado en el interior. Expired - Lifetime ES2109297T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE9110057U DE9110057U1 (de) 1991-08-14 1991-08-14 Datenträgerkarte mit eingeklebtem Schaltkreisträger

Publications (1)

Publication Number Publication Date
ES2109297T3 true ES2109297T3 (es) 1998-01-16

Family

ID=6870260

Family Applications (1)

Application Number Title Priority Date Filing Date
ES92113439T Expired - Lifetime ES2109297T3 (es) 1991-08-14 1992-08-06 Soporte de datos con un soporte de circuito pegado en el interior.

Country Status (4)

Country Link
EP (1) EP0527438B1 (es)
AT (1) ATE159600T1 (es)
DE (2) DE9110057U1 (es)
ES (1) ES2109297T3 (es)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1995029460A1 (de) * 1994-04-27 1995-11-02 Siemens Aktiengesellschaft Chipkarte
US5917705A (en) * 1994-04-27 1999-06-29 Siemens Aktiengesellschaft Chip card
JPH0885285A (ja) * 1994-07-21 1996-04-02 Hitachi Maxell Ltd セキュリティカード用基板の製造方法、およびセキュリティカード用基板
DE4443767A1 (de) * 1994-12-08 1996-06-13 Giesecke & Devrient Gmbh Elektronisches Modul und Datenträger mit elektrischem Modul
FR2731538B1 (fr) * 1995-03-08 1997-04-11 Solaic Sa Procede pour fixer a un corps de carte electronique un module comportant un microcircuit et carte electronique comportant un module fixe selon ce procede
FR2735256A1 (fr) * 1995-06-09 1996-12-13 Solaic Sa Carte a circuit integre
US6072698A (en) * 1995-09-27 2000-06-06 Siemens Aktiengesellschaft Chip module with heat insulation for incorporation into a chip card
DE19543427C2 (de) * 1995-11-21 2003-01-30 Infineon Technologies Ag Chipmodul, insbesondere zum Einbau in eine Chipkarte
DE19601389A1 (de) * 1996-01-16 1997-07-24 Siemens Ag Chipkartenkörper
DE29708687U1 (de) * 1997-05-15 1997-07-24 Siemens AG, 80333 München Klebeverbindung
FR2800087A1 (fr) * 1999-10-26 2001-04-27 Gemplus Card Int Procede et moyens pour l'amelioration du collage entre materiaux polymeres, notamment pour carte a puce
DE10109993A1 (de) * 2001-03-01 2002-09-05 Giesecke & Devrient Gmbh Verfahren zur Herstellung eines Moduls
FR2855890B1 (fr) * 2003-06-05 2005-07-22 Sagem Carte multicouche en materiau thermoplastique et procede de securisation de carte multicouche
DE102008014302A1 (de) * 2008-03-05 2009-09-17 Rs Technologie Und Service Gmbh Verfahren zur Herstellung von Schutzelementen sowie deren Verwendung

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6164431A (ja) * 1984-09-07 1986-04-02 Bridgestone Corp 異種材質防水シ−ト間の接合方法
JPS61141089A (ja) * 1984-12-14 1986-06-28 Toshiba Corp Icカ−ド
FR2579799B1 (fr) * 1985-03-28 1990-06-22 Flonic Sa Procede de fabrication de cartes a memoire electronique et cartes obtenues suivant ledit procede
JP2838707B2 (ja) * 1987-12-29 1998-12-16 テルモ株式会社 医療器具とその製造方法

Also Published As

Publication number Publication date
ATE159600T1 (de) 1997-11-15
DE59208980D1 (de) 1997-11-27
DE9110057U1 (de) 1992-02-20
EP0527438A2 (de) 1993-02-17
EP0527438B1 (de) 1997-10-22
EP0527438A3 (en) 1993-12-15

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