EP4258693A1 - System und verfahren zur erzeugung eines audiosignals - Google Patents

System und verfahren zur erzeugung eines audiosignals Download PDF

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Publication number
EP4258693A1
EP4258693A1 EP23166645.4A EP23166645A EP4258693A1 EP 4258693 A1 EP4258693 A1 EP 4258693A1 EP 23166645 A EP23166645 A EP 23166645A EP 4258693 A1 EP4258693 A1 EP 4258693A1
Authority
EP
European Patent Office
Prior art keywords
acoustic
substrate
mems
speaker unit
liner
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP23166645.4A
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English (en)
French (fr)
Inventor
Mordehai Margalit
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Sonicedge Ltd
Original Assignee
Sonicedge Ltd
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Filing date
Publication date
Application filed by Sonicedge Ltd filed Critical Sonicedge Ltd
Publication of EP4258693A1 publication Critical patent/EP4258693A1/de
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R17/00—Piezoelectric transducers; Electrostrictive transducers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/005—Electrostatic transducers using semiconductor materials
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/02—Loudspeakers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
    • H04R1/22—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired frequency characteristic only 
    • H04R1/24—Structural combinations of separate transducers or of two parts of the same transducer and responsive respectively to two or more frequency ranges
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2201/00—Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
    • H04R2201/02—Details casings, cabinets or mounting therein for transducers covered by H04R1/02 but not provided for in any of its subgroups
    • H04R2201/028—Structural combinations of loudspeakers with built-in power amplifiers, e.g. in the same acoustic enclosure
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2217/00—Details of magnetostrictive, piezoelectric, or electrostrictive transducers covered by H04R15/00 or H04R17/00 but not provided for in any of their subgroups
    • H04R2217/03—Parametric transducers where sound is generated or captured by the acoustic demodulation of amplitude modulated ultrasonic waves
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R3/00—Circuits for transducers, loudspeakers or microphones
    • H04R3/12—Circuits for transducers, loudspeakers or microphones for distributing signals to two or more loudspeakers

