EP4076826A1 - Procédé de gravure d'un motif sur un revêtement déposé sur un substrat; substrat correspondant - Google Patents
Procédé de gravure d'un motif sur un revêtement déposé sur un substrat; substrat correspondantInfo
- Publication number
- EP4076826A1 EP4076826A1 EP20848862.7A EP20848862A EP4076826A1 EP 4076826 A1 EP4076826 A1 EP 4076826A1 EP 20848862 A EP20848862 A EP 20848862A EP 4076826 A1 EP4076826 A1 EP 4076826A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- engraving
- substrate
- etching
- speed
- travel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
- B23K26/355—Texturing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/0006—Working by laser beam, e.g. welding, cutting or boring taking account of the properties of the material involved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
- B23K26/0838—Devices involving movement of the workpiece in at least one axial direction by using an endless conveyor belt
- B23K26/0846—Devices involving movement of the workpiece in at least one axial direction by using an endless conveyor belt for moving elongated workpieces longitudinally, e.g. wire or strip material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/362—Laser etching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
- B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/34—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions
- C03C17/36—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal
- C03C17/40—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal all coatings being metal coatings
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/34—Coated articles, e.g. plated or painted; Surface treated articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/30—Organic material
- B23K2103/42—Plastics
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
- B23K2103/54—Glass
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C2218/00—Methods for coating glass
- C03C2218/30—Aspects of methods for coating glass not covered above
- C03C2218/32—After-treatment
- C03C2218/328—Partly or completely removing a coating
Definitions
- the present invention relates to the field of etching a coating deposited on a substrate.
- lasers in the context of glass processes in order to heat the coating.
- one or more laser beams are used to form a line making it possible to heat treat a substrate.
- a laser for etching the substrate in particular for marking.
- a laser beam is focused on the substrate to etch it. This engraving can be used for identification.
- one solution consists in reducing the shielding effect of the metal coatings. This reduction is obtained by iaser etching. This iaser etching involves locally etching the coating to reduce the shielding effect.
- the present invention therefore proposes to resolve these drawbacks by providing an etching process making it possible to etch the coating of a substrate according to a defined pattern in an efficient manner.
- the invention consists of a method of etching a pattern on a coating deposited on a substrate, said substrate defying at a speed V3, said pattern being produced by a processing unit generating a laser beam in the form of a engraving point capable of moving in the direction of travel with an amplitude A1 at a speed V1 greater than V3 on at least one line portion and in a direction orthogonal to the direction of travel with an amplitude A2 at a speed V2 over at minus a portion of a line.
- Said method comprising the following steps:
- the lines of the pattern are etched in the same direction from upstream of the substrate to downstream or vice versa.
- the displacement of the beam from the etching end point PAi to an etching starting point PDi + 1 is obtained by a displacement in the direction of travel and a displacement in a direction orthogonal to the direction of travel.
- the lines of the pattern are etched alternately in the direction from upstream of the substrate to downstream or vice versa.
- the displacement of the beam from the etching end point PAi to an etching starting point PDi + 1 consists of a displacement in a direction orthogonal to the running direction, the shift by a distance dx being obtained by scrolling of the substrate.
- the invention also relates to a method for etching a coating deposited on a substrate, characterized in that it comprises the following steps:
- the invention also relates to a method of etching a coating deposited on a substrate, said substrate moving at a speed V3, said pattern being produced by a processing unit generating a laser beam in the form of an etching point capable of being moving along the direction of travel with an amplitude A1 at a speed V1 and in a direction orthogonal to the direction of travel with an amplitude A2 at a speed V2, said method comprising the following steps:
- said coating is treated so as to be etched in the direction of travel by the method of etching a coating according to the invention and / or to be etched in a direction orthogonal to the direction of travel by the process of treatment of a coating according to the invention.
- said substrate is divided into a plurality of zones each extending over the entire length of the substrate in the direction of travel, these zones being parallel to each other, the coating of each zone being treated in parallel.
- the etching in the direction of travel of several areas uses a processing unit capable of generating a number of beams equal to the number of areas to be treated and / or the etching in the direction orthogonal to the direction of travel of several areas. uses a processing unit capable of generating a number of beams equal to the number of areas to be treated.
- the processing unit allows each beam to move on the surface of the substrate, in the direction of travel and / or the direction orthogonal to the direction of travel, at a speed greater than 1.5 m / s, preferably greater than 10 m / s, more preferably greater than 20 m / s.
