Classifications

• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
  • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
  • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
  • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
  • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
  • C08G59/22—Di-epoxy compounds
  • C08G59/24—Di-epoxy compounds carbocyclic
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
  • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
  • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
  • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
  • C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
  • C08G59/4085—Curing agents not provided for by the groups C08G59/42 - C08G59/66 silicon containing compounds
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
  • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
  • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
  • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
  • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
  • C08G59/4215—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof cycloaliphatic
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
  • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
  • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
  • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
  • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
  • C08G59/4284—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof together with other curing agents
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
  • C08K3/00—Use of inorganic substances as compounding ingredients
  • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
  • C08K3/013—Fillers, pigments or reinforcing additives
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
  • C08K5/00—Use of organic ingredients
  • C08K5/04—Oxygen-containing compounds
  • C08K5/09—Carboxylic acids; Metal salts thereof; Anhydrides thereof
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
  • C08K2201/00—Specific properties of additives
  • C08K2201/019—Specific properties of additives the composition being defined by the absence of a certain additive

Definitions

• the present disclosure generally relates to a curable two-part resin system, cured articles obtainable therefrom, and uses thereof.
• Curable resin systems are widely known for various purposes.
• One area of interest is the use of such systems for the encapsulation of stators and/or rotors of electrical motors, usually by casting.
• a number of curable systems are disclosed in the prior art, including:
• WO 2016/202608 A1 discloses curable compositions based on cycloaliphatic epoxy resins, which can be used as insulating materials for electrical and electronic components like printed circuit boards. WO 2016/202608 A1 is silent on the use of crystalline inorganic fillers or block-copolymers with polysiloxane blocks and organic blocks. Although WO 2016/202608 A1 discloses a composition containing epoxycyclohexylmethyl epoxycyclohexanecarboxylate and methylnorbornene-2,3-dicarboxylic acid anhydride, it is free of inorganic fillers or blockcopolymers with polysiloxane blocks and organic blocks.
• WO 2010/112272 A1 discloses a system containing wollastonite and fused silica.
• the system disclosed therein is based on bisphenol A diglycidyl ether (BADGE) rather than a cycloaliphatic epoxy resin and shows a poor performance as compared to the presently disclosed two-part resin system.
• BADGE bisphenol A diglycidyl ether
• EP 3255103 B1 relates to a resin system containing a block-copolymer component but no amorphous or crystalline filler.
• the glass transition temperature (“Tg”) of such resin system is low as compared to the presently disclosed two-part resin system.
• the BADGE-based resin of WO 2019/175342 A1 comprises a block-copolymer component but lacks an amorphous inorganic filler, resulting in a low crack temperature index (SCT) and a low Tg as compared to the presently disclosed two-part resin system.
• SCT crack temperature index
• a curable two-part resin system capable of achieving one or more (or all) of the following properties: a strength of greater than 60 MPa, an elongation at break of greater than 0.8%, and a toughness having a K1c value greater than 2.6 MPAm 05 and a G1C value greater than 500 J/m 2 .
• the resin system to further achieve beneficial thermal properties, including a Tg greater than 190°C, a coefficient of thermal expansion (CTE) equal to or less than 22 ppm/K, a very low crack temperature index (SCT) less than -200°C, and additionally a good flowability as indicated by a moderate viscosity of less than 10 Pas at 60°C, no toxic label (as defined below) and containing minimal to no nanoparticles, which are complex in production.
• beneficial thermal properties including a Tg greater than 190°C, a coefficient of thermal expansion (CTE) equal to or less than 22 ppm/K, a very low crack temperature index (SCT) less than -200°C, and additionally a good flowability as indicated by a moderate viscosity of less than 10 Pas at 60°C, no toxic label (as defined below) and containing minimal to no nanoparticles, which are complex in production.
• compositions and/or methods disclosed herein can be made and executed without undue experimentation in light of the present disclosure. While the compositions and methods of the present disclosure have been described in terms of preferred embodiments, it will be apparent to those having ordinary skill in the art that variations may be applied to the compositions and/or methods and in the steps or sequences of steps of the methods described herein without departing from the concept, spirit, and scope of the present disclosure. All such similar substitutes and modifications apparent to those skilled in the art are deemed to be within the spirit, scope, and concept of the present disclosure.
