EP4263116A1 - Dispositif de traitement d'un matériau - Google Patents

Dispositif de traitement d'un matériau

Info

Publication number
EP4263116A1
EP4263116A1 EP21831010.0A EP21831010A EP4263116A1 EP 4263116 A1 EP4263116 A1 EP 4263116A1 EP 21831010 A EP21831010 A EP 21831010A EP 4263116 A1 EP4263116 A1 EP 4263116A1
Authority
EP
European Patent Office
Prior art keywords
rotation
optics
processing
laser
laser beam
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP21831010.0A
Other languages
German (de)
English (en)
Inventor
Daniel Grossmann
Malte Kumkar
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Trumpf Laser Se
Original Assignee
Trumpf Laser GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Trumpf Laser GmbH filed Critical Trumpf Laser GmbH
Publication of EP4263116A1 publication Critical patent/EP4263116A1/fr
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1ns or less
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0652—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising prisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
    • G02B26/0816—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
    • G02B26/10—Scanning systems
    • G02B26/12—Scanning systems using multifaceted mirrors

Definitions

  • the present invention relates to a device for processing and in particular for microstructuring a material using ultrashort laser pulses of an ultrashort pulse laser, in particular for use with processing optics with a high numerical aperture.
  • Microstructuring processes using ultrashort laser pulses of an ultrashort pulse laser and using processing optics with a large numerical aperture are usually severely limited in terms of throughput and process speed.
  • systems such as polygon scanners cannot, or only in exceptional cases, be used in applications with optics with a large numerical aperture for large-area processing and, in particular, microstructuring of a material.
  • Rotatable, optical scanning devices are known from EP 2 359 193 B1, which make it possible to carry out microstructuring processes over a large area.
  • a device for processing a material by means of ultra-short laser pulses of a laser beam from an ultra-short-pulse laser is proposed, preferably for introducing microstructures into the material, comprising a coupling system that is stationary with respect to an axis of rotation and has coupling optics for coupling in the laser beam, a coupling system that is rotatably connected about the axis of rotation Rotation system with rotation optics, and processing optics connected to the rotation system and rotatable together with it for imaging the laser beam in or on the material to be processed, wherein the coupling optics are designed in such a way that a laser beam coupled into them is guided into a corresponding processing plane, and wherein the rotation optics and the processing optics are designed in such a way that they image the corresponding processing plane in the processing plane of the material to be processed.
  • the ultra-short pulse laser provides ultra-short laser pulses.
  • ultra-short can mean that the pulse length is, for example, between 500 picoseconds and 10 femtoseconds, in particular between 20 picoseconds and 50 femtoseconds.
  • the ultrashort pulse laser can also provide bursts of ultrashort laser pulses, each burst comprising the emission of multiple laser pulses.
  • the time interval between the laser pulses can be between 100 nanoseconds and 10 microseconds.
  • a time-shaped pulse that exhibits a significant change in amplitude within a range between 50 femtoseconds and 5 picoseconds is also considered to be an ultrashort laser pulse.
  • the term pulse or laser pulse is used repeatedly in the following text.
  • laser pulse trains comprising a plurality of laser pulses with a repetition frequency between 100 MHz and 50 GHz, and temporally shaped laser pulses are also included, even if this is not explicitly stated in each case.
  • the ultra-short laser pulses emitted by the ultra-short-pulse laser accordingly form a laser beam.
  • the ultra-short pulse laser is preferably designed as a stationary system. Since the rotating optics, unlike the laser, can be moved, the in-coupling system with the in-coupling optics takes on the task of introducing the laser beam from the stationary laser into the rotating optics.
  • the coupling system is kept stationary with respect to the axis of rotation, which can mean in particular that the coupling system does not rotate with the rotation system.
  • the stationary in-coupling system includes in-coupling optics, which can include an arrangement of one or more lenses and/or mirrors, and takes on the task of imaging the laser beam provided by the ultra-short pulse laser in an optical intermediate plane on the image side, the so-called corresponding processing plane.
  • the in-coupling optics can also include beam-shaping or beam-deflecting elements, with the influencing of the beam caused by these elements being imaged by the in-coupling optics in the corresponding processing plane.
  • the rotation system is connected to the coupling system.
  • the rotation system and the coupling system are rotatably connected to one another. Since the in-coupling system is held stationary, the rotation system can move at least in sections around an axis of rotation defined by the in-coupling system.
  • the beam propagation direction can coincide with the axis of rotation.
  • the axis of rotation can also be offset parallel to the direction of beam propagation, or tilted against the direction of beam propagation, with the focussing possibly having to be adjusted depending on the angle of rotation.
  • Rotatable can mean that the rotation system can be rotated through at least 360° or any multiple thereof. However, this does not preclude pivoting around a certain limited angular range around the coupling system; in particular, the rotation system can also oscillate through angles smaller than 360° and thus only perform a back and forth pivoting movement.
  • a rotatable connection allows the rotation system to be pivoted or rotated about the axis of rotation and at the same time ensures that the rotation system is securely held and guided during rotation.
  • the rotatable connection can be realized, for example, by a ball bearing. This reduces the friction between the rotation system and the coupling system.
  • other preferably low-friction connections are also possible.
  • the rotation system has rotation optics.
  • the rotating optics can have a large number of lenses or mirrors.
  • the rotating optics essentially transfer the intermediate plane on the image side, ie the corresponding processing plane, to the intermediate plane of the processing optics on the object side.
  • the rotation optics can act here as an extension of the beam path and transfer the corresponding processing plane together with the processing optics in the direction of the workpiece.
  • the rotation optics can include deflection optics, with which the laser beam is deflected from the corresponding processing plane of the coupling optics into the rotation system.
  • the rotating optics can also include a lens or multiple lenses, the object-side focal point of the rotating optics coinciding with the corresponding processing plane of the coupling optics.
  • the rotating optics can also include a decoupling mirror, which deflects the laser beam from the rotating system in the direction of the processing optics.
  • the processing optics are connected to the rotation system.
  • the processing optics and the rotation system are connected to each other.
  • the connection can be a screw, click or plug connection, for example.
  • the processing optics can be an objective or an arrangement of lenses and/or mirrors, with the processing optics imaging the corresponding processing plane of the coupling optics in the processing plane in or on the material via the rotating optics.
  • the system of rotation optics and processing optics maps the corresponding processing plane provided by the coupling optics onto the actual processing plane in the material to be processed.
  • the processing plane is a plane perpendicular to the beam propagation direction, which preferably runs parallel to the surface of the material to be processed and in which the processing of the material is to take place.
  • the processing level always refers to the processing optics.
  • the optical elements in the beam path lead to slight curvatures and distortions in the processing plane, so that the processing plane is usually at least locally curved.
  • the focus of the laser beam through the processing optics also has a finite volume in which the microstructures can be introduced into the material.
  • the focus region also extends in the beam propagation direction, so that a processing volume actually results instead of a processing plane.
  • the processing plane can also be intentionally curved, for example to enable three-dimensional processing of the material, or to enable processing on a curved surface.
  • the processing plane is therefore to be understood overall as the volume of space in which microstructures can be introduced into the material through the realizable imaging of the laser beam.
  • the alignment of this volume relative to the direction of propagation of the laser beams is a good approximation due to the alignment of the given mathematical processing level.
  • the processing level is therefore always mentioned, although the accessible processing volume is always taken into account, even if it is not explicitly mentioned.
  • the term "focus” can be understood generally as a targeted increase in intensity, with the laser energy converging into a "focus area".
