ES2080058T3 - ELECTRIC CONDUCTOR ISOLATED THROUGH A POLYMER. - Google Patents
ELECTRIC CONDUCTOR ISOLATED THROUGH A POLYMER.Info
- Publication number
- ES2080058T3 ES2080058T3 ES89117457T ES89117457T ES2080058T3 ES 2080058 T3 ES2080058 T3 ES 2080058T3 ES 89117457 T ES89117457 T ES 89117457T ES 89117457 T ES89117457 T ES 89117457T ES 2080058 T3 ES2080058 T3 ES 2080058T3
- Authority
- ES
- Spain
- Prior art keywords
- polymer
- electric conductor
- adhesive
- resistant
- thermally cured
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/303—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups H01B3/38 or H01B3/302
- H01B3/306—Polyimides or polyesterimides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/301—Macromolecular compounds obtained by reactions forming a linkage containing sulfur with or without nitrogen, oxygen or carbon in the main chain of the macromolecule, not provided for in group H01B3/302
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/46—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes silicones
Landscapes
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Organic Insulating Materials (AREA)
- Insulated Conductors (AREA)
- Insulators (AREA)
Abstract
Process for joining a completely thermally cured polymer to itself or to another material by coating the polymer with an adhesive layer of a completely thermally cured organosiloxanimide adhesive which contains an organic peroxide, and curing the adhesive by heating in order to crosslink it. The polymer used may be a polyimide, a polyphenylene sulphide or a polyether ether ketone. A heat-resistant and solvent-resistant polymer-insulated wire is obtained.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US28804888A | 1988-12-21 | 1988-12-21 |
Publications (1)
Publication Number | Publication Date |
---|---|
ES2080058T3 true ES2080058T3 (en) | 1996-02-01 |
Family
ID=23105529
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ES89117457T Expired - Lifetime ES2080058T3 (en) | 1988-12-21 | 1989-09-21 | ELECTRIC CONDUCTOR ISOLATED THROUGH A POLYMER. |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP0377080B1 (en) |
AT (1) | ATE131310T1 (en) |
DE (2) | DE58909529D1 (en) |
ES (1) | ES2080058T3 (en) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CA2085653A1 (en) * | 1992-01-10 | 1993-07-11 | Michael G. Minnick | Polyetherimide/dimethylsiloxane copolymer adhesive system for bonding copper foil to polyetherimide flexible films |
IT1255027B (en) * | 1992-05-08 | 1995-10-13 | Luca Castellani | CABLE FOR HIGH OPERATING TEMPERATURES |
JP2013020727A (en) * | 2011-07-07 | 2013-01-31 | Nitto Denko Corp | Coating material for rectangular copper wire, coated rectangular copper wire and electrical apparatus |
JP2013033716A (en) * | 2011-07-07 | 2013-02-14 | Nitto Denko Corp | Covering material for superconducting wire, superconducting electric wire and electrical device |
JP2013020726A (en) * | 2011-07-07 | 2013-01-31 | Nitto Denko Corp | Coating material for rectangular copper wire, coated rectangular copper wire and electrical apparatus |
JP2013020725A (en) * | 2011-07-07 | 2013-01-31 | Nitto Denko Corp | Coating material of superconducting wire, superconducting wire and electrical apparatus |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0727966B2 (en) * | 1986-07-04 | 1995-03-29 | 日立化成工業株式会社 | Semiconductor device |
-
1989
- 1989-09-21 DE DE58909529T patent/DE58909529D1/en not_active Expired - Fee Related
- 1989-09-21 AT AT89117457T patent/ATE131310T1/en not_active IP Right Cessation
- 1989-09-21 EP EP89117457A patent/EP0377080B1/en not_active Expired - Lifetime
- 1989-09-21 ES ES89117457T patent/ES2080058T3/en not_active Expired - Lifetime
- 1989-09-21 DE DE198989117457T patent/DE377080T1/en active Pending
Also Published As
Publication number | Publication date |
---|---|
EP0377080A3 (en) | 1991-12-18 |
EP0377080B1 (en) | 1995-12-06 |
ATE131310T1 (en) | 1995-12-15 |
DE377080T1 (en) | 1990-10-18 |
EP0377080A2 (en) | 1990-07-11 |
DE58909529D1 (en) | 1996-01-18 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
FG2A | Definitive protection |
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