EP4301091A1 - Procédé de fabrication d'un dispositif de chauffage et dispositif de chauffage - Google Patents

Procédé de fabrication d'un dispositif de chauffage et dispositif de chauffage Download PDF

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Publication number
EP4301091A1
EP4301091A1 EP23179310.0A EP23179310A EP4301091A1 EP 4301091 A1 EP4301091 A1 EP 4301091A1 EP 23179310 A EP23179310 A EP 23179310A EP 4301091 A1 EP4301091 A1 EP 4301091A1
Authority
EP
European Patent Office
Prior art keywords
layer
carrier
anodized layer
heating conductor
heating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP23179310.0A
Other languages
German (de)
English (en)
Inventor
Wolfgang Thimm
Patrick Kilian
Michael Tafferner
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EGO Elektro Geratebau GmbH
Original Assignee
EGO Elektro Geratebau GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by EGO Elektro Geratebau GmbH filed Critical EGO Elektro Geratebau GmbH
Publication of EP4301091A1 publication Critical patent/EP4301091A1/fr
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
    • H05B3/22—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible
    • H05B3/32—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulators on a metallic frame
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
    • H05B3/22—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible
    • H05B3/28—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor embedded in insulating material
    • H05B3/30—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor embedded in insulating material on or between metallic plates
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/04—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings of inorganic non-metallic material
    • C23C28/042—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings of inorganic non-metallic material including a refractory ceramic layer, e.g. refractory metal oxides, ZrO2, rare earth oxides
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
    • C25D11/005—Apparatus specially adapted for electrolytic conversion coating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
    • C25D11/02—Anodisation
    • C25D11/04—Anodisation of aluminium or alloys based thereon
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
    • C25D11/02—Anodisation
    • C25D11/04—Anodisation of aluminium or alloys based thereon
    • C25D11/06—Anodisation of aluminium or alloys based thereon characterised by the electrolytes used
    • C25D11/08—Anodisation of aluminium or alloys based thereon characterised by the electrolytes used containing inorganic acids
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
    • C25D11/02—Anodisation
    • C25D11/04—Anodisation of aluminium or alloys based thereon
    • C25D11/18—After-treatment, e.g. pore-sealing
    • C25D11/24—Chemical after-treatment
    • C25D11/246—Chemical after-treatment for sealing layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/02—Heating or cooling
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
    • C25D11/02—Anodisation
    • C25D11/022—Anodisation on selected surface areas
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/002—Heaters using a particular layout for the resistive material or resistive elements
    • H05B2203/003—Heaters using a particular layout for the resistive material or resistive elements using serpentine layout
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/013—Heaters using resistive films or coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/017—Manufacturing methods or apparatus for heaters

