EP4067104A1 - Procédé de fabrication pour un élément de sécurité optiquement variable - Google Patents

Procédé de fabrication pour un élément de sécurité optiquement variable Download PDF

Info

Publication number
EP4067104A1
EP4067104A1 EP22020007.5A EP22020007A EP4067104A1 EP 4067104 A1 EP4067104 A1 EP 4067104A1 EP 22020007 A EP22020007 A EP 22020007A EP 4067104 A1 EP4067104 A1 EP 4067104A1
Authority
EP
European Patent Office
Prior art keywords
embossing
lacquer
layer
varnish
feature
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP22020007.5A
Other languages
German (de)
English (en)
Other versions
EP4067104B1 (fr
Inventor
Winfried HOFFMÜLLER
Tobias Sattler
Andreas Rauch
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Giesecke and Devrient Currency Technology GmbH
Original Assignee
Giesecke and Devrient Currency Technology GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Giesecke and Devrient Currency Technology GmbH filed Critical Giesecke and Devrient Currency Technology GmbH
Publication of EP4067104A1 publication Critical patent/EP4067104A1/fr
Application granted granted Critical
Publication of EP4067104B1 publication Critical patent/EP4067104B1/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
    • B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
    • B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
    • B42D25/40—Manufacture
    • B42D25/405—Marking
    • B42D25/43—Marking by removal of material
    • B42D25/445—Marking by removal of material using chemical means, e.g. etching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
    • B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
    • B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
    • B42D25/30—Identification or security features, e.g. for preventing forgery
    • B42D25/36—Identification or security features, e.g. for preventing forgery comprising special materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
    • B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
    • B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
    • B42D25/30—Identification or security features, e.g. for preventing forgery
    • B42D25/324—Reliefs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
    • B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
    • B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
    • B42D25/30—Identification or security features, e.g. for preventing forgery
    • B42D25/36—Identification or security features, e.g. for preventing forgery comprising special materials
    • B42D25/373—Metallic materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
    • B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
    • B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
    • B42D25/40—Manufacture
    • B42D25/405—Marking
    • B42D25/415—Marking using chemicals
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
    • B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
    • B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
    • B42D25/40—Manufacture
    • B42D25/405—Marking
    • B42D25/425—Marking by deformation, e.g. embossing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
    • B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
    • B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
    • B42D25/40—Manufacture
    • B42D25/405—Marking
    • B42D25/43—Marking by removal of material
    • B42D25/44—Marking by removal of material using mechanical means, e.g. engraving

