EP4370475A1 - Verfahren zum schneiden einer platte aus verbundglas - Google Patents

Verfahren zum schneiden einer platte aus verbundglas

Info

Publication number
EP4370475A1
EP4370475A1 EP22741783.9A EP22741783A EP4370475A1 EP 4370475 A1 EP4370475 A1 EP 4370475A1 EP 22741783 A EP22741783 A EP 22741783A EP 4370475 A1 EP4370475 A1 EP 4370475A1
Authority
EP
European Patent Office
Prior art keywords
laminated glass
glass panel
laser beam
panel
sheets
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP22741783.9A
Other languages
English (en)
French (fr)
Inventor
Cécile OZANAM
Florian BIGOURDAN
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Saint Gobain Glass France SAS
Compagnie de Saint Gobain SA
Original Assignee
Saint Gobain Glass France SAS
Compagnie de Saint Gobain SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Saint Gobain Glass France SAS, Compagnie de Saint Gobain SA filed Critical Saint Gobain Glass France SAS
Publication of EP4370475A1 publication Critical patent/EP4370475A1/de
Pending legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00Severing cooled glass
    • C03B33/02Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/0222Scoring using a focussed radiation beam, e.g. laser
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • B23K26/40Removing material taking account of the properties of the material involved
    • B23K26/402Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B23K26/0624Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1ns or less
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0665Shaping the laser beam, e.g. by masks or multi-focusing by beam condensation on the workpiece, e.g. for focusing
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08Devices involving relative movement between laser beam and workpiece
    • B23K26/082Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50Working by transmitting the laser beam through or within the workpiece
    • B23K26/53Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00Severing cooled glass
    • C03B33/02Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/033Apparatus for opening score lines in glass sheets
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00Severing cooled glass
    • C03B33/07Cutting armoured, multi-layered, coated or laminated, glass products
    • C03B33/076Laminated glass comprising interlayers
    • C03B33/078Polymeric interlayers

