EP4237763A1 - Wärmepumpe - Google Patents
WärmepumpeInfo
- Publication number
- EP4237763A1 EP4237763A1 EP21814677.7A EP21814677A EP4237763A1 EP 4237763 A1 EP4237763 A1 EP 4237763A1 EP 21814677 A EP21814677 A EP 21814677A EP 4237763 A1 EP4237763 A1 EP 4237763A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- refrigerant
- collector
- heat pump
- condensate pan
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B47/00—Arrangements for preventing or removing deposits or corrosion, not provided for in another subclass
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D21/00—Defrosting; Preventing frosting; Removing condensed or defrost water
- F25D21/14—Collecting or removing condensed and defrost water; Drip trays
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B13/00—Compression machines, plants or systems, with reversible cycle
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2400/00—Component parts or details not otherwise provided for in this subclass
- F25B2400/16—Receivers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D2321/00—Details or arrangements for defrosting; Preventing frosting; Removing condensed or defrost water, not provided for in other groups of this subclass
- F25D2321/14—Collecting condense or defrost water; Removing condense or defrost water
Definitions
- the invention relates to a heat pump according to the preamble f 5 of patent claim 1 .
- a heat pump of the type mentioned at the outset is known from patent document EP 3 358 277 A1.
- a coolant collector provided there is designed to be connected to a condensate pan provided there in a heat-conducting manner by means of a pipe.
- Another heat pump of a similar type is known from patent document EP 2 500 676 B1.
- This consists of a refrigerant 15 circuit for a refrigerant, a refrigerant collector belonging to the refrigeration circuit, through which the refrigerant flows, an expansion device belonging to the refrigeration circuit, through which the refrigerant flows and viewed in the flow direction of the refrigerant downstream of the refrigerant collector, a 20 nem belonging to the refrigeration circuit, dated Refrigerants flow through an evaporator downstream of the expansion device, seen in the flow direction of the refrigerant, and a condensate pan associated with the evaporator for collecting condensate occurring on the evaporator.
- a heat exchanger is arranged in the condensate pan in order to keep it free of ice. This is traversed by refrigerant, which is then fed to the evaporator itself.
- the object of the invention is to improve a heat pump of the type mentioned at the outset.
- the efficiency of the heat pump should be increased.
- This object is achieved with a heat pump of the type mentioned at the outset by the features listed in the characterizing part of patent claim 1 .
- the distance between the refrigerant collector and the condensate pan is a maximum of 15 cm for the transfer of heat present on the refrigerant collector from the outside by thermal conduction to the condensate pan.
- the solution according to the invention is characterized in that heat occurring in particular on an outer wall of the refrigerant collector is transferred to the condensate pan by thermal conduction.
- the heat transfer takes place in the broadest sense, in particular optionally to a very small extent via the pipeline mentioned (EP 3 358 277 A1) or by convection (EP 2 500 676 B1), namely in that always new warm refrigerant is conveyed via a line and said heat exchanger to the condensate pan, d. H . the heat 20 me is spent extra by means of the refrigerant to the condensate pan.
- the heat that is already present on the outside of the refrigerant collector is transferred to the condensate pan in particular by thermal conduction (and possibly also by thermal radiation), which correspondingly increases the efficiency of the heat pump.
- the stipulation that the refrigerant collector is connected to the condensate pan in a thermally conductive manner includes on the one hand the option that this (i.e. the refrigerant collector) is arranged directly on the condensate pan, i.e.
- a heat-conducting body is arranged satwanne, which conducts the heat from the refrigerant collector to the condensate pan.
- FIG. 1 shows a schematic of a first embodiment of the heat pump according to the invention, in which the coolant collector and the condensate pan are designed to be connected directly to one another;
- FIG. 2 shows a schematic of a second embodiment of the heat pump according to the invention, in which the coolant collector and the condensate pan are connected to one another via a heat-conducting element.
- the present invention relates to a heat pump.
- This consists of a refrigerant circuit 1 for a refrigerant, a refrigerant collector 2 belonging to the refrigeration circuit 1 25 , through which the refrigerant flows, an expansion device 3 belonging to the refrigeration circuit 1 , through which the refrigerant flows and viewed in the flow direction of the refrigerant downstream of the refrigerant collector 2 , an expansion device 3 belonging to the refrigeration circuit 1 , flowed through by the refrigerant 30 and seen in the flow direction of the refrigerant downstream of the expansion device 3 evaporation fer 4 and the evaporator 4 associated condensate pan 5 to catch on the evaporator 4 accumulating condensate.
- the coolant collector 2 is connected to the condensate pan 5 in a heat-conducting manner.
- the refrigerant collector 2 is connected to the condensate pan 5 in a “convection-free” manner.
- the heat-conducting element 6 is designed without contact with the refrigerant. This means that, for example, not a pipeline carrying the refrigerant 10 serves as the heat-conducting element 6, but a heat-conducting element 6 that is separate for heat conduction is provided.
- an electrical heating device that may be provided on the condensate pan for keeping ice free can be dispensed with, which ultimately increases the efficiency of the heat pump.
- the distance between the refrigerant collector 2 and the condensate pan 5 is at most 15 cm, preferably less than 10 cm, particularly preferably less than 5 cm, or even (only) 0 cm. The latter case is shown in FIG. H .
- the coolant collector 25 2 and the condensate pan 5 are designed to touch.
- a preferably metallic heat-conducting element 6 (because it conducts heat well) is arranged, see FIG.
