EP4133536A4 - Structure de diode électroluminescente et procédé de fabrication associé - Google Patents

Structure de diode électroluminescente et procédé de fabrication associé

Info

Publication number
EP4133536A4
EP4133536A4 EP21784647.6A EP21784647A EP4133536A4 EP 4133536 A4 EP4133536 A4 EP 4133536A4 EP 21784647 A EP21784647 A EP 21784647A EP 4133536 A4 EP4133536 A4 EP 4133536A4
Authority
EP
European Patent Office
Prior art keywords
manufacturing
light emitting
emitting diode
diode structure
light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP21784647.6A
Other languages
German (de)
English (en)
Other versions
EP4133536A1 (fr
Inventor
Wing Cheung Chong
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Raysolve Optoelectronics Suzhou Co Ltd
Original Assignee
Raysolve Optoelectronics Suzhou Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US17/162,515 external-priority patent/US20210320145A1/en
Application filed by Raysolve Optoelectronics Suzhou Co Ltd filed Critical Raysolve Optoelectronics Suzhou Co Ltd
Publication of EP4133536A1 publication Critical patent/EP4133536A1/fr
Publication of EP4133536A4 publication Critical patent/EP4133536A4/fr
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
    • H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
    • H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
    • H01L27/124—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/005—Processes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/005—Processes
    • H01L33/0093—Wafer bonding; Removal of the growth substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/04—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a quantum effect structure or superlattice, e.g. tunnel junction
    • H01L33/06—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a quantum effect structure or superlattice, e.g. tunnel junction within the light emitting region, e.g. quantum confinement structure or tunnel barrier
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/36—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/36—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
    • H01L33/38—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes with a particular shape
    • H01L33/385—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes with a particular shape the electrode extending at least partially onto a side surface of the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/44—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0016—Processes relating to electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0025—Processes relating to coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Led Devices (AREA)
  • Led Device Packages (AREA)
EP21784647.6A 2020-04-09 2021-03-26 Structure de diode électroluminescente et procédé de fabrication associé Pending EP4133536A4 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US202063007829P 2020-04-09 2020-04-09
US17/162,515 US20210320145A1 (en) 2020-04-09 2021-01-29 Light Emitting Diode Structure and Method for Manufacturing the Same
PCT/CN2021/083179 WO2021203987A1 (fr) 2020-04-09 2021-03-26 Structure de diode électroluminescente et procédé de fabrication associé

Publications (2)

Publication Number Publication Date
EP4133536A1 EP4133536A1 (fr) 2023-02-15
EP4133536A4 true EP4133536A4 (fr) 2024-05-08

Family

ID=76333624

Family Applications (1)

Application Number Title Priority Date Filing Date
EP21784647.6A Pending EP4133536A4 (fr) 2020-04-09 2021-03-26 Structure de diode électroluminescente et procédé de fabrication associé

Country Status (4)

Country Link
EP (1) EP4133536A4 (fr)
JP (2) JP2023525439A (fr)
KR (1) KR20220139993A (fr)
CN (1) CN112992964B (fr)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114023861A (zh) * 2021-11-01 2022-02-08 镭昱光电科技(苏州)有限公司 Micro-LED芯片结构及其制作方法
CN114497333A (zh) * 2021-12-21 2022-05-13 镭昱光电科技(苏州)有限公司 Micro-LED微显示芯片及其制作方法
CN114628563B (zh) * 2022-05-12 2022-09-09 镭昱光电科技(苏州)有限公司 Micro LED显示芯片及其制备方法
CN114759130B (zh) * 2022-06-15 2022-09-02 镭昱光电科技(苏州)有限公司 一种Micro-LED显示芯片及其制备方法
CN115498089B (zh) * 2022-11-16 2023-02-17 镭昱光电科技(苏州)有限公司 微显示器件及制备方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20180287027A1 (en) * 2017-03-30 2018-10-04 Vuereal Inc. Vertical solid-state devices
US20190164947A1 (en) * 2017-11-24 2019-05-30 Lumens Co., Ltd. Method for fabricating high-efficiency micro-led module

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4020838B2 (ja) * 2003-07-14 2007-12-12 三洋電機株式会社 発光素子アレイ及び光プリントヘッド
KR100867541B1 (ko) * 2006-11-14 2008-11-06 삼성전기주식회사 수직형 발광 소자의 제조 방법
US8642363B2 (en) * 2009-12-09 2014-02-04 Nano And Advanced Materials Institute Limited Monolithic full-color LED micro-display on an active matrix panel manufactured using flip-chip technology
CN202332853U (zh) * 2011-10-19 2012-07-11 贵州大学 大功率倒装阵列led芯片
JP2015181138A (ja) * 2012-07-27 2015-10-15 株式会社ブイ・テクノロジー 半導体発光装置
US9153548B2 (en) * 2013-09-16 2015-10-06 Lux Vue Technology Corporation Adhesive wafer bonding with sacrificial spacers for controlled thickness variation
WO2016122725A1 (fr) * 2015-01-30 2016-08-04 Technologies Llc Sxaymiq Micro-diode électroluminescente pourvue d'un miroir latéral métallique
CN109417082B (zh) * 2016-03-18 2023-08-01 Lg伊诺特有限公司 半导体器件以及包括半导体器件的显示装置
JP6815129B2 (ja) * 2016-08-26 2021-01-20 株式会社沖データ 半導体装置、光プリントヘッド、及び画像形成装置
CN106876406B (zh) * 2016-12-30 2023-08-08 上海君万微电子科技有限公司 基于iii-v族氮化物半导体的led全彩显示器件结构及制备方法
KR102422386B1 (ko) * 2017-04-21 2022-07-20 주식회사 루멘스 마이크로 led 디스플레이 장치 및 그 제조방법
TWI689092B (zh) * 2017-06-09 2020-03-21 美商晶典有限公司 具有透光基材之微發光二極體顯示模組及其製造方法
US10177178B1 (en) * 2017-07-05 2019-01-08 Gloablfoundries Inc. Assembly of CMOS driver wafer and LED wafer for microdisplay
JP7268972B2 (ja) * 2017-09-07 2023-05-08 キヤノン株式会社 発光サイリスタ、発光サイリスタアレイ、露光ヘッド、および画像形成装置
CN108598104A (zh) * 2018-06-25 2018-09-28 广东省半导体产业技术研究院 一种并联微led阵列及其制作方法
CN109713089A (zh) * 2018-12-28 2019-05-03 映瑞光电科技(上海)有限公司 GaN基LED白光垂直结构芯片及其制备方法
CN109920814B (zh) * 2019-03-12 2022-10-04 京东方科技集团股份有限公司 显示基板及制造方法、显示装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20180287027A1 (en) * 2017-03-30 2018-10-04 Vuereal Inc. Vertical solid-state devices
US20190164947A1 (en) * 2017-11-24 2019-05-30 Lumens Co., Ltd. Method for fabricating high-efficiency micro-led module

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2021203987A1 *

Also Published As

Publication number Publication date
JP2023525439A (ja) 2023-06-16
CN112992964B (zh) 2023-07-07
JP2024059811A (ja) 2024-05-01
CN112992964A (zh) 2021-06-18
KR20220139993A (ko) 2022-10-17
EP4133536A1 (fr) 2023-02-15

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