ES2098682T3 - Procedimiento de moldeo utilizando una composicion de resina epoxi en un componente. - Google Patents

Procedimiento de moldeo utilizando una composicion de resina epoxi en un componente.

Info

Publication number
ES2098682T3
ES2098682T3 ES93309325T ES93309325T ES2098682T3 ES 2098682 T3 ES2098682 T3 ES 2098682T3 ES 93309325 T ES93309325 T ES 93309325T ES 93309325 T ES93309325 T ES 93309325T ES 2098682 T3 ES2098682 T3 ES 2098682T3
Authority
ES
Spain
Prior art keywords
epoxy resin
composition
resin
component
accelerator
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES93309325T
Other languages
English (en)
Inventor
Christopher Herbert Bull
Richard John Martin
Paul Terrence Wombwell
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Novartis AG
BASF Schweiz AG
Original Assignee
Ciba Geigy AG
Ciba SC Holding AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ciba Geigy AG, Ciba SC Holding AG filed Critical Ciba Geigy AG
Application granted granted Critical
Publication of ES2098682T3 publication Critical patent/ES2098682T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00—Processes of treating or compounding macromolecular substances
    • C08J3/20—Compounding polymers with additives, e.g. colouring
    • C08J3/201—Pre-melted polymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
    • B29C39/003—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor characterised by the choice of material
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C08G59/686—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing nitrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C08G59/72—Complexes of boron halides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C37/00—Component parts, details, accessories or auxiliary operations, not covered by group B29C33/00 or B29C35/00
    • B29C37/005—Compensating volume or shape change during moulding, in general
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2063/00—Use of EP, i.e. epoxy resins or derivatives thereof, as moulding material
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Transition And Organic Metals Composition Catalysts For Addition Polymerization (AREA)
  • Peptides Or Proteins (AREA)
  • Heating, Cooling, Or Curing Plastics Or The Like In General (AREA)

Abstract

LA PRESENTE INVENCION PROPORCIONA UN PROCESO PARA HACER UN MOLDEADO DE PLASTICOS CURADOS INTRODUCIENDO UNA COMPOSICION DE RESINA CURABLE PRE-CALENTADA A UN MOLDE CALENTADOR EL CUAL ESTA A UNA TEMPERATURA SUFICIENTEMENTE ELEVADA PARA INICIAR LA CURACION DE LA RESINA, Y SUMINISTRANDO ADEMAS RESINA BAJO PRESION PARA COMPENSAR EL ENCOGIMIENTO DE LA COMPOSICION, EN DONDE LA RESINA CURABLE ES UNA FORMULACION DE RESINA EPOXIDICA QUE CONTIENE UN GRUPO EPOXIDICO POR MOLECULA DE MEDIA, UN ENDURECEDOR DE ANHIDRIDO ACIDO, UN ACELERADOR Y UN COMPONENTE DE RELLENO, SIENDO ELEGIDOS LA RESINA EPOXIDICA, EL ENDURECEDOR Y EL ACELERADOR DE MODO QUE LA FORMULACION SEA ESTABLE A 25 C DURANTE AL MENOS 14 DIAS.
ES93309325T 1992-11-27 1993-11-23 Procedimiento de moldeo utilizando una composicion de resina epoxi en un componente. Expired - Lifetime ES2098682T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB929224854A GB9224854D0 (en) 1992-11-27 1992-11-27 Moulding process

Publications (1)

Publication Number Publication Date
ES2098682T3 true ES2098682T3 (es) 1997-05-01

Family

ID=10725758

Family Applications (1)

Application Number Title Priority Date Filing Date
ES93309325T Expired - Lifetime ES2098682T3 (es) 1992-11-27 1993-11-23 Procedimiento de moldeo utilizando una composicion de resina epoxi en un componente.

Country Status (19)

