EP4066268B1 - Contact module for contacting printed circuit boards - Google Patents

Contact module for contacting printed circuit boards Download PDF

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Publication number
EP4066268B1
EP4066268B1 EP21766675.9A EP21766675A EP4066268B1 EP 4066268 B1 EP4066268 B1 EP 4066268B1 EP 21766675 A EP21766675 A EP 21766675A EP 4066268 B1 EP4066268 B1 EP 4066268B1
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EP
European Patent Office
Prior art keywords
circuit board
printed circuit
contact
press
contact module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
EP21766675.9A
Other languages
German (de)
French (fr)
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EP4066268A1 (en
Inventor
Michael Heck
Dennis Cleve
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Marquardt GmbH
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Marquardt GmbH
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Publication of EP4066268A1 publication Critical patent/EP4066268A1/en
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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H13/00—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch
    • H01H13/02—Details
    • H01H13/10—Bases; Stationary contacts mounted thereon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H1/00—Contacts
    • H01H1/58—Electric connections to or between contacts; Terminals
    • H01H1/5805—Connections to printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H9/00—Details of switching devices, not covered by groups H01H1/00 - H01H7/00
    • H01H9/02—Bases, casings, or covers
    • H01H9/0264—Protective covers for terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H1/00—Contacts
    • H01H1/12—Contacts characterised by the manner in which co-operating contacts engage
    • H01H1/36—Contacts characterised by the manner in which co-operating contacts engage by sliding
    • H01H1/44—Contacts characterised by the manner in which co-operating contacts engage by sliding with resilient mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H13/00—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch
    • H01H13/02—Details
    • H01H13/04—Cases; Covers
    • H01H13/06—Dustproof, splashproof, drip-proof, waterproof or flameproof casings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H13/00—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch
    • H01H13/50—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch having a single operating member
    • H01H13/52—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch having a single operating member the contact returning to its original state immediately upon removal of operating force, e.g. bell-push switch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H9/00—Details of switching devices, not covered by groups H01H1/00 - H01H7/00
    • H01H9/02—Bases, casings, or covers
    • H01H9/04—Dustproof, splashproof, drip-proof, waterproof, or flameproof casings
    • H01H2009/048—Dustproof, splashproof, drip-proof, waterproof, or flameproof casings using a sealing boot, e.g. the casing having separate elastic body surrounding the operating member and hermetically closing the opening for it
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
    • H01R12/58—Fixed connections for rigid printed circuits or like structures characterised by the terminals terminals for insertion into holes
    • H01R12/585—Terminals having a press fit or a compliant portion and a shank passing through a hole in the printed circuit board
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
    • H01R12/73—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • H01R12/735—Printed circuits including an angle between each other
    • H01R12/737—Printed circuits being substantially perpendicular to each other

