ES2058132T3 - REACTOR FOR PLASMA ATTACK INTENSIFIED BY A MAGNETIC FIELD. - Google Patents

REACTOR FOR PLASMA ATTACK INTENSIFIED BY A MAGNETIC FIELD.

Info

Publication number
ES2058132T3
ES2058132T3 ES87311195T ES87311195T ES2058132T3 ES 2058132 T3 ES2058132 T3 ES 2058132T3 ES 87311195 T ES87311195 T ES 87311195T ES 87311195 T ES87311195 T ES 87311195T ES 2058132 T3 ES2058132 T3 ES 2058132T3
Authority
ES
Spain
Prior art keywords
wafer
gas
electrode
reactor
magnetic field
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES87311195T
Other languages
Spanish (es)
Inventor
David Cheng
Dan Maydan
Sasson Somekh
Kenneth R Stalder
Dana L Andrews
Mei Chang
John M White
Jerry Yuen Kui Wong
Vladimir J Zeitlin
David Nin-Kou Wang
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Inc
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Application granted granted Critical
Publication of ES2058132T3 publication Critical patent/ES2058132T3/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67069—Apparatus for fluid treatment for etching for drying etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32458—Vessel
    • H01J37/32477—Vessel characterised by the means for protecting vessels or internal parts, e.g. coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32623—Mechanical discharge control means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32733—Means for moving the material to be treated
    • H01J37/32743—Means for moving the material to be treated for introducing the material into processing chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32733—Means for moving the material to be treated
    • H01J37/32788—Means for moving the material to be treated for extracting the material from the process chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32798—Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
    • H01J37/32853—Hygiene
    • H01J37/32862—In situ cleaning of vessels and/or internal parts

Abstract

A magnetic field enhanced single wafer plasma etch reactor (60) is disclosed. The features of the reactor include an electrically-controlled stepped magnetic field for providing high rate uniform etching at high pressures; temperature controlled reactor surfaces including heated anode surfaces (walls and gas manifold) and a cooled wafer supporting pedestal/cathode (70,72); and a unitary wafer exchange mechanism (74) comprising wafer lift pins (79) which extend through the pedestal and a wafer clamp ring (78). The lift pins and clamp ring are moved vertically by a one-axis lift mechanism (140) to accept the wafer from a co-operating external robot blade (76), clamp the wafer to the pedestal and return the wafer to the blade. The electrode cooling combines water cooling for the body of the electrode (70) and a thermal conductivity-enhancing gas interface between the wafer and electrode for keeping the wafer surface cooled despite the high power densities applied to the electrode. A gas feed-through device (114, 175, 176) applies the cooling gas to the RF powered electrode (72) without breakdown of the gas. Protective coatings/layers (81,83) of materials such as quartz are provided for surfaces such as the clamp ring and gas manifold. The combination of these features provides a wide pressure regime, high etch rate, high throughput single wafer etcher wich provides uniformity, directionality and selectivity at high gas pressure, operates cleanly and incorporates in-situ self-cleaning capability. <IMAGE>
ES87311195T 1986-12-19 1987-12-18 REACTOR FOR PLASMA ATTACK INTENSIFIED BY A MAGNETIC FIELD. Expired - Lifetime ES2058132T3 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US94484386A 1986-12-19 1986-12-19

Publications (1)

Publication Number Publication Date
ES2058132T3 true ES2058132T3 (en) 1994-11-01

Family

ID=25482161

Family Applications (1)

Application Number Title Priority Date Filing Date
ES87311195T Expired - Lifetime ES2058132T3 (en) 1986-12-19 1987-12-18 REACTOR FOR PLASMA ATTACK INTENSIFIED BY A MAGNETIC FIELD.

