EP4340124A1

EP4340124A1 - Radiation unit and base station antenna

Info

Publication number: EP4340124A1
Application number: EP21947869.0A
Authority: EP
Inventors: Zhenggui LIU; Huimin Li; Xiaoming Sun; Qiang Zhang; Yaoting YANG; Yanming Sun; Weihua Wu
Original assignee: CICT Mobile Communication Technology Co Ltd
Current assignee: CICT Mobile Communication Technology Co Ltd
Priority date: 2021-06-30
Filing date: 2021-09-06
Publication date: 2024-03-20
Also published as: CN113471668B; CN113471668A; BR112023026858A2; WO2023272936A1

Abstract

The present application provides a radiation unit and a base station, and relates to the technical field of communications. The radiation unit comprises a substrate and two groups of radiation arms. Each group of radiation arms comprises two radiation single arms. Each radiation single arm has at least one decoupling structure. Two radiation single arms of the same group of radiation arms are coupled by means of a radiation surface. One radiation single arm in each group of radiation arms is located on a first surface of the substrate, and the other radiation single arm is located on a second surface of the substrate; or, the two radiation single arms in each group of radiation arms are located on the same surface of the substrate. In the radiation unit and the base station antenna provided in the present application, the two radiation single arms of each group of radiation arms are disposed on two surfaces of the substrate, respectively, thereby increasing the impedance bandwidth. By coupling the two radiation single arms in the same group of radiation arms by means of the radiation surface and adjusting the coupling area, the attenuation of inter-frequency signals is achieved, the decoupling effect is enhanced, and the technical problem in the existing technology that mutual coupling between frequency bands is difficult to reduce in a fused array antenna is resolved.

Description

CROSS-REFERENCE TO RELATED APPLICATION

The present application claims priority to Chinese Patent Application No. 202110734497.X, filed on June 30, 2021 , entitled "Radiation Unit and Base Station Antenna", which is hereby incorporated by reference in its entirety.

TECHNICAL FIELD

The present application relates to the field of communication, and particular to a radiation unit and a base station antenna.

BACKGROUND

With the development of the Internet and the Internet of Things, 4G/5G integrated array antennas have become a major focus in research. Traditional radiation units interact with each other through electromagnetic coupling and it is hard to reduce inter-frequency coupling and secondary radiation, which results in low accuracy and severe error. Reducing the inter-frequency coupling and secondary radiation and ensuring that each frequency band indicator does not deteriorate under multi-band integration have become urgent problems to be solved.

SUMMARY

The present application provides a radiation unit and a base station antenna to solve a problem of difficulty in reducing inter-frequency coupling of an integrated array antenna.
The present application provides a radiation unit, including a substrate and two groups of radiation arms. Each of the two groups of radiation arms includes two radiation single arms. Each of the two radiation single arms is provided with at least one decoupling structure. Two radiation single arms in the same group of radiation arms are coupled through a radiation surface, one radiation single arm of each of the two groups of radiation arms is located on a first surface of the substrate, and another radiation single arm of each of the two groups of radiation arms is located on a second surface of the substrate, or two radiation single arms of each of the two groups of radiation arms are located on the same surface of the substrate.
According to the radiation unit provided by an embodiment of the present application, the decoupling structure includes one or more of a high-low-impedance line decoupling stub, an open-circuit decoupling stub and a slot decoupling stub.
According to the radiation unit provided by an embodiment of the present application, an end of the radiation single arm away from a radiation center is provided with at least one high-low-impedance line decoupling stub, and the radiation single arm is provided with a slot decoupling stub along an extension direction of the radiation single arm.
According to the radiation unit provided by an embodiment of the present application, the decoupling structures are mirror-symmetrical relative to a center line of the radiation single arm.
The radiation unit provided by an embodiment of the present application further includes a first substrate and a second substrate; the first substrate and the second substrate are arranged orthogonally and are both connected to the substrate; both a first side surface of the first substrate and a first side surface of the second substrate are provided with feeder structure, both a second side surface of the first substrate and a second side surface of the second substrate are provided with grounding structure; the grounding structure and the feeder structure are coupled or electrically connected to the radiation arm, respectively.
According to the radiation unit provided by an embodiment of the present application, the grounding structure includes a ground welding surface, a ground coupling surface and a grounding surface, and the ground welding surface is fixed to the substrate and is electrically connected to the radiation surface; the ground coupling surface and the feeder structure are located on the same side and the ground coupling surface is connected to the ground welding surface; the grounding surface and the feeder structure are located on opposite sides and the ground coupling surface is coupled to the grounding surface.
According to the radiation unit provided by an embodiment of the present application, the grounding surface and the ground coupling surface are located on opposite sides of the first substrate or the second substrate, and the ground welding surface protrudes outward from the first substrate or the second substrate to connect the grounding surface and the ground coupling surface, and the ground welding surface is connected to the ground coupling surface to form a convex shape.
According to the radiation unit provided by an embodiment of the present application, the feeder structure includes a feeder circuit, the feeder circuit is coupled to and feed the radiation arm, and an end of the feeder circuit is provided with a feed ground through hole connected to the grounding structure.
According to the radiation unit provided by an embodiment of the present application, a first end of the first substrate is provided with a first bayonet, and a second end of the second substrate is provided with a second bayonet; the first substrate and the second substrate are orthogonally snapped together through the first bayonet and the second bayonet.
The present application further provides a base station antenna, including the radiation unit as described above.
In the radiation unit and base station antenna provided by the present application, an impedance bandwidth is increased by disposing two radiation single arms of each group of radiation arms on the two surfaces of the substrate; and a coupling area is regulated by coupling two radiation single arms in the same group of radiation arms through the radiation surface, weakening inter-frequency signals and enhancing the decoupling effect and solving the problem of difficulty in reducing inter-frequency coupling of the integrated array antenna.

