ES2007749A6 - Material termoplastico de aportacion para la soldadura y metodo para su produccion. - Google Patents

Material termoplastico de aportacion para la soldadura y metodo para su produccion.

Info

Publication number
ES2007749A6
ES2007749A6 ES8703270A ES8703270A ES2007749A6 ES 2007749 A6 ES2007749 A6 ES 2007749A6 ES 8703270 A ES8703270 A ES 8703270A ES 8703270 A ES8703270 A ES 8703270A ES 2007749 A6 ES2007749 A6 ES 2007749A6
Authority
ES
Spain
Prior art keywords
binder
compsn
flux
metal powder
soldering material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
ES8703270A
Other languages
English (en)
Inventor
Karl-Heinz Wendisch
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kawe Electro & Co KG GmbH
Original Assignee
Kawe Electro & Co KG GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kawe Electro & Co KG GmbH filed Critical Kawe Electro & Co KG GmbH
Publication of ES2007749A6 publication Critical patent/ES2007749A6/es
Expired legal-status Critical Current

Links

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

MATERIAL TERMOPLASTICO DE APORTACION PARA LA SOLDADURA Y METODO PARA SU PRODUCCION, EL CUAL MATERIAL CONSISTENTE EN UN POLVO DE METALES DE APORTACION PARA SOLDADURA, UN FUNDENTE Y UN COMPUESTO AGLUTINANTE TERMOPLASTICO QUE CONSISTE EN ACIDOS MACROCARBONICOS DE LA FORMULA CNH2NO2, SIENDO N F 14, 16, 18 O 20. EL PUNTO DE FUSION DEL COMPUESTO AGLUTINANTE OSCILA ENTRE 50 Y 75JC Y SU EVAPORACION TIENE LUGAR A UNOS 180JC. EL POLVO DE METALES DE APORTACION PARA LA SOLDADURA CONSISTE EN UNA ALEACION EUTECTICA DE ESTAÑO, PLOMO Y PLATA. EL FUNDENTE ES UNA COLOFONIA POCO ACTIVADA. EL FUNDENTE (FM) SE DISUELVE EN I-PROPANOL (LM) Y EL POLVO DE METALES (MS) SE MEZCLA CON EL MISMO. ENTONCES SE AÑADE EL COMPUESTO AGLUTINANTE (BM), SE FUNDE Y SE MEZCLA. FINALMENTE SE EVAPORA EL DISOLVENTE (LM). PERMITE MEJORAR EL PROCESO DE SOLDADURA DE COMPONENTES ELECTRONICOS Y SIMILARES.
ES8703270A 1986-10-21 1987-11-17 Material termoplastico de aportacion para la soldadura y metodo para su produccion. Expired ES2007749A6 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US92110086A 1986-10-21 1986-10-21

Publications (1)

Publication Number Publication Date
ES2007749A6 true ES2007749A6 (es) 1989-07-01

Family

ID=25444918

Family Applications (1)

Application Number Title Priority Date Filing Date
ES8703270A Expired ES2007749A6 (es) 1986-10-21 1987-11-17 Material termoplastico de aportacion para la soldadura y metodo para su produccion.

Country Status (1)

Country Link
ES (1) ES2007749A6 (es)

Similar Documents

Publication Publication Date Title
US5088189A (en) Electronic manufacturing process
US5221038A (en) Method for forming tin-indium or tin-bismuth solder connection having increased melting temperature
US5389160A (en) Tin bismuth solder paste, and method using paste to form connection having improved high temperature properties
CN101208173B (zh) 无铅焊膏及其制法
TW360578B (en) Lead-free solder used for connecting electronic parts on organic substrate
US5455004A (en) Lead-free alloy containing tin, zinc, indium and bismuth
CA2030865A1 (en) Method of forming a solder layer on pads of a circuit board and method of mounting an electronic part on a circuit board
KR870009408A (ko) 도전성 동(銅) 페이스트(paste)조성물
EP0345485A1 (en) Solder paste for use in a reducing atmosphere
CA2000301A1 (en) Copper doped low melt solder for component assembly and rework
US4834794A (en) Solder composition of mixed powders
CA2261258A1 (en) A flux formulation
ES2007749A6 (es) Material termoplastico de aportacion para la soldadura y metodo para su produccion.
ES8503541A1 (es) Procedimiento para la soldadura blanda mecanica de metales pesados.
JP3736797B2 (ja) 高温クリームはんだ用組成物およびインダクタ
JP2003112285A (ja) ソルダーペースト
CA2011030A1 (en) Process for reflow soldering
KR970006527A (ko) 저융점합금 및 그 분말을 이용한 크림땜납
JPH09277082A (ja) ソルダペースト
KR100209241B1 (ko) 무연솔더 조성물
JPH0280193A (ja) ソルダペースト
AU5664686A (en) Thermoplastic soldering material, process and device
JPH0313952B2 (es)
EP0127993A3 (en) Soldering fluxes and their production processes
DE68917169D1 (de) Weichlotflussmittel.

Legal Events

Date Code Title Description
SA6 Expiration date (snapshot 920101)

Free format text: 2007-11-17

FD1A Patent lapsed

Effective date: 19981103