Definitions

  • This invention relates to a contact module for contacting one or two printed circuit boards and a method for producing such a contact module.
  • circuit board If two circuit boards are mentioned in the following description, this also includes a combination of a circuit board and a lead frame, unless expressly mentioned anyway.
  • solder contact that makes contact with an element that can be connected to the contact module.
  • Such a, usually metallic, solder contact has a solder area that is soldered to the circuit board. This area can be designed as an SMD soldering surface, where SMD stands for "surface-mount device", as a single soldering pin or as an arrangement of specific contours that are formed in one piece with the soldering contact.
  • SMD stands for "surface-mount device”
  • solder contacts with an SMD soldering area with a single solder connection or with several z.
  • solder contacts are required for each orientation of such a contact module on a circuit board, if, for example, an insertion direction should be oriented parallel or perpendicular relative to a plane of the circuit board. If, for example, a connection is to have an orientation oriented perpendicular to a circuit board plane, corresponding solder contacts are installed, which also have solder pins oriented perpendicular to the circuit board. If the mounting direction is oriented parallel to a PCB plane, the solder contacts are relative to the insertion direction, for example. B. oriented transversely.
  • connection and orientation variants separate variants of the solder contacts to be installed are usually kept and the problem arises during assembly of sealing them appropriately against environmental influences.
  • the sealing of the connecting device after connecting, for example, the circuit board or lead frame to be integrated in an actuator with the PCB base circuit board presents the manufacturer with major challenges.
  • a good and permanent connection to the circuit board or lead frame is required.
  • an electrical component in particular comprising movable components
  • movable components such as an actuator or a switch with an actuating pin or a movable switching element and an integral circuit board on a further circuit board or a lead frame (e.g. a control plate or a central, higher-level PCB) to be installed in an electrically connecting manner and to seal the interfaces to the circuit boards appropriately according to the requirements.
  • the document DE102011089020 discloses a contact module according to the preamble of claim 1.
  • the protection type is standardized, e.g. E.g. in EN 60529 (VDE 0470-1): 2014-09 Protection types through housing (IP code) or IEC 60529:1989 + A1:1999 + A2:2013 and the German version EN 60529:1991 + A1:2000 + A2:2013, formerly VDE 0470-1.
  • the protection class defined according to the international standard indicates the suitability of electrical equipment for various environmental conditions.
  • the protection type must be distinguished from the electrical protection class. While the protection class defines the protection of active parts against contact, penetration of foreign bodies and water as well as shock resistance (so-called housing protection), the protection class describes measures against dangerous voltages on touchable, operationally not live conductive parts of equipment.
  • the protection class IP 67 defines a high level of protection against the ingress of foreign bodies and water. When it comes to circuit board connections, however, it is difficult to achieve a good seal that can be implemented cost-effectively and permanently seals the arrangement.
  • the present invention is based on the technical problem of specifying a circuit board contact arrangement, a contact module for connecting an actuator or a circuit board to another circuit board and a method for producing a contact module, which do not have the disadvantages described above or at least to a lesser extent have, and in particular to specify a contact arrangement that is flexible with regard to the type of connection to be provided, tightness and orientation and thus enables cost-effective provision.
  • a contact module according to claim 1 is provided for this purpose.
  • the circuit board contacts have a central contact section lying in the sealing body and angled at approximately 90°. This results in orientations of flat circuit boards that are perpendicular to one another. It is also advantageous if the connecting sections adjoin a web section protruding from the sealing body and are arranged offset from the web section in a parallel plane, the offset being larger, in particular several times larger, in relation to the material thickness of the web section, viewed in the direction of offset. This can be achieved by a bending section in between. As a result, the connecting surface is located on a side surface of the contacts and not on their end face and allows a targeted and precise positioning of one circuit board in one assembly step.
  • the respective press-in zone is formed from two parallel contact arms, which are connected to one another in a material-locking manner at their plug-in end and in particular have an oblique side flank which begins at the plug-in end of the press-in zone and runs in the extension direction of the press-in zone in such a way that the thickness of the press-in zone increases at least partially in this area.
  • a further preferred embodiment of the invention provides that the sealing body is designed as an encapsulation with an electrically non-conductive plastic around the circuit board contacts.
  • the sealing body forms a circumferential collar and preferably an adjoining essentially cuboid base from which two locking arms protrude in one piece.
  • a particularly good sealing interaction can be achieved with a housing that has one end face against the collar.
  • the base is sealed with the housing not directly over the locking hooks; the locking hooks only hold the housing in position for laser welding, which creates the tight connection.
  • the contact module is integrated into a switch or electrical component having an actuator, the contact module being surrounded by a housing (of the switch or component) and preferably also having a wiper mounted against a spring within the housing cooperates with the actuator to operate the grinder along the circuit board, preferably to operate it in a switching manner.
  • an elastically deformable sealing head is provided on an actuation section of the housing, which is located above the actuator in the actuation direction.
  • a further aspect of the present invention provides a method according to claim 8.
  • the connecting sections are non-positively connected to a circuit board (via elastic/plastic deformation) and are mounted at least in sections protruding into a housing that is open on one side, in order to rest against the sealing body with a housing edge of the housing in the assembled state.
  • the entire arrangement can then be pressed into a circuit board with the press-in zones (preferably with the sealing element described above) in the area of the press-in zones.
  • the Figure 1 shows a schematic representation of an embodiment of a configuration of a switch according to the invention, with a perspective view of the parts of a switch S having a contact module according to the invention being shown.
  • the switch S has a housing 40 in which an actuator 43, a spring 42, a wiper 41 movably mounted against the spring 42, which cooperates with the actuator 43 to actuate the wiper 41 along the circuit board PCB1.
  • a bearing pin for the spring 42 protrudes in one piece from the top of the sealing body 20.
  • an elastically deformable sealing head 50 is provided above the reference number 51, which is located above the actuator 43 in the actuation direction.
  • circuit board contact arrangement 1 for contacting a first circuit board PCB1 with a second (not shown) circuit board or lead frame shown.
  • the circuit board contact arrangement 1 has two circuit board contacts 10, which have a connecting section 11 at one contact end 10a and a press-in zone 12 at their second contact end 10b.
  • a sealing body 20 which completely surrounds the contacts in a central section is formed by means of an overmolding. From the respective connecting section 11 protrudes from one (upper) side surface 21 and the press-in zones 12 protrude from another, namely front side surface 22.
  • the length of the press-in zones and the contact projection from the sealing body 20 is matched to the thickness of the sealing element 30, which is also shown.
  • This sealing element 30 is designed as a one-piece sealing element with penetration openings 31 for the press-in zones 12 and an opening in between for a positioning pin which protrudes through the opening in between.
  • the sealing element which is located in the area where the contacts will later be inserted, can have a thinly formed membrane, which is pierced by the contacts during assembly.
  • the circuit board contacts 10 have a central contact section angled at approximately 90° inside the sealing body. Furthermore, the connecting sections 11 adjoin a web section 22 protruding from the sealing body 20, in that a lateral section offset from the web section 22 in a parallel plane is formed via a bending section.
  • the connecting sections 11 are schematically connected to the first printed circuit board PCB1 by means of a non-positive connection.
  • the two press-in zones 12 are formed from two parallel contact arms 12a, 12b, which in this exemplary embodiment are connected to one another in a material-locking manner at their insertion-side end and have an oblique side flank 12c.
  • the sealing body 20 forms a circumferential collar 24 and two locking arms 25 for attachment to the housing 40.