Country Status (5)

Country Link
EP (2) EP0272142B1 (en)
JP (1) JP2624975B2 (en)
AT (2) ATE111261T1 (en)
DE (2) DE3752042T2 (en)
ES (1) ES2058132T3 (en)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5000113A (en) * 1986-12-19 1991-03-19 Applied Materials, Inc. Thermal CVD/PECVD reactor and use for thermal chemical vapor deposition of silicon dioxide and in-situ multi-step planarized process
US5158644A (en) * 1986-12-19 1992-10-27 Applied Materials, Inc. Reactor chamber self-cleaning process
DE3854875T2 (en) * 1987-06-26 1996-05-23 Applied Materials Inc Process for self-cleaning a reaction chamber
US4944860A (en) * 1988-11-04 1990-07-31 Eaton Corporation Platen assembly for a vacuum processing system
JP2886878B2 (en) * 1989-03-01 1999-04-26 株式会社日立製作所 Vacuum processing equipment
KR0170391B1 (en) * 1989-06-16 1999-03-30 다카시마 히로시 Processing apparatus with a gas distributor having back and forth parallel movement relative to a workpiece support
US5556501A (en) * 1989-10-03 1996-09-17 Applied Materials, Inc. Silicon scavenger in an inductively coupled RF plasma reactor
US6068784A (en) * 1989-10-03 2000-05-30 Applied Materials, Inc. Process used in an RF coupled plasma reactor
US5312778A (en) * 1989-10-03 1994-05-17 Applied Materials, Inc. Method for plasma processing using magnetically enhanced plasma chemical vapor deposition
JPH03142828A (en) * 1989-10-27 1991-06-18 Tokyo Electron Ltd Treatment apparatus
JP2875945B2 (en) * 1993-01-28 1999-03-31 アプライド マテリアルズ インコーポレイテッド Method of depositing silicon nitride thin film on large area glass substrate at high deposition rate by CVD
KR960006958B1 (en) * 1993-02-06 1996-05-25 현대전자산업주식회사 Low temperature electrode structure of ecr etching apparatus
US5427621A (en) * 1993-10-29 1995-06-27 Applied Materials, Inc. Method for removing particulate contaminants by magnetic field spiking
US5900103A (en) 1994-04-20 1999-05-04 Tokyo Electron Limited Plasma treatment method and apparatus
US6391147B2 (en) 1994-04-28 2002-05-21 Tokyo Electron Limited Plasma treatment method and apparatus
US5738751A (en) * 1994-09-01 1998-04-14 Applied Materials, Inc. Substrate support having improved heat transfer
US5503676A (en) * 1994-09-19 1996-04-02 Lam Research Corporation Apparatus and method for magnetron in-situ cleaning of plasma reaction chamber
TW347460B (en) * 1995-11-29 1998-12-11 Applied Materials Inc Flat bottom components and flat bottom architecture for fluid and gas systems
US6293749B1 (en) 1997-11-21 2001-09-25 Asm America, Inc. Substrate transfer system for semiconductor processing equipment
EP1167572A3 (en) * 2000-06-22 2002-04-10 Applied Materials, Inc. Lid assembly for a semiconductor processing chamber
JP4236873B2 (en) * 2002-06-21 2009-03-11 東京エレクトロン株式会社 Magnetron plasma processing equipment
US7686918B2 (en) 2002-06-21 2010-03-30 Tokyo Electron Limited Magnetron plasma processing apparatus
WO2004088710A2 (en) * 2003-04-02 2004-10-14 Nkt Research & Innovation A/S Method and apparatus for gas plasma treatment with controlled extent of gas plasma, and use thereof
FR2920912B1 (en) * 2007-09-12 2010-08-27 S O I Tec Silicon On Insulator Tech METHOD FOR MANUFACTURING A LAYER TRANSFER STRUCTURE

