EP4258693B1 - System und verfahren zur erzeugung eines audiosignals - Google Patents

System und verfahren zur erzeugung eines audiosignals

Info

Publication number
EP4258693B1
EP4258693B1 EP23166645.4A EP23166645A EP4258693B1 EP 4258693 B1 EP4258693 B1 EP 4258693B1 EP 23166645 A EP23166645 A EP 23166645A EP 4258693 B1 EP4258693 B1 EP 4258693B1
Authority
EP
European Patent Office
Prior art keywords
acoustic
mems
substrate
speaker unit
liner
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
EP23166645.4A
Other languages
English (en)
French (fr)
Other versions
EP4258693A1 (de
EP4258693C0 (de
Inventor
Mordehai Margalit
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sonicedge Ltd
Original Assignee
Sonicedge Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sonicedge Ltd filed Critical Sonicedge Ltd
Publication of EP4258693A1 publication Critical patent/EP4258693A1/de
Application granted granted Critical
Publication of EP4258693C0 publication Critical patent/EP4258693C0/de
Publication of EP4258693B1 publication Critical patent/EP4258693B1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R17/00—Piezoelectric transducers; Electrostrictive transducers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/005—Electrostatic transducers using semiconductor materials
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/02—Loudspeakers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
    • H04R1/22—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired frequency characteristic only 
    • H04R1/24—Structural combinations of separate transducers or of two parts of the same transducer and responsive respectively to two or more frequency ranges
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2201/00—Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
    • H04R2201/02—Details casings, cabinets or mounting therein for transducers covered by H04R1/02 but not provided for in any of its subgroups
    • H04R2201/028—Structural combinations of loudspeakers with built-in power amplifiers, e.g. in the same acoustic enclosure
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2217/00—Details of magnetostrictive, piezoelectric, or electrostrictive transducers covered by H04R15/00 or H04R17/00 but not provided for in any of their subgroups
    • H04R2217/03—Parametric transducers where sound is generated or captured by the acoustic demodulation of amplitude modulated ultrasonic waves
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R3/00—Circuits for transducers, loudspeakers or microphones
    • H04R3/12—Circuits for transducers, loudspeakers or microphones for distributing signals to two or more loudspeakers