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  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Push-Button Switches (AREA)

Description

Diese Erfindung betrifft ein Kontaktmodul für die Kontaktierung einer bzw. zweier Leiterplatten und ein Verfahren zur Herstellung eines solchen Kontaktmoduls.This invention relates to a contact module for contacting one or two printed circuit boards and a method for producing such a contact module.

Wenn in der nachfolgenden Beschreibung von zwei Leiterplatten gesprochen wird, ist darunter auch synonym eine Kombination aus einer Leiterplatte und einem Stanzgitter mit umfasst, falls nicht ohnehin ausdrücklich erwähnt.If two circuit boards are mentioned in the following description, this also includes a combination of a circuit board and a lead frame, unless expressly mentioned anyway.

Im Stand der Technik gibt es eine Vielzahl von Lösungen, um elektrische Einrichtungen, wie Aktuatoren, elektrische Schalter, elektrische Betätiger oder dergleichen mit einer Leiterplatte zu kontaktieren, wobei es eine besondere Herausforderung darstellt, wenn dabei zwei Leiterplatten oder einer Leiterplatte und einem metallischen Stanzgitter miteinander verbunden werden müssen.In the prior art there are a variety of solutions for contacting electrical devices such as actuators, electrical switches, electrical actuators or the like with a circuit board, with a particular one A challenge arises when two circuit boards or a circuit board and a metallic lead frame have to be connected to each other.

Bekannte Kontaktmodule, die zum Verlöten mit einer Leiterplatte eingerichtet sind, besitzen pro Kontaktanbindung jeweils z. B. einen Lötkontakt, der eine Kontaktierung zu einem an das Kontaktmodul anschließbaren Element herstellt. Ein solcher, üblicherweise metallischer Lötkontakt, hat einen Lötbereich, der mit der Leiterplatte verlötet wird. Dieser Bereich kann als SMD-Lötfläche, wobei SMD für "surface-mount device" steht, als einzelner Lötstift oder als eine Anordnung bestimmter Konturen ausgeführt sein, die einstückig mit dem Lötkontakt gebildet sind. Bei der Herstellung eines solchen Kontaktmoduls, wie zum Beispiel eines Teils eines Aktuators oder einer Betätigungseinrichtung für eine Leiterplatte, werden anschlussspezifisch entweder Lötkontakte mit SMD-Lötflache, mit einem einzelnen Lötanschluss oder mit mehreren z. B. zwei Lötstiften nebeneinander verbaut. Demnach ist bei der Herstellung von solchen Einrichtungen für jede Variante der vorgesehenen Anbindung an die Leiterplatte eine separate Variante zu verbauender Lötkontakte bereitzuhalten.Known contact modules that are set up for soldering to a circuit board each have z. B. a solder contact that makes contact with an element that can be connected to the contact module. Such a, usually metallic, solder contact has a solder area that is soldered to the circuit board. This area can be designed as an SMD soldering surface, where SMD stands for "surface-mount device", as a single soldering pin or as an arrangement of specific contours that are formed in one piece with the soldering contact. When producing such a contact module, such as a part of an actuator or an actuating device for a circuit board, either solder contacts with an SMD soldering area, with a single solder connection or with several z. B. two soldering pins installed next to each other. Accordingly, when producing such devices, a separate variant of solder contacts to be installed must be prepared for each variant of the intended connection to the circuit board.

Weiter ist z. B. für jede Orientierung eines solchen Kontaktmoduls auf einer Leiterplatte ein separates Design von Lötkontakten erforderlich, soweit beispielsweise eine Einsteckrichtung relativ zu einer Planebene der Leiterplatte parallel oder senkrecht orientiert sein soll. Soweit eine Verbindung beispielsweise eine senkrecht zu einer Leiterplattenebene orientierte Ausrichtung haben soll, werden entsprechende Lötkontakte verbaut, die ebenfalls senkrecht zur Leiterplatte orientierte Lötstifte haben. Bei einer parallel zu einer Leiterplattenplanebene orientierten Montagerichtung, sind die Lötkontakte relativ zu der Einsteckrichtung z. B. quer orientiert.Next is e.g. B. a separate design of solder contacts is required for each orientation of such a contact module on a circuit board, if, for example, an insertion direction should be oriented parallel or perpendicular relative to a plane of the circuit board. If, for example, a connection is to have an orientation oriented perpendicular to a circuit board plane, corresponding solder contacts are installed, which also have solder pins oriented perpendicular to the circuit board. If the mounting direction is oriented parallel to a PCB plane, the solder contacts are relative to the insertion direction, for example. B. oriented transversely.

Für all diese Verbindungs- und Orientierungsvarianten werden üblicherweise separate Varianten der zu verbauenden Lötkontakte vorgehalten und stellt sich bei der Montage das Problem, diese geeignet gegen Umwelteinflüsse abzudichten.For all of these connection and orientation variants, separate variants of the solder contacts to be installed are usually kept and the problem arises during assembly of sealing them appropriately against environmental influences.

Die Abdichtung der Verbindungseinrichtung nach dem Verbinden zum Beispiel der in einem Aktuator zu integrierenden Leiterplatte bzw. Stanzgitter mit der PCB-Basisleiterplatte stellt den Hersteller vor große Herausforderungen. Darüber hinaus sind eine gute und dauerhafte Verbindung zur Leiterplatte oder zum Stanzgitter erforderlich.The sealing of the connecting device after connecting, for example, the circuit board or lead frame to be integrated in an actuator with the PCB base circuit board presents the manufacturer with major challenges. In addition, a good and permanent connection to the circuit board or lead frame is required.