Definitions

  • the invention relates to a method for producing a heating device and a heating device produced using such a method.
  • a heating device which has a metallic support and several heating conductors applied to it.
  • the metallic carrier must be electrically insulated before the heating conductor is applied.
  • a thick-film paste containing glass is applied using a screen printing process. It is then baked and forms a finished insulating layer.
  • the heating conductors can then be applied to this insulating layer.
  • the carrier has to withstand such high temperatures due to the high temperatures required both for the application of the insulating layer and a possibly similar thick-film process.
  • the invention is based on the object of creating a method mentioned at the beginning and a heating device produced using such a method, with which problems of the prior art can be solved and in particular it is possible to have a heating device that is easy to use and easy to produce, which enables safe operation.
  • the heating device has a carrier, namely a metallic carrier, and at least one heating conductor which is applied to the carrier.
  • This carrier is therefore provided in such a way that it has a heating conductor side.
  • aluminum is chosen as the material for the carrier, which is easily and inexpensively available and has very good heat conduction properties, especially for a heating device.
  • An anodized layer is created on the heating conductor side, directly on the carrier or on its heating conductor side. There is therefore no further layer in between, i.e. between the carrier or its heating conductor side on the one hand and the anodized layer on the other.
  • the anodized layer is advantageously applied galvanically, as will be explained in more detail below.
  • a galvanic process can be used to generate and apply the anodized layer to the carrier or its heating conductor side.
  • the carrier is placed at least with the heating conductor side in a galvanic bath which has an acid electrolyte.
  • This acid electrolyte may have a relatively low temperature, preferably less than 20°C.
  • the relatively low temperature allows the formation of the anodized layer to be controlled and a particularly high-quality anodized layer to be created.
  • the at least one heating conductor is then applied over the anodized layer, either in a layer process, possibly directly on the anodized layer, or as a separate component or component.
  • a thin-film process can also advantageously be selected for this, but a thick-film process is particularly advantageous.
  • the heating conductor has a corresponding thickness; in the case of a thick-film heating conductor, this is 20 ⁇ m to 200 ⁇ m.
  • a metallic heating conductor can also be provided, advantageously with additional electrical insulation between the carrier or anodized layer on the one hand and the heating conductor on the other.
  • an additional insulation layer can be applied to the anodized layer in order to further improve the electrical insulation compared to the metallic carrier.
  • such an additional insulation layer can be applied as a thin layer, advantageously produced or applied by thermal spraying, directly onto the anodized layer. It is advantageously applied as an aluminum oxide layer. A possible procedure for this is from the DE 10 2008 026 101 A1 known, to which explicit reference is made in this regard.
  • the anodized layer can even be produced as a hard anodized layer, for which higher current densities are used.
  • a temperature of the galvanic bath can be significantly below 20°C, advantageously between 0°C and 15°C.
  • a current density is preferably chosen to be higher than for generating a normal one Anodized layer, advantageously with a current density greater than 20 mA/cm 2 or even greater than 30 mA/cm 2 .
  • Such current densities can range up to 60 mA/cm 2 or 80 mA/cm 2 .
  • a duration can be, for example, 30 minutes to 60 minutes.
  • Sulfuric acid can be used as the acid electrolyte, so the galvanic bath can be an aqueous sulfuric acid bath.
  • the sulfuric acid can be concentrated to 15% or 20% by weight.
  • Such a hard anodized layer is even harder and more stable than the aforementioned anodized layer alone, regardless of the method used to apply it.
  • An anodized layer can be applied with a thickness between 20 ⁇ m and 150 ⁇ m, preferably with a thickness between 40 ⁇ m and 100 ⁇ m.
  • a thickness of the anodized layer can advantageously be approximately 100 ⁇ m. In this way, sufficient dielectric strength can be achieved for a high-voltage test.
  • the carrier preferably consists of an aluminum alloy that is relatively pure.
  • An alloy Al99.5 or AlMg 3 can advantageously be used.
  • the heating conductor side may possibly have been processed by mechanical processing such as grinding, sandblasting or the like before producing the anodizing layer thereon, as is known for anodizing processes or hard anodizing processes.
  • the adhesive properties of the anodized layer can then be improved.
  • a thickener layer can be applied as a further layer to the finished anodized layer or to an aforementioned additional insulation layer on the anodized layer.
  • a thickener layer can also be applied to the anodized layer first and an additional insulation layer can be applied on top of it.
  • the thickener layer is preferably a high-temperature-resistant thickener layer, which then also survives the operation of the heating device per se and the application and, if necessary, baking of the heating conductor without damage.
  • a sol-gel sealer, a glass sealer or an aluminum orthophosphate sealer, for example, can be used as a thickener layer.
  • the thickener layer can prevent the heating conductor from being applied to a surface that contains aluminum. Therefore, lower requirements may have to be met for the structure or application of the heating conductor in a mentioned layer process, in particular in a thick-film process.
  • a thickener layer mentioned can have a smaller thickness than the anodized layer itself.
  • a thickness can be in a range between 10 ⁇ m and 100 ⁇ m. It can consist of aluminum oxide or titanium dioxide, alternatively it can consist of chromium oxide, zirconium oxide or magnesium oxide.
