ES2060334T3 - Aparato de prueba de circuito impreso. - Google Patents

Aparato de prueba de circuito impreso.

Info

Publication number
ES2060334T3
ES2060334T3 ES91420092T ES91420092T ES2060334T3 ES 2060334 T3 ES2060334 T3 ES 2060334T3 ES 91420092 T ES91420092 T ES 91420092T ES 91420092 T ES91420092 T ES 91420092T ES 2060334 T3 ES2060334 T3 ES 2060334T3
Authority
ES
Spain
Prior art keywords
face
printed circuit
pattern
under test
circuit under
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES91420092T
Other languages
English (en)
Inventor
Christophe Vaucher
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
INT MARKET DEV SARL
Original Assignee
INT MARKET DEV SARL
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by INT MARKET DEV SARL filed Critical INT MARKET DEV SARL
Application granted granted Critical
Publication of ES2060334T3 publication Critical patent/ES2060334T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • G01R1/07328—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support for testing printed circuit boards

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
  • Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Testing Electric Properties And Detecting Electric Faults (AREA)

Abstract

LA PRESENTE INVENCION TRATA DE UN APARATO DE PRUEBA DE UN CIRCUITO IMPRIMIDO (30) EN EL QUE EL ENLACE ENTRE EL CIRCUITO A PROBAR Y LOS CIRCUITOS DE PRUEBA DEL APARATO ESTA ASEGURADO POR CLAVOS CONDUCTORES GUIADOS AL MENOS POR UNA PLACA DE GUIA PERFORADA (34). EN ESTE APARATO, EL CIRCUITO A PROBAR CONSTA AL MENOS UN MOTIVO ESTANDAR QUE FORMA PARTE DE UN CONJUNTO PREDETERMINADO DE MOTIVOS ESTANDARS SENSIBLEMENTE CONDUCTORES DE PASO ESTRECHO, QUE CONSTAN AL NIVEL DE CADA MOTIVO ESTANDAR, DE UNA PLAQUETA (20) CUYA PRIMERA CARA SITUADA DEL LADO DEL CIRCUITO A PROBAR LLEVA UN PRIMER MOTIVO DE CONTACTOS DISPUESTOS SEGUN EL MOTIVO ESTANDAR Y CUYA SEGUNDA CARA LLEVA UN SEGUNDO MOTIVO DE CONTACTOS DISPUESTOS REGULARMENTE A UN PASO COMPATIBLE CON EL DE LOS CLAVOS. CADA CLAVO DE LA PRIMERA CARA ESTA CONECTADO ELECTRICAMENTE UN CLAVO DE LA SEGUNDA CARA.
ES91420092T 1990-03-21 1991-03-19 Aparato de prueba de circuito impreso. Expired - Lifetime ES2060334T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR9003920A FR2660072B1 (fr) 1990-03-21 1990-03-21 Appareil de test de circuit imprime.

Publications (1)

Publication Number Publication Date
ES2060334T3 true ES2060334T3 (es) 1994-11-16

Family

ID=9395175

Family Applications (1)

Application Number Title Priority Date Filing Date
ES91420092T Expired - Lifetime ES2060334T3 (es) 1990-03-21 1991-03-19 Aparato de prueba de circuito impreso.

Country Status (7)

Country Link
US (1) US5216358A (es)
EP (1) EP0448483B1 (es)
AT (1) ATE108909T1 (es)
DE (1) DE69102917T2 (es)
ES (1) ES2060334T3 (es)
FR (1) FR2660072B1 (es)
HK (1) HK187695A (es)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5633598A (en) * 1993-06-23 1997-05-27 Everett Charles Technologies, Inc. Translator fixture with module for expanding test points
WO1995023341A1 (en) * 1994-02-23 1995-08-31 Everett Charles Technologies, Inc. Translator fixture with module for expanding test points
US5521513A (en) * 1994-10-25 1996-05-28 Teradyne Inc Manufacturing defect analyzer
AT401704B (de) * 1995-01-11 1996-11-25 Mikroelektronik Ges Mit Beschr Trägerplatte für integrierte schaltkreise
TW360790B (en) 1996-10-28 1999-06-11 Atg Test Systems Gmbh Printed circuit board test apparatus and method
US6211690B1 (en) * 1997-10-15 2001-04-03 Tessera, Inc. Apparatus for electrically testing bare printed circuits
US6326797B2 (en) 1998-03-04 2001-12-04 International Business Machines Corporation Apparatus and method for evaluating printed circuit board assembly manufacturing processes
US6114015A (en) * 1998-10-13 2000-09-05 Matsushita Electronic Materials, Inc. Thin-laminate panels for capacitive printed-circuit boards and methods for making the same
US6783620B1 (en) 1998-10-13 2004-08-31 Matsushita Electronic Materials, Inc. Thin-laminate panels for capacitive printed-circuit boards and methods for making the same
US6414504B2 (en) 1999-05-20 2002-07-02 Delaware Capital Formation, Inc. Coaxial tilt pin fixture for testing high frequency circuit boards
US6984997B2 (en) * 2003-11-13 2006-01-10 International Business Machines Corporation Method and system for testing multi-chip integrated circuit modules
US20060033515A1 (en) * 2004-08-13 2006-02-16 Tessera, Inc. Test fixture with movable pin contacts
US8760185B2 (en) * 2009-12-22 2014-06-24 Anthony J. Suto Low capacitance probe for testing circuit assembly
US8310256B2 (en) * 2009-12-22 2012-11-13 Teradyne, Inc. Capacitive opens testing in low signal environments

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3654585A (en) * 1970-03-11 1972-04-04 Brooks Research And Mfg Inc Coordinate conversion for the testing of printed circuit boards
DE3312436A1 (de) * 1982-10-29 1984-05-03 Feinmetall Gmbh, 7033 Herrenberg Kontaktiervorrichtung
DK291184D0 (da) * 1984-06-13 1984-06-13 Boeegh Petersen Allan Fremgangsmaade og indretning til test af kredsloebsplader
DE8427884U1 (de) * 1984-09-21 1986-07-31 Siemens AG, 1000 Berlin und 8000 München Einrichtung für die Funktionsprüfung integrierter Schaltkreise
FR2608775B1 (fr) * 1986-12-19 1988-12-30 Thomson Csf Interface de test pour circuits imprimes nus
FR2634025B1 (fr) * 1988-07-08 1990-11-09 Thomson Csf Adaptateur de brochage pour le test de circuits imprimes de haute densite

Also Published As

Publication number Publication date
FR2660072A1 (fr) 1991-09-27
EP0448483A1 (fr) 1991-09-25
HK187695A (en) 1995-12-22
EP0448483B1 (fr) 1994-07-20
DE69102917T2 (de) 1995-02-02
FR2660072B1 (fr) 1992-07-24
US5216358A (en) 1993-06-01
ATE108909T1 (de) 1994-08-15
DE69102917D1 (de) 1994-08-25

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