Insgesamt steht damit die Aufgabe im Raum einerseits ein elektrisches Bauelement (insbesondere umfassend bewegliche Bauteile), wie einen Aktuator oder ein Schalter mit einem Betätigungsstift oder einem beweglichen Schaltelement und einer integralen Leiterplatte auf einer weiteren Leiterplatte oder einem Stanzgitter (z. B. einer Steuerplatte oder einer zentralen übergeordneten PCB) elektrisch verbindend zu montieren und dabei die Schnittstellen zu den Leiterplatten entsprechend den Anforderungen passend abzudichten.Overall, the task is, on the one hand, an electrical component (in particular comprising movable components), such as an actuator or a switch with an actuating pin or a movable switching element and an integral circuit board on a further circuit board or a lead frame (e.g. a control plate or a central, higher-level PCB) to be installed in an electrically connecting manner and to seal the interfaces to the circuit boards appropriately according to the requirements.

Das Dokument DE102011089020 offenbart ein Kontaktmodul gemäß dem Oberbegriff des Anspruchs 1.The document DE102011089020 discloses a contact module according to the preamble of claim 1.

Die Schutzart ist standardisiert z. B. in der EN 60529 (VDE 0470-1): 2014-09 Schutzarten durch Gehäuse (IP-Code) bzw. IEC 60529:1989 + A1 :1999 + A2:2013 und der deutschen Fassung EN 60529:1991 + A1:2000 + A2:2013, früher VDE 0470-1. Die gemäß der internationalen Norm definierte Schutzart gibt die Eignung von elektrischen Betriebsmitteln für verschiedene Umgebungsbedingungen an. Die Schutzart ist von der elektrischen Schutzklasse zu unterscheiden. Während die Schutzart den Schutz aktiver Teile gegen Berührung, Eindringen von Fremdkörpern und Wasser sowie die Stoßfestigkeit definieren (sog. Gehäuseschutz), beschreibt die Schutzklasse Maßnahmen gegen gefährliche Spannungen an berührbaren, betriebsmäßig nicht unter Spannung stehenden leitfähigen Teilen von Betriebsmitteln.The protection type is standardized, e.g. E.g. in EN 60529 (VDE 0470-1): 2014-09 Protection types through housing (IP code) or IEC 60529:1989 + A1:1999 + A2:2013 and the German version EN 60529:1991 + A1:2000 + A2:2013, formerly VDE 0470-1. The protection class defined according to the international standard indicates the suitability of electrical equipment for various environmental conditions. The protection type must be distinguished from the electrical protection class. While the protection class defines the protection of active parts against contact, penetration of foreign bodies and water as well as shock resistance (so-called housing protection), the protection class describes measures against dangerous voltages on touchable, operationally not live conductive parts of equipment.

So definiert die Schutzart IP 67 einen hohen Schutz gegen das Eindringen von Fremdkörpern und Wasser. Bei Leiterplattenverbindungen ist es allerdings schwierig eine gute Dichtung zu erzielen, die gleichzeitig kostengünstig realisierbar ist und dauerhaft die Anordnung abdichtet.The protection class IP 67 defines a high level of protection against the ingress of foreign bodies and water. When it comes to circuit board connections, however, it is difficult to achieve a good seal that can be implemented cost-effectively and permanently seals the arrangement.

Vor diesem Hintergrund liegt der vorliegenden Erfindung die technische Problemstellung zugrunde, eine Leiterplattenkontaktanordnung, ein Kontaktmodul für die Verbindung eines Aktuators bzw. einer Leiterplatte mit einer weiteren Leiterplatte und ein Verfahren zum Herstellen eines Kontaktmoduls anzugeben, welche die voranstehend beschriebenen Nachteile nicht oder zumindest in geringerem Maße aufweisen, und insbesondere eine Kontaktanordnung anzugeben, der bezüglich der vorzusehenden Verbindungsart, Dichtigkeit und Orientierung flexibel ist und so das kostengünstige Bereitstellen ermöglicht.Against this background, the present invention is based on the technical problem of specifying a circuit board contact arrangement, a contact module for connecting an actuator or a circuit board to another circuit board and a method for producing a contact module, which do not have the disadvantages described above or at least to a lesser extent have, and in particular to specify a contact arrangement that is flexible with regard to the type of connection to be provided, tightness and orientation and thus enables cost-effective provision.

Die voranstehend beschriebene, technische Problemstellung wird jeweils gelöst durch eine Leiterplattenkontaktanordnung, ein Kontaktmodul für die Verbindung eines Aktuators bzw. einer Leiterplatte mit einer weiteren Leiterplatte und ein Verfahren zum Herstellen eines Kontaktmoduls entsprechend den jeweils definierten unabhängigen Ansprüchen. Weitere Ausgestaltungen der Erfindung ergeben sich aus den abhängigen Ansprüchen und der nachstehenden Beschreibung.The technical problem described above is solved in each case by a circuit board contact arrangement, a contact module for connecting an actuator or a circuit board to another circuit board and a method for producing a contact module in accordance with the respectively defined independent claims. Further refinements of the invention result from the dependent claims and the description below.