Definitions

  • the invention relates to a manufacturing method for an optically variable security element for protecting valuables, which contains a carrier and a feature layer with first and second feature areas in which different first and second embossing lacquer layers are present.
  • Data carriers such as value or ID documents, but also other valuables, such as branded items, are often provided with security elements for protection, which allow the authenticity of the data carrier to be checked and which at the same time serve as protection against unauthorized reproduction.
  • the security elements can be designed, for example, in the form of a security thread embedded in a bank note, a cover film for a bank note with a hole, an applied security strip, a self-supporting transfer element or also in the form of a feature area applied directly to a document of value.
  • optically variable security elements which have two relief structures which are arranged at different height levels and are each provided with a color coating and which are embossed in suitably colored embossed lacquer layers, see FIG WO 2020/011390 A1 , WO 2020/011391 A1 and WO 2020/011392 A1 .
  • the viewer in order to view the deeper-lying relief structure, the viewer usually has to look through the embossing lacquer layer of the higher-lying relief structure, so that depending on the desired visual impression for the coloring of the embossing lacquers, in particular the embossing lacquer of the higher-lying embossing lacquer layer, there can be considerable restrictions.
  • the invention is based on the object of specifying a method with which generic optically variable security elements can be produced with high register accuracy of the different first and second embossing lacquer layers.
  • the invention provides a method for producing a security element which can be used in particular to protect valuables.
  • the security element to be produced contains a feature layer with first and second feature areas in which different first and second embossing lacquer layers are present.
  • a layer of a first embossing lacquer is applied to a carrier in the first feature areas.
  • a layer of a second, different embossing lacquer is then applied over the entire surface, so that the second embossing lacquer is present in the second feature regions on the carrier.
  • the one through the two layers of embossing lacquer The feature layer formed is then partially removed from its free upper side.
  • the first embossing lacquer areas are uncovered, so that in the first feature areas the first embossing lacquer layer and in the second feature areas the second embossing lacquer layer lie next to one another with an exact register.
  • a precisely registered arrangement of feature regions refers in particular to an arrangement in which the feature regions abut one another or are arranged at a predetermined, defined small distance from one another.
  • a close distance is in particular a distance of a few microns or a few tens of microns up to 100 ⁇ m and in some applications up to 200 ⁇ m.
  • the carrier can remain permanently in the security element or it can represent a production carrier which is removed from the security element again after the security element has been transferred to a target substrate.
  • a system If a system has to dry physically, it usually has to be dried before embossing.
  • Crosslinking reactions for example by radiation, or slower reactions (e.g. in 2K systems) should generally take place after embossing, as they can make embossing difficult or even impossible.
  • the second embossing varnish is preferably applied in such a way that it is also present, at least partially or over the entire surface, in the first feature areas (40) on the areas with, in particular dried or pre-cured, first embossing varnish (42).
  • the first embossing varnish is preferably dried or pre-cured before the removal, in particular before the application of the second embossing varnish.
  • An actual crosslinking reaction can thus take place during or after embossing or can only be triggered during or after embossing, in particular by irradiation.
  • the first embossing lacquer is applied in a first layer thickness d 1 , and preferably dried or pre-cured, which is greater than the desired target layer thickness d 0 .
  • the second embossing varnish is applied over the entire surface in a second layer thickness d 2 which is greater than the desired target layer thickness d 0 and preferably greater than the first layer thickness d 1 .
  • the second embossing lacquer layer is then present on the carrier with the second layer thickness d 2 .
  • the second embossing lacquer is at least partially present, preferably over the entire surface and/or with a layer thickness of at least or exactly d 2 -d 1 , only alternatively only partially.
  • the second embossing varnish is preferably dried or pre-cured.
  • the feature layer formed by the two embossing lacquer layers is removed mechanically down to the desired target layer thickness d 0 .
  • the second embossing varnish is preferably applied in several steps and after each application step a wiping or doctoring step takes place in order to keep the layer thickness of the second embossing varnish small on the areas with dried or cured first embossing varnish.
  • the feature layer formed by the two embossing lacquer layers is removed with a milling machine down to the desired target layer thickness d 0 .
  • the two embossing varnishes advantageously have different optical properties, in particular different colors.
  • mechanical ablation can incrementally remove material from the exposed top of the feature layer at increasing depths, and the end point of the mechanical ablation can be determined by analysis of the optical properties, particularly the color, of the ablation material.
  • the end point is preferably determined by checking whether the color of the first embossing varnish also appears in the ablation material in addition to the color of the second embossing varnish.
  • the first and second embossing varnish are matched to one another, so that the second embossing varnish is soluble in a removal medium, while the first embossing varnish is insoluble in the removal medium, at least in the dried or hardened state.
  • the second embossing varnish is dried and the second embossing varnish is removed with the removal medium until the areas with dried or hardened first embossing varnish are exposed. The removal process is then stopped.
  • the second embossing varnish is preferably applied in several steps and after each application step there is a wiping or squeegee step in order to keep the layer thickness of the second embossing varnish small on the areas with dried or cured first embossing varnish.
  • the second embossing lacquer can in particular contain a colorant or color pigments, with the concentration of the colorant or color pigments preferably being reduced as the number of application steps increases. It is also possible to reduce the amount or the layer thickness of the applied embossing varnish with an increasing number of application steps.
  • the second embossing varnish is advantageously applied once or several times until the second embossing varnish in the second feature areas fills the depressions between the areas with dried or hardened first embossing varnish.
  • an embossed structure is advantageously embossed into the first embossed lacquer layer, which produces a first optical effect
  • an embossed structure is embossed into the second embossed lacquer layer, which produces a second, different optical effect.
  • the embossed structures of the first and second embossed lacquer layers are advantageously essentially at the same height, which means in particular that the mean heights of the two embossed structures differ by no more than the difference in height within each embossed structure.
  • the embossing lacquer layers are each provided with an embossing structure one after the other in an earlier and a later embossing step.
  • the earlier embossing step only one of the two embossing lacquer layers is embossed, and in the later embossing step only the other of the two embossing lacquer layers is embossed, preferably by using a flexible embossing tool, a soft embossing press or a flexible compensating layer in the layer structure of the security element in order to correct the subsequent embossing structure only to be transferred to the embossed lacquer layer that has not already been embossed.
  • the two embossing varnishes have different solidification properties, and the embossing varnishes particularly preferably also have different optical properties.
  • Lacquers that harden by physical drying can be applied as embossing lacquers. If both the first and the second embossing varnish are each formed by a thermoplastic embossing varnish, they advantageously have different softening temperatures, which preferably differ by more than 10 °C, particularly preferably by more than 25 °C, in particular by more than 50 °C differentiate.
  • thermoplastics can also be used side by side as embossing lacquers, with a first “thermoplastic” being able to be post-crosslinked, for example by radiation. For example, a removal process is used until both thermoplastics are next to each other and have the same height. Neither have comparable melting points and can be embossed at the same time. After the embossing step, the first thermoplastic is crosslinked. As a result, it has a higher melting point, which means that its structure is not destroyed in the second embossing step, and the second thermoplastic can be embossed.
  • a radiation-curing, in particular UV-curing, embossing varnish is applied as an embossing varnish and a thermoplastic embossing varnish is applied as another embossing varnish.
