ES2049766T3 - Empleo de pastas aplicables por serigrafia para la fabricacion de revestimientos electricamente conductores sobre laminas flexibles de plastico. - Google Patents

Empleo de pastas aplicables por serigrafia para la fabricacion de revestimientos electricamente conductores sobre laminas flexibles de plastico.

Info

Publication number
ES2049766T3
ES2049766T3 ES89103845T ES89103845T ES2049766T3 ES 2049766 T3 ES2049766 T3 ES 2049766T3 ES 89103845 T ES89103845 T ES 89103845T ES 89103845 T ES89103845 T ES 89103845T ES 2049766 T3 ES2049766 T3 ES 2049766T3
Authority
ES
Spain
Prior art keywords
manufacture
pasts
serigraphy
applicable
electrically conductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES89103845T
Other languages
English (en)
Spanish (es)
Inventor
Klaus Dr Dipl-Chem Lutz
Hans-Joachim Baer
Karl-Anton Dr Dipl-Chem Starz
Werner Dr Dipl-Chem Leske
Harry Muller
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Evonik Operations GmbH
Original Assignee
Degussa GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Degussa GmbH filed Critical Degussa GmbH
Application granted granted Critical
Publication of ES2049766T3 publication Critical patent/ES2049766T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/24Electrically-conducting paints
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20Conductive material dispersed in non-conductive organic material
    • H01B1/22Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/09Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Dispersion Chemistry (AREA)
  • Organic Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Conductive Materials (AREA)
  • Push-Button Switches (AREA)
  • Paints Or Removers (AREA)
  • Polysaccharides And Polysaccharide Derivatives (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Non-Insulated Conductors (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
ES89103845T 1988-03-19 1989-03-04 Empleo de pastas aplicables por serigrafia para la fabricacion de revestimientos electricamente conductores sobre laminas flexibles de plastico. Expired - Lifetime ES2049766T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE3809331A DE3809331C1 (enExample) 1988-03-19 1988-03-19

Publications (1)

Publication Number Publication Date
ES2049766T3 true ES2049766T3 (es) 1994-05-01

Family

ID=6350211

Family Applications (1)

Application Number Title Priority Date Filing Date
ES89103845T Expired - Lifetime ES2049766T3 (es) 1988-03-19 1989-03-04 Empleo de pastas aplicables por serigrafia para la fabricacion de revestimientos electricamente conductores sobre laminas flexibles de plastico.

Country Status (5)

Country Link
US (1) US5011627A (enExample)
EP (1) EP0334084B1 (enExample)
AT (1) ATE101299T1 (enExample)
DE (2) DE3809331C1 (enExample)
ES (1) ES2049766T3 (enExample)