  • the term “focus” is therefore used in the following regardless of the beam shape actually used and the methods for bringing about an intensity increase.
  • the location of the increase in intensity along the direction of beam propagation can also be influenced by "focusing".
  • the increase in intensity can be more or less punctiform and the focal area can have a Gaussian intensity cross-section, as is provided by a Gaussian laser beam.
  • the increase in intensity can also be in the form of a line, with a Bessel-shaped focus area being produced around the focus position, as can be provided by a non-diffracting beam.
  • the focus position of which extends in three dimensions such as a multi-spot profile of Gaussian laser beams and/or non-Gaussian intensity distributions.
  • the strength of the material processing depends, among other things, on the position of the focus of the processing optics.
  • the focus here includes the volume in space in which the energy of the laser is converged by the processing optics and in which the laser energy density is high enough to introduce microstructures into the material.
  • the laser beam can be imaged onto or into the material. This can mean that the focus of the laser beam through the processing optics is above the surface of the material, or exactly on the surface of the material, or in the volume of the material.
  • the laser beam is at least partially absorbed by the material, so that the material is thermally heated, for example, or goes into a temporary plasma state and evaporates, or a material modification is introduced that changes the local bond structure or density and is thereby processed.
  • material processing can consist, for example, in microstructuring of the material. Microstructuring can mean that one-, two- or three-dimensional structures or patterns or material modifications are to be introduced into the material, with the size of the structures typically being at least one dimension in the micrometer range, or the resolution of the structures in the Order of magnitude of the wavelength of the laser light used.
  • a Bessel-like jet may have a longitudinal extent in the millimeter range.
  • the rotation system rotates around the coupling optics. This rotation takes place at an angular velocity around the axis of rotation defined by the in-coupling optics.
  • the laser beam can be positioned and/or shaped in the corresponding processing plane. In this way, a micro-positioning of the beam focus can be achieved, both in the plane lying through the surface of the material to be processed and with regard to the focus position in the direction of the beam.
  • the beam influencing system Before the launch system can mean that the beam is influenced before it is introduced into the launch system.
  • the beam influencing system can thus be connected upstream of the coupling system.
  • the coupling system can mean that the beam influencing system influences the laser beam after the laser beam has been coupled into the coupling system.
  • the beam influencing system Before and in the coupling system can mean that the beam influencing system has several stages and the laser beam is influenced for the first time, for example, before the coupling system and is influenced again in the coupling system. However, each stage can be viewed as an independent beam control system. However, it can also be the case that the beam influencing system acts as a unit before and in the coupling system.
  • the beam influencing system can also influence the shape of the incident laser beam. For example, it can affect the beam profile of the laser beam. For example, a flat-top beam profile can be generated from a Gaussian beam profile. However, a lateral beam profile, ie the intensity distribution of the laser beam in the plane perpendicular to the beam propagation, can also be elliptical, triangular, linear or otherwise shaped. However, the beam influencing system can also change the propagation direction of the laser beam by deflecting the incident laser beam. In particular, the beam influencing system can also shift the incident laser beam parallel to its original direction of propagation in the processing plane of the processing optics, ie impose a spatial parallel offset on the laser beam there.
  • the rotation optics and the processing optics within the technical specifications, such as the focal lengths and magnifications, if available, as well as other imaging properties, such as the maximum deflection by the beam influencing system, with the processing optics in the processing plane a working field can be realized in which the laser beam can be freely positioned.
  • the working field in the processing plane can, for example, have an extent of 2 to 500 of a beam diameter of the laser beam that can be achieved in this processing plane.
  • the beam influencing system can be used to shift the beam position in the corresponding processing plane and thus, after imaging onto the material to be processed, also shift the position of the focused beam on the material to be processed. Accordingly, in addition to the movement of the rotating optics and thus the movement of the processing optics over the material, a further positioning can be impressed on the laser beam processing the material. In this way, further positions in the material can be controlled accordingly, so that other points on the material can also be controlled independently of the geometric position predetermined by the rotational movement of the rotation system and a feed between the material and the device.
  • the beam influencing system can also shape the laser beam in such a way that the further spatial configuration of the intensity distribution of the laser beam is adapted.
  • This shaping can include, for example, that partial beams are generated from the incoming laser beam by the beam influencing system and a distance between them can be set.
  • the laser beam can preferably be split into at least two partial laser beams, so that the number of laser beams that can be used for material processing is multiplied accordingly.
  • a shape of the laser beam that includes several partial laser beams is also called multi-spot geometry.
  • the partial laser beams are preferably introduced into the material synchronously or at the same time. This enables additional optimization of heat accumulation during material processing.
  • the time interval between successive pulses can be maximized in order to minimize the heat input of the laser into the material.
  • an increased effect can be achieved with a single pulse
  • the partial laser beams can in particular be introduced into the material next to one another and/or at different insertion depths. This means in particular that the partial laser beams are not superimposed. In the case of more than two partial laser beams, this can mean that all partial laser beams lie on one line, in particular on a straight line. However, it can also mean that the arrangement of the partial laser beams requires two dimensions.
  • the partial laser beams can be arranged as desired in a circular or rectangular or chessboard pattern.
  • the partial laser beams can also lie on top of one another and overlap with one another, and the partial laser beams can be introduced into the material at different insertion depths.
  • the partial laser beams can also be arranged arbitrarily in three dimensions. In particular, a three-dimensional positioning of the partial laser beams can also take place.
  • the beam influencing system can also enable the focus to be shifted for each partial laser beam.
  • the beam influencing system can also be a pure beam shaping system or a multiplexing system for generating partial laser beams.
  • the beam influencing system could also generate non-diffracting beam profiles, such as Bessel beams or Gauss-Bessel beams and/or other beams, for example laterally shaped laser beams, ie laser beams shaped perpendicularly to the propagation direction.
  • the intensity profiles can be designed, for example, via a diffractive optical element or an axicon.
  • a processing geometry describes the entirety of the beam properties in the working area.
  • a processing geometry can include a grid of 5 ⁇ 5 partial laser beams, all of which have the same beam profile or different beam profiles.
  • a processing geometry can be given by the arrangement of the partial laser beams in a so-called multi-spot profile.
  • a machining geometry also includes the properties for example the position, the intensity and the beam profile of the individual partial laser beams or laser beams.
  • Each partial laser beam can also be referred to as an element of the processing geometry.
  • a star-shaped beam profile is one processing geometry.
  • a round and a star-shaped beam profile in the working field are also processing geometry.
  • Both the round and the star-shaped laser beam are elements of the processing geometry. If the position of at least one of the two elements is changed, the machining geometry as a whole is also changed. If the beam profile of an element is changed, the processing geometry is also changed.
  • a machining geometry is generally also given by a single laser beam in the working area.
  • the beam influencing system can include a beam shaping element and/or a beam positioning element, which is arranged in the area of the corresponding processing plane.
  • the laser can preferably be operated in its basic mode and/or the laser beam can be a coherent superimposition of several modes of the laser, with the diffraction index M 2 being less than 1.5.
  • the mode of the laser is defined by the resonator of the laser, with the basic mode of the laser typically being referred to as TEM00 and TEM standing for transverse electrical mode.