Erfindungsgemäß wird hierzu ein Kontaktmodul gemäß Anspruch 1 vorgesehen.According to the invention, a contact module according to claim 1 is provided for this purpose.

In einer vorteilhaften Ausführungsform der Erfindung ist vorgesehen, dass die Leiterplattenkontakte einen zentralen, um etwa 90° gewinkelten im Abdichtungskörper liegenden Kontaktabschnitt aufweisen. Dadurch ergeben sich Orientierungen von flachen Leiterplatten, die senkrecht aufeinander stehen. Ebenfalls vorteilhaft ist es, wenn sich die Verbindungsabschnitte an einen aus dem Abdichtungskörper hervorstehenden Stegabschnitt anschließen und gegenüber dem Stegabschnitt in einer Parallelebene versetzt angeordnet sind, wobei der Versatz größer, insbesondere um ein Mehrfaches größer ist, in Relation zur Materialdicke des Stegabschnittes betrachtet in Richtung des Versatzes. Dies kann durch einen dazwischen liegenden Biegeabschnitt erreicht werden. Dadurch befindet sich die Verbindungsfläche an einer Seitenfläche der Kontakte und nicht an deren Stirnfläche und erlaubt eine gezielte und positionsgenaue Orientierung der einen Leiterplatte in einem Montageschritt.In an advantageous embodiment of the invention it is provided that the circuit board contacts have a central contact section lying in the sealing body and angled at approximately 90°. This results in orientations of flat circuit boards that are perpendicular to one another. It is also advantageous if the connecting sections adjoin a web section protruding from the sealing body and are arranged offset from the web section in a parallel plane, the offset being larger, in particular several times larger, in relation to the material thickness of the web section, viewed in the direction of offset. This can be achieved by a bending section in between. As a result, the connecting surface is located on a side surface of the contacts and not on their end face and allows a targeted and precise positioning of one circuit board in one assembly step.

Gemäß der Erfindung ist vorgesehen, dass die jeweilige Einpresszone aus zwei parallel verlaufenden Kontaktarme gebildet ist, welche an ihrem einsteckseitigen Ende materialschlüssig miteinander verbunden sind und insbesondere eine schräge Seitenflanke aufweisen, die am steckseitigen Ende der Einpresszone beginnt und in Erstreckungsrichtung der Einpresszone so verläuft, dass die Dicke der Einpresszone zumindest partiell in diesem Bereich zunimmt. Dies erlaubt eine vereinfachte Einführung der Einpresszonen der gesamten Vorrichtung, d. h. eines Schalters mit der Leiterplattenkontaktanordnung in eine weitere Leiterplatte.According to the invention it is provided that the respective press-in zone is formed from two parallel contact arms, which are connected to one another in a material-locking manner at their plug-in end and in particular have an oblique side flank which begins at the plug-in end of the press-in zone and runs in the extension direction of the press-in zone in such a way that the thickness of the press-in zone increases at least partially in this area. This allows a simplified introduction of the press-in zones of the entire device, i.e. H. a switch with the circuit board contact arrangement into another circuit board.

Eine weitere bevorzugte Ausgestaltung der Erfindung sieht vor, dass der Abdichtungskörper als eine Umspritzung mit einem elektrisch nicht leitenden Kunststoff um die Leiterplattenkontakte herum ausgebildet ist.A further preferred embodiment of the invention provides that the sealing body is designed as an encapsulation with an electrically non-conductive plastic around the circuit board contacts.

In einer weiteren bevorzugten Ausgestaltung der Erfindung ist vorgesehen, dass der Abdichtungskörper einen umlaufenden Kragen ausbildet und vorzugsweise eine sich daran anschließende im Wesentlichen quaderförmige Basis aus der einstückig zwei Rastarme hervorstehen. Auf diese Weise kann eine besonders gut dichtende Zusammenwirkung mit einem Gehäuse erreicht werden, das mit einer Stirnseite gegen den Kragen lagert. Die Abdichtung des Sockels mit dem Gehäuse erfolgt dabei nicht unmittelbar über die Rasthaken; die Rasthaken halten das Gehäuse nur in Position für das Laserschweißen, welches die dichte Verbindung herstellt.In a further preferred embodiment of the invention it is provided that the sealing body forms a circumferential collar and preferably an adjoining essentially cuboid base from which two locking arms protrude in one piece. In this way, a particularly good sealing interaction can be achieved with a housing that has one end face against the collar. The base is sealed with the housing not directly over the locking hooks; the locking hooks only hold the housing in position for laser welding, which creates the tight connection.

In einer weiteren Beispiel ist vorgesehen, dass das Kontaktmodul in einem Schalter oder elektrischen Bauelement aufweisend einen Aktuator integriert, wobei das Kontaktmodul dabei von einem Gehäuse (des Schalters bzw. Bauelements) umgeben ist und vorzugsweise ferner innerhalb des Gehäuses ein gegen eine Feder gelagerter Schleifer mit dem Aktuator zusammenwirkt, um den Schleifer entlang der Leiterplatte zu betätigen, vorzugsweise schaltend zu betätigen.In a further example, it is provided that the contact module is integrated into a switch or electrical component having an actuator, the contact module being surrounded by a housing (of the switch or component) and preferably also having a wiper mounted against a spring within the housing cooperates with the actuator to operate the grinder along the circuit board, preferably to operate it in a switching manner.