  • a further advantage of the relatively lower temperatures when applying the different layers is less warping of the material of the carrier, which can be caused by different expansion coefficients of the different materials. This is particularly advantageous because aluminum is not particularly strong.
  • heating conductors for several heating devices can also be applied to a support, i.e. as multiple uses.
  • the carrier can then be separated into several parts for the individual heating devices.
  • a common separation involves cutting using a laser. It can be advantageous to mask the separation points beforehand so that there is no or at least no thick aluminum oxide layer or anodized layer, thickener layer or additional insulation layer there. Then the aforementioned separation is easier.
  • a heating device according to the invention is preferably installed in a pump for a water-conducting household appliance, advantageously a washing machine or a dishwasher, or such a pump has a heating device according to the invention.
  • a heating device according to the invention can be installed in an evaporator or steam generator for a cooking device such as an oven or steamer or in an aforementioned water-conducting household appliance.
  • a top view of a heating device 11 according to the invention is shown.
  • the heating device 11 has a carrier 13, advantageously consisting of a pure or high-purity aluminum alloy, for example Al99.5 or AlMg 3 .
  • the carrier 13 is flat and rectangular, but it can also have any other shape.
  • An anodized layer 16 shown in dashed lines, is applied to the carrier 13 or its upward heating conductor side, over the entire surface. It insulates the carrier 13 or its heating conductor side according to an electrical insulation layer.
  • a heating conductor 21 can then be applied directly to this anodized layer 16, advantageously as a thick-film heating conductor in a conventional process, in particular a screen printing process.
  • the heating conductor 21 has a meander shape and can be electrically contacted in a known manner by means of two contact fields 22a and 22b. This corresponds to the known state of the art.
  • the anodized layer 16 therefore forms sufficient electrical insulation between the heating conductor 21 and the contact fields 22a and 22b on the one hand and the metallic carrier 13 on the other.
  • the anodized layer can have a thickness mentioned above, for example approximately 50 ⁇ m.
  • a sectional view through a slightly modified heating device 111 is shown.
  • a flat support 113 made of an aforementioned aluminum alloy is provided, for example with a thickness of 0.5 mm to 5 mm.
  • An anodized layer 116 is produced as electrical insulation on an upward-facing heating conductor side 114 of the carrier 113.
  • This anodized layer 116 is not only built up on the heating conductor side or the top of the carrier 113, but rather penetrates into this top side with a penetration depth 117 shown in dashed lines. This can be a few micrometers thick and up to half the thickness of the anodized layer 116 .
  • the anodized layer 116 consists of aluminum oxide in a known manner, and when it is created, the aluminum on the top or on the heating conductor side 114 is also converted into aluminum oxide and thus into the anodized layer 116 itself.
  • a thickener layer 119 explained at the beginning is applied to the anodized layer 116.
  • This is advantageously a sol-gel layer that is also resistant to high temperatures like the anodized layer 116 itself. It can have been produced in the aforementioned manner, for example it can consist of a mixture of aluminum oxide and titanium dioxide, alternatively of chromium oxide, zirconium oxide or magnesium oxide . Its thickness can be less than that of the anodized layer 116, for example only half as thick, i.e. approximately 50 ⁇ m.
  • a heating conductor 121 is again applied to the thickener layer 119 as described above, advantageously again using a screen printing process as a thick-film heating conductor.
  • FIG. 3 shows how an anodized layer according to the invention can be applied to a tubular support 213.
  • the tubular carrier 213 is completely immersed in a container 24 with a galvanic bath 25 therein, advantageously aqueous sulfuric acid.
  • a cooling device 27 including cooling coils 28 the galvanic bath 25 can be kept at an advantageously low temperature, for example at a constant 5 ° C.
  • a voltage source 31 is connected, on the one hand, to an electrode 30 in the galvanic bath 25 and, on the other hand, to the carrier 213 in an electrically conductive manner.
  • anodized layer then grows as a hard anodized layer on the carrier 213, in this case on the inside and outside or wherever the carrier 213 is immersed in the galvanic bath 25.
  • This electroplating process is known and can be easily carried out. By appropriately covering at least part of the surface of the carrier 213, the formation of an anodized layer can be prevented.
  • a plasma spraying device 33 which applies aluminum oxide as plasma 35 to the heating conductor side 14 in a known manner.
  • the plasma spray device 33 can be used accordingly the carrier 13 can be moved, alternatively also the carrier 13 relative to the plasma spray device 33.
  • the aluminum oxide of the plasma 35 hitting the heating conductor side 14 then grows there as an additional insulation layer.
  • Fig. 5 is shown as corresponding to the heating device 111 of Fig. 2
  • a sol-gel sealer 38 is sprayed onto an anodized layer 116 by means of a spray device 37.
  • This forms a previously described thickener layer 119 on the anodized layer 16. It can fill possible pores or cracks in the anodized layer 116 and thus bring about secure electrical insulation of the electrically conductive aluminum carrier 113. Furthermore, it simply forms an additional electrically insulating layer and thus additionally improves the electrical insulation of the aluminum carrier 113, in particular compared to the heating conductor 121.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Ceramic Engineering (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Automation & Control Theory (AREA)
  • Resistance Heating (AREA)
EP23179310.0A 2022-06-24 2023-06-14 Procédé de fabrication d'un dispositif de chauffage et dispositif de chauffage Pending EP4301091A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102022206363.5A DE102022206363A1 (de) 2022-06-24 2022-06-24 Verfahren zur Herstellung einer Heizeinrichtung und Heizeinrichtung