  • the basic mode corresponds to the Gaussian beam shape, whereby superimposition of this basic mode with higher modes from the spectrum of the resonator can lead to a deviation of the beam shape of the laser beam from the Gaussian beam shape.
  • the deviation i.e. the diffraction factor, is measured as the quotient of the divergence angle of the actual laser beam to an ideal Gaussian laser beam, with the divergence angle being given by the opening angle of the envelope of the laser beams with the same beam waist.
  • the normal of the working plane can be inclined by less than 10° to the axis of rotation. However, it is preferably not inclined relative to the axis of rotation, in particular it is then aligned parallel to the axis of rotation. This means that the processing plane can be moved over the material in a circular ring.
  • the normal of the working plane can be aligned perpendicular to the axis of rotation.
  • the processing plane sweeps over the lateral surface, in particular the inner lateral surface of a cylinder.
  • the device is therefore suitable for processing cylindrically symmetrical surfaces.
  • the beam influencing system can enable a redistribution of the intensity distribution in the corresponding processing plane in such a way that a higher intensity is achieved in partial areas within the processing plane than would be possible without the beam influencing system.
  • the beam influencing system can include a beam shaping element and/or a beam positioning element and/or a focus-shifting element which is not arranged in the corresponding processing plane.
  • This arrangement means that the energy of the incident laser beam can be redistributed in the corresponding processing plane and thus the lateral extent of the laser beam impinging on the beam influencing system becomes significantly smaller, for example smaller by a factor of at least 5, the energy is retained and the intensity becomes larger, for example at least by a factor of 5.
  • the beam influencing system can also bring about a coherent superimposition of individual laser beams, in particular partial laser beams.
  • the beam influencing system can preferably comprise an acousto-optical deflector unit, with an acousto-optical deflector unit consisting of one or more acousto-optical deflectors.
  • an acoustic wave for example in the form of a Wave packet, a propagating wave or a standing wave that periodically modulates the refractive index of the optical material.
  • a diffraction grating for an incident laser beam is realized here by the periodic modulation of the refractive index.
  • An incident laser beam is diffracted at the diffraction grating and thereby at least partially deflected at an angle to its original beam propagation direction.
  • the grating constant of the diffraction grating and thus the deflection angle depends, among other things, on the wavelength of the grating oscillation and thus on the frequency or frequencies of the applied AC voltage.
  • a combination of two acousto-optical deflectors in the deflector unit can be used, for example, to deflect the laser beam in the x and y directions.
  • the beam influencing system generates a Bessel or Bessel-like beam, so that it actually or virtually runs through the corresponding processing plane.
  • the beam influencing system Since the beam influencing system is arranged in front of and/or in the coupling system, it is not rotated. It thus generates images of the affected laser beam in its focal point on the image side that are stationary, that is to say fixed to the axis of rotation, while neglecting imaging errors.
  • the focal point of the beam influencing system on the image side can, in particular, coincide with the corresponding processing plane, so that the laser beam is positioned and/or shaped in the corresponding processing plane. As a result, the affected laser beam is then imaged in the processing plane in or on the material in a corresponding manner.
  • the beam influencing system does not rotate, but the image of the beam influencing system in the rotating optics is deflected by a mirror optics and this also rotates, an image of the non-rotated corresponding processing plane appears offset in or on the material.
  • the working field is guided in a circular path over the material by this process, in the coordinate system of the non-rotated coupling system, with the working fields being able to spatially overlap at two different times.
  • Overlapping can be compensated for by quickly controlling the acousto-optical deflector unit by adapting the beam shape produced with the beam influencing system according to the angular velocity of the rotation system and according to the current angular orientation.
  • this allows the various elements of a machining geometry, such as e.g. partial laser beams, can be rearranged in the working area by rapid activation, so that the microstructures are not unintentionally introduced into the material more than once.
  • the beam influencing system is preferably designed in such a way that the laser beam is positioned and/or shaped with pulse precision in the corresponding processing plane, and focus positioning or beam shaping with pulse precision is preferably achieved in the processing plane of the material to be processed.
  • the processing optics preferably includes a high-NA lens, preferably with a numerical aperture greater than 0.1, particularly preferably with a numerical aperture greater than 0.2, or a Schwarzschild lens, which preferably has a focusing device, particularly preferably a piezo shifter, in the Focus position is adjustable.
  • the numerical aperture NA describes the ability of an optical element to focus light.
  • the numerical aperture results from the opening angle of the marginal rays of the lens and the refractive index of the material between the lens and the focal point.
  • a maximum numerical aperture is reached when the opening angle is 90° between the marginal ray and the optical axis.
  • the maximum resolution or the minimum structure size that can be imaged through the lens is then directly proportional to the wavelength of the laser light divided by the numerical aperture.
  • a high NA lens is a lens which has a large numerical aperture, i.e. a large opening angle.
  • the numerical aperture is preferably greater than 0.1, particularly preferably greater than 0.2.
  • a Schwarzschild lens is an optical component which, in contrast to the classic lens, is not based on the diffraction and refraction of radiation by an optical element, such as a lens.
  • the imaging property is achieved by a mirror construction, namely the combination of a convex and a concave mirror reached.
  • the numerical aperture is achieved through the curvature of the concave mirror, similar to a reflecting telescope.
  • the advantage of the Schwarzschild lens is, on the one hand, that a large working distance between the lens and the material can be achieved with a high numerical aperture and also with a moderate input beam diameter.
  • reflective components are used so that the light does not have to pass through a lens in order to be modified in its direction of propagation.
  • a Schwarzschild lens is therefore particularly suitable for use with increased laser power, for example in the production of microchips in, for example, lithographic or microlithographic methods.
  • a focusing device of the lens can be attached, for example, between the rotation system and the processing optics.
  • the focusing device is preferably arranged in a non-rotating part.
  • the path between the processing optics and the material surface can be changed via a focusing device. This allows a sharp image of the corresponding processing level to be generated.
  • a focusing device can be a piezo shifter, for example.
  • a piezo shifter is a piezo electronic component that changes its geometric dimensions when an electrical voltage is applied. For example, a thickness can be varied by applying a voltage to the piezo shifter. If the thickness of the piezo shifter is part of the path between the lens and the material surface, then the position of the focus point on or in the material can be determined via the piezo shifter.
  • a focusing device can also be a TAG lens, a piezo-deformable mirror or an acousto-optical deflector.
  • the focusing device therefore makes it possible to ensure a sharp image of the laser beam in the desired processing plane.
  • the device with the beam influencing system and the high-NA processing optics enables micro-processing processes, which are necessary for small structure sizes and/or high resolution, to be scaled to flat material processing using high processing speeds.
  • the rotation system can be designed flat, preferably as a cylinder, or arm-shaped.
  • a two-dimensional rotation system can be a disk, for example, with the diameter of the disk perpendicular to the axis of rotation being greater than the thickness of the disk along the axis of rotation.
  • the diameter may be 10 or 100 times larger than the thickness.
  • the axis of rotation can pass through one of the points of symmetry of the disk, in particular through a point at which the shape of the disk is characterized by rotational symmetry.
  • the disk can have a slight unbalance and have a uniform mass distribution in the radial direction.
  • air resistance can be reduced by a disc-shaped configuration and impairing turbulence can be reduced, provided that work is not carried out with a correspondingly large negative pressure.
  • the disc can be a cylinder whose thickness is significantly smaller than the diameter, with the axis of rotation passing through the center of the disc.