  • designs in which both embossing varnishes are formed by UV embossing varnishes are also possible.
  • the embossing lacquers can in particular be applied in different colors, different transparency and/or different luminescence.
  • the embossing varnishes are preferably colored with a translucent color and are therefore both colored and partially translucent.
  • embossing lacquer layers of the first and second feature areas are advantageously arranged next to one another without gaps or overlaps.
  • the first and second embossing lacquer layers are provided with a common reflection-increasing coating, in particular a high-index or metallic coating.
  • This coating preferably takes place after an embossing of the first and second embossing varnish with a respective embossing structure that produces different first and second optical effects.
  • the embossed structures of the first and second embossing lacquer layers each contain structural elements with structural dimensions in the plane that are between 30 ⁇ m and 200 ⁇ m, in particular between 50 ⁇ m and 150 ⁇ m.
  • One or both embossed structures advantageously contain micromirror arrangements with directed reflecting micromirrors, in particular with non-diffractive mirrors, and preferably with planar mirrors, concave mirrors and/or Fresnel-like mirrors as structural elements.
  • optically variable security element can contain further layers, such as protective, cover or additional functional layers, machine-readable elements, primer layers or heat-sealing lacquer layers, which, however, do not represent the essential elements of the present invention and are therefore not described in detail.
  • the security element to be produced is advantageously a security thread, in particular a window security thread or a pendulum security thread, a tear-open thread, a security band, a security strip, a patch or a label for application to security paper, a document of value or the like.
  • thermoplastic lacquers also known as thermoplastics
  • lacquers with different properties typically have the properties described below, although lacquers with different properties can also be used for special applications.
  • Typical UV embossing varnish is initially much easier to emboss than thermoplastic embossing varnish.
  • a liquid embossing varnish can first be applied to a foil. This reaches the embossing tool without roller contact.
  • the film with the embossing lacquer is brought into contact with the embossing tool using an impression roller, whereby the lacquer surface adopts the structure of the embossing tool.
  • no pressure would be required, the paint would simply flow into the structures, displacing the air.
  • the embossing process on the machine is not arbitrarily slow, so that when embossing with too little impression pressure, the varnish can no longer completely displace the air in the specified time.
  • a certain embossing pressure is used when certain requirements are placed on the speed and freedom from bubbles. If UV curing were not to take place, the lacquer would flow again immediately after coming into contact with the embossing tool after the film was pulled off the embossing tool.
  • the film wraps around the embossing tool to a certain extent. If the film with the paint comes into contact with the embossing tool through the impression roller, the film normally no longer spontaneously removes itself from the embossing tool.
  • UV emitters are arranged, which cross-link the UV coating while it is still in contact with the embossing tool. Only after this reaction is the film removed from the embossing tool. The entire process usually runs continuously.
  • the paint cured in this way is usually a duroplastic.
  • thermoplastic embossing usually runs differently than the UV embossing described.
  • a thermoplastic is solid at room temperature and therefore not flowable, at elevated temperature it becomes embossable at a certain temperature. If the temperature is further increased, the lacquer becomes sticky, which limits the meaningful embossing with a standard embossing tool. If necessary, however, non-stick coated tools can be used.
  • the embossing die can be heated, embossed at an elevated temperature, and the embossing die can, if necessary, be cooled down again somewhat before demoulding. In a roll-to-roll process, there is usually no cooling before demoulding.
  • the film can be heated with contact to the embossing tool, embossed at the highest temperature and immediately removed from the mold without getting into the sticky area of the thermoplastic.
  • Such high heating that the thermoplastic actually becomes liquid is advantageously avoided.
  • the embossing tool is advantageously provided with a non-stick coating.
  • a metallization of the unembossed embossing lacquer to prevent adhesions can be provided, or care is taken to ensure that the higher-melting thermoplastic only becomes higher-melting at a later point in time. This can be ensured, for example, with the aid of the crosslinkers mentioned elsewhere (for example isocyanates) or also by radiation crosslinking.
  • two thermoplastically embossable UV raw materials can be located next to one another, with one of these two formulations containing a photoinitiator.
  • the second embossing can be done.
  • the second "thermoplastic" is left uncrosslinked or it is post-crosslinked by electron beam curing, since the latter process can be carried out without photoinitiators.
  • the second thermoplastic may also contain a photoinitiator that is not addressed at the wavelength(s) of the first emitter.
  • embossing lacquers which harden or crosslink thermally instead of photochemically.
  • embossing lacquers have a softening point T 1 and a hardening point T 2 >T 1 .
  • embossing varnishes can, for example, be based on acrylates with isocyanates.
  • a further procedure consists of selectively heating one of the embossing varnishes.
  • An area with a selectively excitable substance in the UV/visible/IR or electrically/capacitive/magnetic with an alternating field) selectively only leads to heating of the area containing this substance.
  • two areas with UV embossing varnish can also be provided and processed one after the other, in particular embossed.
  • figure 1 shows a schematic representation of a bank note 10 with an optically variable security element 12 in the form of a glued-on transfer element.
  • the invention is not limited to transfer elements and banknotes, but can be used with all types of security elements, for example labels on goods and packaging or to protect documents, ID cards, passports, credit cards, health cards and the like.
  • transfer elements such as patches with or without their own backing layer
  • security threads or security strips for example, can also be considered.
  • the security element 12 gives the viewer a three-dimensional impression and shows, for example, at the same time a binary color and effect change when the banknote 10 is tilted, in which a first three-dimensional motif in a first color is visible from a first viewing direction and a second three-dimensional motif is seen from a second viewing direction motif appears in a second colour.
  • embossing lacquer layers are arranged next to one another in a registered manner in one plane of the security element and are specifically provided with different, mutually independent embossing structures.
  • the embossing lacquer layers expediently also have other different properties, namely in particular different visual properties, such as different color, transparency and/or luminescence.
  • the optically variable effects produced by the embossing on the one hand and the visual effects produced by the additional properties of the embossing lacquer layers on the other hand can be perfectly matched to one another.
  • FIG. 2 For illustration shows 2 a schematic representation of a security element 20 with a carrier film 22 in the form of a transparent PET film which is provided with an embossed feature layer 24 .
  • the feature layer 24 consists of an alternating sequence of feature areas 30, 40 desired shape and size (only one of the feature areas is provided with reference numerals), which differ from each other both by the different glazing coloring of the applied embossing lacquer layers 32, 42, as well as by the different Formation of the respective embossed structures 34, 44 differ.
  • the embossed structures 34, 44 of the two feature regions 30, 40 lie in a common plane essentially at the same level and are provided with a common reflection-increasing metal coating 26, for example a vapor-deposited aluminum layer.
  • the metallized embossed structures are leveled with a lacquer layer 28 and the security element can be glued to the desired target substrate, such as the bank note 10 , via an adhesive layer 29 . After sticking on, the carrier substrate 22 can be pulled off or remain in the security element as a protective film.
  • the security element 20 is designed to be viewed through the translucent embossing lacquer layers 32, 42.
  • the observer 14 looks in the feature areas 30 through the embossing lacquer layer areas 32 at the metalized embossed structures 34 , while in the feature areas 40 he looks through the embossed lacquer layer areas 42 at the metalized embossed structures 44 .
  • the embossing varnish 32 can be colored red and the embossing structures 34 can produce a curved representation of the value number “10” as a motif, while the embossing varnish 42 is colored green and the embossed structures 44 produce a curved representation of a coat of arms as a motif.
  • the two motifs can also be recognizable from different viewing directions.
  • the feature areas 30, 40 with their different color effects produced by the embossing lacquer layers 32, 42 and their different motifs produced by the embossing 34, 44 are arranged in register directly next to one another without gaps or overlaps.
