AR201530A1 - Conjunto de semiconductor montado en un prisionero constructivo - Google Patents

Conjunto de semiconductor montado en un prisionero constructivo

Info

Publication number
AR201530A1
AR201530A1 AR257338A AR25733875A AR201530A1 AR 201530 A1 AR201530 A1 AR 201530A1 AR 257338 A AR257338 A AR 257338A AR 25733875 A AR25733875 A AR 25733875A AR 201530 A1 AR201530 A1 AR 201530A1
Authority
AR
Argentina
Prior art keywords
prisoner
constructive
assembly mounted
semiconductor assembly
semiconductor
Prior art date
Application number
AR257338A
Other languages
English (en)
Original Assignee
Lucas Electrical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lucas Electrical Co Ltd filed Critical Lucas Electrical Co Ltd
Application granted granted Critical
Publication of AR201530A1 publication Critical patent/AR201530A1/es

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433Auxiliary members in containers characterised by their shape, e.g. pistons
    • H01L23/4334Auxiliary members in encapsulations
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01005Boron [B]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01006Carbon [C]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01013Aluminum [Al]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01019Potassium [K]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01029Copper [Cu]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01082Lead [Pb]

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Gasket Seals (AREA)
AR257338A 1974-01-18 1975-01-17 Conjunto de semiconductor montado en un prisionero constructivo AR201530A1 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB2391/74A GB1489603A (en) 1974-01-18 1974-01-18 Semi-conductor assemblies

Publications (1)

Publication Number Publication Date
AR201530A1 true AR201530A1 (es) 1975-03-21

Family

ID=9738724

Family Applications (1)

Application Number Title Priority Date Filing Date
AR257338A AR201530A1 (es) 1974-01-18 1975-01-17 Conjunto de semiconductor montado en un prisionero constructivo

Country Status (8)

Country Link
US (1) US4007477A (es)
AR (1) AR201530A1 (es)
DE (1) DE2501337A1 (es)
ES (1) ES208825Y (es)
FR (1) FR2258709B1 (es)
GB (1) GB1489603A (es)
IN (1) IN149708B (es)
IT (1) IT1026361B (es)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4099201A (en) * 1977-04-11 1978-07-04 General Electric Company Semiconductor rectifier assembly having an insulating material therein that evolves gases when exposed to an arc
DE2734571A1 (de) * 1977-07-30 1979-02-15 Bosch Gmbh Robert Gleichrichteranordnung
US4167744A (en) * 1978-03-23 1979-09-11 Rca Corporation Electroluminescent semiconductor device having optical fiber window
FR2421465A1 (fr) * 1978-03-30 1979-10-26 Sev Marchal Diode de puissance a element semi-conducteur destinee notamment a equiper un pont redresseur d'alternateur
US4403102A (en) * 1979-11-13 1983-09-06 Thermalloy Incorporated Heat sink mounting
DE3124692A1 (de) * 1981-06-24 1983-01-13 Robert Bosch Gmbh, 7000 Stuttgart "halbleitergleichrichter"
US4521827A (en) * 1981-10-23 1985-06-04 Thermalloy, Inc. Heat sink mounting
US4587377A (en) * 1984-09-21 1986-05-06 Illinois Tool Works Inc. Electrically insulating fastener for heat sinks of different thicknesses
US20040042178A1 (en) * 2002-09-03 2004-03-04 Vadim Gektin Heat spreader with surface cavity
DE102011056848A1 (de) * 2011-12-22 2013-06-27 Semikron Elektronik Gmbh & Co. Kg Leistungshalbleitermodul oder Ansteuermodul hierfür
DE102013103116B3 (de) 2013-03-27 2014-09-18 Semikron Elektronik Gmbh & Co. Kg Leistungshalbleitermodul und Verfahren zur Herstellung eines Leistungshalbleitermoduls

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL274434A (es) * 1961-02-06 1900-01-01
DE1514152A1 (de) * 1964-12-16 1969-09-11 Licentia Gmbh Halbleiter-Gleichrichterzelle
GB1140677A (en) * 1965-05-07 1969-01-22 Ass Elect Ind Improvements relating to semi-conductor devices
SE333197B (sv) * 1966-12-27 1971-03-08 Asea Ab Halvledaranordning foer stora stroemstyrkor
US3449506A (en) * 1967-05-11 1969-06-10 Int Rectifier Corp Aluminum rectifier base having copper insert
DE1944515A1 (de) * 1969-09-02 1971-03-04 Siemens Ag Halbleiterbauelement mit Kunststoffuellung

Also Published As

Publication number Publication date
IN149708B (es) 1982-03-20
GB1489603A (en) 1977-10-26
AU7687474A (en) 1976-06-24
ES208825U (es) 1976-04-01
ES208825Y (es) 1976-07-16
DE2501337A1 (de) 1975-07-24
IT1026361B (it) 1978-09-20
FR2258709B1 (es) 1978-06-23
US4007477A (en) 1977-02-08
FR2258709A1 (es) 1975-08-18

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