EP4340124A1 - Unité de rayonnement et antenne de station de base - Google Patents

Unité de rayonnement et antenne de station de base Download PDF

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Publication number
EP4340124A1
EP4340124A1 EP21947869.0A EP21947869A EP4340124A1 EP 4340124 A1 EP4340124 A1 EP 4340124A1 EP 21947869 A EP21947869 A EP 21947869A EP 4340124 A1 EP4340124 A1 EP 4340124A1
Authority
EP
European Patent Office
Prior art keywords
radiation
substrate
arms
ground
grounding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP21947869.0A
Other languages
German (de)
English (en)
Inventor
Zhenggui LIU
Huimin Li
Xiaoming Sun
Qiang Zhang
Yaoting YANG
Yanming Sun
Weihua Wu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CICT Mobile Communication Technology Co Ltd
Original Assignee
CICT Mobile Communication Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by CICT Mobile Communication Technology Co Ltd filed Critical CICT Mobile Communication Technology Co Ltd
Publication of EP4340124A1 publication Critical patent/EP4340124A1/fr
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q21/00—Antenna arrays or systems
    • H01Q21/24—Combinations of antenna units polarised in different directions for transmitting or receiving circularly and elliptically polarised waves or waves linearly polarised in any direction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
    • H01Q1/241—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
    • H01Q1/246—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for base stations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q23/00—Antennas with active circuits or circuit elements integrated within them or attached to them
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
    • H01Q9/04—Resonant antennas
    • H01Q9/06—Details
    • H01Q9/065—Microstrip dipole antennas