  • the processing optics can be attached to or on the flat rotation system, so that the processing optics protrude from the surface of the rotation system.
  • the processing optics can also be integrated into the rotation system.
  • An arm-shaped rotation system can be given by an arm, where the length of the arm is greater than the sides of its cross-section.
  • the axis of rotation can pass through the midpoint of the longitudinal axis of the arm, thereby reducing a corresponding imbalance.
  • the axis of rotation can also run through another point on the longitudinal axis, in particular through an end point of the longitudinal axis.
  • the rotating optics can be integrated into the disk or into the arm and, in particular, run in a corresponding cavity in the disk or into the arm. However, it can also be the case that the rotating optics are fixed on or below or on the disk or the arm. In any case, the imbalance caused by the rotation optics and processing optics can be reduced by appropriate balancing weights on the disk or the arm.
  • the rotating optics can contain imaging mirror and/or lens optics. However, the rotating optics can also include beam-shaping elements such as a diffractive optical element or an axicon.
  • Imaging mirror optics are mirrors whose surface has a curvature. Images can be generated by such a curvature, or the image scale can be changed, for example enlarged or reduced. The same applies to lens optics.
  • the rotational optics contain an imaging mirror and/or lens optics
  • the corresponding processing plane can be imaged in the processing plane in a reduced or enlarged manner. In particular, this makes it possible to change the structure size of the microstructures.
  • the rotation optics can include a telescope, preferably a relay telescope, which, together with the processing optics, images the corresponding processing plane of the coupling system, preferably reduced, into the processing plane on or in the workpiece.
  • a telescope is an arrangement of mirrors and/or lenses that have an imaging or focusing property.
  • an imaging property is given by an enlargement or a reduction in size of the corresponding processing plane.
  • a relay telescope is in particular an arrangement of imaging elements which are used to lengthen the optical path of imaging optics, for example the coupling optics, or to invert the image.
  • the telescope maps the corresponding processing plane onto or into the workpiece in a reduced or enlarged manner.
  • the focussing is done by a lens with a high numerical aperture, which can be adjusted in the focus position, for example, by means of a piezo shifter.
  • the laser beam or the coupling system with a rotation system and the material can be moved relative to one another with a feed.
  • a feed device can be designed, for example, as an XY or XYZ table or as a roll-to-roll system. This makes it possible to shift the laser beam and the material relative to one another, with the relative shift also being able to relate to the static part of the device, ie the coupling system of the device, instead of to the laser beam. In this case, a superimposed movement of rotation and feed then takes place.
  • a relative shift means that the feed or offset is brought about by a feed device that moves either the material or the device, in particular the coupling system, in one of the spatial directions. In particular, the feed is associated with a feed rate, the feed moving along a feed trajectory. If the coupling system is moved with the feed device, the laser beam can be fed to the coupling optics either via a fiber, for example a hollow core fiber, or via a free beam path, for example with the aid of a gantry axis system.
  • a feed device makes it possible to add further translational degrees of freedom to the device, so that a larger area of the material can be processed with the laser beam by connecting it to the rotation device.
  • the material of a roll-to-roll process can be routed through the processing level.
  • the material In a roll-to-roll process, the material is clamped between two rolls and transported by rotating the rolls, or shifted along a transport direction.
  • the material can be processed quickly with the device according to the invention.
  • the material can be at least locally cylindrical, the axis of rotation can coincide with the axis of the cylinder, the processing plane can thereby be adapted to a cylinder surface and the feed can be oriented parallel to the axis of rotation.
  • At least locally cylindrical means that the material only has to be cylindrical in sections, in particular only having to have one radius of curvature.
  • a film wound up on a roll is unwound for processing and wound up again after processing.
  • the film can be adapted to a cylinder surface in sections, ie over a limited length, for processing, the cylinder axis then largely coinciding with the axis of rotation, preferably coinciding exactly with the axis of rotation.
  • a control system for synchronizing the control of the beam influencing system, the rotation system and the ultra-short pulse laser can preferably be provided, with the beam influencing system shifting the processing geometry in the corresponding processing plane in such a way that, if the working fields overlap for two consecutive laser pulses, the structures introduced in or on the material only complement each other and there are no unwanted multiple exposures.
  • Synchronization means that the controller, the beam influencing system, the rotation system and the ultrashort pulse laser and optionally the feed device have a common time base.
  • the control device is connected to the pulsed laser system and to the beam influencing system and the rotation system and optionally to the feed device.
  • the various systems can be controlled via the controller in such a way that the laser beams can be introduced into the material in the desired manner.
  • the common time base can be used to compensate for delays in the actuation etc., for example.
  • a corresponding control device is typically based on an FPGA (Field Programmable Gate Array) with fast-connected memories, with processing parameters such as focus position, pulse energy or mode (single pulse or laser burst) being able to be stored for a specific processing operation.
  • FPGA Field Programmable Gate Array
  • control commands or their execution are synchronized in all connected devices with, for example, the seed frequency of the laser, the seed frequency being the basic pulse frequency of the laser, so that there is a common time base for all components.
  • the exact location, the position of the laser focus on the workpiece and the pulse energy can be set and changed by correspondingly fast control of the pulsed laser, beam influencing system, rotation system and feed device.
  • the seed frequency then serves to control the beam influencing system, for example to control the acousto-optical deflector unit with exact timing and thus to determine the position of the laser focus.
  • the size and direction of the modulation are still given by the control system. For example, by a predetermined or controllable angular velocity of the rotation device in connection with the common time base, the exact alignment of the
  • the feed device can move the coupling system with the rotation system relative to the material parallel to the axis of rotation.
  • the inner lateral surface of a cylinder can be swept over.
  • the radius of the rotation system may be adjustable, with the rotation optics being arranged to compensate for the adjustment of the radius in the rotation system.
  • the radius of the rotation system is given by the radius of the circular movement of the rotation axis to the center of the processing optics.
  • An adjustable radius of the rotation system can mean that the distance between the processing optics and the rotation axis can be adjusted.
  • the processing optics can be placed closer to the axis of rotation or further away from it.
  • the available material can be optimally utilized.
  • the processing optics can also be moved during processing, resulting in a larger working field for the processing optics.
  • processing can then take place on the various circular rings or circular segments. Machining is then no longer limited to a given radius, but machining can take place on the surface that is limited by the maximum radius of the rotation system.
  • the optical path between the corresponding processing plane and the processing plane must also be adjusted. This can be done with rotating optics, the telescope being designed in such a way that no additional magnification is achieved by displacement and further properties such as the focus position are retained.
  • the radius of the However, the rotation system does not vary dynamically during the machining process, although dynamic change is also possible.
  • the rotation system can preferably have at least two rotation optics, each of which is connected to its own processing optics, and the beam influencing system is preferably set up to generate at least two processing geometries, which are each introduced into one of the rotation optics of the rotation system via deflection optics.
  • the beam influencing system can generate several processing geometries in parallel or in alternation.
  • the beam influencing system can form two partial laser beams, one partial laser beam having a star-shaped beam profile and the other partial laser beam having a rectangular beam profile, both partial beams being offset parallel to one another by several micrometers, for example 100 ⁇ m.
  • a deflection optics can be a game system, which directs one or more partial beams in the direction of a specific processing optics.
