Classifications

• • G—PHYSICS
  • G01—MEASURING; TESTING
  • G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
  • G01F23/00—Indicating or measuring liquid level or level of fluent solid material, e.g. indicating in terms of volume or indicating by means of an alarm
  • G01F23/22—Indicating or measuring liquid level or level of fluent solid material, e.g. indicating in terms of volume or indicating by means of an alarm by measuring physical variables, other than linear dimensions, pressure or weight, dependent on the level to be measured, e.g. by difference of heat transfer of steam or water
  • G01F23/26—Indicating or measuring liquid level or level of fluent solid material, e.g. indicating in terms of volume or indicating by means of an alarm by measuring physical variables, other than linear dimensions, pressure or weight, dependent on the level to be measured, e.g. by difference of heat transfer of steam or water by measuring variations of capacity or inductance of capacitors or inductors arising from the presence of liquid or fluent solid material in the electric or electromagnetic fields
  • G01F23/263—Indicating or measuring liquid level or level of fluent solid material, e.g. indicating in terms of volume or indicating by means of an alarm by measuring physical variables, other than linear dimensions, pressure or weight, dependent on the level to be measured, e.g. by difference of heat transfer of steam or water by measuring variations of capacity or inductance of capacitors or inductors arising from the presence of liquid or fluent solid material in the electric or electromagnetic fields by measuring variations in capacitance of capacitors
  • G01F23/268—Indicating or measuring liquid level or level of fluent solid material, e.g. indicating in terms of volume or indicating by means of an alarm by measuring physical variables, other than linear dimensions, pressure or weight, dependent on the level to be measured, e.g. by difference of heat transfer of steam or water by measuring variations of capacity or inductance of capacitors or inductors arising from the presence of liquid or fluent solid material in the electric or electromagnetic fields by measuring variations in capacitance of capacitors mounting arrangements of probes
• • G—PHYSICS
  • G01—MEASURING; TESTING
  • G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
  • G01F23/00—Indicating or measuring liquid level or level of fluent solid material, e.g. indicating in terms of volume or indicating by means of an alarm
  • G01F23/22—Indicating or measuring liquid level or level of fluent solid material, e.g. indicating in terms of volume or indicating by means of an alarm by measuring physical variables, other than linear dimensions, pressure or weight, dependent on the level to be measured, e.g. by difference of heat transfer of steam or water
  • G01F23/26—Indicating or measuring liquid level or level of fluent solid material, e.g. indicating in terms of volume or indicating by means of an alarm by measuring physical variables, other than linear dimensions, pressure or weight, dependent on the level to be measured, e.g. by difference of heat transfer of steam or water by measuring variations of capacity or inductance of capacitors or inductors arising from the presence of liquid or fluent solid material in the electric or electromagnetic fields
  • G01F23/263—Indicating or measuring liquid level or level of fluent solid material, e.g. indicating in terms of volume or indicating by means of an alarm by measuring physical variables, other than linear dimensions, pressure or weight, dependent on the level to be measured, e.g. by difference of heat transfer of steam or water by measuring variations of capacity or inductance of capacitors or inductors arising from the presence of liquid or fluent solid material in the electric or electromagnetic fields by measuring variations in capacitance of capacitors
• • G—PHYSICS
  • G01—MEASURING; TESTING
  • G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
  • G01F23/00—Indicating or measuring liquid level or level of fluent solid material, e.g. indicating in terms of volume or indicating by means of an alarm
  • G01F23/22—Indicating or measuring liquid level or level of fluent solid material, e.g. indicating in terms of volume or indicating by means of an alarm by measuring physical variables, other than linear dimensions, pressure or weight, dependent on the level to be measured, e.g. by difference of heat transfer of steam or water
  • G01F23/26—Indicating or measuring liquid level or level of fluent solid material, e.g. indicating in terms of volume or indicating by means of an alarm by measuring physical variables, other than linear dimensions, pressure or weight, dependent on the level to be measured, e.g. by difference of heat transfer of steam or water by measuring variations of capacity or inductance of capacitors or inductors arising from the presence of liquid or fluent solid material in the electric or electromagnetic fields
  • G01F23/263—Indicating or measuring liquid level or level of fluent solid material, e.g. indicating in terms of volume or indicating by means of an alarm by measuring physical variables, other than linear dimensions, pressure or weight, dependent on the level to be measured, e.g. by difference of heat transfer of steam or water by measuring variations of capacity or inductance of capacitors or inductors arising from the presence of liquid or fluent solid material in the electric or electromagnetic fields by measuring variations in capacitance of capacitors
  • G01F23/265—Indicating or measuring liquid level or level of fluent solid material, e.g. indicating in terms of volume or indicating by means of an alarm by measuring physical variables, other than linear dimensions, pressure or weight, dependent on the level to be measured, e.g. by difference of heat transfer of steam or water by measuring variations of capacity or inductance of capacitors or inductors arising from the presence of liquid or fluent solid material in the electric or electromagnetic fields by measuring variations in capacitance of capacitors for discrete levels

Definitions

• the present disclosure relates to the sensor field, and particularly to a liquid level sensor.