• the term “or” is used to mean “and/or” unless clearly indicated to refer solely to alternatives and only if the alternatives are mutually exclusive.
• the term “about” is used to indicate that a value includes the inherent variation of error for the quantifying device, mechanism, or method, or the inherent variation that exists among the subject(s) to be measured. For example, but not by way of limitation, when the term “about” is used, the designated value to which it refers may vary by plus or minus ten percent, or nine percent, or eight percent, or seven percent, or six percent, or five percent, or four percent, or three percent, or two percent, or one percent, or one or more fractions therebetween.
• the term “substantially free” refers to a composition or blend in which a particular compound or moiety is present in an amount that has no material effect on the composition or blend.
• “substantially free” may refer to a composition or blend in which the particular compound or moiety is present in the composition or blend in an amount of less than 2% by weight, or less than 1% by weight, or less than 0.5% by weight, or less than 0.1% by weight, or less than 0.05% by weight, or even less than 0.01% by weight, based on the total weight of the composition or blend, or that no amount of that particular compound or moiety is present in the respective composition or blend.
• At least one will be understood to include one as well as any quantity more than one, including but not limited to, 1 , 2, 3, 4, 5, 10, 15, 20, 30, 40, 50, 100, etc.
• the term “at least one” may extend up to 100 or 1000 or more depending on the term to which it refers. In addition, the quantities of 100/1000 are not to be considered as limiting since lower or higher limits may also produce satisfactory results.
• the words “comprising” (and any form of comprising, such as “comprise” and “comprises”), “having” (and any form of having, such as “have” and “has”), “including” (and any form of including, such as “includes” and “include”) or “containing” (and any form of containing, such as “contains” and “contain”) are inclusive or open-ended and do not exclude additional, unrecited elements or method steps.
• phrases “or combinations thereof’ and “and combinations thereof’ as used herein refers to all permutations and combinations of the listed items preceding the term.
• “A, B, C, or combinations thereof’ is intended to include at least one of: A, B, C, AB, AC, BC, or ABC and, if order is important in a particular context, also BA, CA, CB, CBA, BCA, ACB, BAC, or CAB.
• expressly included are combinations that contain repeats of one or more items or terms such as BB, AAA, CC, AABB, AACC, ABCCCC, CBBAAA, CABBB, and so forth.
• ambient temperature refers to the temperature of the surrounding work environment (e.g., the temperature of the area, building or room where the curable system is used or produced), exclusive of any temperature changes induced by a chemical reaction.
• the ambient temperature is typically between about 10°C and about 30°C, more specifically about 25°C.
• the term “ambient temperature” is used interchangeably with “room temperature” herein.
• the present disclosure is related to a curable two-part resin system, comprising (a) a resin part, comprising at least one cycloaliphatic epoxy resin and (b) a hardener part, comprising (i) at least one alicyclic anhydride, and (ii) a block-copolymer comprising polysiloxane blocks and organic blocks, wherein at least one of the resin part and the hardener part further comprises an inorganic filler in an amount such that the curable two-part resin system comprises greater than 60 wt% of the inorganic filler, and wherein the inorganic filler comprises an amorphous inorganic material and a crystalline inorganic material.
• the amorphous inorganic material is amorphous silica, and the crystalline inorganic material is wollastonite.
• the curable two-part resin system is substantially free of rubber particles.
• the resin system according to the present disclosure overcomes the disadvantages of the state of the art by achieving features which solve conflicting objectives (as defined below).
• Such features include good strength (i.e., greater than 60 MPa), a moderate elongation at break (i.e., greater than 0.8%), and a high toughness (i.e., a K1c value greaterthan 2.6 MPAm 05 and a G1C value greaterthan 500 J/m 2 ).
• beneficial thermal properties can be achieved, including a high glass transition temperature (Tg) (i.e., a Tg greaterthan 190°C), a small coefficient of thermal expansion (CTE) (i.e., a CTE less than or equal to 22 ppm/K), a very low crack temperature index (SCT) (i.e., an SCT value less than -200°C), a good flowability (i.e., a modest viscosity of less than 10 Pas at 60°C), no toxic label and an avoidance of nanoparticles, which are complex in production.