BRIEF DESCRIPTION OF DRAWINGS

To clearly illustrate solutions of the present application, accompanying drawings used in the description of the embodiments are briefly introduced below. The drawings in the following description only show some embodiments of the present application. For those of ordinary skill in the art, other drawings may also be obtained based on these drawings without creative effort.

FIG. 1 is a first schematic structural diagram of a radiation unit according to an embodiment of the present application;
FIG. 2 is a second schematic structural diagram of a radiation unit according to an embodiment of the present application;
FIG. 3 is a schematic diagram showing distribution of radiation single arms according to an embodiment of the present application;
FIG. 4 is a perspective diagram of a radiation unit according to an embodiment of the present application;
FIG. 5 is a first schematic structural diagram of a first substrate according to an embodiment of the present application;
FIG. 6 is a second schematic structural diagram of a first substrate according to an embodiment of the present application;
FIG. 7 is a first schematic structural diagram of a second substrate according to an embodiment of the present application;
FIG. 8 is a second schematic structural diagram of a second substrate according to an embodiment of the present application.

Reference signs:

1, radiation unit; 10, substrate; 11, first radiation single arm; 12, second radiation single arm; 13, third radiation single arm; 14, fourth radiation single arm; 101, slot decoupling stub; 102, high-low-impedance line decoupling stub; 103, ground connecting point; 104, first coupling surface; 105, second coupling surface; 21, first substrate; 22, second substrate; 211, first feeder circuit; 212, first feed ground through hole; 213, first ground coupling surface; 214, first grounding surface; 215, first ground welding surface; 216, first bayonet; 221, second feeder circuit; 222, second feed ground through hole; 223, second ground coupling surface; 224, second grounding surface; 225, second ground welding surface; 226, second bayonet.