  • FIGS. 3 and 4 each show four intermediate steps in the production of security element 20 in (a) to (d).
  • the thermoplastic embossing varnishes 32, 42 are matched to one another in such a way that, in addition to the different colors, they also have different softening temperatures and can therefore be embossed at different temperatures.
  • the thermoplastic embossing lacquer 42 can already be embossed at a lower temperature T 2
  • the thermoplastic embossing lacquer 32 can only be embossed at a higher temperature T 1 >T 2 .
  • both embossing lacquers 32, 42 are provided with the first embossing structure 34 using a first embossing tool 50, as in FIG 3(b) illustrated.
  • the carrier film with the embossed feature layer is then cooled to the lower temperature T 2 and removed from the mold, thereby solidifying the embossing lacquer 32 in the feature areas 30 with the embossed embossing structure 34 while the embossing lacquer 42 remains deformable.
  • the embossing varnish 42 will therefore flow partially or completely after demoulding and will at best accept the first embossing incompletely, as in 3(c) indicated by reference numeral 34'.
  • the second embossing tool 52 for the second embossing step with which the second embossing structure 44 is embossed into the still deformable embossing lacquer layer 42 of the feature regions 40 at the lower temperature T 2 .
  • the embossing structure 34 of the feature regions 30 is already solidified, it is no longer significantly influenced by the second embossing step, in particular due to the measures described in more detail below.
  • the carrier film with the feature layer embossed twice is cooled to a temperature T ⁇ T 2 , for example to room temperature, and the embossing lacquer 42 in the feature areas 40 is thereby also solidified.
  • a feature layer 24 with the desired double embossing 34, 44 registered on the feature regions 30, 40 is obtained, as shown in FIG 3(d) shown.
  • the feature layer 24 can be metallized, as in 2 illustrated, or the intermediate of 3(d) can be further processed in a different way to a desired security element.
  • thermoplastic embossing varnish 32 and a UV embossing varnish 42 are used. Unlike the configurations described below, in the design of the 4 first the thermoplastic embossing varnish and only then the UV embossing varnish. Even if a UV embossing varnish is typically easier to emboss than a thermoplastic embossing varnish, when using suitable embossing varnishes and/or under suitable conditions, an embossing sequence as in 4 come into use.
  • a carrier film 22 for example a transparent, colorless PET film, is provided and coated with a thermoplastic embossing varnish 32 in the feature areas 30 and with a UV embossing varnish 42 in the feature areas 40, each with a desired different color effect.
  • the first embossing structure 34 is embossed with a first embossing tool 50 under embossing conditions in which the thermoplastic embossing lacquer 32 can be embossed, as in FIG Fig.4(b) illustrated.
  • the embossing conditions can include, for example, a temperature T 1 of 120° C. and high embossing pressure.
  • the carrier film with the embossed feature layer is then cooled to a lower temperature T 2 ⁇ T 1 and removed from the mold, and the embossing lacquer 32 in the feature regions 30 is thereby solidified.
  • the UV embossing lacquer 42 is not embossed under the embossing conditions of the first embossing step, so that after the first embossing step in the feature areas 30 the embossing lacquer 32 provided with the embossing structure 34 and in the feature areas 40 the unembossed UV embossing varnish 42 is present, as in Fig.4(c) shown.
  • the second embossing tool 52 is shown, with which the second embossing structure 44 is embossed into the UV-curable embossing lacquer layer 42 of the feature regions 40 at the lower temperature T 2 and under UV radiation 54 .
  • the heat input into the thermoplastic layer 32 can be minimized by the hardening of the embossing lacquer layer 42 by means of the radiation of a UV LED. Because of the low temperature during the second embossing step and because of the measures described in more detail below, the already solidified embossing structure 34 of the feature regions 30 is not significantly influenced by the second embossing step.
  • the embossing varnish 42 is also solidified in the feature areas 40, so that as in FIG 3 a feature layer 24 with a desired double embossing 34, 44 registered on the feature areas 30, 40 is obtained, as in FIG Figure 4(d) shown.
  • the two embossing lacquer layers 32, 42 are already present on the carrier film in the first embossing step.
  • One way to ensure that the embossing of the first embossed layer is not destroyed or damaged by the subsequent embossing step is to use a flexible embossing tool for the second embossing.
  • the structures 34 and 44 to be impressed in each case have structure dimensions L 1 and L 2 of 50 ⁇ m to 150 ⁇ m in the plane.
  • the structure height is typically in the order of a few micrometers.
  • the UV embossing varnish 42 is first provided with the desired second embossing structure 44 and then cured, as in Fig.5(a) shown.
  • the thermoplastic embossing varnish 32 can also be embossed or, as in Fig.5(a) , having remained without an imprinted structure due to flowing.
  • the first embossing structure 34 is now embossed with the aid of a flexible embossing tool 60 which carries the desired embossing structure 34 on its surface.
  • the flexible embossing tool 60 is made of silicone rubber, for example, and is deformed by pressure peaks on a length scale ⁇ of a few micrometers.
  • the feature areas 40 with the already cured UV embossing varnish 42 cause a corresponding deformation 62 of the flexible embossing tool 60 during embossing, so that on the one hand the already cured embossing varnish areas 42 are not damaged, but on the other hand embossing varnish 32 in the feature areas 30 is embossed with the embossing structure 34 can, as in Fig.5(b) illustrated.
  • transition areas 64 in which the shape of the embossing tool 60 changes greatly, have dimensions of the order of magnitude ⁇ «L 1 , L 2 , the transition areas 64 are therefore significantly smaller than the structural dimensions of the embossings 34, 44, a possibly lower Inadequate or even missing embossing in the transition areas 64 has no significant influence on the quality of the embossed structures 34 in the feature area 30 overall.
  • the feature layer 24 is therefore provided with the desired registered double embossing 34, 44 in the feature areas 30, 40, as shown in FIG Fig.5(c) shown.
  • Another possibility is related to 6 in the use of a hard embossing tool 70 in conjunction with a soft embossing press 72 and a suitable carrier film 74 in the security element.
  • the in 6(a) The initial situation shown largely corresponds to the initial situation of the Fig.5(a) , that is, on a suitable carrier film 74, described in more detail below, there is a feature layer 24, in which a thermoplastic embossing varnish 32 is applied in feature areas 30 and a UV embossing varnish 42 is applied in feature areas 40.
  • the UV embossing varnish 42 has already been provided with a desired embossing 44 in a first embossing step.
  • the structures 34, 44 to be embossed have structure dimensions L 1 and L 2 in the plane, which are between 50 ⁇ m and 150 ⁇ m.
  • a hard embossing tool 70 is used, which can consist of nickel, for example.
  • the hard embossing tool 70 is particularly well suited for embossing thermoplastic paint 32, but it is less able to compensate for differences in height than the flexible embossing tool 60 of the design figure 5 .
  • embossing always requires counter-pressure, which is generally applied by an embossing press 72 .
  • a special feature of the process is the 6 a relatively soft embossing device 72 is used, which consists of an elastomer with a hardness of less than 90 Shore, in particular less than 85 Shore.
  • the already hardened UV embossing lacquer areas 42 are pressed by the hard embossing tool 70 together with the carrier film 74 sufficiently far into the soft embossing press 72 in order to emboss the thermoplastic embossing lacquer 32 without damaging or destroying the UV embossing lacquer areas 42 to be able to
  • the feature layer 24 is then provided with the desired registered double embossing 34, 44 in the feature areas 30, 40, as shown in FIG 6(c) shown.
  • the impression can also have a structured surface be equipped, which locally limits a deformation of the impression roller.
  • a very thin carrier film 74 can be used, the thickness of which is preferably less than 23 ⁇ m, in particular less than 19 ⁇ m and particularly preferably between 6 ⁇ m and 15 ⁇ m.
  • the carrier film 74 can also be matched to the embossing conditions in that the glass transition temperature Tg of the carrier film is exceeded under the embossing conditions of the second embossing step and the film is therefore particularly easily deformable.
  • Another way to ensure that the first embossed layer is not destroyed or damaged under the embossing conditions of the later embossed layer is to provide a compensation layer 80 in the layer structure of the security element itself.
  • a compensation layer 80 is provided between a carrier film 22 and the feature layer 24, which at least in the Embossing conditions of the second embossing is flexible and preferably has elastic properties. If it is provided that the optical effect of the security element is viewed from the side of the embossing lacquer layers 32, 42 and thus also through the compensating layer, the compensating layer is preferably transparent and designed with a low scattering effect.