  • the partial beams are therefore directed by the deflection optics in particular onto specific beam paths.
  • the deflection optics are part of the rotation system and are therefore in particular also rotated.
  • the device can have a plurality of processing optics, with each processing optic being able to be reached by a specific beam path of the rotating optics.
  • each processing optic has, for example, N arms, N being a natural number.
  • Each processing optics has its own processing plane, with the corresponding processing plane being generated by the coupling optics.
  • the beam influencing system provides a large number of different or identical processing geometries in the corresponding processing plane. In particular, only repositioned machining geometries are included here. However, all processing optics can also access the same corresponding processing level.
  • the deflection optics can be switchable and the processing geometries can be deflected to specific beam paths.
  • the deflection optics can be integrated into the beam influencing optics or supported by them.
  • a specific processing geometry can be guided to a specific trajectory by the deflection optics. This can be made possible in particular by synchronizing the rotation system, the beam influencing system and the ultra-short pulse laser.
  • the deflection optics can be switchable, for example implemented by a flip mirror system, as a result of which a laser beam can be directed either onto a first trajectory or onto a second trajectory.
  • a selection of the available trajectories is possible through switchable deflection optics, so that the laser beam can be directed to a specific trajectory.
  • a deflection optics can also consist, for example, in that the acousto-optical deflector unit makes the machining geometry available or not makes it available at a specific point in the corresponding machining plane.
  • the beam influencing system can image a processing geometry in a scanner, preferably a 1D or 2D galvanic scanner; the scanner can move the laser beam and image it in the corresponding processing plane.
  • a galvanic scanner is a deflection device for the laser beam, with a parallel offset of the transmitted laser beam being generated in relation to the original laser beam.
  • a one-dimensional galvano scanner deflects the laser beam in only one direction, while a two-dimensional galvano scanner deflects the laser beam in two different directions, which are preferably orthogonal to one another.
  • the scanner can also be understood as part of the beam influencing system, as it influences the position of the laser beam.
  • the scanner can thus be arranged in front of and/or in the beam influencing system.
  • the laser beam can be deflected by a first acousto-optical deflector unit and then a further position offset can be imposed.
  • the laser beam can only through a Acousto-optical deflectors unit are deflected, then by a
  • Beam shaping device are directed and then directed into a scanner.
  • FIG. 1 shows a schematic structure of the device
  • Figure 2 is a detailed view of the construction of the device
  • FIG. 1 A, B different versions of the rotation system
  • Figure 4 shows the processing field of the rotation system in connection with a
  • FIG. 5 shows the processing field of the rotation system in connection with the
  • FIG. 6 A, B, C, D, E, F shows a detailed view of a possible machining strategy
  • FIG. 7A, B shows a schematic representation of a Schwarzschild lens and imaging elements in a rotary optics
  • FIG. 8 shows a schematic representation of the device with two different ones
  • Figure 9 A, B is a schematic representation of a deflection optics for a variety of
  • FIG. 10 A, B shows a schematic representation of the device with scanner optics
  • FIG. 11A, B shows a schematic representation of the device for processing cylindrical materials in sections
  • FIG. 12 shows a schematic representation of the device with axicon.
  • FIG. 1 the structure of a device 1 for processing a material 6 is shown schematically.
  • An ultra-short pulse laser 7 provides ultra-short laser pulses that form the laser beam 70 .
  • the ultra-short laser pulses or the laser beam 70 are coupled into the coupling system 2 .
  • the laser pulses pass through the coupling system 2 and are forwarded to a rotation system 3 .
  • the coupling system 2 and the rotation system 3 are rotatably connected to one another.
  • the coupling system 2 is kept stationary with respect to the axis of rotation 34 while the rotation system 3 rotates about the axis of rotation 34 of the rotation system 3 .
  • the axis of rotation 34 is defined by the in-coupling system 2 , in particular its in-coupling optics 20 and in particular the optical axis of the in-coupling optics 20 .
  • the ultra-short laser pulses are forwarded to processing optics 4 and are guided by them to the material 6 and introduced there on the surface and/or into the volume.
  • the ultra-short laser pulses are at least partially absorbed by the material 6, as a result of which the material 6 can be processed on the basis of linear or non-linear absorption processes.
  • Material processing can consist, for example, in microstructuring and/or modification of the material 6 .
  • the material 6 is connected to a feed device 5 in particular via a material receptacle, as a result of which the material 6 can be displaced relative to the laser beam 70, in particular relative to the coupling optics 2.
  • the material can also be positioned in a fixed manner, with the feed device 5 moving the coupling system 2 with the rotation system 3 over the material 6 (not shown). In any case, the rotation system 3 rotates about the rotation axis 34 during the feed movement.
  • the rotation of the rotating optics 3 makes it possible to process the material 6 over a large area using a processing optics 4 which, for example, has a high numerical aperture.
  • the processing optics 4 are guided by the rotation of the rotary optics 3 on a circle or, with a superimposed feed, on a spiral path relative to the material. Accordingly, the working field covers a circular ring into which the laser light can be introduced. Due to the simultaneous displacement with the feed device 5 is thus possible to add further circular segments or spiral segments to the initial circular rings in order to ensure a flat processing of the material 6 .
  • the ultra-short pulse laser 7, the coupling system 2, the rotation system 3, and the feed device 5 can be synchronized with one another via a control system 8.
  • the seed frequency of the ultrashort pulse laser 7 or another high-frequency signal can serve as a common time base for the synchronization. Since a common time base is available throughout the system, precise control over the introduction of the laser pulses into the material 6 is possible.
  • FIG. 2 shows a detailed view of the schematic structure of the device 1 including the beam path.
  • the coupling system 2 includes a coupling optics 20.
  • the coupling optics 20 includes a beam influencing system 22, which deflects or modifies the incident laser beam 70 of the ultrashort pulse laser 7.
  • the beam influencing system 22 can also be arranged even further in front and outside of the in-coupling system 2 .
  • the beam influencing system 22 can in particular be an acousto-optical deflector unit.
  • This unit enables the position of each pulse or burst within a small working field to be released with pinpoint accuracy and a deflection rate of up to several megahertz (random access scan).
  • the working field is between 2 and 500 beam diameters, for example, so that a relatively small change in position can be carried out, but at a very high speed.
  • the change in position of each pulse can be observed in the corresponding processing plane 42 .
  • a variant that should be particularly emphasized is the shifting of the focus position on the material 6 that is accurate to the individual pulse, also in the direction of beam propagation, through appropriate pre-shaping of the laser beam by the beam influencing system 22.
  • the laser beams 70 modified by the beam influencing system 22 are finally guided into the corresponding processing plane 42 .
  • the rotation system 3 into which the laser beam is deflected via deflection optics 32 , is connected to the coupling system 2 .
  • the coupling system 2 and the rotation system 3 are connected to one another via a rotatable connection 24 in such a way that the rotation system 3 can rotate relative to the coupling system 2 and at the same time the laser beam can reliably pass through.
  • the rotation system 3 rotates around the axis of rotation 34.
  • the axis of rotation 34 and the beam propagation direction do not necessarily run parallel to each other. In particular, the beam propagation direction can deviate from the axis of rotation 34 when the beam deflection has taken place.
  • the rotation system 3 includes rotation optics 30 , which includes the deflection optics 32 , a telescope 36 and a coupling-out mirror 38 .
  • the processing optics 4 adjoin the rotation system 3 at a distance R, starting from the rotation axis 34 .
  • the laser beam is deflected by the rotation system 3 via the outcoupling mirror 38 into the processing optics 4 .
  • a telescopic image or a 4f image can also be formed by the processing optics 4 in combination with the components arranged in the rotary arm 3 .
  • the processing optics 4 are connected to the rotation system 3 via an optional piezo shifter 44 .
  • the piezo shifter 44 makes it possible to focus the laser beam 70 with the processing optics 4 in the processing plane 40 .
