ES208825U - Disposicion de semiconductor. - Google Patents

Disposicion de semiconductor.

Info

Publication number
ES208825U
ES208825U ES0208825U ES208825U ES208825U ES 208825 U ES208825 U ES 208825U ES 0208825 U ES0208825 U ES 0208825U ES 208825 U ES208825 U ES 208825U ES 208825 U ES208825 U ES 208825U
Authority
ES
Spain
Prior art keywords
semiconductor
translation
machine
legally binding
google translate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
ES0208825U
Other languages
English (en)
Other versions
ES208825Y (es
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lucas Electrical Co Ltd
Original Assignee
Lucas Electrical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lucas Electrical Co Ltd filed Critical Lucas Electrical Co Ltd
Publication of ES208825U publication Critical patent/ES208825U/es
Application granted granted Critical
Publication of ES208825Y publication Critical patent/ES208825Y/es
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H01L23/4334—Auxiliary members in encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Gasket Seals (AREA)

Abstract

Disposición de semiconductor, caracterizada porque incluye un vástago conductor, un dispositivo semiconductor montado en dicho vástago, de modo que una primera zona de contacto del dispositivo esté conectada térmica y eléctricamente con el mismo, un conductor eléctrico que incluye una porción ensanchada de cabeza que está conectada térmica y eléctricamente con una segunda zona de contacto del dispositivo, un cuerpo configurado para definir un alojamiento en el que está introducido dicho vástago, de modo que el dispositivo quede alojado en el espacio definido entre el vástago y las paredes del alojamiento, extendiéndose el conductor eléctrico a través de una abertura de una de dichas paredes, medios de hermetización, para impedir la entrada de materia extraña a través de dicha abertura y hacia dicho espacio, y un órgano elástico aprisionado y deformado entre la porción de cabeza del conductor y dicho cuerpo, de modo que la porción de cabeza sea forzada hacia un contacto a presión con el dispositivo.
ES1974208825U 1974-01-18 1974-12-31 Disposicion de semiconductor. Expired ES208825Y (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB2391/74A GB1489603A (en) 1974-01-18 1974-01-18 Semi-conductor assemblies

Publications (2)

Publication Number Publication Date
ES208825U true ES208825U (es) 1976-04-01
ES208825Y ES208825Y (es) 1976-07-16

Family

ID=9738724

Family Applications (1)

Application Number Title Priority Date Filing Date
ES1974208825U Expired ES208825Y (es) 1974-01-18 1974-12-31 Disposicion de semiconductor.

Country Status (8)

Country Link
US (1) US4007477A (es)
AR (1) AR201530A1 (es)
DE (1) DE2501337A1 (es)
ES (1) ES208825Y (es)
FR (1) FR2258709B1 (es)
GB (1) GB1489603A (es)
IN (1) IN149708B (es)
IT (1) IT1026361B (es)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4099201A (en) * 1977-04-11 1978-07-04 General Electric Company Semiconductor rectifier assembly having an insulating material therein that evolves gases when exposed to an arc
DE2734571A1 (de) * 1977-07-30 1979-02-15 Bosch Gmbh Robert Gleichrichteranordnung
US4167744A (en) * 1978-03-23 1979-09-11 Rca Corporation Electroluminescent semiconductor device having optical fiber window
FR2421465A1 (fr) * 1978-03-30 1979-10-26 Sev Marchal Diode de puissance a element semi-conducteur destinee notamment a equiper un pont redresseur d'alternateur
US4403102A (en) * 1979-11-13 1983-09-06 Thermalloy Incorporated Heat sink mounting
DE3124692A1 (de) * 1981-06-24 1983-01-13 Robert Bosch Gmbh, 7000 Stuttgart "halbleitergleichrichter"
US4521827A (en) * 1981-10-23 1985-06-04 Thermalloy, Inc. Heat sink mounting
US4587377A (en) * 1984-09-21 1986-05-06 Illinois Tool Works Inc. Electrically insulating fastener for heat sinks of different thicknesses
US20040042178A1 (en) * 2002-09-03 2004-03-04 Vadim Gektin Heat spreader with surface cavity
DE102011056848A1 (de) * 2011-12-22 2013-06-27 Semikron Elektronik Gmbh & Co. Kg Leistungshalbleitermodul oder Ansteuermodul hierfür
DE102013103116B3 (de) * 2013-03-27 2014-09-18 Semikron Elektronik Gmbh & Co. Kg Leistungshalbleitermodul und Verfahren zur Herstellung eines Leistungshalbleitermoduls

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1250005B (es) * 1961-02-06 1967-09-14
DE1514152A1 (de) * 1964-12-16 1969-09-11 Licentia Gmbh Halbleiter-Gleichrichterzelle
GB1140677A (en) * 1965-05-07 1969-01-22 Ass Elect Ind Improvements relating to semi-conductor devices
SE333197B (sv) * 1966-12-27 1971-03-08 Asea Ab Halvledaranordning foer stora stroemstyrkor
US3449506A (en) * 1967-05-11 1969-06-10 Int Rectifier Corp Aluminum rectifier base having copper insert
DE1944515A1 (de) * 1969-09-02 1971-03-04 Siemens Ag Halbleiterbauelement mit Kunststoffuellung

Also Published As

Publication number Publication date
DE2501337A1 (de) 1975-07-24
IN149708B (es) 1982-03-20
GB1489603A (en) 1977-10-26
AU7687474A (en) 1976-06-24
FR2258709A1 (es) 1975-08-18
FR2258709B1 (es) 1978-06-23
AR201530A1 (es) 1975-03-21
US4007477A (en) 1977-02-08
ES208825Y (es) 1976-07-16
IT1026361B (it) 1978-09-20

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