EP4066268B1 - Module de contact pour la mise en contact de cartes de circuits imprimés - Google Patents

Module de contact pour la mise en contact de cartes de circuits imprimés Download PDF

Info

Publication number
EP4066268B1
EP4066268B1 EP21766675.9A EP21766675A EP4066268B1 EP 4066268 B1 EP4066268 B1 EP 4066268B1 EP 21766675 A EP21766675 A EP 21766675A EP 4066268 B1 EP4066268 B1 EP 4066268B1
Authority
EP
European Patent Office
Prior art keywords
circuit board
printed circuit
contact
press
contact module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
EP21766675.9A
Other languages
German (de)
English (en)
Other versions
EP4066268A1 (fr
Inventor
Michael Heck
Dennis Cleve
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Marquardt GmbH
Original Assignee
Marquardt GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Marquardt GmbH filed Critical Marquardt GmbH
Publication of EP4066268A1 publication Critical patent/EP4066268A1/fr
Application granted granted Critical
Publication of EP4066268B1 publication Critical patent/EP4066268B1/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H13/00—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch
    • H01H13/02—Details
    • H01H13/10—Bases; Stationary contacts mounted thereon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H1/00—Contacts
    • H01H1/58—Electric connections to or between contacts; Terminals
    • H01H1/5805—Connections to printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H9/00—Details of switching devices, not covered by groups H01H1/00 - H01H7/00
    • H01H9/02—Bases, casings, or covers
    • H01H9/0264—Protective covers for terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H1/00—Contacts
    • H01H1/12—Contacts characterised by the manner in which co-operating contacts engage
    • H01H1/36—Contacts characterised by the manner in which co-operating contacts engage by sliding
    • H01H1/44—Contacts characterised by the manner in which co-operating contacts engage by sliding with resilient mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H13/00—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch
    • H01H13/02—Details
    • H01H13/04—Cases; Covers
    • H01H13/06—Dustproof, splashproof, drip-proof, waterproof or flameproof casings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H13/00—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch
    • H01H13/50—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch having a single operating member
    • H01H13/52—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch having a single operating member the contact returning to its original state immediately upon removal of operating force, e.g. bell-push switch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H9/00—Details of switching devices, not covered by groups H01H1/00 - H01H7/00
    • H01H9/02—Bases, casings, or covers
    • H01H9/04—Dustproof, splashproof, drip-proof, waterproof, or flameproof casings
    • H01H2009/048—Dustproof, splashproof, drip-proof, waterproof, or flameproof casings using a sealing boot, e.g. the casing having separate elastic body surrounding the operating member and hermetically closing the opening for it
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
    • H01R12/58—Fixed connections for rigid printed circuits or like structures characterised by the terminals terminals for insertion into holes
    • H01R12/585—Terminals having a press fit or a compliant portion and a shank passing through a hole in the printed circuit board
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
    • H01R12/73—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • H01R12/735—Printed circuits including an angle between each other
    • H01R12/737—Printed circuits being substantially perpendicular to each other