Definitions

  • the present disclosure generally relates to systems and methods for generating an audio signal.
  • the system and methods of generating an audio signal are applied in a mobile, wearable, or portable device.
  • the system and methods of generating an audio signal are applied in earphones, headsets, hearables, or hearing aids.
  • US 8861752 describes a picospeaker which is a novel sound generating device and a method for sound generation.
  • the picospeaker creates an audio signal by generating an ultrasound acoustic beam which is then actively modulated.
  • the resulting modulated ultrasound signal has a lower acoustic frequency sideband which corresponds to the frequency difference between the frequency of the ultrasound acoustic beam and the modulation frequency.
  • US 20160360320 and US 20160360321 describe MEMS architectures for realizing the picospeaker.
  • US 20160277838 describes one method of implementation of the picospeaker using MEMS processing.
  • US 2016277845 describes an alternative method of implementation of the picospeaker using MEMS processing.
  • US 2021/067865 A1 describes a speaker device for generating an audio signal in e.g. earphones, which has an ultrasound source coupled to an acoustic medium through a time-varying acoustic coupler.
  • acoustic signal as used in the current disclosure means a mechanical wave traversing either a gas, liquid or solid medium with any frequency or spectrum portion between 10 Hz and 10,000,000 Hz.
  • audio or “audio spectrum” or “audio signal” - as used in the current disclosure means an acoustic signal or portion of an acoustic signal with a frequency or spectrum portion between 10 Hz and 20,000 Hz.
  • blind as used in the current disclosure means a structure with at least one acoustic port through which an acoustic wave traverses with low loss.
  • “shutter” - as used in the current disclosure means a structure configured to move in reference to the blind and increase the acoustic loss of the acoustic port or ports.
  • active demodulation as used in the current disclosure means any of but not limited to frequency shift of an ultrasound acoustic signal by modulation of the acoustic impedance of at least one part of the MEMS speaker.
  • the invention proposes a speaker device according to claim 1 and a method of manufacturing a speaker device according to claim 15.
  • a speaker device in some examples, includes a membrane and a shutter.
  • the membrane is configured to oscillate along a first directional path and at a combination of frequencies with at least one frequency effective to generate an ultrasonic acoustic signal.
  • a shutter and blind are positioned proximate to the membrane.
  • the membrane, the blind, and the shutter may be positioned in a substantially parallel orientation with respect to each other.
  • the membrane, the blind, and the shutter may be positioned in the same plane and the acoustic signal is transmitted along acoustic channels leading from the membrane to the shutter.
  • the modulator and or shutter are composed of more than one section.
  • the membrane is driven by an electric signal that oscillates at a frequency ⁇ and hence moves at b Cos(2 ⁇ * ⁇ t), where b is the amplitude of the membrane movement, and t is time.
  • the electric signal is further modulated by a portion that is derived from an audio signal a(t).
  • Equation (2) describes a modulated audio signal with an upper and lower side band around a carrier frequency of ⁇ (Double Side Band- DSB).
  • ⁇ Double Side Band- DSB
  • active demodulation In one example we use the term "active demodulation" to describe the above functions where a frequency shift of an ultrasound acoustic signal is facilitated by modulation of the acoustic impedance of at least one part of the MEMS speaker.
  • connection of the lid to a substrate has a total leakage that when subjected to 1 Pascal of pressure difference would enable an airflow of any off but not limited to; less than 1 mm 3 /sec; less than 10 mm 3 /sec; less than 100 mm 3 /sec.
  • the MEMS speaker unit (103) is configured as an electro static device with at least three electrical connections or pad or as a pizeo electric device with at least three electrical connections or at least four electrical connections or bond pads.
  • the MEMS speaker unit (103) has at least two acoustic ports on opposing side of the MEMS speaker unit (103).
  • the MEMS speaker unit (103) is assembled on the substrate (105).
  • the ratio of the area of the backside acoustic port to the area of the MEMS speaker device is any of but not limited to at least 1 ⁇ 2 at least 3 ⁇ 4; at least 1 ⁇ 4; at least 0.1; at least 0.2.
  • the acoustic port shape is circular.
  • a backside trace serves as a means to bond or solder the area around an acoustic port (225) and to seal the acoustic port (225) to an underlying substrate or audio device.
  • One or more top side holes (230) can have an area smaller than 1 mm 2 , 2 mm 2 , 3 mm 2 , 6 mm 2 .
  • the top side hole (230) is circular.
  • the thickness of the substrate (103) is any of but not limited to smaller than 0.1 mm, smaller than 0.2 mm, smaller than 0.25 mm, smaller than 0.5 mm.
  • the thickness of the lid (101) is any of but not limited to smaller than 0.1 mm; smaller than 0.2 mm; smaller than 0.3 mm.
  • FIG. 3A is an example of a speaker device with an acoustic filter (301) connected to a front port.
  • acoustic filter (301) and acoustic cavity are used interchangeably.
  • the acoustic signal generated by the speaker device needs to be filtered by one or more acoustic filters.
  • an acoustic filter has one or more resonances at any of but not limited to lower than 300 Hz; lower than 1 KHz; lower than 3 KHz; lower than 6 KHz or combinations of these.
  • the horn is designed using available methods of horn design to optimize the audio spatial and frequency response.
