DE377080T1 - ELECTRICAL LADDER INSULATED WITH A POLYMER. - Google Patents

ELECTRICAL LADDER INSULATED WITH A POLYMER.

Info

Publication number
DE377080T1
DE377080T1 DE198989117457T DE89117457T DE377080T1 DE 377080 T1 DE377080 T1 DE 377080T1 DE 198989117457 T DE198989117457 T DE 198989117457T DE 89117457 T DE89117457 T DE 89117457T DE 377080 T1 DE377080 T1 DE 377080T1
Authority
DE
Germany
Prior art keywords
adhesive
insulated conductor
polymer
conductor according
peroxide
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE198989117457T
Other languages
German (de)
Inventor
Ewald D-8501 Eckental Brueckner
Kevin Newark Delaware 19711 Kirk
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
WL Gore and Associates GmbH
Original Assignee
WL Gore and Associates GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by WL Gore and Associates GmbH filed Critical WL Gore and Associates GmbH
Publication of DE377080T1 publication Critical patent/DE377080T1/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/303Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups H01B3/38 or H01B3/302
    • H01B3/306Polyimides or polyesterimides
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/301Macromolecular compounds obtained by reactions forming a linkage containing sulfur with or without nitrogen, oxygen or carbon in the main chain of the macromolecule, not provided for in group H01B3/302
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/46Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes silicones

Landscapes

  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Organic Insulating Materials (AREA)
  • Insulated Conductors (AREA)
  • Insulators (AREA)

Abstract

Process for joining a completely thermally cured polymer to itself or to another material by coating the polymer with an adhesive layer of a completely thermally cured organosiloxanimide adhesive which contains an organic peroxide, and curing the adhesive by heating in order to crosslink it. The polymer used may be a polyimide, a polyphenylene sulphide or a polyether ether ketone. A heat-resistant and solvent-resistant polymer-insulated wire is obtained.

Claims (23)