- the refrigerant collector 2 is preferably arranged below the condensate pan 5 when the heat pump is operated as intended. It is also preferred that the condensate pan 5 has a drain channel and/or that the refrigerant collector 2 is connected at least to the drain channel in a thermally conductive manner.
- the refrigerant collector 2 is designed as a high-pressure collector.
- the refrigerant circuit 1 preferably has a high-pressure side 1 . 1 with the condenser 8 and a low-pressure side 1 .2 with the evaporator 4 on.
- the refrigerant collector 2 15 on the high-pressure side 1 . 1 of the refrigerant circuit 1 is arranged. This causes the refrigerant in the refrigerant collector 2 and thus the refrigerant collector 2 itself to have a relatively high temperature. A large amount of thermal energy can thus be transferred to the condensate pan 5 in order to thaw it. 20
- the refrigerant circuit 1 has a compressor 7 , through which the refrigerant flows, and which is connected downstream of the evaporator 4 , viewed in the direction of flow of the refrigerant.
- the refrigerant circuit 1 it is preferable for the refrigerant circuit 1 to have a condenser 8 through which the refrigerant flows and which is downstream of the compressor 7, viewed in the direction of flow of the refrigerant.
- the heat pump according to the invention according to exemplary embodiment 30 from FIG. 1 functions as follows (correspondingly to FIG. 2): During regular operation of the heat pump, condensate forms on the relatively cool evaporator 4 , which drips down and is caught by the condensate pan 5 . Since the condensate itself is cold, it can happen that the condensate pan 5 ices over and the condensate can no longer properly escape from the condensate pan 5 through a drain.
- the coolant collector 2 is now arranged directly below the condensate pan 5 . In this refrigerant 10 collector 2 is warm refrigerant, which heats the refrigerant collector 2 on.
- the heat pump according to the invention thus prevents the condensate pan 5 from freezing in a simple and efficient manner, which in turn improves the efficiency of the heat pump itself.
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Combustion & Propulsion (AREA)
- Other Air-Conditioning Systems (AREA)
- Central Heating Systems (AREA)
- Compression-Type Refrigeration Machines With Reversible Cycles (AREA)
- Heat-Pump Type And Storage Water Heaters (AREA)
Abstract
Description
Claims
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102020128276.1A DE102020128276A1 (de) | 2020-10-28 | 2020-10-28 | Wärmepumpe |
| PCT/DE2021/100856 WO2022089687A1 (de) | 2020-10-28 | 2021-10-26 | Wärmepumpe |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| EP4237763A1 true EP4237763A1 (de) | 2023-09-06 |
| EP4237763B1 EP4237763B1 (de) | 2024-10-16 |
| EP4237763C0 EP4237763C0 (de) | 2024-10-16 |
Family
ID=78770304
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP21814677.7A Active EP4237763B1 (de) | 2020-10-28 | 2021-10-26 | Wärmepumpe |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20230384019A1 (de) |
| EP (1) | EP4237763B1 (de) |
| CN (1) | CN116368338B (de) |
| DE (1) | DE102020128276A1 (de) |
| WO (1) | WO2022089687A1 (de) |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3451226A (en) * | 1967-11-29 | 1969-06-24 | Frick Co | Drip pan having defrosting means |
| JPH08303912A (ja) * | 1995-05-11 | 1996-11-22 | Mitsubishi Heavy Ind Ltd | 冷凍装置 |
| DE102004012498A1 (de) * | 2004-03-15 | 2005-10-06 | BSH Bosch und Siemens Hausgeräte GmbH | Kältegerät |
| JP5528903B2 (ja) * | 2010-05-12 | 2014-06-25 | 矢崎エナジーシステム株式会社 | 吸収式冷暖房給湯システム |
| US20120055185A1 (en) * | 2010-09-02 | 2012-03-08 | Ran Luo | Refrigeration apparatus |
| EP2500676B1 (de) | 2011-03-14 | 2019-07-03 | STIEBEL ELTRON GmbH & Co. KG | Wärmepumpe |
| JP2013019641A (ja) * | 2011-07-13 | 2013-01-31 | Toshiba Corp | 冷蔵庫 |
| DE202013101884U1 (de) * | 2013-04-30 | 2013-05-17 | Carcoustics Techconsult Gmbh | Vorrichtung zum Aufnehmen und Verdampfen von kondensierten Flüssigkeiten an einer Kälteanlage und Kälteanlage mit dieser Vorrichtung |
| JP6191671B2 (ja) | 2015-09-30 | 2017-09-06 | ダイキン工業株式会社 | 冷媒漏洩箇所特定方法 |
| JP7016812B2 (ja) * | 2016-04-01 | 2022-02-07 | エイチブイピーエス・ホールディングス(ピーティーワイ)リミテッド | 空調装置 |
-
2020
- 2020-10-28 DE DE102020128276.1A patent/DE102020128276A1/de active Pending
-
2021
- 2021-10-26 WO PCT/DE2021/100856 patent/WO2022089687A1/de not_active Ceased
- 2021-10-26 EP EP21814677.7A patent/EP4237763B1/de active Active
- 2021-10-26 CN CN202180074211.8A patent/CN116368338B/zh active Active
- 2021-10-26 US US18/031,658 patent/US20230384019A1/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| CN116368338B (zh) | 2025-11-07 |
| WO2022089687A1 (de) | 2022-05-05 |
| DE102020128276A1 (de) | 2022-04-28 |
| CN116368338A (zh) | 2023-06-30 |
| EP4237763B1 (de) | 2024-10-16 |
| EP4237763C0 (de) | 2024-10-16 |
| US20230384019A1 (en) | 2023-11-30 |
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