  • a horn can have one adiabatic transition in one dimension and a second adiabatic transition in a second dimension.
  • the horn is designed to efficiently transform a volume velocity source or a pump speaker into a free space pressure source.
  • the connection of the acoustic filter (301) to the front port is facilitated by any of but not limited to mechanical pressure; adhesive; polymer; Silicone; solder or combination of these.
  • FIG. 3B is an example of a speaker device with an acoustic filter (303) connected to the back port and FIG. 3C is an example of a speaker device with acoustic filters (301, 303) connected to both front and back ports.
  • the speaker device is characterized in that the air flow from one port is the opposite of the air flow in the second port.
  • the acoustic signal from one port is 180° in respect to the second port.
  • the acoustic response of one port and corresponding acoustic filter has a resonance lower than the acoustic response of second port and corresponding acoustic filter.
  • an acoustic cavity includes an acoustic port.
  • An acoustic port is designed to optimize the transfer of an acoustic signal from the acoustic device and any of the above-described cavities to an acoustic medium.
  • an acoustic port is a horn with an adiabatic increase in area from a small area corresponding to a speaker device or associated cavity to a larger area corresponding to a suitable low frequency target response.
  • the horn is designed using available methods of horn design to optimize the audio spatial and frequency response.
  • a horn can have one adiabatic transition in one dimension and a second adiabatic transition in a second dimension.
  • the horn is designed to efficiently transform a volume velocity source or a pump speaker into a free space pressure source.
  • the connection of the acoustic filter (301) to the front port is facilitated by any of but not limited to mechanical pressure; adhesive; polymer; Silicone; solder or combination of these.
  • FIG. 4A is an example of a speaker device with a side acoustic port (401) and bottom acoustic port (403).
  • one or more side acoustic ports (401) replace or augment a top port ( FIG. 2C 230).
  • an acoustic side port (401) is defined by cutting, drilling or griding using any of but not limited to laser; mechanical element; water drill.
  • a side acoustic port (401) is defined prior to forming the lid, and the shape of the port is any of but not limited to rectangular; square; ellipsoid; circular; or combinations of these.
  • an acoustic side port introduces challenges in cutting the assembled speaker device due to water seepage.
  • a structure is defined at one or more sides the package.
  • examples of structures include a wire frame; a molded frame; adhesive glue line.
  • a structure includes one or more acoustic ports. The top lid attaches to the structure leaving the side acoustic port (401) connecting between the inside of the speaker device package and the external surroundings outside the speaker device package.
  • FIG. 4B is an example of a speaker device with one or more liner acoustic ports (405) in the top trace (213).
  • a liner acoustic port (405) is configured by a method including; creating a top trace (213); etching a liner acoustic port (405) in the top trace (213).
  • a liner acoustic port (405) is configured by a method including; creating a top trace (213) with recesses for a liner acoustic port (405).
  • the acoustic port is configured when the MEMS speaker unit (103) is attached the top trace (213) creating the top of the liner acoustic port.
  • either bottom side and or top side of MEMS speaker unit (103) is segmented so that geometrically distinct areas of the acoustic ports of the MEMS speaker unit (103) are acoustically connected to different acoustic cavities and acoustic ports.
  • FIG. 5A is an example of a top view of a speaker device without a lid.
  • MEMS speaker unit (103) is attached to top trace (213) which is attached to the substrate (105).
  • Lid trace (501) is created with top trace (213) or independently and provides a marking and attach platform for the lid. Bond pads as depicted in FIG. 2 are not shown to simplify the drawing.
  • FIG. 5B is a further example of top view of a speaker device without a lid which in addition to MEMS speaker unit (103) includes a drive ASIC (503).
  • the drive ASIC (503) application specific integrated circuit) is an electronic device receiving power and control signals to operate the MEMS speaker unit.
  • the drive ASIC (503) includes one or more bond pads for input and out electrical connection.
  • FIG. 6A is an example of a top view of a speaker device with two or more MEMS speaker units assembled on a substrate with a top lid removed.
  • the speaker device is comprised of; two or more MEMS speaker units (603, 605, 607, 609); a substrate (601); an acoustic filter (619).
  • a MEMS speaker unit (603, 605, 607, 609) is assembled on a substrate (601) using either epoxy, solder or eutectic bonding.
  • the substrate (601) includes mechanical support (613, 615, 617, 619).
  • the mechanical support (613, 615, 617, 619) is the same as a top side trace ( FIG.
  • FIG. 6B is an example of a bottom view of a speaker device with two or more MEMS speaker units ( FIG. 6A 603, 605, 607, 609, shown as dashed traces) assembled on a substrate.
  • a speaker device is further comprised of a substrate (601), electric pads (641, 643, 645), acoustic port (621, 623, 625, 627) each individually or collectively acoustically coupled to a MEMS speaker unit ( FIG. 6A 603, 605, 607, 609) and a filter acoustic port (651) which is acoustically coupled to the acoustic filter ( FIG. 6A 619).
  • Bottom side of speaker device further includes one or more backside trace similar to ( FIG. 2B 227).