Definitions

  • This invention relates to a contact module for contacting one or two printed circuit boards and a method for producing such a contact module.
  • circuit board If two circuit boards are mentioned in the following description, this also includes a combination of a circuit board and a lead frame, unless expressly mentioned anyway.
  • solder contact that makes contact with an element that can be connected to the contact module.
  • Such a, usually metallic, solder contact has a solder area that is soldered to the circuit board. This area can be designed as an SMD soldering surface, where SMD stands for "surface-mount device", as a single soldering pin or as an arrangement of specific contours that are formed in one piece with the soldering contact.
  • SMD stands for "surface-mount device”
  • solder contacts with an SMD soldering area with a single solder connection or with several z.
  • solder contacts are required for each orientation of such a contact module on a circuit board, if, for example, an insertion direction should be oriented parallel or perpendicular relative to a plane of the circuit board. If, for example, a connection is to have an orientation oriented perpendicular to a circuit board plane, corresponding solder contacts are installed, which also have solder pins oriented perpendicular to the circuit board. If the mounting direction is oriented parallel to a PCB plane, the solder contacts are relative to the insertion direction, for example. B. oriented transversely.
  • connection and orientation variants separate variants of the solder contacts to be installed are usually kept and the problem arises during assembly of sealing them appropriately against environmental influences.
  • the sealing of the connecting device after connecting, for example, the circuit board or lead frame to be integrated in an actuator with the PCB base circuit board presents the manufacturer with major challenges.
  • a good and permanent connection to the circuit board or lead frame is required.
  • an electrical component in particular comprising movable components
  • movable components such as an actuator or a switch with an actuating pin or a movable switching element and an integral circuit board on a further circuit board or a lead frame (e.g. a control plate or a central, higher-level PCB) to be installed in an electrically connecting manner and to seal the interfaces to the circuit boards appropriately according to the requirements.
  • the document DE102011089020 discloses a contact module according to the preamble of claim 1.
  • the protection type is standardized, e.g. E.g. in EN 60529 (VDE 0470-1): 2014-09 Protection types through housing (IP code) or IEC 60529:1989 + A1:1999 + A2:2013 and the German version EN 60529:1991 + A1:2000 + A2:2013, formerly VDE 0470-1.
  • the protection class defined according to the international standard indicates the suitability of electrical equipment for various environmental conditions.
  • the protection type must be distinguished from the electrical protection class. While the protection class defines the protection of active parts against contact, penetration of foreign bodies and water as well as shock resistance (so-called housing protection), the protection class describes measures against dangerous voltages on touchable, operationally not live conductive parts of equipment.
  • the protection class IP 67 defines a high level of protection against the ingress of foreign bodies and water. When it comes to circuit board connections, however, it is difficult to achieve a good seal that can be implemented cost-effectively and permanently seals the arrangement.
  • the present invention is based on the technical problem of specifying a circuit board contact arrangement, a contact module for connecting an actuator or a circuit board to another circuit board and a method for producing a contact module, which do not have the disadvantages described above or at least to a lesser extent have, and in particular to specify a contact arrangement that is flexible with regard to the type of connection to be provided, tightness and orientation and thus enables cost-effective provision.
  • a contact module according to claim 1 is provided for this purpose.
  • the circuit board contacts have a central contact section lying in the sealing body and angled at approximately 90°. This results in orientations of flat circuit boards that are perpendicular to one another. It is also advantageous if the connecting sections adjoin a web section protruding from the sealing body and are arranged offset from the web section in a parallel plane, the offset being larger, in particular several times larger, in relation to the material thickness of the web section, viewed in the direction of offset. This can be achieved by a bending section in between. As a result, the connecting surface is located on a side surface of the contacts and not on their end face and allows a targeted and precise positioning of one circuit board in one assembly step.
  • the respective press-in zone is formed from two parallel contact arms, which are connected to one another in a material-locking manner at their plug-in end and in particular have an oblique side flank which begins at the plug-in end of the press-in zone and runs in the extension direction of the press-in zone in such a way that the thickness of the press-in zone increases at least partially in this area.
  • a further preferred embodiment of the invention provides that the sealing body is designed as an encapsulation with an electrically non-conductive plastic around the circuit board contacts.
  • the sealing body forms a circumferential collar and preferably an adjoining essentially cuboid base from which two locking arms protrude in one piece.
  • a particularly good sealing interaction can be achieved with a housing that has one end face against the collar.
  • the base is sealed with the housing not directly over the locking hooks; the locking hooks only hold the housing in position for laser welding, which creates the tight connection.
  • the contact module is integrated into a switch or electrical component having an actuator, the contact module being surrounded by a housing (of the switch or component) and preferably also having a wiper mounted against a spring within the housing cooperates with the actuator to operate the grinder along the circuit board, preferably to operate it in a switching manner.
  • an elastically deformable sealing head is provided on an actuation section of the housing, which is located above the actuator in the actuation direction.
  • a further aspect of the present invention provides a method according to claim 8.
  • the connecting sections are non-positively connected to a circuit board (via elastic/plastic deformation) and are mounted at least in sections protruding into a housing that is open on one side, in order to rest against the sealing body with a housing edge of the housing in the assembled state.
  • the entire arrangement can then be pressed into a circuit board with the press-in zones (preferably with the sealing element described above) in the area of the press-in zones.
  • the Figure 1 shows a schematic representation of an embodiment of a configuration of a switch according to the invention, with a perspective view of the parts of a switch S having a contact module according to the invention being shown.
  • the switch S has a housing 40 in which an actuator 43, a spring 42, a wiper 41 movably mounted against the spring 42, which cooperates with the actuator 43 to actuate the wiper 41 along the circuit board PCB1.
  • a bearing pin for the spring 42 protrudes in one piece from the top of the sealing body 20.
  • an elastically deformable sealing head 50 is provided above the reference number 51, which is located above the actuator 43 in the actuation direction.
  • circuit board contact arrangement 1 for contacting a first circuit board PCB1 with a second (not shown) circuit board or lead frame shown.
  • the circuit board contact arrangement 1 has two circuit board contacts 10, which have a connecting section 11 at one contact end 10a and a press-in zone 12 at their second contact end 10b.
  • a sealing body 20 which completely surrounds the contacts in a central section is formed by means of an overmolding. From the respective connecting section 11 protrudes from one (upper) side surface 21 and the press-in zones 12 protrude from another, namely front side surface 22.
  • the length of the press-in zones and the contact projection from the sealing body 20 is matched to the thickness of the sealing element 30, which is also shown.
  • This sealing element 30 is designed as a one-piece sealing element with penetration openings 31 for the press-in zones 12 and an opening in between for a positioning pin which protrudes through the opening in between.
  • the sealing element which is located in the area where the contacts will later be inserted, can have a thinly formed membrane, which is pierced by the contacts during assembly.
  • the circuit board contacts 10 have a central contact section angled at approximately 90° inside the sealing body. Furthermore, the connecting sections 11 adjoin a web section 22 protruding from the sealing body 20, in that a lateral section offset from the web section 22 in a parallel plane is formed via a bending section.
  • the connecting sections 11 are schematically connected to the first printed circuit board PCB1 by means of a non-positive connection.
  • the two press-in zones 12 are formed from two parallel contact arms 12a, 12b, which in this exemplary embodiment are connected to one another in a material-locking manner at their insertion-side end and have an oblique side flank 12c.
  • the sealing body 20 forms a circumferential collar 24 and two locking arms 25 for attachment to the housing 40.