• the device for measuring the amount of non-conductive liquids can use an electrostatic capacitive sensor.
• the sensor is a device that detects the presence and amount of liquid through the following principles: Insulating liquid enters between the electrodes intervening the space, and the electro-static capacitance changes between the electrodes.
• the electrodes are arranged in a barrel-shaped electrically insulating frame, or one electrode is configured in a barrel shape, and the amount of liquid in the container is measured based on the electrostatic capacitance between the electrodes that changes due to the liquid entering and leaving the barrel.
• a flat capacitive sensor There is another method using a flat capacitive sensor.
• Figure 1 is a schematic diagram of a liquid level sensor in prior art.
• a liquid level sensor comprises a conductive rod 6, a metal cover plate 4, a spacer plate 3, a soldering lug 9, and an electrode plate. 7.
• the connection stability is relatively poor, which affects the accuracy and performance of the sensor.
• the liquid level sensor includes a metal cover plate, a conductive pin passing through the metal cover plate, a plurality of electrode plates, and a plurality of support plates supporting the plurality of electrode plates respectively, so that a fixed interval or distance is maintained between the plurality of electrode plates.
• Each electrode plate of the plurality of electrode plates has a planar portion and a wing portion that extends outwardly from the planar portion of the electrode plate. The wing portion is attached or connected to the conductive pin.
• the wing portion includes a bent portion or bent part and a conductive portion or conductive part.
• the wing portion is located in the middle of the electrode plates.
• the wing portion is located at the first end of each electrode plate of the plurality of electrode plates, and the distance between the first end and the metal cover plate is less than the distance between the second end of each electrode plate and the metal cover plate.
• the conductive portion is connected to the conductive pin.
• the first surface of the conductive portion is connected to the conductive pin.
• the second surface of the conductive portion is connected to the conductive pin.
• one support plate of the plurality of support plates is provided at the first end of the electrode plate, and the other support plate of the plurality of support plates is provided at the second end.
• one support plate of the plurality of support plates is provided at the second end portion, and the other support plate of the plurality of support plates is provided between the wing portion and the second end portion.
• the plurality of electrode plates are arranged in parallel.
• one or more convex parts are provided on the conductive portion.
• a liquid level sensor including a metal cover plate, a conductive pin that passes through the metal cover plate, multiple electrode plates, multiple support plates respectively supporting the plurality of electrode plates so that a fixed interval (i.e., a gap or distance) is maintained between the plurality of electrode plates.
• each electrode plate of the plurality of electrode plates has a wing portion that extends outwardly from a planar portion of each electrode plate.
• a conductive pin is attached to each wing portion such as by welding..
• the wing portion and the electrode plate are integrally formed, and the wing portion is connected to the conductive pin, which improves the stability of the connection between the electrode plate and the conductive pin and improves the working stability of the liquid level sensor.
• a liquid level sensor can include a metal cover having a cap-shaped body member with a generally flat top surface including at least one aperture, a peripheral side wall extending from the top surface and including a flanged portion at a distal perimeter of the side wall.
• a plurality of conductive pins can extend through the at least one aperture in the top surface of the body member and from a first side of the metal cover to a second side of the metal cover.
• a sealing glass can be disposed between each of the plurality of pins and the at least one aperture to hermetically seal the pins to the body member and electrically isolate the pins from the body member and one another.
• a plurality of generally rectangular-shaped electrically-conductive electrode plates extending from the second side of the cover can be included with each of the electrode plates having a planar portion.
• a plurality of electrically-insulating support plates can support the plurality of electrode plates.
• the electrode plates can be positioned in an adjacent relationship to one another such that the planar portions of respective adjacent electrode plates are generally parallel to one another and separated by a predetermined gap.