- the speed ratio between the speed of movement V3 of the substrate and the speed V1, V2 according to the direction of travel and / or the direction orthogonal to the direction of travel is greater than 10, preferably greater than 50.
- the etching perimeter of each processing unit has an amplitude A1 greater than 100 mm, preferably greater than 150 mm.
- the etching perimeter of each processing unit has an amplitude A2 greater than 100 mm, preferably greater than 150 mm.
- the method is capable of treating an area with a width greater than 1 m, preferably 1.5 m and even more preferably 3 m.
- the invention further relates to a substrate on which a coating is deposited, characterized in that said coating is treated by the etching process according to the invention.
- said substrate is glass.
- said substrate is a polymer
- the coating is metallic.
- FIG, 2 is a schematic representation of a pattern to be engraved according to a first embodiment of the invention
- -the fig. 3 and 4 are schematic representations of two cycles of steps making it possible to obtain the pattern to be engraved in a first embodiment of the invention
- -the fig. 5a and 5b are schematic representations of several associated patterns according to a first embodiment of the invention.
- -the fig. 6, 7 and 8 are schematic representations of two cycles of steps making it possible to obtain a pattern to be engraved in a second embodiment of according to the invention
- -the fig. 9 is a schematic representation of a substrate treated according to the first embodiment of the invention with several contiguous areas;
- -the fig. 10 is a schematic representation of an alternative processing unit
- -the fig. 11 is a schematic representation of a substrate treated according to the first embodiment and the second embodiment according to the invention.
- -the fig. 12 to 14 are diagrams relating to the number of achievable lines.
- a laser treatment device 1 comprises displacement means 2 allowing the conveying of a substrate S as shown in FIG. 1a.
- This substrate S is a substrate of the glass type or of the polymer type, transparent or not, on which a coating is deposited.
- This coating is metallic or not.
- This substrate is preferably a large substrate of at least 1.5m in width I and 2m in length L, preferably 3m wide and 6m long.
- This coating includes at least one layer of a metallic material.
- the displacement speed V3 is at least 3 m / min, preferably at least 5 m / min or even 10 m / min.
- the iaser treatment device 1 further comprises a treatment unit 20 for treating the surface of the coating.
- a treatment unit 20 for treating the surface of the coating By surface treatment, it is understood processes of modification of the material affecting depths less than 10% of the thickness of the treated product.
- the surface treatment can comprise, for example, ablation, annealing, marking, texturing, a chemical reaction.
- This processing unit 20 is used for etching, a pattern, locally the coating on a zone Z of width Iz and length Lz.
- the width Iz is equal to the width I of the substrate and the length Lz is equal to the length L of the substrate.
- This processing unit 20 comprises a laser source 22 generating a primary beam F of energy E.
- the beam F has the shape of a point, that is to say that its surface is less than 31000 ⁇ m 2 and / or that its shape is cylindrical symmetry.
- the iaser beam F supplied has a diameter d and a repetition rate r such that two successive pulses overlap on at least a portion of their surface.
- the beam F passes through a scanning element 25 allowing the iaser beam to move on the substrate to be treated at at least one speed V1 greater than the speed V3.
- the scanning element 25 is designed to allow said beam to move in a direction parallel to the direction of travel and in a direction orthogonal to the direction of travel.
- the scanning element 25 allows an amplitude A1 of the beam according to the direction of travel according to a speed V1 and an amplitude A2 of the beam according to a direction orthogonal to the direction of travel according to a speed V2, the speeds V1 and V2 can be equal or non-variable or constant, for example, these speeds are greater than 1.5 m / s, preferably greater than 10 m / s, more preferably greater than 20 m / s and the amplitudes Ai and A2 are greater than 100 mm, preferably greater than 150 mm
- the scanning element 25 is used to process a coating on a substrate S.
- the scanning element 25 makes it possible to process the substrate S in the direction of travel as visible in FIG. 1b.
- the first embodiment consists in producing a pattern M which is repeated to obtain the treatment of the zone Z to be treated.
- the scanning element 25 is then used to carry out a process for engraving a pattern.
- This pattern M comprises a plurality of lines n as visible in FIG. 2, the lines n being spaced at a distance of.
- This method of engraving a pattern M comprises a first step consisting in carrying out the engraving of a first line n1.
- This first line n1 comprises a starting point PD1 and an ending point PA1.
- This first line has a length 11 and has a shape fi. This shape is preferably rectilinear ., Parallel to the direction of travel ., But can also be curved or wavy.
- a second step is to engrave at least one other ni line.