In einer ebenfalls bevorzugten Ausgestaltung der Erfindung ist vorgesehen, dass an einem Betätigungsabschnitt des Gehäuses ein elastisch verformbarer Dichtkopf vorgesehen ist, der sich in Betätigungsrichtung oberhalb des Aktuator befindet.In a likewise preferred embodiment of the invention it is provided that an elastically deformable sealing head is provided on an actuation section of the housing, which is located above the actuator in the actuation direction.

Ein weiterer Aspekt der vorliegenden Erfindung sieht ein Verfahren gemäß Anspruch 8 vor.A further aspect of the present invention provides a method according to claim 8.

Weiter bevorzugt ist es, wenn die Verbindungsabschnitte mit einer Leiterplatte kraftschlüssig (über elastische/plastische Verformung) verbunden werden und zumindest abschnittsweise in ein einseitig offenes Gehäuse hineinragend montiert werden, um im montierten Zustand mit einem Gehäuserand des Gehäuses an dem Abdichtungskörper anzuliegen. Danach kann die gesamte Anordnung in eine Leiterplatte mit den Einpresszonen eingepresst werden (vorzugsweise mit dem weiter oben beschriebenen Dichtelement) im Bereich der Einpresszonen.It is further preferred if the connecting sections are non-positively connected to a circuit board (via elastic/plastic deformation) and are mounted at least in sections protruding into a housing that is open on one side, in order to rest against the sealing body with a housing edge of the housing in the assembled state. The entire arrangement can then be pressed into a circuit board with the press-in zones (preferably with the sealing element described above) in the area of the press-in zones.

Andere vorteilhafte Weiterbildungen der Erfindung sind in den Unteransprüchen gekennzeichnet bzw. werden nachstehend zusammen mit der Beschreibung der bevorzugten Ausführung der Erfindung anhand der Figuren näher dargestellt.Other advantageous developments of the invention are characterized in the subclaims or are shown in more detail below together with the description of the preferred embodiment of the invention with reference to the figures.

Es zeigen:

  • Fig.1 eine perspektivische Ansicht der Teile eines Schalters aufweisend ein erfindungsgemäßes Kontaktmodul und
  • Fig. 2 eine perspektivische Anordnung des Schalters aus Fig. 1 im zusammen montierten Zustand und
  • Fig. 3 eine Leiterplattenkontaktanordnung.
Show it:
  • Fig.1 a perspective view of the parts of a switch having a contact module according to the invention and
  • Fig. 2 a perspective arrangement of the switch Fig. 1 when assembled and
  • Fig. 3 a circuit board contact arrangement.

Im Folgenden wird die Erfindung anhand einer beispielhaften Ausführungsform mit Bezug auf die Figuren 1 bis 3 näher beschrieben, wobei gleiche Bezugszeichen auf gleiche funktionale und/oder strukturelle Merkmale hinweisen.The invention is explained below using an exemplary embodiment with reference to Figures 1 to 3 described in more detail, with the same reference numbers indicating the same functional and / or structural features.

Die Figur 1 zeigt eine schematische Darstellung einer Ausführungsform einer erfindungsgemäßen Konfiguration eines Schalters, wobei eine perspektivische Ansicht der Teile eines Schalters S aufweisend ein erfindungsgemäßes Kontaktmodul gezeigt ist.The Figure 1 shows a schematic representation of an embodiment of a configuration of a switch according to the invention, with a perspective view of the parts of a switch S having a contact module according to the invention being shown.

Der Schalter S weist ein Gehäuse 40 auf in dem ein Aktuator 43, eine Feder 42, einen gegen die Feder 42 beweglich gelagerten Schleifer 41, der mit dem Aktuator 43 zusammenwirkt, um den Schleifer 41 entlang der Leiterplatte PCB1 zu betätigen. Aus der Oberseite des Abdichtungskörpers 20 ragt einstückig ein Lagerpin für die Feder 42 hervor. An dem oberen Betätigungsabschnitt des Gehäuses 40 ist ein elastisch verformbarer Dichtkopf 50 oberhalb des Bezugszeichens 51 vorgesehen, der sich in Betätigungsrichtung oberhalb des Aktuator 43 befindet. In der Figur 2 findet sich eine perspektivische Anordnung des Schalters aus Fig. 1 im zusammen montierten Zustand aufweisend die nachfolgend beschriebene Leiterplattenkontaktanordnung 1.The switch S has a housing 40 in which an actuator 43, a spring 42, a wiper 41 movably mounted against the spring 42, which cooperates with the actuator 43 to actuate the wiper 41 along the circuit board PCB1. A bearing pin for the spring 42 protrudes in one piece from the top of the sealing body 20. On the upper actuation section of the housing 40, an elastically deformable sealing head 50 is provided above the reference number 51, which is located above the actuator 43 in the actuation direction. In the Figure 2 There is a perspective arrangement of the switch Fig. 1 in the assembled state, having the circuit board contact arrangement 1 described below.