• each electrode plate of the plurality of electrode plates can include an integrally-formed wing portion that extends laterally outward from the planar portion of the electrode plate.
• Each wing portion can have a bent portion and an attachment portion.
• the attachment portion can be laterally spaced or offset from the planar portion of the electrode plate.
• Each of the conductive pins of the plurality of conductive pins can be attached to the attachment portion of the wing portion of a corresponding electrode plate of the plurality of electrode plates.
• the planar portions of each of the plurality of electrode plates can have a first thickness and the wing portions of each of the plurality of electrode plates can have a second thickness.
• the second thickness can be substantially the same as the first thickness. Alternatively, the second thickness can be greater or smaller than the first thickness.
• Figure 1 is a schematic diagram of a liquid level sensor in prior art
• Figure 2 is a schematic diagram of an electrode plate according to an embodiment of the present disclosure.
• Figure 3 is a first schematic diagram of a support plate according to an embodiment of the present disclosure.
• Figure 4 is a schematic diagram of a liquid level sensor according to an embodiment of the present disclosure.
• Figure 5 is a second schematic diagram of an electrode plate according to an embodiment of the present disclosure.
• Figure 6 is a second schematic diagram of a support plate according to an embodiment of the present disclosure.
• Figure 7 is a second schematic diagram of a liquid level sensor according to an embodiment of the present disclosure.
• Figure 8 is a third schematic diagram of an electrode plate according to an embodiment of the present disclosure.
• Figure 9 is a third schematic diagram of a support plate according to an embodiment of the present disclosure.
• Figure 10 is a third schematic diagram of a liquid level sensor according to an embodiment of the present disclosure.
• Figure 11 is a fourth schematic diagram of an electrode plate according to an embodiment of the present disclosure
• Figure 12 is a fourth schematic diagram of a support plate according to an embodiment of the present disclosure.
• Figure 13 is a fourth schematic diagram of a liquid level sensor according to an embodiment of the present disclosure.
• Example embodiments will now be described more fully with reference to the accompanying drawings.
• the example embodiments are provided so that this disclosure will be thorough, and will fully convey the scope to those who are skilled in the art. Numerous specific details are set forth such as examples of specific components, devices, and methods, to provide a thorough understanding of embodiments of the present disclosure. It will be apparent to those skilled in the art that specific details need not be employed, that example embodiments may be embodied in many different forms and that neither should be construed to limit the scope of the disclosure. In some example embodiments, well-known processes, well- known device structures, and well-known technologies are not described in detail.
• an exemplary liquid level sensor 8 can include a first portion or metal cover plate 1001 and a second portion or probe portion 803.
• the first portion or metal cover plate 1001 can take the form of a hermetic terminal assembly.
• the first portion can include a cap-shaped metal body member 804 having a generally flat top surface 805 including one or more apertures 806.
• a peripheral side wall 807 can extend from the top surface and can include a flanged portion 808 at a distal perimeter of the side wall.
• One or more electrically conductive pins 1002 can pass through the apertures 806 in the top surface 805 of the body member 804 and extend from a first side of the metal cover plate 1001 to a second side of the metal cover plate 1001.
• the second portion or probe portion 803 can include a plurality of generally planar electrode plates 801 located on the second side of the metal cover plate 1001.
• the electrode plates 801 are supported by a plurality of support plates 901 , respectively, so that a fixed gap or distance d can be maintained between the electrode plates 801.
• Each electrode plate 801 of the plurality of electrode plates 801 includes a planar portion 810 and a wing portion 802.
• the wing portion 802 extends outwardly from the planar portion 810 of the electrode plate 801.
• a respective conductive pin 1002 can be electrically connected or attached to the wing portion 802 of a corresponding electrode plate 801.
• the liquid level sensor 11 shown in Figures 8-10 adopts multiple electrode plates 801 and a plurality of conductive pins 1002.
• Each electrode plate 801 includes a wing portion 802 that is connected to a respective one of the plurality of conductive pin 1002, such as by welding.
• the wing portion 802 extends outwardly from the electrode plate 801 and the wing portion 802 can be integrally formed with the electrode plate 801. This configuration improves the stability of the connection between the electrode plate 801 and the conductive pin 802, and improves the stability of the liquid level sensor 11.
• the wing portion 802 comprises a bent portion or bent part 8021 and a conductive portion or conductive part 8022.