DETAILED DESCRIPTION OF THE EMBODIMENTS

To illustrate the objectives, solutions and advantages of the application, the solutions in the present application are described clearly and completely below in combination with the drawings in the application. The described embodiments are part of the embodiments of the application, not all of them. All other embodiments obtained by a person of ordinary skill in the art based on the embodiments of the present application without creative effort belong to the scope of the present application.
The specific embodiments of the present application are described in detail below with reference to the drawings and embodiments. The following examples are intended to illustrate the application, but are not intended to limit the scope of the application.
In the description of the present application, it is to be appreciated that the orientational or positional relationships indicated by terms such as "center", "upper", "lower", "left", "right", etc. are based on the orientational or positional relationship shown in the drawings, and are merely for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the apparatus or component stated must have a particular orientation, or constructed and operated in a particular orientation, and thus the terms are not to be construed as limiting the application.
In addition, terms "first" and "second" are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of features indicated. Therefore, the features defined with "first" and "second" may explicitly or implicitly include at least one of the features. In the description of the present application, "a plurality of" means at least two, such as two, three, etc., unless specifically defined otherwise.
As shown in FIG. 1 and FIG. 2, a radiation unit 1 according to an embodiment of the present application includes a substrate 10 and two groups of radiation arms. The radiation arms are mounted on a surface of the substrate 10. The radiation arms may be a printed circuit structure, a die-cast integrated molding structure or a sheet metal stamping structure.
Each of the two groups of radiation arms includes two radiation single arms and the two radiation single arms are arranged at both ends of the radiation arm respectively to form a half wave or full wave structure. FIG. 3 is a schematic diagram of the distribution of radiation single arms with the substrate removed. As shown in FIG. 3, a first radiation single arm 11 and a third radiation single arm 13 form a group of radiation arms, a second radiation single arm 12 and a fourth radiation single arm 14 forms another group of radiation arms, and the two groups of radiation arms are orthogonally distributed. In another embodiment, the first radiation single arm 11 and the second radiation single arm 12 form a group of radiation arms, the third radiation single arm 13 and the fourth radiation single arm 14 form another group of radiation arms, and the two groups of radiation arms are horizontally-symmetrically distributed.
Each of the radiation single arms is provided with at least one decoupling structure to increase an structure suppressing other frequencies and reduce the inter-frequency coupling effect.
The substrate 10 includes a first surface and a second surface located on opposite sides. One radiation single arm of each group of radiation arms is located on the first surface of the substrate 10, and another radiation single arm of each group of radiation arms is located on the second surface of the substrate 10. The first surface or the second surface is provided with a coupling surface, two radiation single arms in a same group of radiation arms are coupled through a radiation surface, which may increase a matching bandwidth and improve the filtering. In another embodiment, two radiation single arms of each group of radiation arms are located on a same surface of the substrate. That is, two radiation single arms of one group of radiation arms are located on the first surface of the substrate, and two radiation single arms of another group of radiation arms are located on the second surface of the substrate.
For example, FIG. 1 is a schematic structural diagram of the radiation unit 1 located on the first surface, and FIG. 2 is a schematic structural diagram of the radiation unit 1 located on the second surface. As shown in FIG. 1 and FIG. 2, both the first radiation single arm 11 and the second radiation single arm 12 are located on the first surface, both the third radiation single arm 13 and the fourth radiation single arm 14 are located on the second surface, and both a first coupling surface 104 and a second coupling surface 105 are located on the first surface. In an embodiment where two groups of radiation arms are orthogonally distributed, the first radiation single arm 11 and the third radiation single arm 13 are coupled through the second coupling surface 105, and the second radiation single arm 12 and the fourth radiation single arm 14 are coupled through the first coupling surface 104. In an embodiment where the two groups of radiation arms are horizontally-symmetrically distributed, the first radiation single arm 11 and the second radiation single arm 12 are coplanar, and the third radiation single arm 13 and the fourth radiation single arm 12 are coplanar. The first coupling surface 104 and the second coupling surface 105 are used to increase the impedance bandwidth, and inter-frequency signals are weakened and the decoupling effect is enhanced by regulating the coupling area.
In the radiation unit provided by the present application, an impedance bandwidth is increased by disposing two radiation single arms of each group of radiation arms on the two surfaces of the substrate; and a coupling area is regulated by coupling two radiation single arms in the same group of radiation arms through the radiation surface, weakening inter-frequency signals and enhancing the decoupling effect and solving the problem of difficulty in reducing inter-frequency coupling of the integrated array antenna in the related art.
Installation positions of all radiation single arms are rotation-symmetrical or mirror-symmetrical relative to the center of the substrate. For example, as shown in FIG. 3, installation positions of all radiation single arms are rotation-symmetrical relative to the center of the substrate and two groups of radiation arms form ±45° polarizations.
The decoupling structures include one or more of a high-low-impedance line decoupling stub, an open-circuit decoupling stub and a slot decoupling stub and have functions of adding a structure suppressing other frequencies on the radiation single arms and reducing the inter-frequency coupling among arrays.
For example, as shown in FIGs. 1 to 3, an end of each radiation single arm away from a radiation center is provided with a high-low-impedance line decoupling stub 102, and each radiation single arm is provided with a slot decoupling stub 101 along an extension direction of the each radiation single arm. The number of the high-low-impedance line decoupling stub 102 is at least one.