• Tg glass transition temperature
• CTE coefficient of thermal expansion
• SCT very low crack temperature index
• good flowability i.e., a modest viscosity of less than 10 Pas at 60°C
• no toxic label i.e., a modest viscosity of less than 10 Pas at 60°C
• a “toxic label” is defined as a toxic rating (GHS 06) according to EU directive 1272/2008/EU.
• viscosity of the resin system of the present disclosure could be kept at a moderate level (thus improving the processability) when the block-copolymer is in the hardener part as compared to instances when the blockcopolymer is in the resin part instead of the hardener part.
• “Viscosity at a moderate level” is understood as 4 Pas to 10 Pas, in another embodiment as 6 Pas to 8 Pas or no more than 7 Pas, in each case at 60°C.
• the resin system of the present disclosure thus offers a combination of advantageous, conflicting features, which usually cannot be maximized simultaneously (but only at the expense of the other feature/ parameter).
• the presently disclosed resin system is able to achieve good toughness despite having a high Tg; moderate elongation despite having a high Tg; good flowability despite having a high filler load and low CTE; low CTE despite high strength and toughness; and no toxic label for the hardener part, even if with a high filler load.
• the organic blocks in the block-copolymer are polyester blocks, for example based on caprolactone or other lactones, or polycarbonate blocks.
• suitable block-copolymers include polycaprolactone-polysiloxane block copolymer, polylactic acid-polysiloxane block copolymer and polypropylene carbonatepolysiloxane block copolymer.
• the polysiloxane blocks are for example polydimethylsiloxane blocks or polymethylethylsiloxane blocks.
• the block-copolymer is a polycaprolactone-polysiloxane block copolymer such as Genioperl® W35 (Wacker Chemie AG, Kunststoff, Germany).
• the resin part (a) and hardener part (b) of the two-part resin system are present in a stoichiometric ratio ⁇ 15 mol% of the resin part to the hardener part.
• the “stoichiometric ratio ⁇ 15 mol%” is understood as a molar amount between 1.15 equivalents of hardener per resin and 0.85 equivalents of hardener per resin.
• Each mole of anhydride groups is understood as one equivalent of anhydride hardener and each mole of epoxy groups is understood as one equivalent of epoxy resin.
• ⁇ 14 mol% or ⁇ 12 mol%, or ⁇ 10 mol%, or ⁇ 8 mol%, or ⁇ 6 mol% as used herein.
• the “stoichiometric ratio ⁇ 14 mol%” is understood as a molar amount between 1.14 equivalents of hardener per resin and 0.86 equivalents of hardener per resin.
• the ratio of resin (a) to hardener (b) is a stoichiometric ratio ⁇ 14 mol%, or ⁇ 12 mol%, or ⁇ 10 mol%, or ⁇ 8 mol%, or ⁇ 6 mol%.
• resin (a) and hardener (b) are used in a 1 :1 ratio or 6 mol% excess of resin (a) or 8 mol% excess of resin (a) or 12 mol% excess of resin (a).
• the cycloaliphatic epoxy resin may, for example, be selected from the group consisting of bis(epoxycyclohexyl)-methylcarboxylate, bis(2,3-epoxycyclopentyl)ether, 1 ,2- bis(2,3-epoxycyclopentyl)ethane, vinylcyclohexene dioxide, 3,4-epoxycyclohexylmethyl-3',4'- epoxycyclohexane carboxylate, 3,4-epoxy-6-methylcyclohexylmethyl-3',4'-epoxy-6'- ethylcyclohexane carboxylate, bis(3,4-epoxycyclohexylmethyl)adipate, bis(3,4-epoxy-6- methylcyclohexylmethyl)adipate, dicyclopentadiene dioxide, dipentene dioxide, 1 , 2,5,6- diepoxycyclooctane, 1 ,2,7,8-diepoxyoc
• the cycloaliphatic epoxy resin is a non-glycidyl epoxy resin.
• the cycloaliphatic epoxy resin is 3,4- epoxycyclohexylmethyl-3’,4’-epoxycyclohexancarboxylate.
• the alicyclic anhydride is an unsaturated compound.
• the alicyclic anhydride comprises 9 to 10 carbons.