• the bent part 8021 can provide a certain amount of metal elasticity, and provide buffer elasticity for the electrode plate 801 and the connected conductive pin 1002, and in various working environments of the liquid level sensor 11. In this way, the stability of the connection between the electrode plate 801 and the conductive pin 1002 is improved.
• the conductive part 8022 of the wig portion 802 is electrically connected to the conductive pin 1002 to enable an electrical signal to be conducted or transmitted from the electrode plate 801 to the pin 1002.
• the wing portion can be arranged at multiple positions along the planar portion of the support plate, for example:
• Configuration 1 The wing portion is located in the middle of multiple electrode plates (as shown in Figures 2, 3, 4, 5, 6, 7, 11 , 12, and 13).
• Configuration 2 The wing portion is located at the first end of each electrode plate in the plurality of electrode plates, and the distance between the first end of each electrode plate and the metal cover plate is smaller than the distance between the second end of each electrode plate and the metal cover plate.
• the conductive part is located at a position that offset a distance from the planar portion of the electrode plate.
• the conductive pin is connected to the conductive part.
• the conductive pin is electrically connected to an attachment portion of the conductive part for signal conduction or transmission between the electrode plate to the conductive pin.
• a first surface or attachment portion of the conductive part is connected to the conductive pin; or, a second surface of the conductive part is connected to the conductive pin.
• a variety of configurations can be employed to connect the wing portion to the conductive pin, and different positions of the conductive pin can be accommodated, which improves the diversity of possible connections.
• the interval or distance between the electrode plates should be kept constant.
• multiple support plates e.g ., 2 support plates
• one of the multiple support plates can be arranged at a first end of the electrode plates.
• the other support plate of the multiple support plates can be arranged at a second end of the electrode plates.
• one support plate of the multiple support plates can be arranged at a second end of the electrode plates, and the other support plate of the multiple support plates can be arranged between the wing portion and the second end of the electrode plates.
• Multiple support plates are used to ensure a constant interval or gap, and the support plates can be arranged in a variety of ways, which improves the diversity of the support plate settings, ensures a constant interval, and improves the accuracy of the liquid level sensor measurement.
• a plurality of electrode plates are arranged so the respective planar portions of the electrode planes are parallel to one another and the respective wing portions of the electrode planes extend outwardly from the planar portions in a direction away from one another.
• one or more convex parts i.e., pads or protrusions are provided on the conductive part of the wing portion. This arrangement can make the welding of the conductive pin to the conductive part more precise, make the connection between the electrode plate and the conductive pin more stable, and make the measurement of the liquid level sensor more accurate.
• Example one provides a liquid level sensor as shown in Figures 2, 3 and 4.
• the liquid level sensor includes a metal cover plate 401 , a plurality of conductive pins 402, each conductive pin passing through the metal cover plate 401, a plurality of electrode plates 201 , a plurality of support plates 301 , each support plate 301 supporting the plurality of electrode plates 201 , so that the plurality of electrode plates 201 maintain a fixed interval, gap or distance.
• Each electrode plate 201 of the electrode plate 201 includes a wing portion 202 extending outward from a planar portion of the electrode plate 201 , and the conductive pin 402 is connected to the wing portion 202.
• the wing portion 202 has a bent part 2021 and a conductive part 2022.
• the bent part 2021 can provide a certain amount of metal elasticity, and provide buffer elasticity for the electrode plate 201 and the respective connected conductive pin 402. In various working environments of the liquid level sensor, this can improve the stability of the connection between the electrode plate and the conductive pin, and the conductive part is connected to the conductive pin for signal conduction or transmission.
• the wing portion 202 is located in the middle of the plurality of electrode plates 201 (i.e., between a first end 2023 and a second end 2024 of the electrode plates 201). Such an implementation is convenient for production.
• This embodiment provides a liquid level sensor as shown in Figs. 5, 6 and 7.
• the liquid level sensor can include a metal cover plate 701 , at least one conductive pin 702 passing through the metal cover plate 701 , multiple electrode plates 501, multiple support plates 501, each supporting, the electrode plates 501 so that a fixed interval, gap or distance between the multiple electrode plates 501 is maintained.
• Each electrode plate 501 of the multiple electrode plate 501 includes a wing portion 502 extending outward from a planar portion of the electrode plate 501. The wing portion 502 is connected to the conductive pin 702.
• the wing portion 502 includes a bent part 5021 and a conductive part 5022.
• the bent part can provide a certain amount of metal elasticity, and provide buffer elasticity for the electrode plate and the connected conductive pin. In various working environments of the liquid level sensor this can improve the stability of the connection between the electrode plate and the conductive pin, and the conductive part is electrically connected to the conductive pin for signal transmission.