  • the compensation layer 80 can be formed from a silicone rubber, for example.
  • the feature layer 24 contains a thermoplastic embossing varnish 32 in the feature areas 30 and a UV embossing varnish 42 in the feature areas 40, which has already been provided with a desired embossing 44 in a first embossing step.
  • a hard embossing tool 70 which is particularly well suited for embossing a thermoplastic lacquer 32 can then be used for embossing the embossing structure 34 in the second embossing step.
  • the second embossing step of the thermoplastic lacquer 32 takes place at an elevated temperature at which the leveling layer 80 is elastic, so that the already hardened UV embossing lacquer areas 42 are pressed locally into the leveling layer 80 by the hard embossing tool 70 . This prevents the embossing structure 44 from being deformed or damaged and at the same time allows the embossing lacquer layer 32 to be embossed.
  • the layer thickness of the compensating layer 80 should be somewhat greater than the height difference to be compensated for, which is generally between 2 and 15 ⁇ m in the case of typical embossed microstructures 44 .
  • the leveling layer 80 can advantageously also deform in such a way that when the UV embossing lacquer areas 42 are pressed in, the thermoplastic embossing lacquer areas 32 are simultaneously pressed somewhat upwards and thereby support the second embossing. Such a deformation can in particular take place while preserving the volume.
  • the deformation of the elastic compensation layer 80 recovers, so that the feature layer 24 produced is provided with the desired registered double embossing 34, 44 in the feature regions 30, 40, as shown in FIG Fig.7(c) shown.
  • a carrier 90 is first printed in the feature areas 40 by any method with an embossable formulation 42 that is hydrophilic after drying and has the color or transparency desired in the feature areas 40 .
  • the formulation is a UV embossing varnish 42, which after printing is embossed in the feature areas 40 with the associated embossing structure 44 and finally cured by UV crosslinking, as in 8(a) shown.
  • the feature areas 30 are initially uncoated and represent areas with a hydrophobic surface.
  • the carrier film provided with the UV embossing varnish is then moistened with a dampening solution 92 in-line or in a separate process. Only the hydrophilically coated feature areas 40 accept the dampening solution 92, while the hydrophobic feature areas 30 remain free of dampening solution, as in Fig.8(b) illustrated.
  • a second embossing lacquer layer of a thermoplastic embossing lacquer 32 is then applied to the carrier film, for which purpose a printing cylinder 94 is used in the exemplary embodiment, on which the embossing lacquer layer 32 is provided over the entire surface, as in FIG Fig.8(b) shown.
  • the surface of the printing cylinder 94 is equipped with a compressible element 96 in order to ensure that the embossing lacquer 32 is only applied in the gaps 30 between the areas 40 that have already been coated.
  • the compressible element 96 is deformed when the embossing lacquer layer 32 is printed on by the pressure peaks generated by the already cured UV lacquer layer 42, as shown in FIG Fig.8(c) shown, so that the embossing lacquer 32 comes into contact with the carrier 90 in the non-raised feature regions 30 and is transferred there without the embossing structure 44 already present being damaged.
  • the UV embossing varnish 42 of the feature areas 40 is also in contact with the embossing varnish layer 32 during printing, it is ink-repellent due to the previously applied dampening solution 92 and therefore does not accept the embossing varnish 32 .
  • thermoplastic embossing varnish 32 is only deposited in the feature areas 30 in the printing step, as shown in FIG Figure 8(d) shown.
  • the already embossed and hardened UV embossing varnish 42 is present in the feature areas 40 .
  • the intermediate product thus obtained can then, for example in connection with the Figures 5 to 7 described, further processed and the embossing lacquer layer 32 can also be provided with the desired embossing.
  • a thermoplastic embossing varnish another UV embossing varnish can also be used which, since the first embossing varnish is already solidified when the further embossing varnish is printed on, can also have the same solidifying properties as the first embossing varnish.
  • the initial situation shown essentially corresponds to the initial situation in 8 and shows a carrier 90 placed in feature areas 40 was coated with a UV embossing varnish 42 that is hydrophilic after curing.
  • the UV embossing varnish 42 was embossed with the desired embossing structure 44 and cured by UV crosslinking.
  • the carrier film coated in this way was then moistened with a dampening solution 92 in-line or in a separate process, with only the hydrophilically coated feature regions 40 accepting the dampening solution 92, while the uncoated feature regions 30 remain free of dampening solution.
  • a second embossing lacquer layer of a thermoplastic embossing lacquer 32 is then provided over the entire surface of a printing cylinder 94 .
  • a soft impression roller 98 provides a counter-pressure for the imprinting step, but due to its low hardness of less than 90 or less than 85 Shore it can be locally deformed by pressure peaks.
  • the UV embossing varnish areas 42 are also in contact with the embossing varnish layer 32, they are ink-repellent due to the dampening solution 92 applied and therefore do not accept the embossing varnish 32.
  • the overprinting step therefore creates a design with unembossed thermoplastic embossing varnish 32 in the feature areas 30 and with embossed, hardened UV embossing varnish 42 in the feature areas 40, which can be further processed as described above.
  • thermoplastic embossing varnish instead of a thermoplastic embossing varnish, another UV embossing varnish can also be used here, which, since the first embossing varnish is already solidified when the further embossing varnish is printed on is, can also have the same solidification properties as the first embossing lacquer.
  • the carrier film 90 must be sufficiently easily deformable under the printing conditions of the second embossing varnish 32 in order to Fig.9(b) to allow height compensation illustrated by the impression roller 98.
  • a very thin carrier film 90 can be used (thickness preferably less than 23 ⁇ m, in particular 19 ⁇ m, in particular thickness between 6 ⁇ m and 15 ⁇ m) and/or a carrier film 90 with a low glass transition temperature can be used which meets the printing conditions of the second embossing varnish is exceeded, so that the and the film is particularly easily deformed.
  • a compensation layer 80 in the layer structure of the security element itself.
  • a compensating layer 80 is arranged in the layer structure of the security element to be produced on the carrier film 22, which is flexible at least under the printing conditions of the embossing lacquer layer 32 and preferably has elastic properties.
  • the initial situation shown corresponds to the initial situation, except for the leveling layer 9(a) and shows a carrier film 22 with an applied leveling layer 80, for example made of silicone rubber, which has been coated in feature areas 40 with a UV embossing varnish 42 that is hydrophilic after curing.
  • the leveling layer can also be provided with a thin covering layer in order to facilitate the subsequent application of the embossing lacquer layers 32, 42 and/or to provide a suitable surface energy.
  • the UV embossing varnish 42 was embossed with the desired embossing structure 44 and cured by UV crosslinking.
  • the carrier film coated in this way was then moistened with a dampening solution 92 in-line or in a separate process, with only the hydrophilically coated feature regions 40 accepting the dampening solution 92, while the uncoated feature regions 30 remain free of dampening solution.
  • a second embossing lacquer layer of a thermoplastic embossing lacquer 32 is then provided over the entire surface of a printing cylinder 94 .
  • the leveling layer 80 is elastic under the printing conditions of the thermoplastic lacquer 32, so that the already cured UV embossing varnish areas 42 are pressed locally into the leveling layer 80 by the impression cylinder 94. This prevents the embossing structure 44 from being deformed or damaged and enables the embossing lacquer layer 32 to be applied without any problems precisely in the interstices 30 between the UV embossing lacquer regions 42 .
  • the layer thickness of the compensating layer 80 should be somewhat greater than the height difference to be compensated for, which is typically between 2 and 15 ⁇ m.
  • UV embossing varnish areas 42 are also in contact with the embossing varnish layer 32, they are ink-repellent due to the dampening solution 92 applied and therefore do not accept the embossing varnish 32.
  • the deformation of the elastic compensation layer 80 returns so that the 10(c) desired design shown with unembossed thermoplastic embossing varnish 32 in the feature areas 30 and embossed, cured UV embossing varnish 42 in the feature regions 40 arises, which can be further processed as described above.
  • the embossing lacquer layer 42 instead of as in the exemplary embodiments of FIG Figures 8 to 10 printed structured, also be applied in a process of residue-free embossing, as it is basically in the publication EP 3 230 795 B1 is described.
  • the surface energies of the carrier, the embossing tool used and the surface tension of the embossing varnish must be coordinated.
  • a UV embossing varnish 42 is first applied to the carrier 90 over the entire surface in the method mentioned.