- This other line also includes a start point PDI and an end point PAL a length li and has a shape fi.
- the form fi and the length li is identical to the length I1 and to the form f1 of the first line.
- This second step of engraving a line ni is carried out by operating sub-steps.
- a first sub-step consists in moving the beam from the etching end point PAi-1 to the etching starting point PDi at a speed V1, V2, said etching starting point PDi being offset from the end point of etching Pal-1 with a distance dx in the direction of scrolling and a distance dy in a direction orthogonal to the direction of scrolling.
- the engraving of a line other than the first line n1, for example a second line n2 consists in moving the laser beam from the arrival point PA1 to the starting point PD2, this point PD2 being shifted in the direction of scrolling and in the direction orthogonal to said scrolling direction with respect to the point of arrival PA1.
- a second sub-step consists of engraving the line ni with a length li between said starting point of engraving PDi and an end point of engraving PAL
- This second step is repeated a plurality of times making it possible to produce the pattern M with n lines.
- This second step can be done in several different ways. These ways relate to the displacements made to carry out the shifting and the engraving. This movement can be made in a rectilinear or curved manner and can be associated with an engraving or not.
- the engraving lines of the pattern M are produced so that the arrival points PAi are all located upstream of the substrate relative to PDI starting points.
- the engraving consists of a movement from downstream to upstream.
- the shift between said starting point of engraving PDI and the ending point of engraving PAi is effected by a displacement of a distance dx in the direction of travel and by a displacement of a distance dy according to a direction orthogonal to the direction of scrolling.
- the starting point of etching PDi is located upstream with respect to the starting point of etching PDi-1.
- the starting point PDi is shifted by a distance of from the starting point PDi-1.
- the engraving lines n of the pattern M are produced so as to have an alternation in the upstream-downstream direction of engraving.
- the etching points located upstream of the substrate consist of an alternation of arrival points PA and starting points PD, and vice versa for the etching points located downstream.
- the path traveled by the laser point with an identical number of lines n is longer than in the case illustrated in FIG. 4 because the point must always return downstream between a line ni and a line ni + 1.
- the etching of the pattern M is therefore longer, which limits the maximum scrolling speed authorized for the substrate.
- the case illustrated in FIG. 4 advantageously makes it possible to reduce the travel time and to simplify the instruction sent to the scanning modules.
- a third step of the method for etching the pattern M consists in controlling the laser device so that the beam moves from the etching point of the etching end point PAn + x from the last line nx to the etching end point Pa1 of the first line n1. It will be understood that the etching can also be carried out during the movement between the arrival point PAi-1 of the line ni-1 and the starting point PDI of the line ni.
- the pattern of Figure 5b is obtained.
- the process for treating a coating deposited on a substrate comprises various steps consisting in producing a succession of pattern Mi as visible in FIG. 5a.
- a first step in this coating treatment process consists of providing a coated substrate and running it at a speed V3.
- a second step consists in producing a first pattern M1 using the method for etching the pattern M explained previously.
- the first pattern M1 has a first straight line n1 of length 11 between an engraving start point PD1 and an engraving end point PA1.
- a third step consists in repeating the step of producing a pattern M.
- this third step consists in repeating the engraving of the pattern M so that the starting point of engraving PD1 of the first line ni of the pattern Mi + 1 coincides substantially with the engraving end point PA1 first line of the pattern Mi.
- the engraving starting point PD1 of the first line of the pattern Mi + 1 and the engraving end point PA1 first line of the pattern Mi are considered to be coincident if the distance between them is less than twice the point size, preferably the point size or if it is less than the 1 mm pitch.
- This arrangement of the patterns M thus allows a relative continuity of the lines n of the different patterns between them in order to carry out an engraving over the length of the substrate, or, in the absence of real continuity, this arrangement allows someone looking at the product at more than one meter away from not seeing any discontinuity.
- the number of lines n that can be produced for a pattern M depends on the running speed, on the laser device and on the pattern M itself. Indeed, there are two invariable data which are the scrolling speed and the amplitudes A1, A2 of the scanning element.
- the laser beam must be able to move, for each pattern, from the point of engraving of the engraving end point PAi + x of the last line nx to the end point PA1 of engraving of the first line n1 before the latter does not. or taken out of the field A1, A2 of the scanning element.
- the number of lines n in a direction orthogonal to the running direction depends on the spacing between the lines which is equal to the distance dy.
