ES2063316T3 - Procedimiento de interconexion de capas metalicas de la red de capas multiples de una tarjeta electronica y tarjeta resultante. - Google Patents

Procedimiento de interconexion de capas metalicas de la red de capas multiples de una tarjeta electronica y tarjeta resultante.

Info

Publication number
ES2063316T3
ES2063316T3 ES90403493T ES90403493T ES2063316T3 ES 2063316 T3 ES2063316 T3 ES 2063316T3 ES 90403493 T ES90403493 T ES 90403493T ES 90403493 T ES90403493 T ES 90403493T ES 2063316 T3 ES2063316 T3 ES 2063316T3
Authority
ES
Spain
Prior art keywords
card
network
layers
interconnection
procedure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES90403493T
Other languages
English (en)
Inventor
Philippe Chantraine
Marta Zorrilla
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Bull SAS
Original Assignee
Bull SAS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=9388799&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=ES2063316(T3) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Bull SAS filed Critical Bull SAS
Application granted granted Critical
Publication of ES2063316T3 publication Critical patent/ES2063316T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/422—Plated through-holes or plated via connections characterised by electroless plating method; pretreatment therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0344—Electroless sublayer, e.g. Ni, Co, Cd or Ag; Transferred electroless sublayer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0347—Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09563—Metal filled via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/09—Treatments involving charged particles
    • H05K2203/095—Plasma, e.g. for treating a substrate to improve adhesion with a conductor or for cleaning holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0055—After-treatment, e.g. cleaning or desmearing of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Credit Cards Or The Like (AREA)

Abstract

EN LA TARJETA (10), LA RED (11) ESTA HECHA DE CAPAS METALICAS SUPERPUESTAS 12, 14 UNIDAS ENTRE ELLAS POR UN FICHERO (18) EN UN CRUCE (17) COMUN A LAS DOS CAPAS.
ES90403493T 1989-12-21 1990-12-07 Procedimiento de interconexion de capas metalicas de la red de capas multiples de una tarjeta electronica y tarjeta resultante. Expired - Lifetime ES2063316T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR8916956A FR2656493A1 (fr) 1989-12-21 1989-12-21 Procede d'interconnexion de couches metalliques du reseau multicouche d'une carte electronique, et carte en resultant.

Publications (1)

Publication Number Publication Date
ES2063316T3 true ES2063316T3 (es) 1995-01-01

Family

ID=9388799

Family Applications (1)

Application Number Title Priority Date Filing Date
ES90403493T Expired - Lifetime ES2063316T3 (es) 1989-12-21 1990-12-07 Procedimiento de interconexion de capas metalicas de la red de capas multiples de una tarjeta electronica y tarjeta resultante.

Country Status (6)

Country Link
US (1) US5464653A (es)
EP (1) EP0435717B1 (es)
JP (1) JP2618093B2 (es)
DE (1) DE69012082T2 (es)
ES (1) ES2063316T3 (es)
FR (1) FR2656493A1 (es)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2656493A1 (fr) * 1989-12-21 1991-06-28 Bull Sa Procede d'interconnexion de couches metalliques du reseau multicouche d'une carte electronique, et carte en resultant.
DE4122362A1 (de) * 1991-07-05 1993-01-14 Siemens Ag Anordnung und verfahren zum kontaktieren von leitenden schichten
US6428942B1 (en) 1999-10-28 2002-08-06 Fujitsu Limited Multilayer circuit structure build up method
US6882045B2 (en) * 1999-10-28 2005-04-19 Thomas J. Massingill Multi-chip module and method for forming and method for deplating defective capacitors
US6869750B2 (en) * 1999-10-28 2005-03-22 Fujitsu Limited Structure and method for forming a multilayered structure
US7152291B2 (en) 2002-04-15 2006-12-26 Avx Corporation Method for forming plated terminations
US7005379B2 (en) * 2004-04-08 2006-02-28 Micron Technology, Inc. Semiconductor processing methods for forming electrical contacts
US7891091B2 (en) * 2008-11-25 2011-02-22 Yonggang Li Method of enabling selective area plating on a substrate