  • the telescope 36 in connection with the processing optics 4 enables the corresponding processing plane 42 of the beam influencing system 22 to be imaged in the processing plane 40 in or on the material 6 .
  • FIG. 3A shows a cylindrical configuration of the rotation system 3, which is shown in FIG. 2 schematically with regard to the beam path, in a top view or from a bird's eye view.
  • the rotation system 3 is in the form of a flat cylinder in which the optical elements of the rotation system 3 are arranged.
  • the laser beam 70 is introduced into the rotation system 3 via the coupling system 2 .
  • the laser beam 70 is deflected by the deflection optics 32 into the plane of the rotating disk, the XY plane.
  • the laser beam 70 is guided through the rotation optics 30 and finally introduced into the material 6 through the processing optics 4 .
  • the cylinder of the rotation system 3 has a significantly larger diameter than height, so that the cylinder can also be referred to as a disk.
  • the rotation optics 30 and the processing optics 4 can be attached to or in the disk, or can be partially or fully integrated into it. Any imbalance in the disk caused by the processing optics and optical components of the rotation optics 30 can be compensated for by suitable balancing weights.
  • FIG. 3B shows an arm-shaped configuration of the rotation system 3 from a bird's-eye view.
  • the arm-shaped rotation system 3 can be rotated at one end of the arm with the Coupling system 2 connected.
  • the mass of the arm-shaped rotation system 3 is typically significantly lower than that of the cylindrical rotation system, but the imbalance in the arm-shaped rotation system 3 can be significantly greater. This can be remedied by the rotation axis 34 running through the center of gravity of the arm-shaped rotation system 3 and/or the arm-shaped rotation system 3 being designed symmetrically with respect to the rotation axis 34 and having, for example, two processing optics 4 opposite one another.
  • the entire rotation system rotates over the material 6 to be processed or the workpiece arranged underneath, which leads to a high path speed at the location of the processing optics 4 and thus to a high processing speed or a high throughput. Thanks to the fast deflection system, two consecutive pulses can also be deposited in the same position at a high repetition rate, despite the high path speed, as long as the displacement occurs as a result of the rotation within the working field.
  • FIG. 4 shows the processing field 400, which can be reached by means of the device 1 for processing the material without further relative displacement between the device 1 and the material 6.
  • the processing field 400 can be understood here as the temporal overlap of the working fields 706.
  • the working field 706 is arranged in particular in the processing plane 40 of the processing optics 4.
  • a processing field 400 can be traversed, which corresponds to a circular ring.
  • the processing field 400 not only corresponds to a simple circle with the radius R (as would be achieved with a fixed processing optics 4), but to an extended circular ring, assuming a round processing plane 40, which differs from a square Fields of work 706 is largely filled out.
  • the respective position of the pulse introduced into the material 6 can be influenced by means of the beam influencing system 22 within the scope of the deflection made possible by the beam influencing system 22 within the corresponding working field 706 .
  • the beam influencing system 22 thus enables the position of each pulse within a small working field 706 defined (random access scan).
  • the working field is between 2 and 500 focus diameters, for example, so that a relatively small change in the position change can be carried out, but at a very high speed. It is thus possible to enter the respective pulses or also pulse trains or bursts into the material 6 at the positions indicated schematically by the working field 706 during a rotation of the rotation system 3 about the rotation axis 34 . Since the beam influencing unit 22 is very fast, the focus in the material 6 can be precisely positioned during the rotation of the rotation system 3 accordingly. On the one hand, this enables very precise positioning of the respective foci in the material 6 and, on the other hand, the feed rate of a relative movement between the device 1 and the material 6 can be increased while the resolution remains the same.
  • the beam influencing system 22 can also move to positions that could not be approached with a continuous feed between the device 1 and the material 6 due to the constant movement of the device 1 and thus the processing optics 4 in the feed direction without the beam influencing system 22 .
  • the beam influencing system 22 can, as it were, also control points which would already be “behind” the circle geometrically predetermined by the processing optics 4 in the feed direction.
  • ultra-short laser pulses can be flexibly introduced into the material 6 at the positions swept by the circular ring by the beam influencing system 22 during the rotation of the rotation system 3 .
  • the beam influencing system 22 can also or alternatively be used to shape the laser beam in such a way that the focus position in the processing plane 40 can also be varied.
  • the variation of the focus position in the processing plane 40 can also be understood as shaping.
  • not only rapid positioning in the x/y plane can be achieved by means of the beam influencing system 22, but also rapid positioning in the z direction, so that the use of the upstream beam influencing system 22 enables a particularly flexible and precise use of the Device 1 can be achieved.
  • the laser beam 70 can also or alternatively be influenced by the beam influencing system 22 in such a way that its shape is changed.
  • the laser beam 70 can be split into two partial laser beams 702, 704, with which the material 6 can then be processed at the same time.
  • the two partial laser beams have a linear beam profile, with both beam profiles being aligned parallel to one another and one above the other.
  • a so-called multi-spot intensity distribution can also or alternatively be generated by the beam influencing system 22, with a large number of partial laser beams being generated.
  • This structure corresponds, for example, to a simultaneous occupancy of all positions in the working field 706 shown schematically.
  • the generated partial laser beams can also be changed individually in their shape, that is to say in their beam cross section.
  • a first partial laser beam can have a rectangular beam cross section and another partial laser beam can have a round beam cross section.
  • Both the multi-spot intensity distribution and the line-shaped beam profiles are each processing geometries 700 that are introduced into the material.
  • FIG. 5 shows an example of a processing strategy for processing material 6 with device 1 .
  • the coupling system 2, in particular the beam influencing system 22, the rotation system 3 and the ultrashort pulse laser 7, the current deflection by the beam influencing system 22 can also be adjusted depending on the current position of the processing optics 4 in the circular segment.
  • the image is not rotated as a result of the adjustment with the beam influencing system 22, so that the processing geometry only appears offset or shifted in the processing plane.
  • Microstructuring is thus flexible and possible without being tied to the rotating coordinate system, but rather in the stationary coordinate system of the material 6 .
  • the material 6 and the laser beam 70 can be displaced relative to one another during processing.
  • flat microstructures can be produced by a combination of several axis movements, namely by rapid rotation about the axis of rotation 34 and translation along the XYZ axis with the deflection of the laser beam 70 by the beam influencing optics 22 that is accurate to the individual pulse.
  • the radius R of the rotational movement can be adjusted by adapting or supplementing another relay telescope while maintaining the specified numerical aperture, the focusing and the beam influencing system 22, particularly preferably formed by an acousto-optical deflector unit be increased, whereby the resolution in the processing plane and the ring thickness of the annulus typically remain the same.
  • FIG. 6 shows a further detailed view of processing strategies.
  • laser beams 70 are first introduced into the material along the circular ring, as a result of which the material 6 is microstructured, for example (indicated schematically by black triangles). Each of the symbols can in turn be a multi-spot geometry. Meanwhile, the device 1 and the material 6 are shifted relative to one another by means of a shifting device.
  • FIG. 6B the circular ring and thus the area that can be covered by the laser beam 70 has been displaced by the feed V along the x-axis. Due to the rapid activation of the beam influencing system 22 and the common time base of the ultrashort pulse laser 7 with the rest of the system, laser pulses can now be introduced at the points in the circular ring at which no laser pulse has yet been introduced by the previous processing in FIG. 6A. Thus, the processing of the material 6 is successively supplemented during the passage with the feed (shown schematically as black circles).
  • FIG. 6C the circular ring has again been displaced along the x-axis as a result of the feed. Again, the previous processing steps (grey symbols) are supplemented by the laser pulses (schematically represented by black squares).
  • FIG. 6D the circular ring is once again displaced by the feed, the last gaps in the previous processing field being processed (black triangles).
  • the final state of the processing is shown in FIG. 6E.