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)

Claims (15)

  1. Lautsprechervorrichtung, die Folgendes umfasst:
    ein Substrat in Kontakt mit einem ersten akustischen Medium;
    eine auf dem Substrat angeordnete Auskleidung; und
    eine erste MEMS-Lautsprechereinheit, die an der Auskleidung befestigt ist,
    wobei ein zwischen der MEMS-Lautsprechereinheit, der Auskleidung und dem Substrat definiertes Volumen einen Zugang enthält, der eine akustische Kopplung zwischen der MEMS-Lautsprechereinheit und dem ersten akustischen Medium bereitstellt, und sich die Auskleidung mindestens 10 Mikron zu beiden Seiten des Umfangs der MEMS-Lautsprechereinheit erstreckt.
  2. Lautsprechervorrichtung nach Anspruch 1, wobei die Auskleidung eine Mindestdicke von 20 Mikron aufweist.
  3. Lautsprechervorrichtung nach Anspruch 1, wobei die MEMS-Lautsprechereinheit so konfiguriert ist, dass sie Schall aus moduliertem Ultraschall unter Verwendung aktiver Demodulation erzeugt.
  4. Lautsprechervorrichtung nach Anspruch 1, wobei das zwischen der MEMS-Lautsprechereinheit, der Auskleidung und dem Substrat definierte Volumen mindestens 0,05 mm3 beträgt.
  5. Lautsprechervorrichtung nach Anspruch 1, die ferner Folgendes umfasst:
    einen Deckel, der mit dem Substrat verbunden ist, die MEMS-Lautsprechereinheit abdeckt und mit mindestens einem zweiten akustischen Volumen in Kontakt steht,
    wobei der Deckel einen zweiten Anschluss enthält, der eine akustische Kopplung zwischen der MEMS-Lautsprechereinheit und einem zweiten akustischen Medium bereitstellt.
  6. Lautsprechervorrichtung nach Anspruch 5, wobei die Auskleidung eine Mindestdicke von 20 Mikron aufweist.
  7. Lautsprechervorrichtung nach Anspruch 5, wobei die MEMS-Lautsprechereinheit Schall aus moduliertem Ultraschall unter Verwendung aktiver Demodulation erzeugt.
  8. Lautsprechervorrichtung nach Anspruch 5, wobei das zwischen der MEMS-Lautsprechereinheit, der Auskleidung und dem Substrat definierte Volumen mindestens 0,05 mm3 beträgt.
  9. Lautsprechervorrichtung nach Anspruch 5, wobei das durch den Deckel definierte Volumen in mindestens zwei unterschiedliche akustische Volumina unterteilt ist und die Auskleidung einen akustischen Zugang enthält, der mit mindestens einem der beiden unterschiedlichen Volumina gekoppelt ist.
  10. Lautsprechervorrichtung nach Anspruch 1, die ferner Folgendes umfasst:
    mindestens eine zweite MEMS-Lautsprechereinheit, die auf dem Substrat montiert ist; und
    wobei die Auskleidung eine Leiterbahn auf der Oberseite ist, die auf dem Substrat aufgebracht ist und einen Umfang jeder MEMS-Lautsprechereinheit nachzeichnet; und
    einen akustischen Filter auf dem Substrat.
  11. Lautsprechervorrichtung nach Anspruch 10, wobei sich jede Leiterbahn auf der Oberseite mindestens 10 Mikron zu beiden Seiten des Umfangs der assoziierten MEMS-Lautsprechereinheit erstreckt.
  12. Lautsprechervorrichtung nach Anspruch 10, wobei sich jede Leiterbahn auf der Oberseite mindestens 50 Mikron zu beiden Seiten des Umfangs der assoziierten MEMS-Lautsprechereinheit erstreckt.
  13. Lautsprechervorrichtung nach Anspruch 10, wobei sich jede Leiterbahn auf der Oberseite mindestens 100 Mikron zu beiden Seiten des Umfangs der assoziierten MEMS-Lautsprechereinheit erstreckt.
  14. Lautsprechervorrichtung nach Anspruch 10, die ferner Folgendes umfasst:
    einen akustischen Zugang, der individuell akustisch mit einer assoziierten MEMS-Lautsprechereinheit gekoppelt ist, und
    einen akustischen Filterzugang, der akustisch mit dem akustischen Filter gekoppelt ist.
  15. Verfahren zur Herstellung einer Lautsprechervorrichtung, das Folgendes umfasst:
    Bereitstellen eines Substrats mit einem Zugang;
    Anordnen einer Auskleidung auf dem Substrat; und
    Befestigen einer MEMS-Lautsprechereinheit an der Auskleidung, so dass sich die Auskleidung mindestens 10 Mikron zu beiden Seiten des Umfangs der MEMS-Lautsprechereinheit erstreckt, wobei ein zwischen der MEMS-Lautsprechereinheit, der Auskleidung und dem Substrat definiertes Volumen eine akustische Kopplung zwischen der MEMS-Lautsprechereinheit und einem akustischen Medium durch den Zugang bereitstellt.
EP23166645.4A 2022-04-05 2023-04-04 System und verfahren zur erzeugung eines audiosignals Active EP4258693B1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US202263327478P 2022-04-05 2022-04-05

Publications (3)

Publication Number Publication Date
EP4258693A1 EP4258693A1 (de) 2023-10-11
EP4258693C0 EP4258693C0 (de) 2025-10-08
EP4258693B1 true EP4258693B1 (de) 2025-10-08

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ID=85873854

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Application Number Title Priority Date Filing Date
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Country Status (1)

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Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2845204C (en) 2011-08-16 2016-08-09 Empire Technology Development Llc Techniques for generating audio signals
US9913048B2 (en) 2014-02-08 2018-03-06 Empire Technology Development Llc MEMS-based audio speaker system with modulation element
US10284961B2 (en) 2014-02-08 2019-05-07 Empire Technology Development Llc MEMS-based structure for pico speaker
US20160277845A1 (en) 2015-03-17 2016-09-22 Dsp Group Ltd. Mems-based speaker implementation
US20160277838A1 (en) 2015-03-17 2016-09-22 Dsp Group Ltd. Multi-layered mems speaker
WO2016172866A1 (en) * 2015-04-29 2016-11-03 Tgoertek Inc. Piezoelectric speaker and method for forming the same
CN120378809A (zh) * 2019-08-28 2025-07-25 声波边缘有限公司 用于生成音频信号的系统和方法
CN113200509B (zh) * 2021-04-08 2024-10-11 日月光半导体制造股份有限公司 电子元件及半导体封装装置

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EP4258693A1 (de) 2023-10-11
EP4258693C0 (de) 2025-10-08

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