- Concerning the amplitude A1 it is necessary that the time taken by the point to etch X lines n and return to the end point PA1 of the line n1 of the previous pattern Mi-1 is less than the time taken by the substrate to travel 11. It is impossible to etch lines from upstream to downstream whose length 11 is greater than Ai.
- the scanning speed and the length of the line are also parameters to be taken into account.
- the length of the line has its importance on the number of possible lines. Indeed, if the length of the line then increases, for a given scanning speed and a defined time, more lines can be made, since the point moves faster than the substrate.
- Figure 14 shows a curve of the number of lines as a function of the length of the line with a curve 1 for a glass substrate 3 m wide and a running speed of 10 m / min and a curve 2 for a plastic substrate of 1.5 m wide and a web speed of 2Gm / min. If the length of the line increases then the distance to be traveled by the beam to engrave a line and move to the starting position of the engraving of the next line is also likely to increase. If the scanning speed (s) V1, V2 are greater than the travel speed V3 of the substrate S, the scan can then potentially take enough lead on the substrate to etch more lines, within the limit of the amplitude a1 of the perimeter.
- the scanning means are such that the scanning speed is between 1.5 and 30m / s, that the length of the line varies between 10 and 50mm and that the ratio between the speed of scanning and the scrolling speed is at least 10, preferably 20 and even more preferably 50. This allows to have a processing device which processes between 3 and 1Qm2 per minute.
- a laser developing an energy of 600 ⁇ J on a coating comprise a stack provided with two silver-based layers on a glass substrate with a width of 3 m running at iOm / min, the coating requiring an energy of 4m ⁇ to be engraved, it is possible to obtain, for a speed of movement of the optical unit of 20m / s on an amplitude ai, a2 of 150mm a grid of 3mm on the side, each optical unit in which a laser beam enters being suitable to generate 8 parallel lines.
- 7 processing modules 20 should be used.
- each optical unit into which a laser beam enters being able to generate 4 parallel lines.
- 4 processing modules 20 should be used.
- the scanning element makes it possible to process the substrate in the direction orthogonal to the direction of travel.
- the second embodiment relates to an etching process in the direction orthogonal to the direction of travel of a coating deposited on a substrate traveling at a speed V3.
- the etching process comprises various steps.
- the first step is to take a coated substrate and run it at V3 speed.
- the second step consists in carrying out an engraving of a portion pj of a length L1 between an engraving starting point (Pdj) and an engraving end point (Paj) and of form fj.
- This portion is produced by moving the laser beam with a speed and an angle of displacement of the etching point making it possible to obtain a first rectilinear portion and perpendicular to the direction of displacement.
- parallel portions are made. For this, a sequence is repeated, the sequence comprises various sub-steps making it possible to go from a portion pj to a portion pj + 1.
- a first sub-step consists in carrying out an installation step.
- This setting in step consists in positioning the laser beam at the starting point of engraving Pdj + 1 of the next portion pj + 1 to be engraved. For this, several solutions are considered.
- a first solution visible in FIG. 6, consists in moving the laser beam in the direction of travel and in the direction orthogonal to the direction of travel in order to reach the starting point of engraving Pdj + 1 of the portion pj + 1.
- the starting points Pd of each portion p are all on the same side of the substrate.
- a second solution consists in moving the laser beam in the direction of travel to reach the starting point of engraving Pdj + 1 of the portion pj + 1.
- the starting points Pd of each portion p are not all on the same side of the substrate.
- On one side of the substrate there is an alternation of starting points Pd and ending points Pa.
- a third solution consists in using the movement of the substrate as a means for effecting the displacement in the direction of movement. So just leave the beam at the Paj engraving end point and wait.
- a second sub-step consists in carrying out the engraving of said next portion pj + 1 with a length 11 between the starting point of engraving Pdj + 1 and an end point of engraving Paj + 1. For this, the laser beam is moved with a speed and an angle of displacement of the etching point allowing said following portion pi + 1 to be parallel to the previous portion pi.
- the displacement of the beam during the etching of the portion pj + 1 is identical to that used to etch the portion pi.
- the displacement of the beam during the engraving of the portion pj + 1 is the symmetrical of the displacement carried out during the engraving of the portion pj with respect to an axis parallel to the direction of travel.
- the speed and the angle of displacement of the etching point make it possible to obtain a rectilinear portion perpendicular to the direction of displacement and are identical but the different direction left-right / right-left.
- the treatments of two contiguous zones Z along the width of the substrate S are such that the patterns M of these two zones Z complement each other.
- the patterns of two contiguous Z zones can be produced to form, in the end, a rhombus as visible. in figure 8.