Definitions

  • the present disclosure generally relates to systems and methods for generating an audio signal.
  • the system and methods of generating an audio signal are applied in a mobile, wearable, or portable device.
  • the system and methods of generating an audio signal are applied in earphones, headsets, hearables, or hearing aids.
  • US 8861752 describes a picospeaker which is a novel sound generating device and a method for sound generation.
  • the picospeaker creates an audio signal by generating an ultrasound acoustic beam which is then actively modulated.
  • the resulting modulated ultrasound signal has a lower acoustic frequency sideband which corresponds to the frequency difference between the frequency of the ultrasound acoustic beam and the modulation frequency.
  • US 20160360320 and US 20160360321 describe MEMS architectures for realizing the picospeaker.
  • US 20160277838 describes one method of implementation of the picospeaker using MEMS processing.
  • US 2016277845 describes an alternative method of implementation of the picospeaker using MEMS processing.
  • the device needs to be placed in a package and connected electrically, mechanically and acoustically to the audio device.
  • this disclosure we describe examples of packaging the MEMS device using the unique features of the modulated ultrasound picospeaker.
  • acoustic signal as used in the current disclosure means a mechanical wave traversing either a gas, liquid or solid medium with any frequency or spectrum portion between 10 Hz and 10,000,000 Hz.
  • audio or “audio spectrum” or “audio signal” - as used in the current disclosure means an acoustic signal or portion of an acoustic signal with a frequency or spectrum portion between 10 Hz and 20,000 Hz.
  • speaker or “pico speaker” or “micro speaker” or “nano speaker” - as used in the current disclosure means a device configured to generate an acoustic signal with at least a portion of the signal in the audio spectrum.
  • membrane as used in the current disclosure means a flexible structure constrained by at least two points.
  • blind as used in the current disclosure means a structure with at least one acoustic port through which an acoustic wave traverses with low loss.
  • “shutter” - as used in the current disclosure means a structure configured to move in reference to the blind and increase the acoustic loss of the acoustic port or ports.
  • acoustic medium as used in the current disclosure means any of but not limited to; a bounded region in which a material is contained in an enclosed acoustic cavity; an unbounded region where in which a material is characterized by a speed of sound and unbounded in at least one dimension.
  • acoustic medium include but are not limited to; air; water; ear canal; closed volume around ear; air in free space; air in tube or another acoustic channel.
  • active demodulation as used in the current disclosure means any of but not limited to frequency shift of an ultrasound acoustic signal by modulation of the acoustic impedance of at least one part of the MEMS speaker.
  • Some embodiments of the present disclosure may generally relate to a speaker device that includes at least one membrane and shutter.
  • the membrane is positioned in a first plane and configured to oscillate along a first directional path and at a first frequency effective to generate an ultrasonic acoustic signal.
  • the shutter is positioned in a second plane that is substantially separated from the first plane.
  • the shutter is configured to modulate the ultrasonic acoustic signal such that an audio signal is generated.
  • the speaker device is connected to a driver device where the driver device supplies at least two electrical signals to operate the speaker device at least one membrane and shutter respectively.
  • the driver device receives an input audio signal from which it generates a modulated audio signal to operate the membrane and generate an ultrasonic modulated signal.
  • the driver further operates the shutter at the modulation frequency to demodulate the ultrasonic modulated signal and generate an acoustic audio signal.
  • the driving device is a semiconductor integrated circuit which includes; a controller; a charge pump configured to generate a high voltage signal; a switching unit configured to modulate the high voltage signal.
  • the driving device receives a digital sound data stream and an operating voltage and outputs driving signals for the membrane, and shutter.
  • the membrane and shutter operate asynchronously and or independently of each other at one or more frequencies.
  • the membrane and shutter operate synchronously at the same frequency. In the synchronous mode of operation, the amplitude of the audio signal is controlled by any of but not limited to; the relative phase of the membrane and shutter operation; the amplitude of the shutter operation; the amplitude of the membrane operation; any combination of these.
  • the speaker device is attached to a substrate, air flow from the membrane and shutter operation is channeled to acoustic ports, three or more wire bonds connect the speaker device layers to conductive pads on one side of the substrate and to pads on the second side of the substrate, and a lid attached to the top side of the substrate and covering the speaker device and wire bonds provides acoustic functionality and increase the robustness and resilience of the speaker device.
  • a speaker device in some examples, includes a membrane and a shutter.
  • the membrane is configured to oscillate along a first directional path and at a combination of frequencies with at least one frequency effective to generate an ultrasonic acoustic signal.
  • a shutter and blind are positioned proximate to the membrane.
  • the membrane, the blind, and the shutter may be positioned in a substantially parallel orientation with respect to each other.