Furthermore, the decoupling structures of each radiation single arm is mirror-symmetrical relative to the center line of the radiation arm. For example, as shown in FIG. 3, slot decoupling stubs 101 are provided on opposite sides of a hexagonal radiation single arm, the slot decoupling stubs 101 on each radiation arm are vertically-symmetrical relative to the center line of the radiation arm. It should be noted that a length of the slot decoupling stubs 101 is determined according to the frequency band to be decoupled.
In an embodiment, the radiation unit 1 according to an embodiment of the present application further includes a first substrate 21 and a second substrate 22; the first substrate 21 and the second substrate 22 are arranged orthogonally and are both connected to the substrate 10.
For example, as shown in FIG. 4, both the first substrate 21 and the second substrate 22 are vertically connected to the substrate 10. Further, as shown in FIGs. 5 to 8, a first end of the first substrate 21 is provided with a first bayonet 216, and a second end of the second substrate 22 is provided with a second bayonet 226. The first substrate 21 and the second substrate 22 are orthogonally snapped together through the first bayonet 216 and the second bayonet 226.
Both the first substrate 21 and the second substrate 22 include a first side surface and a second side surface facing away from each other. Both the first side surface of the first substrate 21 and the first side surface of the second substrate 22 are provided with feeder structures. In one embodiment, the feeder structures are directly electrically connected to the radiation arm to form direct feed. In another embodiment, the feeder structures and the radiation arms form a coupled feed. The coupled and electrical connection between the feeder structures and the radiation arms not only reduces the welding process, but also extends the bandwidth.
Both the second side surface of the first substrate 21 and the second side surface of the second substrate 22 are provided with grounding structures and the grounding structures are coupled or electrically connected to the radiation arms.
In the present embodiment, each of the grounding structures includes a ground welding surface, a ground coupling surface and a grounding surface, the ground welding surface is fixed to the substrate 10 and is electrically connected to the radiation surface; the ground coupling surfaces and the feeder structures are located on the same side and the ground coupling surface is connected to the ground welding surface; the grounding surface and the feeder structures are located on opposite sides and the ground coupling surface is coupled to the grounding surface. The coupling area of the ground coupling surface and the grounding surface affects the impedance bandwidth and decoupling effect of the radiation unit 1.
Taking the first substrate 21 as an example, FIG. 5 and FIG. 6 are schematic structural diagrams of the first substrate 21 located on the first side surface and the second side surface respectively. The two first ground coupling surfaces 213 and the feeder structures are provided on the first side surface as shown in FIG. 5, the first ground coupling surface 213 is located in the direction of the first substrate 21 close to the substrate 10, the first grounding surface 214 is located on the second side surface as shown in FIG. 6, and the first ground coupling surface 213 is coupled with the first grounding surface 214.
Further, the first grounding surface 214 and the first ground coupling surface 213 are located on opposite sides of the first substrate 21, and the first ground welding surface 215 is connected to the first grounding surface 214 and the first ground coupling surface 213, allowing the first grounding surface 214 and the first ground coupling surface 213 coupling to each other. The first ground welding surface 215 is connected to the first ground coupling surface 213 and forms a convex shape and the first ground welding surface 215 protrudes outward from the first substrate 21. The first ground welding surface 215 is welded to the ground connecting point 103 to fix the substrate 10. Ground welding points 103 are arranged on the substrate 10.
As shown in FIG. 7 and FIG. 8, the second substrate 22 further includes a second ground coupling surface 223, a second grounding surface 224 and a second ground welding surface 225. The grounding structure of the second substrate 22 is the same as that of the first substrate 21 and is not repeated here.
Each of the feeder structure includes a feeder circuit, the feeder circuit feeds the radiation arm coupledly. To achieve DC grounding of the feeder structure, an end of the feeder circuit is provided with a feed ground through hole and the feed ground through hole is connected to the grounding structure.
For example, as shown in FIG. 5 and FIG. 6, a first feeder circuit 211 and a first ground coupling surface 213 are located on the same surface, and an end of the first feeder circuit 211 is provided with a first feed ground through hole 212. The first feeder circuit 211 is connected to the first grounding surface 214 on the second side surface through the first feed ground through hole 212 to ensure the DC grounding of the feeder signal.
As shown in FIG. 7 and FIG. 8, the second substrate 22 further includes a second feeder circuit 221 and a second feed ground through hole 222. The feeder structure of the second substrate 22 is the same as that of the first substrate 21 and is not repeated here.
An embodiment of the present application provides a base station antenna, including the radiation unit 1 as described above in the embodiments.
In the base station antenna provided by the present application, an impedance bandwidth is increased by disposing two radiation single arms of each group of radiation arms on the two surfaces of the substrate; and a coupling area is regulated by coupling two radiation single arms in the same group of radiation arms through the radiation surface, weakening inter-frequency signals and enhancing the decoupling effect and solving the problem of difficulty in reducing inter-frequency coupling of the integrated array antenna in the related art.
Finally, it should be noted that the above embodiments are only used to explain the solutions of the present application, and are not limited thereto; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that they may still modify the solutions documented in the foregoing embodiments and make equivalent substitutions to a part of the technical features; these modifications and substitutions do not make the essence of the corresponding solutions depart from the scope of the solutions of various embodiments of the present application.