Landscapes

  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Push-Button Switches (AREA)

Claims (9)

  1. Module de contact pour un commutateur ou un composant électrique pourvu d'un actionneur, comprenant une première carte de circuits imprimés (PCB1) et un ensemble de contacts de carte de circuits imprimés (1) pour mettre en contact la première carte de circuits imprimés (PCB1) avec une deuxième carte de circuits imprimés (PCB2),
    dans lequel l'ensemble de contacts de carte de circuits imprimés (1) présente au moins deux contacts de carte de circuits imprimés (10) qui présentent une partie de liaison (11) à une extrémité de contact (10a) et présentent une zone de pression (12) à une deuxième extrémité de contact (10b), et
    dans lequel entre la partie de liaison (11) et la zone de pression (12) est prévu au moins un corps d'étanchéité (20) entourant entièrement les contacts de carte de circuits imprimés (10) dans une partie centrale et à partir duquel la partie de liaison (11) fait saillie d'une surface latérale (21) et les parties de pression (12) font saillie d'une autre surface latérale (22),
    dans lequel la première carte de circuits imprimés (PCB1) est reliée de manière électriquement conductrice aux parties de liaison (11) de l'ensemble de contacts de carte de circuits imprimés (1),
    caractérisé en ce que la zone de pression (12) respective est formée par deux bras de contact (12a, 12b) s'étendant en parallèle, qui sont reliés ensemble par liaison de matière à leur extrémité côté enfichage et présentent un flanc latéral incliné (12c) qui commence à l'extrémité côté enfichage de la zone de pression (12) et s'étend dans la direction d'extension de la zone de pression (12) de telle sorte que l'épaisseur de la zone de pression (12) augmente au moins partiellement dans cette zone,
    dans lequel un élément d'étanchéité (30) qui est prévu au niveau du passage des contacts de carte de circuits imprimés (10) présente une membrane de configuration fine qui est réalisée pour être percée par les contacts de carte de circuits imprimés (10) pendant le montage.
  2. Module de contact selon la revendication 1, caractérisé en ce que les contacts de carte de circuits imprimés (10) présentent une partie de contact centrale, située dans le corps d'étanchéité (20) à un angle d'environ 90°.
  3. Module de contact selon la revendication 1 ou 2, caractérisé en ce que les parties de liaison (11) sont consécutives à une partie d'entretoise (22) faisant saillie du corps d'étanchéité (20), et sont disposées de manière décalée par rapport à la partie d'entretoise (22) dans un plan parallèle, dans lequel le décalage est supérieur à, en particulier un multiple de l'épaisseur de matériau de la partie d'entretoise (22), vue en direction du décalage.
  4. Module de contact selon l'une quelconque des revendications précédentes, caractérisé en ce que le corps d'étanchéité (20) est réalisé sous forme de surmoulage autour des contacts de carte de circuits imprimés (10).
  5. Module de contact selon la revendication 4, caractérisé en ce que le corps d'étanchéité (20) réalise une collerette périphérique (24) et de préférence une base substantiellement parallélépipédique consécutive à celle-ci, à partir de laquelle deux bras d'enclenchement (25) font saillie d'un seul tenant.
  6. Module de contact selon l'une quelconque des revendications précédentes, intégré dans un commutateur ou composant électrique présentant un actionneur (43), dans lequel le module de contact est entouré d'un boîtier (40), et à l'intérieur du boîtier (40), un curseur (41) monté contre un ressort (42) coopère avec l'actionneur (43) afin d'actionner le curseur (41) le long de la carte de circuits imprimés (PCB1), de préférence afin de l'actionner en commutation.
  7. Module de contact selon la revendication précédente, caractérisé en ce qu'au niveau d'une partie d'actionnement du boîtier (40) est prévue une tête d'étanchéité à déformation élastique qui se trouve au-dessus de l'actionneur (43) dans la direction d'actionnement.
  8. Procédé permettant de fabriquer un module de contact selon l'une quelconque des revendications précédentes, comprenant les étapes suivantes consistant à :
    a) fournir au moins deux contacts de carte de circuits imprimés (10) disposés l'un à côté de l'autre qui présentent une partie de liaison (11) à une extrémité de contact (10a) et présentent une zone de pression (12) à une deuxième extrémité de contact (10b) ;
    b) fabriquer un corps d'étanchéité (20) entourant entièrement les contacts de carte de circuits imprimés (10) au moyen d'un surmoulage, de préférence dans une opération dans un moule de surmoulage ;
    c) dans lequel le surmoulage est réalisé de telle sorte qu'à partir du corps d'étanchéité (20), la partie de liaison respective (11) fait saillie d'une première surface latérale (21) et les zones de pression respectives (12) font saillie d'une autre surface latérale (22).
  9. Procédé selon la revendication précédente, caractérisé en ce que les parties de liaison (11) de l'ensemble de contacts de carte de circuits imprimés (1) fabriqué selon la revendication 8 sont reliées à la première carte de circuits imprimés (PCB1) au moyen d'une liaison par adhérence, et ensuite montées en faisant saillie au moins par endroits dans un boîtier (40) ouvert d'un côté afin de s'appliquer en étanchéité à l'état monté avec un bord de boîtier (40a) du boîtier (40) contre le corps d'étanchéité (20).
EP21766675.9A 2020-12-10 2021-08-30 Module de contact pour la mise en contact de cartes de circuits imprimés Active EP4066268B1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102020132937.7A DE102020132937A1 (de) 2020-12-10 2020-12-10 Kontaktmodul zur Kontaktierung von Leiterplatten
PCT/EP2021/073836 WO2022122198A1 (fr) 2020-12-10 2021-08-30 Module de contact pour la mise en contact de cartes de circuits imprimés