Definitions

  • the present invention relates to a method and a device for cutting glass and in particular laminated glass panels.
  • Methods and devices for cutting sheets of glass, in particular single sheets, are known. To do this, the sheet of glass is placed on a cutting table and then a cutting tool draws a cutting line. This cutting line is used to weaken the structure of the glass sheet. Then a parting tool is used to separate the glass sheet into pieces.
  • Such a laminated glass panel comprises a first sheet of glass, a second sheet of glass and an interlayer film arranged between the two sheets of glass.
  • Another solution consists in making the laminated glass panel before cutting it. For this, it is necessary to be able to directly cut the entire panel.
  • a known solution consists in using a laser beam to break each sheet of glass alternately. This therefore requires the production of two cutting lines and manipulations of the laminated glass panel in order to achieve the cutting of said panel.
  • the present invention seeks to solve the problems of the prior art by providing a method of cutting a laminated glass panel simplified compared to the method of the prior art.
  • the present invention relates to a process for separating a laminated glass panel, the laminated glass panel comprising at least one film and at least two sheets of glass, the film being interposed between the two sheets of glass, comprising step:
  • a laser device is used to provide the laser beam, said laser device being arranged to provide a Bessel-type laser beam with a wavelength for which the glass sheets and the spacer are transparent, the length of which is at least equal to the thickness of the laminated glass panel and the ratio of the scanning speed to the working frequency of which has a value between two and seven times the diameter of the lobe center of the beam of Bessel.
  • the weakening of the mechanical properties of the laminated glass panel consists in creating a series of impact points, each point making it possible to induce a localized stress field in the glass sheets and micro channels in the interlayer , two successive points of impact being separated by a distance equal to the ratio between the scanning speed and the working frequency.
  • the thickness of the laminated glass panel is between 2 and 30mm. Preferably the thickness of the laminated glass panel is greater than 4mm.
  • each impact point is created by a single pulse. In one example, each impact point is created by a group of at least two pulses.
  • each pulse lasts between 0.1 and 100ps, or even between 0.1 and
  • the rate between two single pulses or two groups of pulses is between 1 and 1000 kHz
  • the method further comprises a separation step consisting of the application of a mechanical force.
  • the present invention further relates to a device for separating a laminated glass panel along at least one predetermined separation line, said laminated glass panel comprising at least one film and at least two sheets of glass, the film being interposed between the glass panels, the laminated glass panel being mechanically weakened with the energy of a laser beam at least along the separation line using the method according to the invention, said device comprising means for break making it possible to exert a mechanical support on the separation line to separate at least two pieces of the laminated glass panel.
  • the laser beam is generated by a laser device capable of moving along two orthogonal axes.
  • the breaking means comprise at least one support element for exerting said mechanical support on the separation line.
  • the breaking means further comprise at least one counterweight element to exert a support on the laminated glass panel contrary to said mechanical support on the separation line.
  • FIG. 1 to 2 shows a laminated glass panel used for the present invention
  • FIG. 3 shows a laminated glass panel having a cut line
  • FIG. 4 and 5 show a Bessel beam used in the present invention
  • FIG. 6 shows a laminated glass panel and a laser device using said Bessel beam according to the invention
  • FIG. 7 shows a laminated glass panel in section with the line of cutting and ball breaking means
  • FIG. 8 shows a laminated glass panel provided with a cut line composed of a plurality of impact points
  • a laminated glass panel P is shown.
  • This laminated glass panel comprises a first sheet 1 of glass and a second sheet 2 of glass.
  • This panel further comprises an interlayer film 3 arranged between the first sheet of glass 1 and the second sheet of glass 2.
  • Such a glass panel has a total thickness of between 2 and 30mm.
  • the thickness is at least equal to 4mm, even more preferably strictly greater than 4mm.
  • This laminated glass panel is subjected to a separation process.
  • This separation process comprises, in the first step, a step consisting in providing a panel P of laminated glass.
  • the latter is in the form of a panel with large dimensions to be cut into at least two pieces.
  • the laminated glass panel P is treated so that a cutting line T is produced as shown in Figure 3.
  • the laminated glass panel is placed on a support such as a cutting table . The glass panel is thus laid flat.
  • the cutting line T is a line of weakening of the glass panel P so that said panel can be separated into several pieces.
  • the cutting line is produced using a laser device 10 generating a laser beam F as shown in FIG. 6.
  • the generated laser beam F is such that it makes it possible to produce this cutting line T .
  • the laser device 10 is designed, arranged to shape the laser beam to obtain a Bessel beam.
  • Such a beam F of Bessel is characterized by a sectional profile comprising a central point Pc and at least one ring A or crown whose center is said central point. This central point is the zone where the intensity of the beam is the highest.
  • the laser beam F used is also characterized by a wavelength. More particularly, the laser device is such that it emits in a wavelength range for which both the glass and the interlayer are transparent—typically in the visible or near infrared range. As such, the wavelength is within an interval of 400 to 1100 nm.
  • the laser beam is shaped so that its length is at least equal to the thickness of the panel.
  • the length LB of a Bessel beam is shown in Figure 4
  • the two sheets of glass 1, 2 and the interlayer film 3 are treated simultaneously.
  • This value of 80% is sufficient because it has been shown that near this length LB, the power density is such that the substrate treated by these portions of the beam conform to what is expected.
  • This beam length advantageously makes it possible to produce the cutting line T in a single pass of the laser beam.
  • Said beam also has power and working frequency characteristics, the latter being characteristic of the duration between each pulse.
  • the laser beam includes a natural frequency related to its wavelength but also a working frequency.
  • the working frequency is related to the fact that the laser beam is pulsed and the pulses are generated with a certain, so-called working frequency.
  • the treatment of the laser beam consists in weakening said laminated glass panel.
  • This embrittlement of the two sheets of glass 1, 2 and of the interlayer film 3 simultaneously consists in creating a zone in which the material of the glass sheets is locally modified so as to induce a localized stress field and in which the interlayer 3 exhibits micro-channels created without material ablation, these micro-channels extending in the direction of the thickness of the film and the material around the center of the micro-channels is presumably denser.