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3319317A (en) * 1963-12-23 1967-05-16 Ibm Method of making a multilayered laminated circuit board
US3436468A (en) * 1965-05-28 1969-04-01 Texas Instruments Inc Plastic bodies having regions of altered chemical structure and method of making same
US3436819A (en) * 1965-09-22 1969-04-08 Litton Systems Inc Multilayer laminate
DE1919421C3 (de) * 1969-04-17 1975-03-13 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Mehrschichtleiterplatte
US3672986A (en) * 1969-12-19 1972-06-27 Day Co Nv Metallization of insulating substrates
US3628999A (en) * 1970-03-05 1971-12-21 Frederick W Schneble Jr Plated through hole printed circuit boards
DE2059425A1 (de) * 1970-12-02 1972-06-22 Siemens Ag Partieller Aufbau von gedruckten Mehrlagenschaltungen
US3760091A (en) * 1971-11-16 1973-09-18 Ibm Multilayer circuit board
US4632857A (en) * 1974-05-24 1986-12-30 Richardson Chemical Company Electrolessly plated product having a polymetallic catalytic film underlayer
JPS5245537A (en) * 1975-10-09 1977-04-11 Oki Electric Ind Co Ltd Nonnelectrolytic nickel plating method
JPS5413969A (en) * 1977-07-04 1979-02-01 Seiko Instr & Electronics Method of manufacturing bilateral printed board
US4301190A (en) * 1978-08-17 1981-11-17 Nathan Feldstein Pretreatment with complexing agent in process for electroless plating
US4367119A (en) * 1980-08-18 1983-01-04 International Business Machines Corporation Planar multi-level metal process with built-in etch stop
DE3125730A1 (de) * 1981-06-30 1983-01-13 Siemens AG, 1000 Berlin und 8000 München Verfahren zum metallisieren elektrischer bauelemente
EP0074605B1 (en) * 1981-09-11 1990-08-29 Kabushiki Kaisha Toshiba Method for manufacturing multilayer circuit substrate
JPS58189365A (ja) * 1982-04-28 1983-11-05 Okuno Seiyaku Kogyo Kk 化学メッキ用アンダーコート組成物
DE3324767A1 (de) * 1983-07-08 1985-01-17 Bayer Ag, 5090 Leverkusen Verfahren zur aktivierung von substraten fuer die stromlose metallisierung
US4888209A (en) * 1983-09-28 1989-12-19 Rohm And Haas Company Catalytic process and systems
US4634468A (en) * 1984-05-07 1987-01-06 Shipley Company Inc. Catalytic metal of reduced particle size
US4659587A (en) * 1984-10-11 1987-04-21 Hitachi, Ltd. Electroless plating process and process for producing multilayer wiring board
US4790912A (en) * 1985-06-06 1988-12-13 Techno-Instruments Investments Ltd. Selective plating process for the electrolytic coating of circuit boards without an electroless metal coating
US4642160A (en) * 1985-08-12 1987-02-10 Interconnect Technology Inc. Multilayer circuit board manufacturing
JPH0724334B2 (ja) * 1987-01-19 1995-03-15 株式会社日立製作所 回路板
DE8711105U1 (de) * 1987-08-14 1987-11-26 Siemens AG, 1000 Berlin und 8000 München Leiterplatte für die Elektronik
US5132038A (en) * 1988-04-25 1992-07-21 Macdermid, Incorporated Composition for preparing printed circuit through-holes for metallization
FR2656493A1 (fr) * 1989-12-21 1991-06-28 Bull Sa Procede d'interconnexion de couches metalliques du reseau multicouche d'une carte electronique, et carte en resultant.

Also Published As

Publication number Publication date
JP2618093B2 (ja) 1997-06-11
FR2656493A1 (fr) 1991-06-28
DE69012082T2 (de) 1994-12-22
DE69012082D1 (de) 1994-10-06
JPH04209555A (ja) 1992-07-30
US5464653A (en) 1995-11-07
EP0435717A1 (fr) 1991-07-03
EP0435717B1 (fr) 1994-08-31

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