In der Figur 3 wird dabei die in Figur 1 aufgenommene Leiterplattenkontaktanordnung 1 für die Kontaktierung einer ersten Leiterplatte PCB1 mit einer zweiten (nicht dargestellten) Leiterplatte oder Stanzgitter gezeigt. Die Leiterplattenkontaktanordnung 1 weist zwei Leiterplattenkontakte 10 auf, die an ihrem einen Kontaktende 10a einen Verbindungsabschnitt 11 und an ihrem zweiten Kontaktende 10b eine Einpresszone 12 aufweisen.In the Figure 3 will be the in Figure 1 recorded circuit board contact arrangement 1 for contacting a first circuit board PCB1 with a second (not shown) circuit board or lead frame shown. The circuit board contact arrangement 1 has two circuit board contacts 10, which have a connecting section 11 at one contact end 10a and a press-in zone 12 at their second contact end 10b.

Zwischen dem Verbindungsabschnitt 11 und der Einpresszone 12 ist ein in einem zentralen Abschnitt die Kontakte vollständig umgebender Abdichtungskörper 20 ausgebildet und zwar mittels einer Umspritzung. Aus der einen (oberen) Seitenfläche 21 ragt der jeweilige Verbindungsabschnitt 11 heraus und aus einer anderen und zwar vorderen Seitenfläche 22 stehen die Einpresszonen 12 hervor.Between the connecting section 11 and the press-in zone 12, a sealing body 20 which completely surrounds the contacts in a central section is formed by means of an overmolding. From the The respective connecting section 11 protrudes from one (upper) side surface 21 and the press-in zones 12 protrude from another, namely front side surface 22.

Die Länge der Einpresszonen und des Kontaktüberstandes aus dem Abdichtungskörper 20 heraus ist dabei auf die Dicke des ebenfalls dargestellten Dichtelements 30 abgestimmt. Dieses Dichtelement 30 ist als ein einteiliges Dichtelement mit Durchdringöffnungen 31 für die Einpresszonen 12 ausgebildet sowie einer dazwischen liegenden Öffnung für einen Positionierpin, der durch die dazwischen liegende Öffnung ragt. Alternativ kann als Dichtelement, welches im Bereich der späteren Durchführung der Kontakte liegt, eine dünn ausgeformte Membran aufweisen, die von den Kontakten während der Montage durchstochen wird.The length of the press-in zones and the contact projection from the sealing body 20 is matched to the thickness of the sealing element 30, which is also shown. This sealing element 30 is designed as a one-piece sealing element with penetration openings 31 for the press-in zones 12 and an opening in between for a positioning pin which protrudes through the opening in between. Alternatively, the sealing element, which is located in the area where the contacts will later be inserted, can have a thinly formed membrane, which is pierced by the contacts during assembly.

Die Leiterplattenkontakte 10 besitzen im Inneren des Abdichtungskörpers einen zentralen, um etwa 90° gewinkelten Kontaktabschnitt. Ferner schließen sich die Verbindungsabschnitte 11 an einen aus dem Abdichtungskörper 20 hervorstehenden Stegabschnitt 22 an, indem über einen Biegeabschnitt ein seitlicher und gegenüber dem Stegabschnitt 22 in einer Parallelebene versetzter Abschnitt gebildet ist. Die Verbindungsabschnitte 11 sind schematisch an der ersten Leiterplatte PCB1 mittels kraftschlüssiger Verbindung verbunden.The circuit board contacts 10 have a central contact section angled at approximately 90° inside the sealing body. Furthermore, the connecting sections 11 adjoin a web section 22 protruding from the sealing body 20, in that a lateral section offset from the web section 22 in a parallel plane is formed via a bending section. The connecting sections 11 are schematically connected to the first printed circuit board PCB1 by means of a non-positive connection.

Die beiden Einpresszonen 12 sind aus zwei parallel verlaufenden Kontaktarmen 12a, 12b gebildet, welche an ihrem einsteckseitigen Ende in diesem Ausführungsbeispiel materialschlüssig miteinander verbunden sind und eine schräge Seitenflanke 12c aufweisen.The two press-in zones 12 are formed from two parallel contact arms 12a, 12b, which in this exemplary embodiment are connected to one another in a material-locking manner at their insertion-side end and have an oblique side flank 12c.

Der Abdichtungskörper 20 bildet einen umlaufenden Kragen 24 aus sowie zwei Rastarme 25 zur Befestigung am Gehäuse 40.The sealing body 20 forms a circumferential collar 24 and two locking arms 25 for attachment to the housing 40.