• the alicyclic anhydride may, for example, be selected from the group consisting of methyltetrahydrophthalic anhydride (MTHPA), himic anhydride, methyl-5-norbornene-2,3- dicarboxylic anhydride (MNA), hexahydro-methylphthalic anhydride, tetrahydrophthalic anhydride, methylphthalic anhydride, naphthalic anhydride, dodecenylsuccinic anhydride and derivatives of succinic anhydride.
• MTHPA methyltetrahydrophthalic anhydride
• MNA methyl-5-norbornene-2,3- dicarboxylic anhydride
• the alicyclic anhydride is methyltetrahydrophthalic anhydride (MTHPA), himic anhydride or methyl-5-norbornene-2,3-dicarboxylic anhydride (MNA).
• MTHPA methyltetrahydrophthalic anhydride
• MNA methyl-5-norbornene-2,3-dicarboxylic anhydride
• the curable system is free of an amine hardener, in particular free of a primary amine or secondary amine, a mercaptan hardener and/or a latent curing agent.
• the inorganic filler is present in the resin part and/or the hardener part such that the curable two-part resin system comprises 65 wt% to 73 wt% of the inorganic filler based on the total weight of the two-part curable system.
• the curable two-part system comprises 66 wt% to 72 wt%, in particular 67 wt% to 71 wt%, of the inorganic filler.
• the curable two-part system comprises greater than 61 wt%, or greater than 63 wt%, or greater than 65 wt%, or greater than 67 wt% of the inorganic filler.
• the content of amorphous inorganic material in the curable two-part resin system is greater than 24 wt%, in particular greater than 35 wt%.
• the curable system comprises 25 wt% to 35 wt%, in particular 28 wt% to 33 wt%, of the amorphous inorganic material.
• the crystalline inorganic material is present in the resin part and/or the hardener part in amount such that the two-part curable system comprises greater than 24 wt%, in particular greater than 29 wt% of the crystalline inorganic material based on the total weight of the two-part curable system.
• the curable two-part system comprises 30 wt% to 50 wt%, in particular 33 wt% to 40 wt%, of the crystalline inorganic material.
• the amorphous inorganic material and the crystalline inorganic material are present in the inorganic filler at a weight ratio between 3:7 and 7:3, in particular between 5:7 and 7:7 of the amorphous inorganic material to crystalline inorganic material.
• the crystalline inorganic material is a silicate or an inosilicate.
• the crystalline inorganic material is an inosilicate with a periodicity of 3.
• the crystalline inorganic material is Wollastonite (Ca 3 Si 3 O9).
• the amorphous inorganic material is natural or synthetic amorphous silica.
• the amorphous inorganic material is synthetic amorphous silica.
• the amorphous inorganic material is fused silica.
• the amorphous inorganic material has an average particle size from 3 pm to 100 pm. In another embodiment, the amorphous inorganic material has an average particle between 7 pm and 50 pm or between 10 pm and 30 pm or between 15 pm and 25 pm.
• the crystalline inorganic material has an average particle size from 1 pm to 70 pm. In another embodiment, the crystalline inorganic material has an average particle is between 2 pm and 50 pm or between 3 pm and 30 pm or between 5 pm and 20 pm.
• the block-copolymer with polysiloxane blocks and organic blocks is present in an amount between 1 to 5 wt%, in particular 3 to 5 wt%, based on the total weight of the curable two-part resin system.
• the curable two-part system further comprises a coreshell type toughener, in particular in an amount between 1 and 5 wt%, most preferably in an amount between 3 and 5 wt% based on the total weight of the curable two-part system.
• a coreshell type toughener in particular in an amount between 1 and 5 wt%, most preferably in an amount between 3 and 5 wt% based on the total weight of the curable two-part system.
• 70 wt% or more, in particular 95 wt% or more, of the core-shell type toughener is comprised in the resin part based on the total weight of the curable two-part system. Adding the core-shell type toughener to the resin part advantageously allows a reduced viscosity of the hardener part and allows thus improved mixing of the resin part and the hardener part.
• the core-shell type toughener has a silicone core and/or a poly(methyl methacrylate) shell.
• the cured system comprises one or more additional components in a total amount of less than 20 wt% based on the total weight of the curable two-part system.