Patentansprüche:Patent claims: 1. Isolierter elektrischer Leiter mit:1. Insulated electrical conductor with: (a) einer Seele aus elektrisch leitendem Metall;(a) a core of electrically conductive metal; (b) einem Isolationsmaterial aus einem Polymer, das die Seele umgibt; und(b) an insulating material made of a polymer surrounding the core; and (c) einem vollständig hitzegehärteten Organosiloxanimid-Klebstoff, der auf das Polymer aufgebracht ist; und(c) a fully heat-cured organosiloxane imide adhesive applied to the polymer; and (d) einer weiteren Schicht des Polymers, die mit dem Klebstoff verklebt ist.(d) a further layer of the polymer bonded to the adhesive. 2. Isolierter Leiter nach Anspruch 1, dadurch g ekennzeichnet, daß das Isolationsmaterial aus einem Polymer hergestellt ist, das aus Polyimid, Polyphenylen-2. Insulated conductor according to claim 1, characterized in that the insulating material is made of a polymer selected from polyimide, polyphenylene sulfid oder Polyether-etherketon ausgewählt ist.sulfide or polyether ether ketone. 3. Isolierter Leiter nach Anspruch 1 oder 2, dadurch gekennzeichnet, daß der Klebstoff aus solchen Klebstoffen ausgewählt ist, die die Formel3. Insulated conductor according to claim 1 or 2, characterized in that the adhesive is selected from those adhesives which have the formula ■&ngr; &ngr; VV ■&ngr;&ngr; VV &ogr; &ogr; &ogr; &ogr; aa —o-—o- KK 11 &igr;&igr; 11 ScSc &igr;&igr; RR
-Rr-Rr aufweisen, worin Q ein tetravalentes Radikal ist, das ausgewählt ist auswherein Q is a tetravalent radical selected from unc/unc/ worin D ausgewählt ist auswhere D is selected from 1111 &igr; ,&igr; , k7 k7 O •CO •C O CO C 4
worin R em bivalentes Radikal, das ausgewählt ist aus
4
wherein R em is a divalent radical selected from
undand &igr;
c H
&igr;
c H
GH? BGH?B und ein bivalentes organisches Radikal der allgemeinen Formeland a bivalent organic radical of the general formula darstellt, worin bedeuten:represents, where: R und R sind Alkylen, für gewöhnlich -(CH_)_ -,R and R are alkylene, usually -(CH_)_ -, oder R , R ist Methyl, Phenyl, Tolyl oder eine Mischung aus aliphatischen und aromatischen Radikalen, R ist Wasserstoff oder ein Alkylradikal mit 1-8 C-Atomen, X ist ausgewählt aus bivalenten Radikalen -CR I- , - cyH2y -, or R , R is methyl, phenyl, tolyl or a mixture of aliphatic and aromatic radicals, R is hydrogen or an alkyl radical with 1-8 C atoms, X is selected from divalent radicals -CR I- , - c y H 2y -, CO -, -SO -, -O -, und -S-, wobei y 1 bis 5, k 1 bis 7, &eegr; 1 bis 7, m eine ganze Zahl größer als 1 und &rgr; Null oder 1 darstellen.CO -, -SO -, -O -, and -S-, where y is 1 to 5, k is 1 to 7, η is 1 to 7, m is an integer greater than 1 and ρ is zero or 1.
4. Isolierter Leiter nach Anspruch 2 oder 3, dadurch4. Insulated conductor according to claim 2 or 3, characterized gekennzeichnet,marked, daß R -CHthat R -CH R2 - R2 - X -C(CH)3J2-, QX -C(CH) 3 J 2 -, Q darstellen, worin D -0-R -0- darstellt, daß &rgr; gleich 1, k gleich 5, &eegr; gleich 4 und m 4 bis 8 ist.wherein D represents -0-R -0-, ρ is 1, k is 5, η is 4 and m is 4 to 8. 5. Isolierter Leiter nach einem der Ansprüche 1 bis 4, dadurch g ekennzeichnet, daß der Klebstoff in Gegenwart eines organischen Peroxids ausgehärtet ist.5. Insulated conductor according to one of claims 1 to 4, characterized in that the adhesive is cured in the presence of an organic peroxide. 6. Isolierter Leiter nach Anspruch.5, dadurch g ekennzeichnet, daß das organische Peroxid Benzoylperoxid, beispielsweise Bis-2,4-dichlorbenzoylperoxid, Dicumylperoxid oder t-Butylperoxid ist.6. Insulated conductor according to claim 5, characterized in that the organic peroxide is benzoyl peroxide, for example bis-2,4-dichlorobenzoyl peroxide, dicumyl peroxide or t-butyl peroxide. 7. Isolierter Leiter nach Anspruch 5 oder 6, dadurch gekennz eichnet, daß der Klebstoff in Gegenwart eines Coaktivators ausgehärtet ist.7. Insulated conductor according to claim 5 or 6, characterized in that the adhesive is cured in the presence of a coactivator. 8. Isolierter Leiter nach Anspruch 7, dadurch g ekennzeichnet,· daß der Coaktivator ein Cyanurat ist.8. Insulated conductor according to claim 7, characterized in that the coactivator is a cyanurate. 9. Isolierter Leiter nach Anspruch 8, dadurch g ekennzeichnet, daß das Cyanurat ein Triallylcyanurat ist.9. Insulated conductor according to claim 8, characterized in that the cyanurate is a triallyl cyanurate. 10. Isolierter Leiter nach einem der Ansprüche 1 bis 9, dadurch gekennzeichnet, daß der Klebstoff zur Erniedrigung der Dielektrizitätskonstante des Isolationsmaterials mit Mikrokugeln aus Glas, die innen hohl sind, versetzt ist.10. Insulated conductor according to one of claims 1 to 9, characterized in that the adhesive is mixed with glass microspheres which are hollow inside in order to reduce the dielectric constant of the insulation material. 11. Isolierter Leiter nach Anspruch 10, dadurch g ekenn &zgr; e i chnet, daß der Klebstoff zur Erhöhung der Haftung mit den Mikrokugeln aus Glas ein Silan enthält. 