  • a structured embossing tool 100 contains tool areas 102, 104 with different height levels, which correspond in shape and size to the feature areas 30 (protruding tool areas 102) and 40 (recessed tool areas 104).
  • the desired embossing structure 44 of the feature areas 40 is arranged in the recessed tool areas 104, which are further away from the layer 42 to be embossed in the subsequent embossing step.
  • the protruding areas 102 reduce the layer thickness of the embossing lacquer 42 present there due to their geometry by displacement. More precisely, this is due to the wetting properties of embossing varnish 42 the splitting coefficient, i.e. the interfacial energy between carrier 90 and embossing varnish 42 and between embossing varnish 42 and structured embossing tool 100 is negative, so that embossing varnish 42 withdraws from feature areas 30 below the protruding tool areas 102 into feature areas 40 below the recessed tool areas 104 .
  • the carrier film 90 thus contains the desired high-resolution structure with embossed, hardened UV lacquer areas 42 and still uncoated feature areas 30 lying in between, as in Fig. 11(b) shown. Further processing can then, for example, as in connection with the Figures 8 to 10 already described.
  • a layer of a first embossing lacquer 32 is first printed on a carrier 90, which has a particularly low surface energy after it has dried or crosslinked.
  • the printed first embossing varnish 32 is embossed and dried or cured.
  • the first embossing lacquer 32 is applied in a structured manner so that feature areas 30 with this first embossing lacquer and still uncoated feature areas 40 without embossing lacquer. It has turned out to be advantageous if approximately half of the total area to be coated is provided with the first embossing lacquer 32 .
  • a second embossing lacquer formulation 42 which has a low viscosity and a high surface tension, is then applied over the entire surface. This corresponds to the situation of the in Figure 12(a) illustrated intermediate step.
  • the second embossing lacquer formulation 42 can be a UV embossing lacquer, in particular a water-dilutable formulation, which may also have to be dried physically before embossing.
  • the second formulation 42 dewets from the first low surface energy stamping varnish 32, as in FIG 12(a) indicated by the arrows 110, so that after dewetting the in Fig. 12(b) situation shown arises.
  • the application of the second embossing lacquer formulation 42 can also be repeated several times, so that material with high surface tension is successively built up in the feature regions 40 until there is a sufficient quantity of second embossing lacquer 42 for the desired second embossing.
  • a first layer of a first thermoplastic embossing varnish 42 with a desired first coloring is applied to a carrier film 22 in a structured manner and dried.
  • the first embossing lacquer 42 is applied in a structured manner in the pattern of the feature regions 40, but with a greater layer thickness d 1 than the layer thickness d 0 actually required at the end, as in FIG 13(a) shown.
  • a second layer of a second thermoplastic embossing varnish 32 with a desired second coloring is then applied over the entire surface.
  • the second embossing lacquer 32 is advantageously applied in a layer thickness d 2 >d 1 , but in principle it is sufficient if the second embossing lacquer is applied in a layer thickness d 2 >d 0 .
  • the second embossing lacquer 32 can also be applied in several steps and in each case in connection with wiping or squeegee steps in order to keep the layer thickness of the second embossing lacquer 32 small on the embossing lacquer areas 42 applied first.
  • the resulting structure is removed mechanically down to the desired layer thickness d 0 , for example by milling off 120 the layer regions 122 that protrude beyond the layer thickness d 0 . If the milling cutter 120 is set to the desired target layer thickness, in the simplest case, be milled up to this target layer thickness, in which both embossing lacquers 32, 42 are exposed in the feature regions 30, 40 arranged exactly next to each other, as in 13(c) shown.
  • a fine adjustment and feedback of the milling step 120 can be carried out with the aid of the milling removal, ie the material removed from the layer regions 122 .
  • the milling removal ie the material removed from the layer regions 122 .
  • a desired removal depth can therefore be checked by means of a spectroscopic examination or, if appropriate, simply by checking the color of the milling removal. This can ensure that the excess of the second embossing lacquer 32, which is present on the first embossing lacquer areas 42, is completely removed and the in 13(c) end position shown is reliably reached.
  • a UV embossing varnish 42 of a first color is applied to a carrier film 22, initially structured in feature regions 40.
  • the UV embossing varnish 42 is typically embossed with the desired embossing structure 44 and cured.
  • the feature areas 30 lying between the embossing lacquer areas 42 ideally remain completely uncoated.
  • thermoplastic embossing varnish 32 of a second color is then provided for which a suitable removal medium exists which can remove the dried embossing varnish 32 with a well-defined removal rate, but which does not dissolve the UV embossing varnish 42 .
  • a second layer is applied to the entire surface of the carrier film 22 with this embossing varnish 32, as shown in 14(b) shown.
  • the application can take place, for example, in flexographic printing, with the flexo sleeve being subjected to high pressure already presses a considerable part of the embossing varnish 32 into the depressions 130 between the already cured UV embossing varnish areas 42 and only relatively little ink comes to lie on the embossing varnish areas 42 .
  • embossing lacquer 32 Immediately after the embossing lacquer 32 has been applied, it is still liquid, so that the excess can be wiped off or scraped off the printed foil and thus in particular removed from the already hardened embossing lacquer areas 42 . After the embossing varnish 32 has been physically dried, the depressions 130 between the already cured UV embossing varnish regions 42 are partially filled, as shown in FIG 14(b) shown. A thin toning film 132 of embossing lacquer material is also generally present on the embossing lacquer areas 42 .
  • embossing lacquer 32 and the removal of excess material are repeated until the depressions 130 are sufficiently filled or even overfilled, as in FIG 14(c) shown.
  • the repetition improves the relationship between the degree of filling of the depressions 130 and the unwanted toning 132 of the embossing lacquer areas 42.
  • thermoplastic embossing varnish 32 After the last repetition of the application and wiping or squeegeeing, the thermoplastic embossing varnish 32 is physically dried so that the in 14(c) situation shown arises.
  • a development step with the associated removal medium is then carried out for the embossing varnish 32 .
  • the removal medium can be aqueous, have a defined pH value or be solvent-based. In this case, it may be necessary to expose the embossing lacquer 32 before the removal.
  • the removal process is stopped, for example by rinsing with another medium.
  • the hardened UV embossing lacquer 42 is not removed by the removal medium of the embossing lacquer 32, so that the exposure takes place with a high degree of selectivity.
  • the desired structure is present on the carrier film 22 with feature regions 40 with the embossed UV embossing lacquer layer 42 of the first color and with feature regions 30 with the still unembossed thermoplastic embossing lacquer layer 32 of the second color lying in between, as in FIG 14(d) shown. Further processing can, for example, follow the procedure already described.
  • thermoplastic embossing varnish instead of the UV embossing varnish 42, in the procedure of 14 another thermoplastic embossing varnish can also be used.
  • This can be insoluble in the removal medium of the embossing lacquer 32 from the beginning or it can contain a crosslinking agent that makes it insoluble for the removal medium of the embossing lacquer 32, but whose crosslinking reaction has not progressed so far at the time of the first embossing that embossing would be prevented .
  • a crosslinker can be an isocyanate, for example, with the use of aliphatic isocyanates leading to a slower reaction leads if the embossing is to take place with a certain time delay after the application step.
  • the first embossing lacquer layer 42 can be applied by applying a desired motif in a structured manner to the feature regions 40 .
  • a desired motif in a structured manner
  • Advantageous options for this, in particular for high-resolution structuring of a UV embossing lacquer layer, have already been described above. If a thermoplastic embossing varnish is applied as the first layer of embossing varnish, pressure at elevated temperature or from the melt may be required for successful fine structuring if the layer thickness is sufficient.
  • a further method step can be provided, with which the embossing lacquer is converted into a permanent and/or embossable form.
  • This can be, for example, an exposure step or an annealing step.
  • a wet-chemical treatment in which the embossing lacquer is brought into contact with a liquid medium in order to bring about hardening or crosslinking, can also be provided.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Credit Cards Or The Like (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
EP22020007.5A 2021-03-25 2022-01-12 Procédé de fabrication pour un élément de sécurité optiquement variable Active EP4067104B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102021001588.6A DE102021001588A1 (de) 2021-03-25 2021-03-25 Herstellungsverfahren für ein optisch variables Sicherheitselement