Claims

A radiation unit, comprising: a substrate and two groups of radiation arms, wherein each of the two groups of radiation arms comprises two radiation single arms, each of the two radiation single arms being provided with at least one decoupling structure; two radiation single arms in the same group of radiation arms are coupled through a radiation surface; one radiation single arm of each of the two groups of radiation arms is located on a first surface of the substrate, and another radiation single arm of each of the two groups of radiation arms is located on a second surface of the substrate; or two radiation single arms of each of the two groups of radiation arms are located on the same surface of the substrate.
The radiation unit of claim 1, wherein the decoupling structure comprises one or more of a high-low-impedance line decoupling stub, an open-circuit decoupling stub and a slot decoupling stub.
The radiation unit of claim 2, wherein an end of the radiation single arm away from a radiation center is provided with at least one high-low-impedance line decoupling stub, and the radiation single arm is provided with a slot decoupling stub along an extension direction of the radiation single arm.
The radiation unit of claim 2, wherein the decoupling structures are mirror-symmetrical relative to a center line of the radiation single arm.
The radiation unit of claim 1, further comprising: a first substrate and a second substrate, wherein the first substrate and the second substrate are arranged orthogonally and are both connected to the substrate; both a first side surface of the first substrate and a first side surface of the second substrate are provided with feeder structure, both a second side surface of the first substrate and a second side surface of the second substrate are provided with grounding structure, and the grounding structure and the feeder structure are coupled or electrically connected to the radiation arm, respectively.
The radiation unit of claim 5, wherein the grounding structure comprises a ground welding surface, a ground coupling surface and a grounding surface; the ground welding surface is fixed to the substrate and is electrically connected to the radiation surface; the ground coupling surface and the feeder structure are located on the same side and the ground coupling surface is connected to the ground welding surface; the grounding surface and the feeder structure are located on opposite sides and the ground coupling surface is coupled to the grounding surface.
The radiation unit of claim 6, wherein the grounding surface and the ground coupling surface are located on opposite sides of the first substrate or the second substrate, and the ground welding surface protrudes outward from the first substrate or the second substrate to connect the grounding surface and the ground coupling surface, and the ground welding surface is connected to the ground coupling surface to form a convex shape.
The radiation unit of claim 5, wherein the feeder structure comprises a feeder circuit, the feeder circuit is coupled to and feed the radiation arm, and an end of the feeder circuit is provided with a feed ground through hole connected to the grounding structure.
The radiation unit of claim 5, wherein a first end of the first substrate is provided with a first bayonet, and a second end of the second substrate is provided with a second bayonet; the first substrate and the second substrate are orthogonally snapped together through the first bayonet and the second bayonet.
A base station antenna, comprising the radiation unit of any one of claims 1 to 9.