Definitions

  • the present application relates to the field of communication, and particular to a radiation unit and a base station antenna.
  • the present application provides a radiation unit and a base station antenna to solve a problem of difficulty in reducing inter-frequency coupling of an integrated array antenna.
  • the present application provides a radiation unit, including a substrate and two groups of radiation arms.
  • Each of the two groups of radiation arms includes two radiation single arms.
  • Each of the two radiation single arms is provided with at least one decoupling structure. Two radiation single arms in the same group of radiation arms are coupled through a radiation surface, one radiation single arm of each of the two groups of radiation arms is located on a first surface of the substrate, and another radiation single arm of each of the two groups of radiation arms is located on a second surface of the substrate, or two radiation single arms of each of the two groups of radiation arms are located on the same surface of the substrate.
  • the decoupling structure includes one or more of a high-low-impedance line decoupling stub, an open-circuit decoupling stub and a slot decoupling stub.
  • an end of the radiation single arm away from a radiation center is provided with at least one high-low-impedance line decoupling stub, and the radiation single arm is provided with a slot decoupling stub along an extension direction of the radiation single arm.
  • the decoupling structures are mirror-symmetrical relative to a center line of the radiation single arm.
  • the radiation unit provided by an embodiment of the present application further includes a first substrate and a second substrate; the first substrate and the second substrate are arranged orthogonally and are both connected to the substrate; both a first side surface of the first substrate and a first side surface of the second substrate are provided with feeder structure, both a second side surface of the first substrate and a second side surface of the second substrate are provided with grounding structure; the grounding structure and the feeder structure are coupled or electrically connected to the radiation arm, respectively.
  • the grounding structure includes a ground welding surface, a ground coupling surface and a grounding surface, and the ground welding surface is fixed to the substrate and is electrically connected to the radiation surface; the ground coupling surface and the feeder structure are located on the same side and the ground coupling surface is connected to the ground welding surface; the grounding surface and the feeder structure are located on opposite sides and the ground coupling surface is coupled to the grounding surface.
  • the grounding surface and the ground coupling surface are located on opposite sides of the first substrate or the second substrate, and the ground welding surface protrudes outward from the first substrate or the second substrate to connect the grounding surface and the ground coupling surface, and the ground welding surface is connected to the ground coupling surface to form a convex shape.
  • the feeder structure includes a feeder circuit, the feeder circuit is coupled to and feed the radiation arm, and an end of the feeder circuit is provided with a feed ground through hole connected to the grounding structure.
  • a first end of the first substrate is provided with a first bayonet
  • a second end of the second substrate is provided with a second bayonet
  • the first substrate and the second substrate are orthogonally snapped together through the first bayonet and the second bayonet.
  • the present application further provides a base station antenna, including the radiation unit as described above.
  • an impedance bandwidth is increased by disposing two radiation single arms of each group of radiation arms on the two surfaces of the substrate; and a coupling area is regulated by coupling two radiation single arms in the same group of radiation arms through the radiation surface, weakening inter-frequency signals and enhancing the decoupling effect and solving the problem of difficulty in reducing inter-frequency coupling of the integrated array antenna.
  • first and second are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of features indicated. Therefore, the features defined with “first” and “second” may explicitly or implicitly include at least one of the features. In the description of the present application, "a plurality of” means at least two, such as two, three, etc., unless specifically defined otherwise.
  • a radiation unit 1 includes a substrate 10 and two groups of radiation arms.
  • the radiation arms are mounted on a surface of the substrate 10.
  • the radiation arms may be a printed circuit structure, a die-cast integrated molding structure or a sheet metal stamping structure.
  • Each of the two groups of radiation arms includes two radiation single arms and the two radiation single arms are arranged at both ends of the radiation arm respectively to form a half wave or full wave structure.
  • FIG. 3 is a schematic diagram of the distribution of radiation single arms with the substrate removed. As shown in FIG. 3 , a first radiation single arm 11 and a third radiation single arm 13 form a group of radiation arms, a second radiation single arm 12 and a fourth radiation single arm 14 forms another group of radiation arms, and the two groups of radiation arms are orthogonally distributed. In another embodiment, the first radiation single arm 11 and the second radiation single arm 12 form a group of radiation arms, the third radiation single arm 13 and the fourth radiation single arm 14 form another group of radiation arms, and the two groups of radiation arms are horizontally-symmetrically distributed.
  • Each of the radiation single arms is provided with at least one decoupling structure to increase an structure suppressing other frequencies and reduce the inter-frequency coupling effect.
  • the substrate 10 includes a first surface and a second surface located on opposite sides.
  • One radiation single arm of each group of radiation arms is located on the first surface of the substrate 10, and another radiation single arm of each group of radiation arms is located on the second surface of the substrate 10.
  • the first surface or the second surface is provided with a coupling surface, two radiation single arms in a same group of radiation arms are coupled through a radiation surface, which may increase a matching bandwidth and improve the filtering.
  • two radiation single arms of each group of radiation arms are located on a same surface of the substrate. That is, two radiation single arms of one group of radiation arms are located on the first surface of the substrate, and two radiation single arms of another group of radiation arms are located on the second surface of the substrate.
  • FIG. 1 is a schematic structural diagram of the radiation unit 1 located on the first surface
  • FIG. 2 is a schematic structural diagram of the radiation unit 1 located on the second surface.
  • both the first radiation single arm 11 and the second radiation single arm 12 are located on the first surface
  • both the third radiation single arm 13 and the fourth radiation single arm 14 are located on the second surface
  • both a first coupling surface 104 and a second coupling surface 105 are located on the first surface.
  • the first radiation single arm 11 and the third radiation single arm 13 are coupled through the second coupling surface 105
  • the second radiation single arm 12 and the fourth radiation single arm 14 are coupled through the first coupling surface 104.