11. Insulated conductor according to claim 10, characterized in that the adhesive contains a silane to increase the adhesion with the glass microspheres. 12. Isolierter Leiter nach Anspruch 11, dadurch g ekenn ze lehnet, daß das Silan ausgewählt ist aus Vinyltris-(2-methoxyethoxy)-silan, 3,4-Epoxybutyltriethoxysilan, 3-Thiocyanatopropyltriethoxysilan oder 3-Methacryloxypropyltriethoxysilan.12. Insulated conductor according to claim 11, characterized in that the silane is selected from vinyltris-(2-methoxyethoxy)-silane, 3,4-epoxybutyltriethoxysilane, 3-thiocyanatopropyltriethoxysilane or 3-methacryloxypropyltriethoxysilane. 13. Isolierter Leiter nach Anspruch 11 oder 12, dadurch gekennzeichnet, daß die Menge an Silan 0,1 bis 0,8 % des Gewichts an Mikrokugeln beträgt.13. Insulated conductor according to claim 11 or 12, characterized in that the amount of silane is 0.1 to 0.8% of the weight of microspheres. 14. Isolierter Leiter nach einem der Ansprüche 1 bis 13, dadurch gekennz e ichnet, daß der Klebstoff ein Flammschutzmittel enthält.14. Insulated conductor according to one of claims 1 to 13, characterized in that the adhesive contains a flame retardant. 15. Isolierter Leiter nach Anspruch 14, dadurch g ekennzeichnet, daß das Flammschutzmittel in einer Konzentration bis zu etwa 20 Gewichtsprozent vorliegt. 15. Insulated conductor according to claim 14, characterized in that the flame retardant is present in a concentration of up to about 20 percent by weight. 16. Verfahren zum Isolieren eines Leiters aus elektrisch leitendem Metall mit folgenden Verfahrensschritten:16. A method for insulating a conductor made of electrically conductive metal, comprising the following steps: (a) Überziehen eines Polymerfilms mit einer Klebstoffschicht aus einem vollständig hitzegehärteten Organosiloxanimid in einem organischen Lösungsmittel;(a) coating a polymer film with an adhesive layer of a fully heat-cured organosiloxane imide in an organic solvent; (b) Verdampfen des Lösungsmittels;(b) evaporating the solvent; (c) Umwickeln des Leiters mit dem Polymerfilm und dem dem Klebstoff oder Einbetten des Leiters in die Klebstoffschicht ;(c) wrapping the conductor with the polymer film and the adhesive or embedding the conductor in the adhesive layer ; (d) Erhitzen des umwickelten Leiters zur Verbindung der Schichten.(d) Heating the wrapped conductor to bond the layers. 17. Verfahren nach Anspruch 16, dadurch gekennzeichnet, daß die Lösung des vollständig hitzegehärteten Organosiloxanimids in einem organischen Lösungsmittel ein organisches Peroxid enthält und daß nach dem Erhitzen zur Verbindung der Schichten der Leiter zur Durchführung der räumlichen Vernetzung des Organosiloxanimids längere Zeit auf einer vergleichsweise niedrigeren Termperatur gehalten wird.17. Process according to claim 16, characterized in that the solution of the completely heat-cured organosiloxane imide in an organic solvent contains an organic peroxide and that after heating to bond the layers, the conductor is kept at a comparatively lower temperature for a longer period of time to carry out the spatial cross-linking of the organosiloxane imide. 18. Verfahren zum Klebverbinden eines Polymers mit sich selbst oder mit einem anderen Material durch Erhitzen einer Verbindungsschicht aus vollständig hitzegehärtetem Organosiloxanimid-Klebstoff, der das Polymer bedeckt.18. A method of adhesively bonding a polymer to itself or to another material by heating a bonding layer of fully heat-cured organosiloxane imide adhesive covering the polymer. 19. Verfahren nach Anspruch 18, dadurch gekennzeichnet, daß das Polymer ein Polyimid, ein Polyphenylensulfid oder ein Polyether-etherketon ist.19. Process according to claim 18, characterized in that the polymer is a polyimide, a polyphenylene sulfide or a polyether ether ketone. 20. Verfahren nach Anspruch 18 oder 19, dadurch g ekenn &zgr; e ichnet, daß der Klebstoff ein organisches Peroxid enthält.20. Method according to claim 18 or 19, characterized in that the adhesive contains an organic peroxide. 21. Verfahren nach Anspruch 20, dadurch gekennzeichnet, daß das organische Peroxid ein Benzoyl peroxid, beispielsweise Bis-2,4-dichlorbenzoylperoxid, Dicumylperoxid oder t-Butylperoxid ist.21. Process according to claim 20, characterized in that the organic peroxide is a benzoyl peroxide, for example bis-2,4-dichlorobenzoyl peroxide, dicumyl peroxide or t-butyl peroxide. 22. Verfahren nach Anspruch 20 oder 21, dadurch gekennzeichnet, daß zusätzlich zum organischen Peroxid ein Coaktivator, vorzugsweise ein Cyanurat verwendet wird.22. Process according to claim 20 or 21, characterized in that in addition to the organic peroxide a coactivator, preferably a cyanurate, is used. 23. Verfahren nach Anspruch 22, dadurch gekennzeichnet, daß als Cyanurat ein Trieallylcyanurat verwendet wird.23. Process according to claim 22, characterized in that a triallyl cyanurate is used as the cyanurate.
DE198989117457T 1988-12-21 1989-09-21 ELECTRICAL LADDER INSULATED WITH A POLYMER. Pending DE377080T1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US28804888A 1988-12-21 1988-12-21