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4159799A (en) * 1977-12-14 1979-07-03 Bell Telephone Laboratories, Incorporated Cassette unit and fixture for loading the unit with a planar member
JPS5927212B2 (en) * 1979-09-25 1984-07-04 三菱電機株式会社 plasma reactor
JPS5816078A (en) * 1981-07-17 1983-01-29 Toshiba Corp Plasma etching device
FR2538987A1 (en) * 1983-01-05 1984-07-06 Commissariat Energie Atomique ENCLOSURE FOR THE TREATMENT AND PARTICULARLY THE ETCHING OF SUBSTRATES BY THE REACTIVE PLASMA METHOD
JPH0669032B2 (en) * 1984-07-24 1994-08-31 富士通株式会社 Plasma processing device
KR910000508B1 (en) * 1984-08-31 1991-01-26 니찌덴 아넬바 가부시끼가이샤 Discharge reaction apparatus utilizing dynamic magnetic field
US4657620A (en) * 1984-10-22 1987-04-14 Texas Instruments Incorporated Automated single slice powered load lock plasma reactor
JPS61119040A (en) * 1984-11-15 1986-06-06 Tokyo Denshi Kagaku Kabushiki Vacuum processor
JPH054282Y2 (en) * 1984-12-04 1993-02-02
JPH0666300B2 (en) * 1985-03-18 1994-08-24 株式会社日立製作所 Dry etching equipment
US4624728A (en) * 1985-06-11 1986-11-25 Tegal Corporation Pin lift plasma processing
US4615755A (en) * 1985-08-07 1986-10-07 The Perkin-Elmer Corporation Wafer cooling and temperature control for a plasma etching system
US4677758A (en) * 1985-10-08 1987-07-07 Seiichiro Aigo Spin drier for semiconductor material
US4668338A (en) * 1985-12-30 1987-05-26 Applied Materials, Inc. Magnetron-enhanced plasma etching process
US4724621A (en) * 1986-04-17 1988-02-16 Varian Associates, Inc. Wafer processing chuck using slanted clamping pins

Also Published As

Publication number Publication date
DE3752042T2 (en) 1997-07-17
EP0566220A3 (en) 1993-10-27
DE3752042D1 (en) 1997-05-07
EP0272142A3 (en) 1990-09-05
EP0566220B1 (en) 1997-04-02
JPS63283024A (en) 1988-11-18
DE3750502D1 (en) 1994-10-13
JP2624975B2 (en) 1997-06-25
EP0566220A2 (en) 1993-10-20
EP0272142B1 (en) 1994-09-07
DE3750502T2 (en) 1995-01-12
EP0272142A2 (en) 1988-06-22
ATE151199T1 (en) 1997-04-15
ATE111261T1 (en) 1994-09-15

Similar Documents

Publication Publication Date Title
DE68921234D1 (en) Vacuum processing reactor.
ES2058132T3 (en) REACTOR FOR PLASMA ATTACK INTENSIFIED BY A MAGNETIC FIELD.
US6529362B2 (en) Monocrystalline ceramic electrostatic chuck
EP0165400B1 (en) Apparatus for plasma etching
EP1604389B1 (en) Processing system and method for thermally treating a substrate
US6583064B2 (en) Low contamination high density plasma etch chambers and methods for making the same
EP1604387B1 (en) Processing system and method for treating a substrate
EP1604388B1 (en) Processing system and method for chemically treating a substrate
US6669783B2 (en) High temperature electrostatic chuck
DE60034862T2 (en) High temperature electrostatic holder
JP2011176365A (en) Chemical oxide removal processing system and method
KR20060126922A (en) Method and apparatus for improved baffle plate
KR20040048272A (en) Apparatus for treating the surface of a substrate with atmospheric pressure plasma
WO2008109504A2 (en) Processing system and method for performing high throughput non-plasma processing
EP0688042A1 (en) Wafer processing apparatus
EP1420081B1 (en) Thin film formation apparatus and thin film formation method employing the apparatus
KR20220156052A (en) Sheath and temperature control of process kits in substrate processing chambers
US7230202B2 (en) Plasma processing apparatus, electrode unit, feeder member and radio frequency feeder rod
JP2000133639A5 (en)
US6221203B1 (en) Apparatus and method for controlling temperature of a chamber
CN219658687U (en) Electrostatic chuck and semiconductor processing apparatus
JPH0476495B2 (en)
US20220293397A1 (en) Substrate edge ring that extends process environment beyond substrate diameter
JPH0528032U (en) Plasma processing device
JPH077142U (en) Wafer table for etching equipment

Legal Events

Date Code Title Description
FG2A Definitive protection

Ref document number: 272142

Country of ref document: ES