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US5200264A (en) * 1989-09-05 1993-04-06 Advanced Products, Inc. Thermoset polymer thick film compositions and their use as electrical circuitry
JPH0412595A (ja) * 1990-05-02 1992-01-17 Mitsubishi Petrochem Co Ltd 導電性ペースト組成物
DE69305942T2 (de) * 1992-09-15 1997-03-13 Du Pont Zusammensetzung für einen Polymer-Dickschichtwiderstand
DE4316575C1 (de) * 1993-05-18 1994-07-07 Ver Glaswerke Gmbh Verfahren zur Herstellung einer gebogenen Verbundglasscheibe, insbesondere Autoglasscheibe
US5656081A (en) * 1995-06-07 1997-08-12 Img Group Limited Press for printing an electrical circuit component directly onto a substrate using an electrically-conductive liquid
US5758575A (en) * 1995-06-07 1998-06-02 Bemis Company Inc. Apparatus for printing an electrical circuit component with print cells in liquid communication
WO1997014157A1 (en) * 1995-10-07 1997-04-17 Img Group Limited An electrical circuit component formed of a conductive liquid printed directly onto a substrate
JPH09286936A (ja) * 1996-04-22 1997-11-04 Sumitomo Metal Mining Co Ltd 透明導電膜形成用塗布液、これを用いた透明導電膜及びその形成方法
US6933331B2 (en) * 1998-05-22 2005-08-23 Nanoproducts Corporation Nanotechnology for drug delivery, contrast agents and biomedical implants
US6652967B2 (en) * 2001-08-08 2003-11-25 Nanoproducts Corporation Nano-dispersed powders and methods for their manufacture
JP2001513697A (ja) * 1997-02-24 2001-09-04 スーペリア マイクロパウダーズ リミテッド ライアビリティ カンパニー エアロゾル法及び装置、粒子製品、並びに該粒子製品から製造される電子装置
US6265471B1 (en) 1997-03-03 2001-07-24 Diemat, Inc. High thermally conductive polymeric adhesive
US6238599B1 (en) * 1997-06-18 2001-05-29 International Business Machines Corporation High conductivity, high strength, lead-free, low cost, electrically conducting materials and applications
JPH1140933A (ja) * 1997-07-17 1999-02-12 Alps Electric Co Ltd 導電性組成物およびそれを用いた電子機器
JPH1135904A (ja) * 1997-07-17 1999-02-09 Alps Electric Co Ltd 導電性組成物およびそれを用いた電子機器
US6855426B2 (en) * 2001-08-08 2005-02-15 Nanoproducts Corporation Methods for producing composite nanoparticles
US20060159838A1 (en) * 2005-01-14 2006-07-20 Cabot Corporation Controlling ink migration during the formation of printable electronic features
JP4389148B2 (ja) * 2002-05-17 2009-12-24 日立化成工業株式会社 導電ペースト
US7708974B2 (en) * 2002-12-10 2010-05-04 Ppg Industries Ohio, Inc. Tungsten comprising nanomaterials and related nanotechnology
US6989110B2 (en) * 2003-06-13 2006-01-24 Murata Manufacturing Co., Ltd. Electroconductive paste and method of producing the same
US7449241B2 (en) * 2003-08-04 2008-11-11 General Electric Company Organic coating compositions for aluminizing metal substrates, and related methods and articles
US7377032B2 (en) * 2003-11-21 2008-05-27 Mitsui Mining & Smelting Co., Ltd. Process for producing a printed wiring board for mounting electronic components
US7332024B2 (en) * 2004-04-29 2008-02-19 General Electric Company Aluminizing composition and method for application within internal passages
US8383014B2 (en) 2010-06-15 2013-02-26 Cabot Corporation Metal nanoparticle compositions
US20060158497A1 (en) * 2005-01-14 2006-07-20 Karel Vanheusden Ink-jet printing of compositionally non-uniform features
US7824466B2 (en) 2005-01-14 2010-11-02 Cabot Corporation Production of metal nanoparticles
US8167393B2 (en) * 2005-01-14 2012-05-01 Cabot Corporation Printable electronic features on non-uniform substrate and processes for making same
US20060160373A1 (en) * 2005-01-14 2006-07-20 Cabot Corporation Processes for planarizing substrates and encapsulating printable electronic features
WO2006076607A1 (en) * 2005-01-14 2006-07-20 Cabot Corporation Ink-jet printing of passive electricalcomponents
US20060190917A1 (en) * 2005-01-14 2006-08-24 Cabot Corporation System and process for manufacturing application specific printable circuits (ASPC'S) and other custom electronic devices
WO2006076605A2 (en) * 2005-01-14 2006-07-20 Cabot Corporation Circuit modeling and selective deposition
WO2006076613A2 (en) * 2005-01-14 2006-07-20 Cabot Corporation Metal nanoparticle compositions
WO2006076608A2 (en) * 2005-01-14 2006-07-20 Cabot Corporation A system and process for manufacturing custom electronics by combining traditional electronics with printable electronics
WO2006076606A2 (en) * 2005-01-14 2006-07-20 Cabot Corporation Optimized multi-layer printing of electronics and displays
JP2006195863A (ja) * 2005-01-17 2006-07-27 Fujitsu Ten Ltd エラー検出装置
DE202005021556U1 (de) 2005-07-20 2008-08-28 Biolog Biotechnologie Und Logistik Gmbh Lösbarer elektrisch leitender Werkstoff auf der Basis funktionaler Saccharide und metallischer Partikel
TWI329323B (en) * 2006-04-21 2010-08-21 Kwo Kung Ming Method of fabricating conductive paste for conductive substrate or conductive film
US7422707B2 (en) * 2007-01-10 2008-09-09 National Starch And Chemical Investment Holding Corporation Highly conductive composition for wafer coating
JP5579604B2 (ja) * 2007-08-20 2014-08-27 ダイマット,インク. 銀フィラーの混合によって強化された熱伝導率を有する接着剤
KR20110033937A (ko) * 2008-07-22 2011-04-01 이 아이 듀폰 디 네모아 앤드 캄파니 박막 광전지에 사용하기 위한 중합체 후막 은 전극 조성물
DE102009045892A1 (de) * 2009-10-21 2011-04-28 Evonik Degussa Gmbh Folie aus Polyarylenetherketon
US9039941B2 (en) * 2009-12-22 2015-05-26 Dic Corporation Conductive paste for screen printing
KR101336903B1 (ko) * 2009-12-22 2013-12-04 디아이씨 가부시끼가이샤 스크린 인쇄용 도전성 페이스트
WO2015152994A1 (en) 2014-04-02 2015-10-08 Ferro Corporation Conductive paste with improved performance in glass strength

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3746662A (en) * 1971-08-09 1973-07-17 Du Pont Conductive systems
JPS57185316A (en) * 1981-05-11 1982-11-15 Sumitomo Metal Mining Co Ltd Electrically conductive resin paste
US4425263A (en) * 1981-06-03 1984-01-10 E. I. Du Pont De Nemours & Co. Flexible screen-printable conductive composition
US4479890A (en) * 1982-10-05 1984-10-30 Rca Corporation Thick film resistor inks
US4592961A (en) * 1984-10-09 1986-06-03 Ercon, Inc. Particle filled flexible coating composition of aromatic polyester and vinylidene chloride copolymer

Also Published As

Publication number Publication date
US5011627A (en) 1991-04-30
DE3809331C1 (enExample) 1989-04-27
EP0334084A2 (de) 1989-09-27
EP0334084A3 (en) 1990-01-17
DE58906854D1 (de) 1994-03-17
ATE101299T1 (de) 1994-02-15
EP0334084B1 (de) 1994-02-02

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