• the additional component or the additional components may, for example, be selected from the group consisting of an anti-settling agent, a coupling agent, a wetting agent, a color agent, an accelerator, a polyol and/or another anhydride other than MTHPA or MNA.
• the anhydride other than MTHPA or MNA is comprised in the hardener.
• the present disclosure is also directed to a cured article obtainable by curing the curable system according to the disclosure above.
• the resin part and the hardener part are each homogenized (e. g. stirred) before combining and curing to yield the cured article.
• the present disclosure is directed to the use of the cured article as disclosed above for electrical applications, in particular for encapsulation of inverters, stators and/or rotors of electrical motors, in particular electrical motors without a permanent magnet. Examples
• ARALDITE® HY 918-1 methyltetrahydrophthalic anhydride (MTHPA), supplier: Huntsman International LLC, The Woodlands, TX.
• Aerosil 202 hydrophobic fumed silica, supplier: Evonik Industries AG, Essen, Germany.
• Byk W 9010 rheologic additive (wetting agent), supplier: Byk Additives and Instruments, Wesel, Germany.
• Antischaum SH silicone-based defoaming agent, supplier: Wacker Chemie AG, Kunststoff, Germany.
• Wollastonite 1 Calcium metasilicate (CaSiO 3 ) with the following specification: particle size D50 of 9-16 microns ( ⁇ 45 microns 84 ⁇ 5 wt.%, ⁇ 4 microns 26 - 36 wt.%, ⁇ 2 microns ⁇ 28 wt.%); bulk density 0.88 - 0.97 g/cm3; brightness, Ry >85%; L/D ratio: 3:1 ; supplier: Nordkalk Oy Ab, Pargas, Finland.
• CaSiO 3 Calcium metasilicate
• Genioperl® W35 Block-copolymer with silicone and organic blocks (based on caprolactone), supplier: Wacker Chemie AG, Kunststoff, Germany.
• Genioperl® P52 Core-Shell particles with silicone-cores and PMMA-shell, supplier: Wacker Chemie AG, Kunststoff, Germany.
• ARALDITE® CY 179-1 (also sold under the name Celloxide 2021 P): 3,4- epoxycyclohexylmethyl-3’,4’-epoxycyclohexanecarboxylate, supplied by Huntsman Advanced Materials (Switzerland) GmbH, Basel, Switzerland
• ARADUR® HY 906 anhydride curing agent mixture of 1-methyl-5-norbornene-2,3-dicarboxylic anhydride and 5-norbornene-2,3-dicarboxylic anhydride, supplied by Huntsman International LLC, The Woodlands, TX.
• Accelerator DY 070 1 -methylimidazole, supplied by Huntsman International LLC, The Woodlands, TX.
• INITIATOR 1 N-benzyl quinolinium hexafluoro antimonate, supplied by Huntsman International LLC, The Woodlands, TX.
• CO-INITIATOR 1 1 ,1 ,2,2-tetraphenyl-1 ,2-ethanediol, supplied by Natland International Corporation, Morrisville, NC.
• NANOPOX® E 601 60 % by weight of 3,4-epoxy cyclohexyl)-methyl-3,4- epoxycyclohexanecarboxylate and 40 % by weight of surface-modified silica nanoparticles, supplied by Evonik Industries AG, Essen, Germany.
• AEROSIL® R 972 fumed silica after-treated with DDS (dimethyldichlorosilane), supplied by Evonik Industries AG, Essen, Germany.
• BYK W 940 anti-settling additive, supplied by Byk Additives and Instruments, Wesel, Germany.
• BYK W 995 wetting and dispersing agent, phosphate-containing polyester, supplied by Byk Additives and Instruments, Wesel, Germany.
• BYK 070 defoaming agent based on silicones and polymers, supplied by Byk Additives and Instruments, Wesel, Germany.
• BAYFERROX® 225 iron oxide pigment, supplied by Lanxess AG, Cologne, Germany.
• TREMIN® 283-600 wollastonite, surface-treated with an epoxy silane, average particle size D50: 21 pm, supplied by Quarzwerke Group, Frechen, Germany.