  • the membrane, the blind, and the shutter may be positioned in the same plane and the acoustic signal is transmitted along acoustic channels leading from the membrane to the shutter.
  • the modulator and or shutter are composed of more than one section.
  • the membrane is driven by an electric signal that oscillates at a frequency ⁇ and hence moves at b Cos(2 ⁇ * ⁇ t), where b is the amplitude of the membrane movement, and t is time.
  • the electric signal is further modulated by a portion that is derived from an audio signal a(t).
  • Equation (2) describes a modulated audio signal with an upper and lower side band around a carrier frequency of ⁇ (Double Side Band- DSB).
  • ⁇ Double Side Band- DSB
  • b/4 * m A(f) is an audio signal.
  • the remaining terms are ultrasound signals where m A(f+2Q) is at twice the modulation frequency and A(f- ⁇ ) + A(f+ ⁇ ) is the original unmodulated signal.
  • Additional acoustic signals may be present due to any but not limited to the following; ultrasound signal from the shutter movement; intermodulation signals due to nonlinearities of the acoustic medium; intermodulation signals due to other sources of nonlinearities including electronic and mechanical.
  • active demodulation In one example we use the term "active demodulation" to describe the above functions where a frequency shift of an ultrasound acoustic signal is facilitated by modulation of the acoustic impedance of at least one part of the MEMS speaker.
  • a speaker device includes at least three electro static active layers or membrane layers; a membrane layer as described in equation (1) which receives a first voltage signal, a shutter or modulator layer as described in equation (3) which receives a second voltage signal and a ground layer.
  • a speaker may include at least two piezo electric active layers; a membrane layer and shutter layer where each layer receives a voltage signal on one side of a membrane and a ground signal on a second side of the membrane.
  • FIG. 1 is an example of a speaker device comprising of at least but not limited to a lid (101) a MEMS speaker unit (103) and a substrate (105).
  • the lid includes at least one acoustic port.
  • Lid materials include but are not limited to; metals; liquid crystal polymer; Nickel; Nickel alloys; Copper; Copper alloys; Aluminum; Aluminum alloys; polymers; Silicon; glass or combinations of these.
  • the lid at least covers the MEMS speaker unit (103) and connects to a substrate (105).
  • Example of connections include but are not limited to adhesive; epoxy; Silicone; solder; metal welding or brazing. In one example the connection of the lid to a substrate is water tight.
  • connection of the lid to a substrate has a total leakage that when subjected to 1 Pascal of pressure difference would enable an airflow of any off but not limited to; less than 1 mm 3 /sec; less than 10 mm 3 /sec; less than 100 mm 3 /sec.
  • the MEMS speaker unit (103) is configured as an electro static device with at least three electrical connections or pad or as a pizeo electric device with at least three electrical connections or at least four electrical connections or bond pads.
  • the MEMS speaker unit (103) has at least two acoustic ports on opposing side of the MEMS speaker unit (103).
  • the MEMS speaker unit (103) is assembled on the substrate (105).
  • substrate (105) materials include but are not limited to; PCB laminates; ceramic substrate; Aluminum Oxide substrate; metal substrate; Aluminum substrates; Aluminum alloys substrate; Nickel substrate; Nickel alloy substrate; Copper substrate; Copper alloy substrate; organic substrates or combinations of such materials and substrates.
  • a substrate (105) includes conducting traces positioned on non-conducting layers. Conducting traces are made from any of but not limited to Copper; Copper alloys; Aluminum; Aluminum alloys; Nickel; Nickel Alloys; Silver; Silver alloys; Gold; Gold alloys or combination of these.
  • a substrate includes electrical vias connecting top side pads or electrical traces to bottom side pads or electrical traces.
  • a substrate includes at least a number of pads corresponding to the electrical connections of the MEMS speaker unit (103). An electrical connection between substrate (105) pads and MEMS speaker unit (103) pads is facilitated with bond wires. Examples of bond wires include copper; gold; Aluminum or combinations of such bond wires.
  • a MEMS speaker device (103) is attached to a substrate (105) by any of but not limited to adhesive; epoxy; solder; bonding; eutectic bonding; laser welding.
  • a substrate includes a liner composed of metal; epoxy or solder mask trace outlining the MEMS speaker unit circumference and the MEMS speaker unit is attached to the liner.
  • the liner is composed of any of but not limited to such materials and has a total height of at least any of but not limited to at least 10 micron; at least 20 micron; at least 40 micron; at least 60 micron at least 100 micron.
  • a substrate includes bottom pads configured to be assembled on a PCB or flex PCB using standard SMD assembly.
  • FIG. 2A is an example of a top view of the speaker device with the lid removed.
  • a MEMS speaker unit (103) is assembled on the substrate (105).
  • a top side trace (213) is deposited on the substrate (105) tracing the circumference of the MEMS speaker unit (103).
  • the top side trace (213) extends at least any of but not limited to at least 10 micron; at least 50 micron; at least 100 micron; to either side of the MEMS speaker unit (103) circumference.
  • the top side trace (213) is composed of any of but not limited to metal; copper; copper alloys; solder mask; epoxy; adhesive; polymer; thermosetting polymer; Silicone or combinations of materials or layers of these.
  • Bond pads (201, 203, 205) are deposited on the substrate as described previously. Wire bonds (207, 209, 211) connect bond pads on MEMS speaker unit (103) to the bond pads (201, 203, 205). While FIG. 2A is an example depicting 3 bond pads, other examples include any of but not limited to; 4; 7; 9; less than 20; less than 50 bond pads.