Publications (1)

Publication Number Publication Date
DE377080T1 true DE377080T1 (en) 1990-10-18

Family

ID=23105529

Family Applications (2)

Application Number Title Priority Date Filing Date
DE58909529T Expired - Fee Related DE58909529D1 (en) 1988-12-21 1989-09-21 Electrical conductor insulated with a polymer.
DE198989117457T Pending DE377080T1 (en) 1988-12-21 1989-09-21 ELECTRICAL LADDER INSULATED WITH A POLYMER.

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE58909529T Expired - Fee Related DE58909529D1 (en) 1988-12-21 1989-09-21 Electrical conductor insulated with a polymer.

Country Status (4)

Country Link
EP (1) EP0377080B1 (en)
AT (1) ATE131310T1 (en)
DE (2) DE58909529D1 (en)
ES (1) ES2080058T3 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0551747A1 (en) * 1992-01-10 1993-07-21 General Electric Company Polyetherimide flexible films
IT1255027B (en) * 1992-05-08 1995-10-13 Luca Castellani CABLE FOR HIGH OPERATING TEMPERATURES
JP2013020726A (en) * 2011-07-07 2013-01-31 Nitto Denko Corp Coating material for rectangular copper wire, coated rectangular copper wire and electrical apparatus
JP2013033716A (en) * 2011-07-07 2013-02-14 Nitto Denko Corp Covering material for superconducting wire, superconducting electric wire and electrical device
JP2013020725A (en) * 2011-07-07 2013-01-31 Nitto Denko Corp Coating material of superconducting wire, superconducting wire and electrical apparatus
JP2013020727A (en) * 2011-07-07 2013-01-31 Nitto Denko Corp Coating material for rectangular copper wire, coated rectangular copper wire and electrical apparatus

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0727966B2 (en) * 1986-07-04 1995-03-29 日立化成工業株式会社 Semiconductor device

Also Published As

Publication number Publication date
ATE131310T1 (en) 1995-12-15
EP0377080A3 (en) 1991-12-18
DE58909529D1 (en) 1996-01-18
EP0377080B1 (en) 1995-12-06
ES2080058T3 (en) 1996-02-01
EP0377080A2 (en) 1990-07-11

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