- the processing unit 20 generates this multitude of beams f by a laser source generating the primary beam F coupled to a splitter 24 making it possible to generate this plurality of secondary beams, these secondary beams are coupled to an element of scanning 25 making it possible to move according to an amplitude A1 in the direction of travel and according to an amplitude A2 in a direction orthogonal to the direction of travel as visible in FIG. 10.
- the laser processing device is arranged to allow the treatment of a coating on a substrate to engrave lines according to the direction of travel using the method of the first embodiment and lines orthogonal to the direction of travel using the method of the second embodiment.
- This variant advantageously makes it possible to engrave a grid on said coating as visible in FIG. 11.
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- Engineering & Computer Science (AREA)
- Optics & Photonics (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Life Sciences & Earth Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Laser Beam Processing (AREA)
- Surface Treatment Of Glass (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- ing And Chemical Polishing (AREA)
Abstract
Description
Claims
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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FR1915197A FR3105045B1 (fr) | 2019-12-20 | 2019-12-20 | Gravure de substrat revetu |
PCT/FR2020/052569 WO2021123690A1 (fr) | 2019-12-20 | 2020-12-18 | Procédé de gravure d'un motif sur un revêtement déposé sur un substrat; substrat correspondant |
Publications (1)
Publication Number | Publication Date |
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EP4076826A1 true EP4076826A1 (fr) | 2022-10-26 |
Family
ID=71661905
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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EP20848862.7A Pending EP4076826A1 (fr) | 2019-12-20 | 2020-12-18 | Procédé de gravure d'un motif sur un revêtement déposé sur un substrat; substrat correspondant |
Country Status (4)
Country | Link |
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US (1) | US20230045271A1 (fr) |
EP (1) | EP4076826A1 (fr) |
FR (1) | FR3105045B1 (fr) |
WO (1) | WO2021123690A1 (fr) |
Families Citing this family (1)
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CN113735460B (zh) * | 2021-08-25 | 2023-04-07 | 福建省万达汽车玻璃工业有限公司 | 镀膜玻璃及其制造方法、以及车窗 |
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KR920006681B1 (ko) * | 1986-07-09 | 1992-08-14 | 마쯔시다덴기산교 가부시기가이샤 | 레이저 가공방법 |
DE102008014263A1 (de) * | 2008-03-13 | 2009-09-24 | Schott Solar Gmbh | Verfahren und Vorrichtung zur Bildung der Trennlinien eines fotovoltaischen Moduls mit serienverschalteten Zellen |
US20090266804A1 (en) * | 2008-04-24 | 2009-10-29 | Costin Darryl J | Combination extrusion and laser-marking system, and related method |
WO2010086865A1 (fr) * | 2009-02-02 | 2010-08-05 | Advanced Dicing Technologies Ltd. | Système et procédé pour le traitement de matériau par laser grande vitesse |
US8263899B2 (en) * | 2010-07-01 | 2012-09-11 | Sunpower Corporation | High throughput solar cell ablation system |
FR2971960B1 (fr) * | 2011-02-25 | 2013-02-22 | Saint Gobain | Traitement thermique de revetement par laser |
JP6058131B2 (ja) * | 2012-07-04 | 2017-01-11 | サン−ゴバン グラス フランスSaint−Gobain Glass France | 少なくとも2つのブリッジを用いて大面積の基板をレーザ加工する装置及び方法 |
DE102014014889A1 (de) * | 2014-10-13 | 2016-04-14 | Boraident Gmbh | Verfahren zur Herstellung eines Fassadenelementes aus Glas zur Abschirmung von Licht und Fassadenelement |
JP6647888B2 (ja) * | 2016-01-29 | 2020-02-14 | ビアメカニクス株式会社 | レーザ加工方法及びレーザ加工装置 |
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2019
- 2019-12-20 FR FR1915197A patent/FR3105045B1/fr active Active
-
2020
- 2020-12-18 US US17/787,081 patent/US20230045271A1/en active Pending
- 2020-12-18 EP EP20848862.7A patent/EP4076826A1/fr active Pending
- 2020-12-18 WO PCT/FR2020/052569 patent/WO2021123690A1/fr unknown
Also Published As
Publication number | Publication date |
---|---|
FR3105045B1 (fr) | 2022-08-12 |
US20230045271A1 (en) | 2023-02-09 |
FR3105045A1 (fr) | 2021-06-25 |
WO2021123690A1 (fr) | 2021-06-24 |
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