  • FIG. 2B is an example of a bottom view of the speaker device substrate (105).
  • a substrate has back side pads (221, 223, 225) deposited on its back side.
  • the number of back side pads (221, 223, 225) corresponds to the number of front side bond pads ( FIG. 2A 201, 203, 205).
  • a backside trace (227) outlines a backside acoustic port (225).
  • the back side trace has no defined spatial relation to the MEMS speaker unit (dotted line of 103).
  • the backside acoustic port (225) is located below the MEMS speaker unit.
  • the ratio of the area of the backside acoustic port to the area of the MEMS speaker device is any of but not limited to at least 1 ⁇ 2; at least 3 ⁇ 4; at least 1 ⁇ 4; at least 0.1; at least 0.2.
  • the acoustic port shape is circular.
  • a backside trace serves as a means to bond or solder the area around an acoustic port (225) and to seal the acoustic port (225) to an underlying substrate or audio device.
  • FIG. 2C is an example of a side view of the speaker device.
  • a MEMS speaker unit (103) is assembled on a substrate (105).
  • a top side trace (213) is deposited between the MEMS speaker unit (103) and substrate (105).
  • the top side trace (213) elevates the MEMS speaker unit (103) from the substrate and can accommodate an acoustic cavity between the bottom acoustic port (225) and the MEMS speaker unit (103).
  • a top side acoustic port (230) provides an acoustic connection between the volume defined by the lid and substrate and the air external to the speaker device.
  • One or more top side holes (230) can have an area smaller than 1 mm 2 , 2 mm 2 , 3 mm 2 , 6 mm 2 .
  • the top side hole (230) is circular.
  • the thickness of the substrate (103) is any of but not limited to smaller than 0.1 mm, smaller than 0.2 mm, smaller than 0.25 mm, smaller than 0.5 mm.
  • the thickness of the lid (101) is any of but not limited to smaller than 0.1 mm; smaller than 0.2 mm; smaller than 0.3 mm.
  • FIG. 3A is an example of a speaker device with an acoustic filter (301) connected to a front port.
  • acoustic filter (301) and acoustic cavity are used interchangeably.
  • the acoustic signal generated by the speaker device needs to be filtered by one or more acoustic filters.
  • an acoustic filter has one or more resonances at any of but not limited to lower than 300 Hz; lower than 1 KHz; lower than 3 KHz; lower than 6 KHz or combinations of these.
  • the acoustic filter is comprised of one or more tubes, where the combination of the tube's diameter and length and cavity volumes where cavity volumes include but are not limited to partial or total ear canal volume; speaker device air volume; cavities in acoustic element or in acoustic path.
  • a tube is designed with a diameter greater than 1mm and length greater to provide along with the ear canal volume an acoustic resonance of 2 to 5 KHz.
  • the speaker device is embedded in an earphone, headset, hearing aid, mobile device, speaker or other acoustic enclosure. Examples of embedding materials include but are not limited to plastic; polymer; Silicone; Metal; Aluminum; Brass; Copper; Wood; thermosetting material; thermoplastic material; injection molded material or combinations of these.
  • An acoustic filter or filter structure is realized as cavities in the embedding material.
  • the specific shape of the cavities is designed using any of but not limited to lumped element design; two port matrix networks; finite element; or computational fluid dynamics.
  • a cavity can be comprised of air; or filled with one or more materials providing any of but not limited to acoustic resistance; ultrasound attenuation; resonant acoustic structures; waterproofing but acoustic transparent material; dustproof but acoustic transparent material; or combinations of these.
  • a cavity is connected to an acoustic medium including but not limited to air; ear canal; headset; acoustic chamber.
  • an acoustic cavity includes an acoustic port.
  • An acoustic port is designed to optimize the transfer of an acoustic signal from the acoustic device and any of the above-described cavities to an acoustic medium.
  • an acoustic port is a horn with an adiabatic increase in area from a small area corresponding to a speaker device or associated cavity to a larger area corresponding to a suitable low frequency target response.
  • the horn is designed using available methods of horn design to optimize the audio spatial and frequency response.
  • a horn can have one adiabatic transition in one dimension and a second adiabatic transition in a second dimension.
  • the horn is designed to efficiently transform a volume velocity source or a pump speaker into a free space pressure source.
  • the connection of the acoustic filter (301) to the front port is facilitated by any of but not limited to mechanical pressure; adhesive; polymer; Silicone; solder or combination of these.
  • FIG. 3B is an example of a speaker device with an acoustic filter (303) connected to the back port and FIG. 3C is an example of a speaker device with acoustic filters (301, 303) connected to both front and back ports.
  • the speaker device is characterized in that the air flow from one port is the opposite of the air flow in the second port.
  • the acoustic signal from one port is 180° in respect to the second port.
  • the acoustic response of one port and corresponding acoustic filter has a resonance lower than the acoustic response of second port and corresponding acoustic filter.
  • an acoustic cavity includes an acoustic port.
  • An acoustic port is designed to optimize the transfer of an acoustic signal from the acoustic device and any of the above-described cavities to an acoustic medium.
  • an acoustic port is a horn with an adiabatic increase in area from a small area corresponding to a speaker device or associated cavity to a larger area corresponding to a suitable low frequency target response.