Country Link
US (1) US5451362A (es)
EP (1) EP0599600B1 (es)
JP (1) JPH06234127A (es)
KR (1) KR100292980B1 (es)
CN (1) CN1052741C (es)
AT (1) ATE146210T1 (es)
AU (1) AU669230B2 (es)
CA (1) CA2109974A1 (es)
DE (1) DE69306538T2 (es)
DK (1) DK0599600T3 (es)
ES (1) ES2098682T3 (es)
GB (1) GB9224854D0 (es)
GR (1) GR3022001T3 (es)
IL (1) IL107740A (es)
MX (1) MX9307464A (es)
MY (1) MY110190A (es)
NO (1) NO934292L (es)
TW (1) TW283111B (es)
ZA (1) ZA938888B (es)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2723334A1 (fr) * 1994-08-05 1996-02-09 Volpi Marie Rose Carroserie pour dissipateur thermique pour appareils de chauffage electrique
EP0799682A3 (de) * 1996-04-04 1998-01-21 Ciba SC Holding AG Herstellung von Formkörpern aus Epoxidharzen mit Hilfe der automatischen Druckgeliertechnik
ES2193341T3 (es) * 1996-06-17 2003-11-01 Vantico Ag Fabricacion de objetos moldeados de una composicion con un monocomponente de resina epoxi mediante la tecnica automatica de gelificacion a presion.
US6103157A (en) * 1997-07-02 2000-08-15 Ciba Specialty Chemicals Corp. Process for impregnating electrical coils
US6290202B1 (en) 1997-11-20 2001-09-18 Kewaunee Scientific Corporation Apparatus for molding thin resin sheets
DE19936605A1 (de) 1999-08-04 2001-02-15 Osram Opto Semiconductors Gmbh Transparente Gießharzmasse für SMT-fähige LED-Anwendungen mit hoher Temperatur und hohen Helligkeiten oder Leuchtstärken
US6521188B1 (en) * 2000-11-22 2003-02-18 Industrial Technology Research Institute Microfluidic actuator
DE10208644A1 (de) * 2002-02-28 2003-09-11 Bakelite Ag Verfahren zur Herstellung und Verarbeitung von Epoxidharz-Formmassen
US7419627B2 (en) * 2002-09-13 2008-09-02 Northrop Grumman Corporation Co-cured vacuum-assisted resin transfer molding manufacturing method
CN101547990B (zh) * 2006-10-06 2012-09-05 汉高股份及两合公司 可泵送的耐洗掉的环氧膏状粘合剂
EP2230267B1 (en) * 2009-03-20 2014-08-13 ABB Research Ltd. Method of producing a curable epoxy resin composition
TW201043837A (en) 2009-06-02 2010-12-16 Power Light Tech Co Ltd Solar energy street lamp structure with adjustable angle
KR101115425B1 (ko) * 2009-10-20 2012-02-20 알피니언메디칼시스템 주식회사 음향 트랜스듀서용 수동소자 제조방법
CN101794976A (zh) * 2010-03-12 2010-08-04 扬中市江城电器设备有限公司 一种风电/核电/水电用耐高压防水母线槽及其制造方法
DE102012202161A1 (de) * 2012-02-14 2013-08-14 Elantas Gmbh Elektroisolierharz auf Basis von Isohexiddioldiglycidethern
US9469745B2 (en) 2012-10-25 2016-10-18 Kohler Co Engineered composite material and products produced therefrom
CN104292754A (zh) * 2014-10-15 2015-01-21 中国航空工业集团公司基础技术研究院 一种环氧树脂的缓释固化方法
CN107163669A (zh) * 2017-06-01 2017-09-15 蓝地球微粉科技有限公司 一种沸石吸附的低温固化促进剂的制备及其使用方法
CN107353597A (zh) * 2017-08-21 2017-11-17 江苏中鹏新材料股份有限公司 塑封材料以及igbt封装器件

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3063965A (en) * 1957-11-25 1962-11-13 Union Carbide Corp Polyepoxide compositions
US4066625A (en) * 1967-05-02 1978-01-03 Amicon Corporation Unitary curable resin compositions
US3624032A (en) * 1969-04-24 1971-11-30 Morton Int Inc Epoxy compositions cured with carboxylic acid anhydrides and metallic salt of acetylacetone
US3637572A (en) * 1969-05-26 1972-01-25 Hitachi Ltd Epoxy resins with organoboron cure promotors
CH509139A (de) * 1969-06-19 1971-06-30 Ciba Geigy Ag Verfahren zur Herstellung von gehärteten Kunststoff-Formkörpern
BE759569A (fr) * 1969-11-28 1971-05-27 Minnesota Mining & Mfg Composition de resine epoxy stable
GB1317048A (en) * 1970-08-11 1973-05-16 Ciba Geigy Uk Ltd Curable epoxide resin compositions
DE2229907A1 (de) * 1972-06-20 1974-01-10 Bayer Ag Fluessige haertungsmittel fuer epoxid harze
FR2242361B1 (es) * 1973-08-27 1976-06-18 Charbonnages Ste Chimique
US4657992A (en) * 1986-02-18 1987-04-14 Coors Porcelain Company Paste anhydride curing system for cast epoxy resin bodies and method for making the same
JPH066622B2 (ja) * 1986-08-13 1994-01-26 新日本理化株式会社 液状エポキシ樹脂組成物
JPS63161018A (ja) * 1986-12-25 1988-07-04 Somar Corp 熱硬化性エポキシ樹脂組成物及びその製造方法
GB8806299D0 (en) * 1988-03-17 1988-04-13 Glynwed Consumer & Building Process of manufacturing thin-walled plastics moulding
US5104604A (en) * 1989-10-05 1992-04-14 Dexter Electronic Materials Div. Of Dexter Corp. Flame retardant epoxy molding compound, method and encapsulated device method of encapsulating a semiconductor device with a flame retardant epoxy molding compound
JPH03115423A (ja) * 1989-09-29 1991-05-16 Toshiba Corp 一液型エポキシ樹脂組成物の製造方法
JPH03269011A (ja) * 1990-03-16 1991-11-29 Nagase Chiba Kk エポキシ樹脂組成物
JP2592366B2 (ja) * 1991-08-16 1997-03-19 東陶機器株式会社 連続気孔多孔体の製造方法

Also Published As

Publication number Publication date
CN1052741C (zh) 2000-05-24
AU669230B2 (en) 1996-05-30
JPH06234127A (ja) 1994-08-23
CA2109974A1 (en) 1994-05-28
EP0599600A2 (en) 1994-06-01
AU5198793A (en) 1994-06-09
KR100292980B1 (ko) 2001-09-17
IL107740A (en) 1997-03-18
ZA938888B (en) 1994-08-01
ATE146210T1 (de) 1996-12-15
KR940011517A (ko) 1994-06-21
IL107740A0 (en) 1994-02-27
NO934292L (no) 1994-05-30
DE69306538T2 (de) 1997-04-10
EP0599600A3 (en) 1995-02-01
EP0599600B1 (en) 1996-12-11
DE69306538D1 (de) 1997-01-23
MY110190A (en) 1998-02-28
US5451362A (en) 1995-09-19
GR3022001T3 (en) 1997-03-31
NO934292D0 (no) 1993-11-26
MX9307464A (es) 1994-08-31
GB9224854D0 (en) 1993-01-13
DK0599600T3 (da) 1997-01-13
TW283111B (es) 1996-08-11
CN1098674A (zh) 1995-02-15

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