Publications (1)

Publication Number Publication Date
EP4301091A1 true EP4301091A1 (fr) 2024-01-03

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EP23179310.0A Pending EP4301091A1 (fr) 2022-06-24 2023-06-14 Procédé de fabrication d'un dispositif de chauffage et dispositif de chauffage

Country Status (4)

Country Link
US (1) US20230422352A1 (fr)
EP (1) EP4301091A1 (fr)
CN (1) CN117295192A (fr)
DE (1) DE102022206363A1 (fr)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020155303A1 (en) * 2001-04-17 2002-10-24 Ytsen Wielstra Insulating layer for a heating element
GB2391153A (en) * 2002-07-19 2004-01-28 Otter Controls Ltd Water heating vessel with planar element having an anodised surface
DE102008008998A1 (de) 2007-02-19 2008-08-21 Fischer Oberflächentechnik GmbH Stromdichteregelung für Eloxalverfahren
DE102008026101A1 (de) 2008-05-30 2009-12-03 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Thermisch gespritzte Al2O3-Schichten mit einem hohen Korundgehalt ohne Zusätze und Verfahren zu ihrer Herstellung
KR101257643B1 (ko) * 2012-12-06 2013-04-29 윤석삼 면상발열체 및 그 제조 방법
EP3197241A1 (fr) 2016-01-19 2017-07-26 E.G.O. ELEKTRO-GERÄTEBAU GmbH Dispositif de chauffage et procede de mesure des temperatures sur un dispositif de chauffage
EP3962234A1 (fr) * 2020-08-27 2022-03-02 Heraeus Nexensos GmbH Élément chauffant flexible, procédé de fabrication d'un tel élément chauffant et utilisation d'un élément chauffant flexible

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020155303A1 (en) * 2001-04-17 2002-10-24 Ytsen Wielstra Insulating layer for a heating element
GB2391153A (en) * 2002-07-19 2004-01-28 Otter Controls Ltd Water heating vessel with planar element having an anodised surface
DE102008008998A1 (de) 2007-02-19 2008-08-21 Fischer Oberflächentechnik GmbH Stromdichteregelung für Eloxalverfahren
DE102008026101A1 (de) 2008-05-30 2009-12-03 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Thermisch gespritzte Al2O3-Schichten mit einem hohen Korundgehalt ohne Zusätze und Verfahren zu ihrer Herstellung
KR101257643B1 (ko) * 2012-12-06 2013-04-29 윤석삼 면상발열체 및 그 제조 방법
EP3197241A1 (fr) 2016-01-19 2017-07-26 E.G.O. ELEKTRO-GERÄTEBAU GmbH Dispositif de chauffage et procede de mesure des temperatures sur un dispositif de chauffage
EP3962234A1 (fr) * 2020-08-27 2022-03-02 Heraeus Nexensos GmbH Élément chauffant flexible, procédé de fabrication d'un tel élément chauffant et utilisation d'un élément chauffant flexible

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Publication number Publication date
DE102022206363A1 (de) 2024-01-04
CN117295192A (zh) 2023-12-26
US20230422352A1 (en) 2023-12-28

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