• SILAN A-187 y-glycidyloxypropyltrimethoxysilane, supplied by Momentive
• Ba 3579-3 Pre-mixture of 82 pbw of ARADUR® HY 918-1 and 0.5 pbw of Accelerator DY 070.
• KIC critical stress intensity factor
• GIC specific break energy
• CTE coefficient of linear thermal expansion
• Tg glass transition temperature
• SOT Crack index (simulated crack temperature) is calculated based on Tg, GIC, CTE and elongation at break according to the description given in published PCT application, WO 2000/055254.
• Masterbatch A 90 g of ARALDITE® CY 179-1 and 10 g of Co-initiator 1 were mixed at 90°C for 30 min. The resulting clear solution was cooled to room temperature.
• Masterbatch B 90 g of ARALDITE® CY 179-1 and 10 g of Initiator 1 were mixed at 60°C for 30 min. The resulting clear solution was cooled to room temperature.
• inventive component A i.e., the resin part
• the inventive component A was prepared as following:
• the mixture was stirred (700 rpm) at 50°C at 10 mbar for 40 min. Then 4 g BYK W-9010 were added to the mixture. The mixture was stirred again for 30 min at 700 rpm at 10 mbar. Finally, the mixture (component A) was cooled down to 40°C and discharged into a container.
• inventive component B i.e., the hardener part
• Aerosil R-202 was added to the mixture and stirred in at 700 rpm for 10 min at 55-60°C. Then the speed was increased to 800 rpm for another 10 min. Finally, the mixture was cooled to 40-45°C and discharged into a container.
• inventive component A was the same as the one used for inventive example 1 .
• inventive component B was prepared as following:
• the comparative component A (i.e., the resin part) was prepared as following: In a 2L ESCO mixer with exterior heating and speed disc for stirring, 503.4 g Celloxide 2021 P was added. This was heated up to 80°C and then 100 g Genioperl W35 was added this was stirred for 1 hour until the W35 was completely dissolved in the resin. After cooling the mass to 60°C, 4 g RPS 1312-1 , 2.2 g Antischaum SH, 20 g Silan A-187 were added to the vessel. All components were stirred for 20 min at 700 rpm under a vacuum of 10 mbar.
• the comparative component B (i.e., the hardener part) is prepared as following:
• Table 2 Comparison of the performance of the SoA with the performance of the inventive systems.
• “Application stability” means no viscosity increase during 1 week mixing at 60°C, no impact on Tg.
• SoA1 is an example for a system with a relatively low CTE and a high Tg based on homopolymerisation of an epoxy resin. This concept is lacking meeting requirements 1 , 2, 5, 6 of the conflicting features. Furthermore, the system of SoA1 shows a lower Tg than the Inventive example 1.
• SoA2 contains nano-Si0 2 but it contains neither wollastonite, nor core-shell nor block- compoymer-type components. Most of the mechanical parameters are significantly worse than the Inventive example 1.
• SoA3 is another known example of a high-Tg system. While this contains wollastonite, it does not contain fused silica, nor core-shell nor block-copolymer-type components. The system is mechanically poor and does not meet criteria 3,4,5, or 7 of the conflicting features.
• SoA4 is an example of combining wollastonite and fused silica.
• the system shows a poor performance because it is not based on the inventive selection of resin components, has the wrong ratio of fused silica and wollastonite and does not contain coreshell or block-copolymer-type components.
• SoA5 is a published example of a system containing a block-copolymer component but lacks wollastonite or fused silica. The system is far away from meeting the overall profile, in particular because of the low Tg.
• SoA6 contains a block-copolymer component like SoA5, but again lacks wollastonite or fused silica.
• the system’s performance is worse than the inventive system in numerous aspects.
• Comparative example 7 demonstrates that a potential use of a polysilicone- polycaprolactone-block-copolymer component in the resin part of the formulation is not viable. While the performance meets the target, the problem is the stability of the resin part during the application process: Such resin tends to increase the viscosity during being mixed over one week at 60°C and is hence not applicable.
• Inventive example 2 is just another example in line with the inventive side conditions and shows that also with other types of anhydrides the target property profile can be met if the inventive requirements are met.

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• 2021
  • 2021-12-20 CN CN202180086618.2A patent/CN116685617A/zh active Pending
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