Publications (2)

Publication Number Publication Date
EP4067104A1 true EP4067104A1 (fr) 2022-10-05
EP4067104B1 EP4067104B1 (fr) 2023-09-27

Family

ID=79602242

Family Applications (1)

Application Number Title Priority Date Filing Date
EP22020007.5A Active EP4067104B1 (fr) 2021-03-25 2022-01-12 Procédé de fabrication pour un élément de sécurité optiquement variable

Country Status (3)

Country Link
EP (1) EP4067104B1 (fr)
CN (1) CN115122800A (fr)
DE (1) DE102021001588A1 (fr)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016173898A1 (fr) * 2015-04-30 2016-11-03 Leonhard Kurz Stiftung & Co. Kg Procédé de fabrication d'un corps multicouche
EP3230795B1 (fr) 2014-12-10 2019-06-05 Joanneum Research Forschungsgesellschaft mbH Vernis d'embossage et procédé d'embossage
WO2020011390A1 (fr) 2018-07-09 2020-01-16 Giesecke+Devrient Currency Technology Gmbh Élément de sécurité optiquement variable à zone de surface réfléchissante
WO2020011392A1 (fr) 2018-07-09 2020-01-16 Giesecke+Devrient Currency Technology Gmbh Élément de sécurité optiquement variable à zone de surface réfléchissante
WO2020011391A1 (fr) 2018-07-09 2020-01-16 Giesecke+Devrient Currency Technology Gmbh Élément de sécurité optiquement variable à zone de surface réfléchissante

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102008029158A1 (de) 2007-12-21 2009-06-25 Giesecke & Devrient Gmbh Sicherheitselement
DE102009052538A1 (de) 2009-11-11 2011-05-12 Giesecke & Devrient Gmbh Herstellung eines mit gefärbten Mikrovertiefungen versehenen Sicherheitselementes
DE102010047250A1 (de) * 2009-12-04 2011-06-09 Giesecke & Devrient Gmbh Sicherheitselement, Wertdokument mit einem solchen Sicherheitselement sowie Herstellungsverfahren eines Sicherheitselementes
AT510505B1 (de) * 2010-08-13 2013-02-15 Hueck Folien Gmbh Sicherheitsetikett mit manipulationsnachweis
AU2012100573B4 (en) * 2012-05-10 2013-03-28 Innovia Security Pty Ltd An optical security device
DE102014001842A1 (de) * 2014-02-11 2015-08-13 Giesecke & Devrient Gmbh Verfahren zum Herstellen eines Sicherheitselements mit Negativschrift und daraus erhältliches Sicherheitselement
FR3019496A1 (fr) * 2014-04-07 2015-10-09 Hologram Ind Composant optique de securite a effet reflectif, fabrication d'un tel composant et document securise equipe d'un tel composant
ES2814449T3 (es) * 2017-10-05 2021-03-29 Giesecke Devrient Currency Tech Gmbh Característica de una ventana transparente por los dos lados con colores dicroicos