Publications (2)

Publication Number Publication Date
EP4066268A1 EP4066268A1 (fr) 2022-10-05
EP4066268B1 true EP4066268B1 (fr) 2024-03-20

Family

ID=77693528

Family Applications (1)

Application Number Title Priority Date Filing Date
EP21766675.9A Active EP4066268B1 (fr) 2020-12-10 2021-08-30 Module de contact pour la mise en contact de cartes de circuits imprimés

Country Status (3)

Country Link
EP (1) EP4066268B1 (fr)
DE (1) DE102020132937A1 (fr)
WO (1) WO2022122198A1 (fr)

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6059381A (en) 1997-12-19 2000-05-09 Itt Manufacturing Enterprises, Inc. ABS pump connector
DE102008014822A1 (de) 2008-03-18 2009-09-24 Hella Kgaa Hueck & Co. Leiterplattenanordnung
DE102011110683A1 (de) * 2010-08-27 2012-05-03 Marquardt Mechatronik Gmbh Elektrischer Schalter
DE102011089020B4 (de) 2011-12-19 2023-11-16 Zf Friedrichshafen Ag Kontaktverbinder und Verfahren zur Herstellung eines Kontaktverbinders
DE102013002709B4 (de) 2013-02-16 2018-03-29 Amphenol-Tuchel Electronics Gmbh Gedichteter Leiterplattensteckverbinder
US9831580B2 (en) 2015-09-15 2017-11-28 Ghsp, Inc. Vehicle-mounted sensorless motor with edge-connected termination
JP6662537B2 (ja) * 2016-07-22 2020-03-11 アルプスアルパイン株式会社 スイッチ装置及び該スイッチ装置の製造方法

Also Published As

Publication number Publication date
EP4066268A1 (fr) 2022-10-05
WO2022122198A1 (fr) 2022-06-16
DE102020132937A1 (de) 2022-06-15