  • the horn is designed using available methods of horn design to optimize the audio spatial and frequency response.
  • a horn can have one adiabatic transition in one dimension and a second adiabatic transition in a second dimension.
  • the horn is designed to efficiently transform a volume velocity source or a pump speaker into a free space pressure source.
  • the connection of the acoustic filter (301) to the front port is facilitated by any of but not limited to mechanical pressure; adhesive; polymer; Silicone; solder or combination of these.
  • FIG. 4A is an example of a speaker device with a side acoustic port (401) and bottom acoustic port (403).
  • one or more side acoustic ports (401) replace or augment a top port ( FIG. 2C 230).
  • an acoustic side port (401) is defined by cutting, drilling or griding using any of but not limited to laser; mechanical element; water drill.
  • a side acoustic port (401) is defined prior to forming the lid, and the shape of the port is any of but not limited to rectangular; square; ellipsoid; circular; or combinations of these.
  • an acoustic side port introduces challenges in cutting the assembled speaker device due to water seepage.
  • a structure is defined at one or more sides the package.
  • examples of structures include a wire frame; a molded frame; adhesive glue line.
  • a structure includes one or more acoustic ports. The top lid attaches to the structure leaving the side acoustic port (401) connecting between the inside of the speaker device package and the external surroundings outside the speaker device package.
  • FIG. 4B is an example of a speaker device with one or more liner acoustic ports (405) in the top trace (213).
  • a liner acoustic port (405) is configured by a method including; creating a top trace (213); etching a liner acoustic port (405) in the top trace (213).
  • a liner acoustic port (405) is configured by a method including; creating a top trace (213) with recesses for a liner acoustic port (405).
  • the acoustic port is configured when the MEMS speaker unit (103) is attached the top trace (213) creating the top of the liner acoustic port.
  • the liner extends until the lid (101) and the lid attaches above the liner defining a side output port ( FIG. 4A 401).
  • a liner acoustic port there is no bottom acoustic port ( FIG. 4A 403).
  • other means create two or more cavities each connected to an output port, in between the lid (101) and substrate (105) where the bottom side of the MEMS speaker unit (103) is acoustically connected to one cavity and one acoustic port and the top side of the MEMS speaker unit (103) is acoustically connected to a second cavity and a second acoustic port.
  • either bottom side and or top side of MEMS speaker unit (103) is segmented so that geometrically distinct areas of the acoustic ports of the MEMS speaker unit (103) are acoustically connected to different acoustic cavities and acoustic ports.
  • FIG. 5A is an example of a top view of a speaker device without a lid.
  • MEMS speaker unit (103) is attached to top trace (213) which is attached to the substrate (105).
  • Lid trace (501) is created with top trace (213) or independently and provides a marking and attach platform for the lid. Bond pads as depicted in FIG. 2 are not shown to simplify the drawing.
  • FIG. 5B is a further example of top view of a speaker device without a lid which in addition to MEMS speaker unit (103) includes a drive ASIC (503).
  • the drive ASIC (503) application specific integrated circuit) is an electronic device receiving power and control signals to operate the MEMS speaker unit.
  • the drive ASIC (503) includes one or more bond pads for input and out electrical connection.
  • the drive ASIC (503) is configured as a WLCSP and attached through the bond pads to the substrate.
  • the drive ASIC (503) is a "bare die” with top side bond pads.
  • the MEMS speaker unit (103) is wire bonded to the drive ASIC (503) and the drive ASIC (503) is wire bonded to the substrate.
  • FIG. 5C is a further example of top view of a speaker device without a lid which in addition to MEMS speaker unit (103) and drive ASIC (503) additional devices (505) are included in the speaker device.
  • additional devices include but are not limited to a MEMS microphone; MEMS accelerometer; MEMS inertial unit (IMU); passive or active electronic components such as inductors; capacitors; resonant devices; resistors; or transformers; MEMS pressure sensor; MEMS anemometer.
  • MEMS microphone MEMS accelerometer
  • MEMS inertial unit IMU
  • passive or active electronic components such as inductors; capacitors; resonant devices; resistors; or transformers
  • MEMS pressure sensor MEMS anemometer.
  • FIG. 6A is an example of a top view of a speaker device with two or more MEMS speaker units assembled on a substrate with a top lid removed.
  • the speaker device is comprised of; two or more MEMS speaker units (603, 605, 607, 609); a substrate (601); an acoustic filter (619).
  • a MEMS speaker unit (603, 605, 607, 609) is assembled on a substrate (601) using either epoxy, solder or eutectic bonding.
  • the substrate (601) includes mechanical support (613, 615, 617, 619).
  • the mechanical support (613, 615, 617, 619) is the same as a top side trace ( FIG.
  • the top side trace (613, 615, 617, 619) extends at least any of but not limited to at least 10 microns; at least 50 microns; at least 100 microns; to either side of the MEMS speaker unit (603, 605, 607, 609) circumference.
  • the top side trace (213) is composed of any of but not limited to metal; copper; copper alloys; solder mask; epoxy; adhesive; polymer; thermosetting polymer; Silicone or combinations of materials or layers of these. As described in FIG.
  • bond pads ( FIG.2 201, 203, 205) are deposited on the substrate adjacent to each MEMS speaker unit (603, 605, 607, 609).