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3230795B1 (fr) 2014-12-10 2019-06-05 Joanneum Research Forschungsgesellschaft mbH Vernis d'embossage et procédé d'embossage
WO2016173898A1 (fr) * 2015-04-30 2016-11-03 Leonhard Kurz Stiftung & Co. Kg Procédé de fabrication d'un corps multicouche
WO2020011390A1 (fr) 2018-07-09 2020-01-16 Giesecke+Devrient Currency Technology Gmbh Élément de sécurité optiquement variable à zone de surface réfléchissante
WO2020011392A1 (fr) 2018-07-09 2020-01-16 Giesecke+Devrient Currency Technology Gmbh Élément de sécurité optiquement variable à zone de surface réfléchissante
WO2020011391A1 (fr) 2018-07-09 2020-01-16 Giesecke+Devrient Currency Technology Gmbh Élément de sécurité optiquement variable à zone de surface réfléchissante

Also Published As

Publication number Publication date
EP4067104B1 (fr) 2023-09-27
CN115122800A (zh) 2022-09-30
DE102021001588A1 (de) 2022-09-29

Similar Documents

Publication Publication Date Title
EP3370973B1 (fr) Rocédé d'application permettant d'appliquer une couche de transfert d'un film sur un substrat
EP2938496B1 (fr) Procédé et dispositif d'estampage à froid sur des objets tridimensionnels
EP0684908B1 (fr) Document de securite et son procede de production
EP3331699B1 (fr) Procédé et dispositif de fabrication d'une feuille multicouche
EP2038124B2 (fr) Procédé pour appliquer une microstructure, moule d'outil et objet doté d'une microstructure
EP2240330B1 (fr) Procédé de réalisation d'une microstructure
DE102017104658B4 (de) Verfahren zur Herstellung eines Decals und ein Decal sowie ein Verfahren zum Dekorieren von Oberflächen von Gegenständen
EP1440133B1 (fr) Procede pour fabriquer une pellicule pouvant etre marquee au laser
WO2017097430A1 (fr) Élément de sécurité muni d'une image lenticulaire
DE10333255B3 (de) Verfahren zur Erzeugung eines Flächenmusters hoher Auflösung
DE19921579C2 (de) Verfahren zur bereichsweisen Übertragung der Dekorlage einer Transferfolie auf ein Substrat sowie hierfür geeignete Transferfolie
EP2237968B1 (fr) Procédé de réalisation d'une microstructure
EP0952907B1 (fr) Procede et dispositif de production d'un materiau sous forme de feuille
EP2760676B1 (fr) Procédé de fabrication d'un support microstructuré
EP3747666A1 (fr) Procédé et dispositif d'application permettant d'appliquer une couche de transfert d'un film sur un corps et corps multicouche
EP4067104B1 (fr) Procédé de fabrication pour un élément de sécurité optiquement variable
EP4067103B1 (fr) Procédé de fabrication pour un élément de sécurité optiquement variable
DE4135872C2 (fr)
DE102021001582A1 (de) Optisch variables Sicherheitselement, Herstellungsverfahren und Prägeanordnung
DE4411404B4 (de) Schichtverbund zum Übertragen von optisch variablen Einzelelementen auf zu sichernde Gegenstände, Sicherheitsdokument und ein Verfahren zur Herstellung eines Schichtverbunds
DE102018115748A1 (de) Verfahren und Vorrichtung zur Druckveredelung
EP3279003A1 (fr) Élément de sécurité et procédé de fabrication d'un élément de sécurité
DE102022001402A1 (de) Verfahren zum Übertragen eines Sicherheitselements auf ein Zielsubstrat
DE10249131B4 (de) Selbstklebendes Material mit bedruckbaren Weißflächen, sowie Verfahren zu dessen Herstellung
DE19738956A1 (de) Vorrichtung zur Herstellung eines Substrats mit optisch variabler Struktur

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE APPLICATION HAS BEEN PUBLISHED

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

RAP3 Party data changed (applicant data changed or rights of an application transferred)

Owner name: GIESECKE+DEVRIENT CURRENCY TECHNOLOGY GMBH

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: REQUEST FOR EXAMINATION WAS MADE

17P Request for examination filed

Effective date: 20230405

RBV Designated contracting states (corrected)

Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

P01 Opt-out of the competence of the unified patent court (upc) registered

Effective date: 20230519

GRAP Despatch of communication of intention to grant a patent

Free format text: ORIGINAL CODE: EPIDOSNIGR1

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: GRANT OF PATENT IS INTENDED

INTG Intention to grant announced

Effective date: 20230630

GRAS Grant fee paid

Free format text: ORIGINAL CODE: EPIDOSNIGR3

GRAA (expected) grant

Free format text: ORIGINAL CODE: 0009210

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE PATENT HAS BEEN GRANTED

AK Designated contracting states

Kind code of ref document: B1

Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

REG Reference to a national code

Ref country code: GB

Ref legal event code: FG4D

Free format text: NOT ENGLISH

REG Reference to a national code

Ref country code: CH

Ref legal event code: EP

REG Reference to a national code

Ref country code: DE

Ref legal event code: R096

Ref document number: 502022000150

Country of ref document: DE

REG Reference to a national code

Ref country code: IE

Ref legal event code: FG4D

Free format text: LANGUAGE OF EP DOCUMENT: GERMAN

REG Reference to a national code

Ref country code: LT

Ref legal event code: MG9D

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: GR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20231228

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: SE

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20230927

Ref country code: RS

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20230927

Ref country code: NO

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20231227

Ref country code: LV

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20230927

Ref country code: LT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20230927

Ref country code: HR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20230927

Ref country code: GR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20231228

Ref country code: FI

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20230927

REG Reference to a national code

Ref country code: NL

Ref legal event code: MP

Effective date: 20230927

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: NL

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20230927

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: IS

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20240127

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: ES

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20230927

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: SM

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20230927

Ref country code: RO

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20230927

Ref country code: IS

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20240127

Ref country code: ES

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20230927

Ref country code: EE

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20230927

Ref country code: CZ

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20230927

Ref country code: SK

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20230927

Ref country code: PT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20240129

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: DE

Payment date: 20240131

Year of fee payment: 3

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: PL

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20230927

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: IT

Payment date: 20240131

Year of fee payment: 3

Ref country code: FR

Payment date: 20240123

Year of fee payment: 3