• the wing portion 502 is located in the middle of the plurality of electrode plates 501 (i.e., between a first end 5023 and a second end 5024 of the electrode plates 501). Such an implementation is convenient for production.
• This embodiment provides a liquid level sensor as shown in Figures 8, 9 and 10.
• the liquid level sensor includes a metal cover plate 1001, at least one conductive pin 1002 passing through the metal cover plate 1001 , a plurality of electrode plates 801 , a plurality of support plates 901 supporting the plurality of electrode plates 801 so that the plurality of electrode plates 801 maintain a fixed interval, gap or distance from one another.
• Each electrode plate 801 includes a wing portion 802 extending outward from a planar portion of the electrode plate 801.
• a corresponding conductive pin 1002 is connected to each wing portion 802.
• the wing portion has a bent portion or part 8021 and a conductive portion or part 8022.
• the bent part can provide a certain amount of metal elasticity, and provide buffer elasticity for the electrode plate and the connected conductive pin. In various working environments of the liquid level sensor, this can improve the stability of the connection between the electrode plate and the conductive pin.
• the conductive part is electrically connected to the conductive pin for signal conduction or transmission.
• the wing portion 802 is located at the first end 8023 of each electrode plate 801 of the plurality of electrode plates, and a distance between the first end 8023 and the metal cover plate 1001 is less than a distance between the second end 8024 of each electrode plate 801 and the metal cover plate 1001.
• a distance between the first end 8023 and the metal cover plate 1001 is less than a distance between the second end 8024 of each electrode plate 801 and the metal cover plate 1001.
• This embodiment provides a liquid level sensor, as shown in Figures 11 , 12 and 13.
• the liquid level sensor includes a metal cover 1301 , a plurality of conductive pins 1302, each conductive pin penetrating or passing through the metal cover 1301 , a plurality of electrode plates 1101 , a plurality of support plates 1201 , each supporting the plurality of electrode plates 1101 so that the multiple electrode plates 1101 are maintained at a fixed interval, gap or distance apart from one another.
• Each electrode plate 1101 of the plurality of electrode plates 1101 has a wing portion 1102, the wing portion 1102 extending outward from a planar portion of the electrode plate 1101 , and the wing portion 1102 is connected to a conductive pin 1302.
• the wing portion 1102 includes a bent part or portion 11021 and a conductive part or portion 11022.
• the bent part can provide a certain amount of metal elasticity, and provide buffer elasticity for the electrode plate and the connected conductive pin. In various working environments of the liquid level sensor, this can improve the stability of the connection between the electrode plate and the conductive pin.
• the conductive part is electrically connected to the conductive pin for signal conduction or transmission.
• the wing portion 1102 is located intermediate the opposite ends 11023 and 11024 of the plurality of electrode plates 1101. Such an implementation is convenient for production.
• the liquid level sensor includes: a metal cover plate; a conductive pin through which the conductive pin penetrates the metal cover plate; a plurality of electrode plates; and a plurality of support plates supporting the plurality of electrode plates respectively, so that a fixed interval is maintained between the plurality of electrode plates; each electrode plate of the plurality of electrode plates has a wing portion, the wing portion is connected to the conductive pin, and the wing portion extends outward from each electrode plate .
• the wing portion and the electrode plate are integrally formed, and the wing portion is connected to the conductive pin, which improves the stability of the connection between the electrode plate and the conductive pin and improves the working stability of the liquid level sensor.

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• Physics & Mathematics (AREA)
• Engineering & Computer Science (AREA)
• Power Engineering (AREA)
• Electromagnetism (AREA)
• Thermal Sciences (AREA)
• Fluid Mechanics (AREA)
• General Physics & Mathematics (AREA)
• Measurement Of Levels Of Liquids Or Fluent Solid Materials (AREA)

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• 2020
  • 2020-05-08 CN CN202020746318.5U patent/CN212658310U/zh active Active
  • 2020-08-27 US US17/922,880 patent/US12130165B2/en active Active
  • 2020-08-27 EP EP20934242.7A patent/EP4147016A4/de not_active Withdrawn
  • 2020-08-27 WO PCT/US2020/048276 patent/WO2021225617A1/en not_active Ceased
  • 2020-08-27 KR KR1020227040333A patent/KR20230002855A/ko not_active Ceased

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