  • Each MEMS speaker unit (603, 605, 607, 609) is electrically connected with a wire bond to one or more band pads with a wire bond.
  • the acoustic filter (619) incudes any of but not limited to; a tube with area A, and length L; one more tube sections (1 to N) each section with a length L x and area A x where x is between 1 and N inclusive; one or more membranes with an area A m and resonance frequency f mx ; one or more Helmholtz resonators with resonance frequency f Hx ; or combinations of these.
  • a lid covers the substrate from the top side and the volume of air enclosed in the lid combined with the acoustic filter (619) generate a combined acoustic frequency response transforming the MEMS speaker unit (603, 605, 607, 609) output to the desired acoustic response.
  • the acoustic filter functions as a bass reflex filter and is designed with a resonant frequency including but not limited to; above 20 Hz; above 50 Hz; above 100 Hz; above 300 Hz; above 500 Hz; above 1 KHz; 3 KHz or combinations of these frequencies.
  • FIG. 6B is an example of a bottom view of a speaker device with two or more MEMS speaker units ( FIG. 6A 603, 605, 607, 609, shown as dashed traces) assembled on a substrate.
  • a speaker device is further comprised of a substrate (601), electric pads (641, 643, 645), acoustic port (621, 623, 625, 627) each individually or collectively acoustically coupled to a MEMS speaker unit ( FIG. 6A 603, 605, 607, 609) and a filter acoustic port (651) which is acoustically coupled to the acoustic filter ( FIG. 6A 619).
  • Bottom side of speaker device further includes one or more backside trace similar to ( FIG. 2B 227).
  • a backside trace serves as a means to bond or solder the area around an acoustic port (621, 623, 625, 627) and to seal the acoustic port (621, 623, 625, 627) to an underlying substrate or audio device.
  • the ratio of the area of the acoustic port (621, 623, 625, 627) to the area of the MEMS speaker device is any of but not limited to at least 1 ⁇ 2; at least 3 ⁇ 4; at least 1 ⁇ 4; at least 0.1; at least 0.2.
  • the acoustic port (621, 623, 625, 627) shape is circular.
  • a speaker device comprised of an acoustic medium; a substrate in contact with the acoustic medium; a liner disposed on substrate; a MEMS speaker unit attached to the liner, wherein the volume, defined between the MEMS speaker unit, the liner and the substrate, includes a port providing acoustic coupling between the MEMS speaker unit and the acoustic medium.
  • the liner has a minimum thickness of 20 micron.
  • the MEMS speaker unit generates sound from modulated ultrasound using active demodulation.
  • the volume defined between the MEMS speaker unit the liner and the substrate is at least 0.05 mm 3 .
  • a speaker device comprised of a first acoustic medium; a second acoustic medium; a substrate in contact with at least a first acoustic medium; a liner disposed on substrate; a MEMS speaker unit attached to the liner; a lid connected to the substrate, covering the MEMS speaker unit and in contact with at least a second acoustic volume; wherein the volume, defined between the MEMS speaker unit, the liner and the substrate, includes a port providing acoustic coupling between the MEMS speaker unit and the first acoustic medium; wherein the lid includes a port providing acoustic coupling between the MEMS speaker unit and the second acoustic medium.
  • the liner has a minimum thickness of 20 micron.
  • the MEMS speaker unit generates sound from modulated ultrasound using active demodulation.
  • the volume defined between the MEMS speaker unit the liner and the substrate is at least 0.05 mm 3 .
  • the volume defined by the lid is segregated into at least two distinct acoustic volumes and the liner includes an acoustic port coupled into at least one of the two distinct volumes.
  • the implementer may opt for a mainly hardware and/or firmware vehicle; if flexibility is paramount, the implementer may opt for a mainly software implementation; or, yet again alternatively, the implementer may opt for some combination of hardware, software, and/or firmware.
  • Examples of a signal bearing medium include, but are not limited to, the following: a recordable type medium such as a floppy disk, a hard disk drive, a Compact Disc (CD), a Digital Versatile Disk (DVD), a digital tape, a computer memory, etc.; and a transmission type medium such as a digital and/or an analog communication medium (e.g., a fiber optic cable, a waveguide, a wired communications link, a wireless communication link, etc.).
  • a typical data processing system generally includes one or more of a system unit housing, a video display device, a memory such as volatile and non-volatile memory, processors such as microprocessors and digital signal processors, computational entities such as operating systems, drivers, graphical user interfaces, and applications programs, one or more interaction devices, such as a touch pad or screen, and/or control systems including feedback loops and control motors (e.g., feedback for sensing position and/or velocity; control motors for moving and/or adjusting components and/or quantities).
  • a typical data processing system may be implemented utilizing any suitable commercially available components, such as those typically found in data computing/communication and/or network computing/communication systems.
  • any two components so associated can also be viewed as being “operably connected”, or “operably coupled”, to each other to achieve the desired functionality, and any two components capable of being so associated can also be viewed as being “operably couplable”, to each other to achieve the desired functionality.
  • operably couplable include but are not limited to physically mateable and/or physically interacting components and/or wirelessly interactable and/or wirelessly interacting components and/or logically interacting and/or logically interactable components.