  • the first radiation single arm 11 and the second radiation single arm 12 are coplanar, and the third radiation single arm 13 and the fourth radiation single arm 12 are coplanar.
  • the first coupling surface 104 and the second coupling surface 105 are used to increase the impedance bandwidth, and inter-frequency signals are weakened and the decoupling effect is enhanced by regulating the coupling area.
  • an impedance bandwidth is increased by disposing two radiation single arms of each group of radiation arms on the two surfaces of the substrate; and a coupling area is regulated by coupling two radiation single arms in the same group of radiation arms through the radiation surface, weakening inter-frequency signals and enhancing the decoupling effect and solving the problem of difficulty in reducing inter-frequency coupling of the integrated array antenna in the related art.
  • Installation positions of all radiation single arms are rotation-symmetrical or mirror-symmetrical relative to the center of the substrate. For example, as shown in FIG. 3 , installation positions of all radiation single arms are rotation-symmetrical relative to the center of the substrate and two groups of radiation arms form ⁇ 45° polarizations.
  • the decoupling structures include one or more of a high-low-impedance line decoupling stub, an open-circuit decoupling stub and a slot decoupling stub and have functions of adding a structure suppressing other frequencies on the radiation single arms and reducing the inter-frequency coupling among arrays.
  • each radiation single arm away from a radiation center is provided with a high-low-impedance line decoupling stub 102, and each radiation single arm is provided with a slot decoupling stub 101 along an extension direction of the each radiation single arm.
  • the number of the high-low-impedance line decoupling stub 102 is at least one.
  • each radiation single arm is mirror-symmetrical relative to the center line of the radiation arm.
  • slot decoupling stubs 101 are provided on opposite sides of a hexagonal radiation single arm, the slot decoupling stubs 101 on each radiation arm are vertically-symmetrical relative to the center line of the radiation arm. It should be noted that a length of the slot decoupling stubs 101 is determined according to the frequency band to be decoupled.
  • the radiation unit 1 further includes a first substrate 21 and a second substrate 22; the first substrate 21 and the second substrate 22 are arranged orthogonally and are both connected to the substrate 10.
  • both the first substrate 21 and the second substrate 22 are vertically connected to the substrate 10. Further, as shown in FIGs. 5 to 8 , a first end of the first substrate 21 is provided with a first bayonet 216, and a second end of the second substrate 22 is provided with a second bayonet 226. The first substrate 21 and the second substrate 22 are orthogonally snapped together through the first bayonet 216 and the second bayonet 226.
  • Both the first substrate 21 and the second substrate 22 include a first side surface and a second side surface facing away from each other. Both the first side surface of the first substrate 21 and the first side surface of the second substrate 22 are provided with feeder structures.
  • the feeder structures are directly electrically connected to the radiation arm to form direct feed.
  • the feeder structures and the radiation arms form a coupled feed. The coupled and electrical connection between the feeder structures and the radiation arms not only reduces the welding process, but also extends the bandwidth.
  • Both the second side surface of the first substrate 21 and the second side surface of the second substrate 22 are provided with grounding structures and the grounding structures are coupled or electrically connected to the radiation arms.
  • each of the grounding structures includes a ground welding surface, a ground coupling surface and a grounding surface, the ground welding surface is fixed to the substrate 10 and is electrically connected to the radiation surface; the ground coupling surfaces and the feeder structures are located on the same side and the ground coupling surface is connected to the ground welding surface; the grounding surface and the feeder structures are located on opposite sides and the ground coupling surface is coupled to the grounding surface.
  • the coupling area of the ground coupling surface and the grounding surface affects the impedance bandwidth and decoupling effect of the radiation unit 1.
  • FIG. 5 and FIG. 6 are schematic structural diagrams of the first substrate 21 located on the first side surface and the second side surface respectively.
  • the two first ground coupling surfaces 213 and the feeder structures are provided on the first side surface as shown in FIG. 5 , the first ground coupling surface 213 is located in the direction of the first substrate 21 close to the substrate 10, the first grounding surface 214 is located on the second side surface as shown in FIG. 6 , and the first ground coupling surface 213 is coupled with the first grounding surface 214.
  • first grounding surface 214 and the first ground coupling surface 213 are located on opposite sides of the first substrate 21, and the first ground welding surface 215 is connected to the first grounding surface 214 and the first ground coupling surface 213, allowing the first grounding surface 214 and the first ground coupling surface 213 coupling to each other.
  • the first ground welding surface 215 is connected to the first ground coupling surface 213 and forms a convex shape and the first ground welding surface 215 protrudes outward from the first substrate 21.
  • the first ground welding surface 215 is welded to the ground connecting point 103 to fix the substrate 10.
  • Ground welding points 103 are arranged on the substrate 10.
  • the second substrate 22 further includes a second ground coupling surface 223, a second grounding surface 224 and a second ground welding surface 225.
  • the grounding structure of the second substrate 22 is the same as that of the first substrate 21 and is not repeated here.
  • Each of the feeder structure includes a feeder circuit, the feeder circuit feeds the radiation arm coupledly.
  • an end of the feeder circuit is provided with a feed ground through hole and the feed ground through hole is connected to the grounding structure.
  • a first feeder circuit 211 and a first ground coupling surface 213 are located on the same surface, and an end of the first feeder circuit 211 is provided with a first feed ground through hole 212.
  • the first feeder circuit 211 is connected to the first grounding surface 214 on the second side surface through the first feed ground through hole 212 to ensure the DC grounding of the feeder signal.
  • the second substrate 22 further includes a second feeder circuit 221 and a second feed ground through hole 222.
  • the feeder structure of the second substrate 22 is the same as that of the first substrate 21 and is not repeated here.
  • An embodiment of the present application provides a base station antenna, including the radiation unit 1 as described above in the embodiments.
  • an impedance bandwidth is increased by disposing two radiation single arms of each group of radiation arms on the two surfaces of the substrate; and a coupling area is regulated by coupling two radiation single arms in the same group of radiation arms through the radiation surface, weakening inter-frequency signals and enhancing the decoupling effect and solving the problem of difficulty in reducing inter-frequency coupling of the integrated array antenna in the related art.