Similar Documents

Publication Publication Date Title
DE102013101823B4 (de) Kontaktträger mit einem Unterteil
DE102015219569B4 (de) Elektronische Anordnung, Kombination und Verfahren zur Montage einer elektronischen Anordnung
AT503687A2 (de) Steuergerät mit einem stirnseitig kontaktierten schaltungsträger
EP0867342A2 (fr) Centrale de distribution électrique pour véhicule automobile et procédé pour sa fabrication
EP4066268B1 (fr) Module de contact pour la mise en contact de cartes de circuits imprimés
DE102020132939A1 (de) Einpresszonen eines Kontaktmoduls zur Kontaktierung einer Leiterplatte
WO2015091538A1 (fr) Élément de connecteur électrique
DE19805708C2 (de) Steckvorrichtung
EP1645018A1 (fr) Coupleur hf destine a connecter une fiche coaxiale a une ligne de transmission hf sur une plaquette
WO2011110309A1 (fr) Connecteur enfichable de carte de circuit imprimé
DE102007049692B4 (de) Sprungkontaktschalter
EP0940887A2 (fr) Connecteur flottant d'interconnexion des assemblages électriques
DE102022107510A1 (de) Antriebseinheit für kraftfahrzeug-technische Anwendungen
WO2024115478A1 (fr) Agencement de contact et module électronique
DE102007042174A1 (de) Elektrisches Schaltgerät für ein Kraftfahrzeug
EP4437622A1 (fr) Connexion enfichable coaxiale pour connexion électrique de composants électriques ou électroniques à fiche axiale
DE102023201588A1 (de) Elektronikmodul
DE102021213350A1 (de) Kontaktierungsanordnung und Elektronikbaugruppe
EP2959550B1 (fr) Porte-contact comprenant une douille isolante
EP4081004A1 (fr) Circuit imprimé, module de connecteur électrique et procédé de fabrication
EP3700026A1 (fr) Élément d'assemblage pour un actionneur
DE102022115567A1 (de) Die vorliegende Erfindung betrifft das technische Gebiet der mechanischen Fixierung von Leiterplatten in einem Motor
EP0966777B1 (fr) Ensemble electrique
DE102007004483A1 (de) Lenksäulenmodul für ein Kraftfahrzeug
DE102016201800A1 (de) Moldmodul, Verfahren zur Herstellung eines Moldmoduls und Moldwerkzeug für die Moldumspritzung eines Moldmoduls

Legal Events

Date Code Title Description
STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: UNKNOWN

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE INTERNATIONAL PUBLICATION HAS BEEN MADE

PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: REQUEST FOR EXAMINATION WAS MADE

17P Request for examination filed

Effective date: 20220630

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

GRAP Despatch of communication of intention to grant a patent

Free format text: ORIGINAL CODE: EPIDOSNIGR1

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: GRANT OF PATENT IS INTENDED

DAV Request for validation of the european patent (deleted)
DAX Request for extension of the european patent (deleted)
INTG Intention to grant announced

Effective date: 20231127

GRAS Grant fee paid

Free format text: ORIGINAL CODE: EPIDOSNIGR3

P01 Opt-out of the competence of the unified patent court (upc) registered

Effective date: 20240109

GRAA (expected) grant

Free format text: ORIGINAL CODE: 0009210

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE PATENT HAS BEEN GRANTED

AK Designated contracting states

Kind code of ref document: B1

Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

REG Reference to a national code

Ref country code: GB

Ref legal event code: FG4D

Free format text: NOT ENGLISH

REG Reference to a national code

Ref country code: CH

Ref legal event code: EP

REG Reference to a national code

Ref country code: DE

Ref legal event code: R096

Ref document number: 502021003066

Country of ref document: DE

REG Reference to a national code

Ref country code: IE

Ref legal event code: FG4D

Free format text: LANGUAGE OF EP DOCUMENT: GERMAN

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: LT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20240320

REG Reference to a national code

Ref country code: LT

Ref legal event code: MG9D

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: GR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20240621

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: HR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20240320

Ref country code: RS

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20240620

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: RS

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20240620

Ref country code: NO

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20240620

Ref country code: LT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20240320

Ref country code: HR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20240320

Ref country code: GR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20240621

Ref country code: FI

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20240320

Ref country code: BG

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20240320

REG Reference to a national code

Ref country code: NL

Ref legal event code: FP

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: SE

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20240320

Ref country code: LV

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20240320

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: NL

Payment date: 20240821

Year of fee payment: 4

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: IS

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20240720

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: DE

Payment date: 20240819

Year of fee payment: 4

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: PT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20240722

Ref country code: SM

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20240320

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: FR

Payment date: 20240823

Year of fee payment: 4