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
EP23166645.4A 2022-04-05 2023-04-04 System und verfahren zur erzeugung eines audiosignals Pending EP4258693A1 (de)

Applications Claiming Priority (1)

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US202263327478P 2022-04-05 2022-04-05

Publications (1)

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EP4258693A1 true EP4258693A1 (de) 2023-10-11

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Country Status (1)

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EP (1) EP4258693A1 (de)

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8861752B2 (en) 2011-08-16 2014-10-14 Empire Technology Development Llc Techniques for generating audio signals
US20160277838A1 (en) 2015-03-17 2016-09-22 Dsp Group Ltd. Multi-layered mems speaker
US20160277845A1 (en) 2015-03-17 2016-09-22 Dsp Group Ltd. Mems-based speaker implementation
US20160360321A1 (en) 2014-02-08 2016-12-08 Empire Technology Development Llc Mems-based structure for pico speaker
US20160360320A1 (en) 2014-02-08 2016-12-08 Empire Technology Development Llc Mems-based audio speaker system with modulation element
US20180139542A1 (en) * 2015-04-29 2018-05-17 Goertek Inc. Piezoelectric speaker and method for forming the same
US20210067865A1 (en) * 2019-08-28 2021-03-04 Mordehai MARGALIT System And Method For Generating An Audio Signal
CN113200509A (zh) * 2021-04-08 2021-08-03 日月光半导体制造股份有限公司 电子元件及半导体封装装置

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8861752B2 (en) 2011-08-16 2014-10-14 Empire Technology Development Llc Techniques for generating audio signals
US20160360321A1 (en) 2014-02-08 2016-12-08 Empire Technology Development Llc Mems-based structure for pico speaker
US20160360320A1 (en) 2014-02-08 2016-12-08 Empire Technology Development Llc Mems-based audio speaker system with modulation element
US20160277838A1 (en) 2015-03-17 2016-09-22 Dsp Group Ltd. Multi-layered mems speaker
US20160277845A1 (en) 2015-03-17 2016-09-22 Dsp Group Ltd. Mems-based speaker implementation
US20180139542A1 (en) * 2015-04-29 2018-05-17 Goertek Inc. Piezoelectric speaker and method for forming the same
US20210067865A1 (en) * 2019-08-28 2021-03-04 Mordehai MARGALIT System And Method For Generating An Audio Signal
CN113200509A (zh) * 2021-04-08 2021-08-03 日月光半导体制造股份有限公司 电子元件及半导体封装装置

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