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  • Engineering & Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Variable-Direction Aerials And Aerial Arrays (AREA)
  • Waveguide Aerials (AREA)
EP21947869.0A 2021-06-30 2021-09-06 Unité de rayonnement et antenne de station de base Pending EP4340124A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN202110734497.XA CN113471668B (zh) 2021-06-30 2021-06-30 辐射单元及基站天线
PCT/CN2021/116742 WO2023272936A1 (fr) 2021-06-30 2021-09-06 Unité de rayonnement et antenne de station de base

Publications (1)

Publication Number Publication Date
EP4340124A1 true EP4340124A1 (fr) 2024-03-20

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Family Applications (1)

Application Number Title Priority Date Filing Date
EP21947869.0A Pending EP4340124A1 (fr) 2021-06-30 2021-09-06 Unité de rayonnement et antenne de station de base

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EP (1) EP4340124A1 (fr)
CN (1) CN113471668B (fr)
BR (1) BR112023026858A2 (fr)
WO (1) WO2023272936A1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113471668B (zh) * 2021-06-30 2022-07-19 中信科移动通信技术股份有限公司 辐射单元及基站天线

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN203339298U (zh) * 2013-06-20 2013-12-11 华南理工大学 一种宽带双极化四叶草平面天线
CN105960737B (zh) * 2015-12-03 2019-08-20 华为技术有限公司 一种多频通信天线以及基站
TWI663777B (zh) * 2017-08-02 2019-06-21 啟碁科技股份有限公司 天線結構
CN207883897U (zh) * 2017-11-08 2018-09-18 罗森伯格技术（昆山）有限公司 一种宽频基站天线辐射单元
CN210430080U (zh) * 2019-07-29 2020-04-28 华南理工大学 宽带双极化滤波基站天线单元、基站天线阵列及通信设备
CN110416719B (zh) * 2019-08-08 2022-02-08 中信科移动通信技术股份有限公司 辐射单元及天线
CN110676579A (zh) * 2019-10-28 2020-01-10 华南理工大学 一种平面扩频宽带基站天线
CN111029727A (zh) * 2019-12-09 2020-04-17 瑞声科技(新加坡)有限公司 一种天线单元及基站
WO2021114017A1 (fr) * 2019-12-09 2021-06-17 瑞声声学科技(深圳)有限公司 Unité d'antenne et station de base
CN111864367A (zh) * 2020-07-27 2020-10-30 摩比天线技术（深圳）有限公司 低频辐射单元及基站天线
CN213304351U (zh) * 2020-10-20 2021-05-28 京信通信技术(广州)有限公司 低频辐射单元和天线
CN113471668B (zh) * 2021-06-30 2022-07-19 中信科移动通信技术股份有限公司 辐射单元及基站天线

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Publication number Publication date
BR112023026858A2 (pt) 2024-03-05
CN113471668B (zh) 2022-07-19
CN113471668A (zh) 2021-10-01
WO2023272936A1 (fr) 2023-01-05

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Owner name: CICT MOBILE COMMUNICATION TECHNOLOGY CO., LTD.