  • the cutting line T is thus produced having a relative displacement between the laminated glass panel P and the laser beam F so that said line T can be carried out.
  • the laser device 10 is mounted to move relative to the glass panel as shown in Figure 6.
  • the cutting line T consists of a plurality of points PI, each point corresponding to an impact of the laser beam.
  • the distance d between each point called the impact point PI is such that it allows each point PI to process an area of the panel P without impacting a contiguous point as shown in figure 8.
  • the laser beam F is such that it makes it possible to create a stress in each of the glass sheets 1, 2 and micro channels in the intermediate film 3.
  • the invention therefore proposes to define a distance between two points of impact making it possible to avoid this problem.
  • the distance d between two contact points is chosen to depend on the dimensions of the laser beam. More particularly, the diameter of the Bessel beam and in particular the width of the central lobe in the focusing zone is used. Indeed, the central lobe is the most energetic zone of the beam, i.e. the zone that impacts the laminated glass panel the most, so it is the zone to be used as a reference.
  • a distance between two points of impact is chosen to be equal to a value between two and seven times said diameter of the central lobe Pc.
  • two parameters of the laser device are taken into account. These parameters are the relative speed of movement between the glass panel P and the laser device 10 and the working frequency.
  • the relative displacement speed is representative of the difference in displacement speed that may exist between the glass panel P placed on a support and the laser device, namely that the glass panel P and/or the device laser 10 can move.
  • This movement speed can also be called sweep speed.
  • the working frequency is the frequency with which the pulses are generated.
  • the working frequency is expressed in Hertz or in s -1 while the scanning speed is expressed in m. s -1 or mm. s -1 , the ratio between the two gives a value in m or mm.
  • this ratio value between the scanning speed and the working frequency be equal to a value between two and seven times said diameter of the central lobe. This determines the frequency and slew rate values used.
  • the working frequency is between 1 and 1000kHz.
  • the laser beam is also characterized by its energy per pulse / group of pulses. This varies from 10 to 5000pJ.
  • the laser beam pulses also have characteristics such as a duration characteristic. Indeed, the amount of energy depends on the intensity of the pulse but also on its duration.
  • the pulses have a duration of between 0.1 and 100 ps, or even between 0.1 and 10 ps.
  • each pulse of the laser beam is such that it is composed of at least two sub-pulses.
  • the laser device is such that each pulse is actually a train of pulses.
  • These pulses also have a duration of between 0.1 and 100 ps, or even between 0.1 and 10 ps.
  • the frequency of the pulses is higher than that of the working frequency.
  • the frequencies between two pulses of the same pulse train are at least one order of magnitude higher than the working frequency.
  • a laminated glass in 22-1 configuration with two 2mm glasses (outside manufacturing tolerance) and a 0.38mm spacer is irradiated along a cutting line with a laser emitting at 1030 nm.
  • the emitting laser is configured to emit a train of two 3 ps pulses at a working frequency of 5 kHz.
  • the total energy per pulse train is about 1000 pJ.
  • the beam The laser is shaped into a Bessel beam with a length LB of 4.6 mm and a diameter of 1 ⁇ m (central lobe) moves at 20 mm/s relative to the laminated glass to be cut.
  • the two pulses of the same group are clocked at 40MHz, i.e. a duration of 25ps between the two.
  • a laminated glass in 22-1 configuration is irradiated along a cutting line with a laser emitting at 1030 nm.
  • the laser is configured to emit a train of 2 pulses of 300 fs at a rate of 500 kHz.
  • the total energy of the pulse train is 24 pJ.
  • the laser beam has a Gaussian shape with a diameter of 20 ⁇ m at the focal point adjusted to the middle of the PVB sheet. It moves at 2 mm/s relative to the laminated glass to be cut.
  • a step, called separation, consisting of the application of a mechanical force is carried out.
  • This mechanical force is applied to the glass at the cutting line (similar to the cutting of a monolithic glass).
  • the two sheets of glass 1, 2 having been placed locally under stress, a crack propagates in the two sheets.
  • the PVB having been weakened by the channels created by the laser, the laminated glass separates into two parts under the only mechanical action applied for the breaking of the glass with a good quality of edges.
  • the support on which the laminated glass panel P is placed comprises breaking means allowing mechanical support to be exerted on the cutting/separation line.
  • breaking means 20 making it possible to exert mechanical support on the cutting/separation line are in the form of a ball B or a bar, visible in FIG. 7, mounted on a base.
  • the base is mounted mobile in order to move in two horizontal directions orthogonal to each other.
  • the base is also arranged to allow the ball B to move in height.
  • the ball / bar is able to be moved vertically. This allows the ball to be brought into contact with the glass panel in order to apply mechanical support.
  • One of the advantages of the present invention is to allow the production of the cutting line and the breaking of the glass without excessive handling. Indeed, in a current process, it is often necessary to turn the glass sheet or the glass panel in order to perform the separation, the rupture or to have a machine capable of exerting pressure on both sides of the laminated glass. With the present invention and the ability to create a cutting line over the entire thickness, it becomes unnecessary to manipulate the glass panel to turn it over to operate the break.
  • breaking means 20 can also comprise a tracking module such as a camera making it possible to locate the cut line.
  • This monitoring module makes it possible, on the one hand, to check that the laser beam is facing the cutting line.
  • the tracking module is coupled with a control unit.
  • This coupling of the tracking module with a control unit makes it possible to control the breaking means 20 via the tracking module. It is then understood that the tracking module is able to identify the cutting line to control the movement of the breaking means.
  • the breaking means 20 further comprise a support unit able to exert a support on the face opposite to the face on which the ball is applied.
  • the weight of the glass sheet acts as a counterweight. This counterweight makes it possible to exert a force which limits the movement of the glass sheet during breaking.
  • this support unit comprises at least one support element which makes it possible to exert a greater force.
  • This support element takes the form of a ball or stud resting on the laminated glass panel. In this case of a single support element, it bears directly opposite the ball, i.e. at the level of the cutting line.
  • the support unit comprises two support elements arranged on either side of the cut line.