  • the feed by the feed device 7 and the rotation of the rotation system 3 in combination with the rapid positioning within the circular ring by the beam influencing system 22 allowed the material 6 to be processed over the entire surface, with continuous feed and thus efficient processing being provided.
  • the machined surface is independent of the selected circles and annuli, since the machined surfaces are expanded and supplemented during the feed.
  • FIG. 6F shows the trajectory of the processing optics 4 that occurs over the material 6 during the feed with the feed device 7 .
  • a spiral shape is created by the superimposed rotation about the axis of rotation 34 with the feed. Along the spiral shape can material modification or microstructures can be introduced into the material 6 within the available working field of the processing optics 4 .
  • FIG. 7A shows a further embodiment of the rotation system 3.
  • a rotation optics which contains an imaging mirror 32, is installed in the rotation system 3.
  • FIG. The imaging or curved mirror 32 is a special configuration of the deflection optics 32. This imaging of the beam in conjunction with the subsequent processing optics 4 can be used to enlarge or reduce the processing geometry, which is generated by the beam influencing system 22 in the corresponding processing plane 42.
  • the position of the corresponding processing plane 42 must be adjusted, for example by a relay telescope 30, so that a targeted image is achieved on the workpiece.
  • FIG. 7B A special configuration of the processing optics 4 is shown in FIG. 7B.
  • the processing optics 4 are designed here in the form of a Schwarzschild lens.
  • a Schwarzschild lens consists of a combination of convex and concave mirrors. Ideally, the mirror systems are rotationally symmetrical.
  • the laser light falls through an opening of the concave mirror, effectively through the back of the concave mirror, onto a convex mirror.
  • the convex mirror reflects the light back to the concave mirror, where it is reflected again and directed past the convex mirror to a focal point. The reflection takes place at the focal point of the Schwarzschild lens, with the image being given by the curvature properties of the different mirror surfaces.
  • the Schwarzschild lens is a so-called mirror lens and allows the corresponding processing plane 42 to be imaged onto or into the material 6 without the light having to penetrate through an optical element. This prevents the laser beam 70 from being absorbed in one of the built-in optical materials and is accordingly particularly suitable for certain wavelengths of the laser.
  • a Schwarzschild lens has a field curvature. If you want to achieve a flat processing plane with a Schwarzschild lens, the field curvature must be pre-compensated. This can be done, for example, in the rotating optics or the beam influencing optics, in that a suitable optical construction is used there to provide, for example, a more curved corresponding processing plane.
  • FIG. 2 A further variant of the device 1 is shown in FIG. In contrast to the structure from FIG. 2, the rotation system 3 does not only have a single beam path for the laser beam 70 . Rather, a large number of possible beam paths are realized by a deflection optics, which includes a plurality of mirrors 32, 32'.
  • the beam influencing system 22 makes available, for example, two different partial laser beams or arrangements of partial laser beams. This can also happen through a possible beam splitting within the beam influencing system 22 .
  • a first arrangement of partial laser beams can fall on the mirror 32, whereas another arrangement of partial laser beams falls on the mirror 32'. Both arrangements are thus directed onto different beam paths by the deflection optics 32, so that the different processing geometries are introduced into the material 6 via different processing optics 4, 4'.
  • the deflection optics 32 can be realized in a switchable manner. This means, for example, that only one specific processing geometry is introduced into the material 6 by a specific beam path of the rotation system 3 .
  • a switchable implementation can also mean that a beam path can be switched on or off in the rotation system 3 so that a certain machining geometry can only be introduced with a certain angular orientation of the rotation system 3 .
  • the laser beam 70 can be split into a plurality of partial laser beams by controlling the beam influencing system 22, preferably by controlling the acousto-optical deflector unit 22, with the acousto-optical deflector unit 22 being able to direct the respective partial beam onto one of the possible deflection optics 32.
  • a first half of the beam can be directed to the left-hand mirror 32 and then a second half of the beam to the right-hand mirror 32'.
  • the corresponding processing level is thus divided into an area that is mapped to the left arm and an area that is mapped to the right arm.
  • the size of the parts of the corresponding processing plane that are accessible to the individual arms can be achieved by varying the acousto-optical deflector unit 22, for example by superimposing a movement of a galvano scanner with the deflection of the acousto-optical deflector unit. This allows you to quickly switch back and forth between the arms and a radial offset entrained by the rotation can be compensated for by jumping from one arm to the other.
  • the laser beam is not split into partial laser beams, but that a processing geometry is impressed on the laser beam 70 by the beam influencing system 22 and this geometry is directed either to the mirror 32 or to the mirror 32'. Even if the rotation system 3 moves at a high angular speed, the beam influencing system 22 in the form of an acousto-optical deflector unit can ensure that the laser beam 70 is directed into the desired beam path via the deflection optics 32 .
  • the embodiment shown in FIG. 8 can also result in the processing geometry provided by a beam influencing system 22 being merely duplicated by the deflection optics, so that the processing geometry is introduced into the material 6 essentially simultaneously via two different beam paths.
  • the deflection optics 32 can have a prism shape, with the prism surfaces being mirrored, for example.
  • the prism can have a multiplicity of mirrored surfaces, the number of the various surfaces preferably corresponding to the number of possible beam paths of the rotation system 3 .
  • FIG. 9B Another form of the rotation system 3 is shown in FIG. 9B.
  • the rotation system 3 has a rotation optics 30 which has five beam paths. Each of the five beam paths ends in its own processing optics 4 through which the processing geometry of the laser beam 70 can be imaged in or on the material 6 .
  • the deflection optics 32 have a pentagonal outline, with the mirrored surfaces of the deflection optics 32 resulting from the facets of the five-sided, pyramidal shape of the deflection optics 32 .
  • An acousto-optical deflector unit 22 can switch the laser beam 70 back and forth between the various processing arms or beam paths of the rotation system 3 and thus address one of the processing optics 4 in each case.
  • multiple beam paths can be addressed simultaneously and not just sequentially, for example by rapidly switching multi-spots. This means that material processing can take place simultaneously through a plurality of processing optics 4 .
  • An expanded variant of the device 1 is shown in FIG.
  • the acousto-optical deflector unit 28 deflects the incident laser beam 70 and is transferred to the galvano scanner by the imaging unit 27 , with the galvano scanner 26 impressing an additional position offset on the laser beam 70 in the corresponding processing plane 42 .
  • the accessible working field with the processing optics 4 is enlarged.
  • a two-dimensional displacement of the image of the high-speed scan field of the acousto-optical deflector unit 28 on the material 6 can be effected as a result.
  • FIG. 10B shows a top view of the circular ring that can be addressed by the processing optics 4 of FIG. 10A in the non-rotated coordinate system of the coupling system.
  • the galvanic scanner 26 makes it possible to further enlarge the accessible circular ring.
  • a device 1 is shown in side view and top view, which can be used for processing foils 6.
  • the foils 6 can, for example, be wound onto a roll in a roll-to-roll process, unwound for processing and then wound up again into a roll after processing.
  • the foils 6 can be drawn into a hollow-cylindrical shape, in particular for processing, with the axis of rotation largely coinciding with the cylinder axis, preferably coinciding exactly.
  • the feed V can be oriented along the cylinder axis, so that processing of the entire film 6 is made possible by a one-dimensional movement of the device 1 along the cylinder axis with simultaneous roll-to-roll transport of the film.
  • a deflection of the laser beam 70 from the transition from the rotating optics 3 to the processing optics 4 can be dispensed with, so that the processing operation can be carried out with an optically and mechanically more stable device 1 .
  • FIG. 12 shows a device 1 in which the beam influencing system 2 is an axicon. If the laser beam 70 passes through the axicon, a non-diffracting beam profile is imposed on the laser beam 70 . In particular, in the present case, the laser beam 70 is not deflected from the rotating optics 3 to the processing optics 4, so that the device 1 shown is suitable for processing materials 6 that are at least partially cylindrical. But it is also possible to use an axicon in a different configuration of the device 1, for example that of Figures 1 to 10.