Claims (9)

  1. A contact module for a switch or an electric component with an actuator, comprising a first printed circuit board (PCB1) and a printed circuit board contact arrangement (1) for contacting the first printed circuit board (PCB1) with a second printed circuit board (PCB2),
    wherein the printed circuit board contact arrangement (1) has at least two printed circuit board contacts (10) which have a connection section (11) at one contact end (10a) thereof and a press-in zone (12) at their second contact end (10b), and
    wherein at least one sealing body (20) which fully surrounds the printed circuit board contacts (10) in a central section is provided between the connection section (11) and the press-in zone (12) and from which the connection section (11) protrudes from one lateral surface (21) and the press-in zones (12) protrude from another lateral surface (22),
    wherein the first printed circuit board (PCB1) is connected to the connection sections (11) of the printed circuit board contact arrangement (1) in an electrically conducting manner,
    characterized in that the respective press-in zone (12) is formed from two contact arms (12a, 12b) running in parallel, which are materially connected to one another at their insertion-side end and have an oblique side flank (12c) which begins at the insertion-side end of the press-in zone (12) and runs in the extension direction of the press-in zone (12) so that the thickness of the press-in zone (12) increases at least partially in this region,
    wherein a sealing element (30), which is provided in the region of the feedthrough of the printed circuit board contacts (10), has a thinly shaped membrane which is formed to be pierced through by the printed circuit board contacts (10) during assembly.
  2. The contact module according to claim 1, characterized in that the printed circuit board contacts (10) have a central contact section which is angled by about 90° and lies in the sealing body (20).
  3. The contact module according to claim 1 or 2, characterized in that the connection sections (11) join at a web section (22) protruding from the sealing body (20) and are arranged offset opposite to the web section (22) in a parallel plane, wherein the offset is larger, in particular a multiple, in relation to the material thickness of the web section (22) as viewed in the direction of the offset.
  4. The contact module according to any one of the preceding claims, characterized in that the sealing body (20) is formed as an overmold around the printed circuit board contacts (10).
  5. The contact module according to claim 4, characterized in that the sealing body (20) forms a surrounding collar (24) and preferably an adjoining substantially cuboidshaped base from which two latching arms (25) protrude in an integral manner.
  6. The contact module according to any one of the preceding claims, integrated into a switch or an electric component with an actuator (43), wherein the contact module is surrounded by a housing (40) and a grinder (41) supported against a spring (42) cooperates with the actuator (43) within the housing (40) in order to actuate the grinder (41) along the printed circuit board (PCB1), preferably actuate it in a switching manner.
  7. The contact module according to the preceding claim, characterized in that an elastically deformable sealing head is provided on an actuation section of the housing (40), which is above the actuator (43) in the actuation direction.
  8. A method for producing a contact module according to any one of the preceding claims, comprising the following steps:
    a. providing at least two printed circuit board contacts (10) arranged side by side, which have a connection section (11) at one contact end (10a) thereof and a press-in zone (12) at their second contact end (10b);
    b. producing a sealing body (20) which fully surrounds the printed circuit board contacts (10) by means of overmolding, preferably in one operating step in an overmolding tool,
    c. wherein the overmolding is formed so that the respective connection section (11) protrudes from a first lateral surface (21) of the sealing body (20) and the respective press-in zones (12) protrude from another lateral surface (22).
  9. The method according to the preceding claim, characterized in that the connection sections (11) of the printed circuit board contact arrangement (1) produced according to claim 8 are materially connected to the first printed circuit board (PCB1) and then are assembled protruding into an unilaterally open housing (40) at least in sections so that a housing edge (40a) of the housing (40) sealingly abuts the housing body (20) in the assembled state.
EP21766675.9A 2020-12-10 2021-08-30 Contact module for contacting printed circuit boards Active EP4066268B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102020132937.7A DE102020132937A1 (en) 2020-12-10 2020-12-10 Contact module for contacting printed circuit boards
PCT/EP2021/073836 WO2022122198A1 (en) 2020-12-10 2021-08-30 Contact module for contacting printed circuit boards

Publications (2)

Publication Number Publication Date
EP4066268A1 EP4066268A1 (en) 2022-10-05
EP4066268B1 true EP4066268B1 (en) 2024-03-20

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Application Number Title Priority Date Filing Date
EP21766675.9A Active EP4066268B1 (en) 2020-12-10 2021-08-30 Contact module for contacting printed circuit boards

Country Status (3)

Country Link
EP (1) EP4066268B1 (en)
DE (1) DE102020132937A1 (en)
WO (1) WO2022122198A1 (en)

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6059381A (en) 1997-12-19 2000-05-09 Itt Manufacturing Enterprises, Inc. ABS pump connector
DE102008014822A1 (en) 2008-03-18 2009-09-24 Hella Kgaa Hueck & Co. Printed circuit board arrangement, has connection part provided with set of connecting sections, where connecting sections are inserted into corresponding push through openings of printed circuit boards by hot pressing
DE102011110683A1 (en) * 2010-08-27 2012-05-03 Marquardt Mechatronik Gmbh Electric switch
DE102011089020B4 (en) 2011-12-19 2023-11-16 Zf Friedrichshafen Ag Contact connector and method for producing a contact connector
DE102013002709B4 (en) 2013-02-16 2018-03-29 Amphenol-Tuchel Electronics Gmbh Sealed PCB connector
US9831580B2 (en) 2015-09-15 2017-11-28 Ghsp, Inc. Vehicle-mounted sensorless motor with edge-connected termination
JP6662537B2 (en) * 2016-07-22 2020-03-11 アルプスアルパイン株式会社 Switch device and method of manufacturing the switch device

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Publication number Publication date
EP4066268A1 (en) 2022-10-05
WO2022122198A1 (en) 2022-06-16
DE102020132937A1 (en) 2022-06-15

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