Landscapes

  • Optics & Photonics (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Joining Of Glass To Other Materials (AREA)
  • Laser Beam Processing (AREA)
EP22741783.9A 2021-07-16 2022-07-15 Verfahren zum schneiden einer platte aus verbundglas Pending EP4370475A1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR2107695A FR3125293B1 (fr) 2021-07-16 2021-07-16 Procédé de découpage d’un panneau de verre feuilleté
PCT/EP2022/069867 WO2023285656A1 (fr) 2021-07-16 2022-07-15 Procédé de découpage d'un panneau de verre feuilleté

Publications (1)

Publication Number Publication Date
EP4370475A1 true EP4370475A1 (de) 2024-05-22

Family

ID=79269815

Family Applications (1)

Application Number Title Priority Date Filing Date
EP22741783.9A Pending EP4370475A1 (de) 2021-07-16 2022-07-15 Verfahren zum schneiden einer platte aus verbundglas

Country Status (4)

Country Link
US (1) US20240326173A1 (de)
EP (1) EP4370475A1 (de)
FR (1) FR3125293B1 (de)
WO (1) WO2023285656A1 (de)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR3146079A1 (fr) * 2023-02-28 2024-08-30 Saint-Gobain Glass France Procédé de découpage d’un film intercalaire

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150165563A1 (en) * 2013-12-17 2015-06-18 Corning Incorporated Stacked transparent material cutting with ultrafast laser beam optics, disruptive layers and other layers
ITUB20152791A1 (it) * 2015-08-03 2017-02-03 Bottero Spa Macchina da taglio per il taglio di una lastra di vetro
US10752534B2 (en) * 2016-11-01 2020-08-25 Corning Incorporated Apparatuses and methods for laser processing laminate workpiece stacks

Also Published As

Publication number Publication date
FR3125293B1 (fr) 2023-12-29
FR3125293A1 (fr) 2023-01-20
US20240326173A1 (en) 2024-10-03
WO2023285656A1 (fr) 2023-01-19

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