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Laser Beam Processing (AREA)

Abstract

La présente invention concerne un dispositif (1) destiné au traitement d'un matériau (6) au moyen d'impulsions laser ultracourtes d'un faisceau laser (70) d'un laser à impulsions ultracourtes (7), comprenant un système d'injection fixe (2) doté d'une unité optique d'injection (20), un système de rotation (3) qui est relié rotatif au système d'injection (2) autour d'un axe de rotation (34) et qui comprend une unité optique de rotation (30), et une unité optique de traitement (4), qui est reliée au système de rotation (3) et peut tourner conjointement avec ce dernier pour guider le faisceau laser (70) dans le matériau (6) à traiter, l'unité optique d'injection (20) étant conçue de sorte qu'un faisceau laser (70) injecté dans ladite unité optique est guidé dans un plan de traitement correspondant (42), et l'unité optique de rotation (30) et l'unité optique de traitement (4) étant conçues de sorte qu'elles forment une image du plan de traitement correspondant (42) dans le plan de traitement (40) du matériau (6) à traiter, un système influant sur le faisceau (22) étant disposé devant et/ou dans le système d'injection (2) de sorte qu'un positionnement et/ou une mise en forme du faisceau laser (70) est réalisé(e) dans le plan de traitement correspondant (42).
EP21831010.0A 2020-12-21 2021-12-07 Dispositif de traitement d'un matériau Pending EP4263116A1 (fr)

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DE102020134367.1A DE102020134367A1 (de) 2020-12-21 2020-12-21 Vorrichtung zum Bearbeiten eines Materials
PCT/EP2021/084561 WO2022135908A1 (fr) 2020-12-21 2021-12-07 Dispositif de traitement d'un matériau

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EP4263116A1 true EP4263116A1 (fr) 2023-10-25

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EP (1) EP4263116A1 (fr)
KR (1) KR20230117224A (fr)
CN (1) CN116710226A (fr)
DE (1) DE102020134367A1 (fr)
WO (1) WO2022135908A1 (fr)

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DE102022121436A1 (de) 2022-08-24 2024-02-29 Schepers Gmbh & Co. Kg Verfahren und Vorrichtung zum Strukturieren der Oberfläche eines Zylinders mittels wenigstens eines Laserstrahls
DE102023100969A1 (de) 2023-01-17 2024-07-18 Schott Ag Vorrichtung und Verfahren zur Laserbearbeitung

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JP2727379B2 (ja) * 1990-05-23 1998-03-11 新明和工業株式会社 レーザーロボットの制御方法
DE10055950B4 (de) 2000-11-10 2004-07-29 Schuler Held Lasertechnik Gmbh & Co. Kg Rollformanlage, insbesondere zur Endlosformung von streifenförmigem Material
US20080116182A1 (en) * 2006-11-21 2008-05-22 Palo Alto Research Center Incorporated Multiple Station Scan Displacement Invariant Laser Ablation Apparatus
US20080116183A1 (en) * 2006-11-21 2008-05-22 Palo Alto Research Center Incorporated Light Scanning Mechanism For Scan Displacement Invariant Laser Ablation Apparatus
US8442302B2 (en) 2008-12-05 2013-05-14 Micronic Laser Systems Method and device using rotating printing arm to project or view image across a workpiece
US20110216302A1 (en) 2010-03-05 2011-09-08 Micronic Laser Systems Ab Illumination methods and devices for partially coherent illumination
KR101015214B1 (ko) * 2010-04-06 2011-02-18 주식회사 엘앤피아너스 레이저를 이용한 패턴 형성 장치
WO2012054927A2 (fr) 2010-10-22 2012-04-26 Electro Scientific Industries, Inc. Systèmes et procédés de traitement au laser permettant une juxtaposition et une suppression de faisceaux
US8958052B2 (en) 2010-11-04 2015-02-17 Micronic Ab Multi-method and device with an advanced acousto-optic deflector (AOD) and a dense brush of flying spots
WO2013182562A1 (fr) 2012-06-04 2013-12-12 Micronic Mydata AB Dispositif d'écriture optique pour feuilles flexibles
KR102569941B1 (ko) 2018-09-28 2023-08-23 코닝 인코포레이티드 투명 기판을 수정하기 위한 시스템 및 방법

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WO2022135908A1 (fr) 2022-06-30
CN116710226A (zh) 2023-09-05
US20230330782A1 (en) 2023-10-19
KR20230117224A (ko) 2023-08-07

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