EP1645018A1 - high-frequency coupler for connecting a coaxial plug to a high-frequency transmission line on a printed circuit board - Google Patents

high-frequency coupler for connecting a coaxial plug to a high-frequency transmission line on a printed circuit board

Info

Publication number
EP1645018A1
EP1645018A1 EP04763118A EP04763118A EP1645018A1 EP 1645018 A1 EP1645018 A1 EP 1645018A1 EP 04763118 A EP04763118 A EP 04763118A EP 04763118 A EP04763118 A EP 04763118A EP 1645018 A1 EP1645018 A1 EP 1645018A1
Authority
EP
European Patent Office
Prior art keywords
circuit board
printed circuit
coupler
pin
coupler according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP04763118A
Other languages
German (de)
French (fr)
Other versions
EP1645018B1 (en
Inventor
Willem Blackborn
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rosenberger Hochfrequenztechnik GmbH and Co KG
Original Assignee
Rosenberger Hochfrequenztechnik GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rosenberger Hochfrequenztechnik GmbH and Co KG filed Critical Rosenberger Hochfrequenztechnik GmbH and Co KG
Publication of EP1645018A1 publication Critical patent/EP1645018A1/en
Application granted granted Critical
Publication of EP1645018B1 publication Critical patent/EP1645018B1/en
Not-in-force legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R24/00—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure
    • H01R24/38—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure having concentrically or coaxially arranged contacts
    • H01R24/40—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure having concentrically or coaxially arranged contacts specially adapted for high frequency
    • H01R24/50—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure having concentrically or coaxially arranged contacts specially adapted for high frequency mounted on a PCB [Printed Circuit Board]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R2103/00—Two poles

Definitions

  • RF coupler for connecting a coaxial connector to an RF transmission line on a circuit board
  • the present invention relates to an RF coupler for connecting a coaxial connector to an RF transmission line on a printed circuit board, according to the preamble of claim 1.
  • the invention has for its object to provide an RF coupler of the above. Type to improve in such a way that an automated manufacturing process can be carried out reliably and with less effort.
  • the RF coupler has at least a first pair of spring plates, which is arranged and designed for electrically contacting a central conductor of the coaxial connector, and at least a second pair of spring plates, which are used for electrically contacting an outer conductor of the coaxial connector is arranged and formed, wherein at least one spring plate of the first pair at one end facing away from the coaxial connector has a contact surface for electrically connecting the RF coupler to the RF transmission line on the circuit board and for mechanical connection to the circuit board and at least one spring plate of the second pair has at one end facing away from the coaxial connector a contact surface for electrically connecting the RF coupler to a ground contact on the printed circuit board and for mechanical connection to the printed circuit board.
  • the RF coupler can also be equipped and soldered simultaneously with the fitting and soldering of components on the circuit board, only for establishing an RF connection or electrical contact with the circuit board, for example through a housing the coaxial connector must be inserted into the spring lamellae without additional soldering work being required to establish the electrical contacts between the RF coaxial connector and the printed circuit board.
  • the coaxial connector can also be removed or replaced at any time without having to open a housing surrounding the circuit board and having to carry out soldering work.
  • a simple and mechanical assembly of printed circuit boards with the RF coupler in the form of a surface-mountable component is achieved in that the contact surfaces of the spring blades are arranged in one plane parallel to the printed circuit board.
  • the coaxial connector expediently has a housing bushing section for a housing surrounding the printed circuit board.
  • all spring lamellae extend in one plane parallel to the printed circuit board.
  • the spring blades of the first pair are formed in one piece in the area of the contact surface.
  • the spring blades of a pair are angled away from one another at their end facing the coaxial connector.
  • the HF coupler has a housing which carries all spring plates.
  • a gripping tip of the pick-and-place machine only has to grip the housing and position it on the printed circuit board, which means that all the spring blades are automatically arranged and positioned correctly.
  • the housing is expediently designed as a flat component and preferably has at least one pin which extends away from the housing for engagement in the printed circuit board.
  • the housing expediently has a recess into which free ends of the spring lamellae which face the coaxial plug project.
  • the pin is designed to engage in a hole in the printed circuit board, the pin having at least one locking lug which projects beyond the outer circumference of the pin in the radial direction, the locking lug being arranged and designed on the pin in such a way that that the outer circumference of the pin in the area of the locking lug is smaller than the diameter of the hole in the printed circuit board, the outer circumference of the section of the pin projecting into the hole in the printed circuit board being designed such that there is between the outer circumference of this section and the inner wall of the hole the circuit board over at least part of the outer circumference results in such a gap with capillarity for solder that during a soldering process, solder located on a surface of the printed circuit board by capillary action into the intermediate space and penetrating it completely.
  • a positive connection without tolerances in the direction along a longitudinal axis of the hole in the circuit board is achieved in that the latching lug on the pin is arranged and designed such that the latching lug is arranged within the hole in the circuit board when the component is completely placed on the circuit board.
  • the circumference of the pin is formed with at least one recess in the longitudinal direction over the entire section located in the hole in the printed circuit board.
  • a particularly good interlock between the solder penetrating into the hole in the circuit board and the circuit board is achieved in that the hole in the circuit board is metallized.
  • FIG. 1 shows a preferred embodiment of an RF coupler according to the invention in a perspective view from above, 2 the RF coupler according to FIG. 1 in a perspective view from below,
  • FIG. 3 shows the RF coupler according to FIG. 1 in the installed state and with the RF coaxial plug pushed on in a perspective view from above,
  • FIG. 4 shows the RF coupler according to FIG. 1 in the installed state and with the RF coaxial plug pushed on in a partially sectioned view from below,
  • FIG. 5 shows a preferred embodiment of a component placed on a printed circuit board in supervision
  • FIG. 6 is a view of detail X of FIG. 5 before a soldering process
  • Fig. 7 is a sectional view taken along line A-A of Fig. 6,
  • Fig. 8 is a view of detail X of Fig. 5 after a soldering process
  • FIG. 9 is a sectional view taken along line B-B of FIG. 8.
  • the preferred embodiment of an RF coupler is designed as a surface-mountable component (SMD - Surface Mount Devide)) and comprises a housing 10 in which a first pair of spring plates 12, 14 and a second pair of spring plates 16 , 18 are arranged.
  • the housing 10 has a recess 20 on one side, in which the spring plates 12, 14, 16, 18 are exposed.
  • the spring plates 12, 14, 16, 18 are arranged and resiliently elastic that the first pair of spring plates 12, 14 an inner conductor of an RF coaxial connector and the second pair of spring blades 16, 18 an outer conductor of the RF coaxial connector with respective free ends in the area the recess 20 electrically contacted, as will be described in more detail later.
  • the spring blades 12, 14 and 16, 18 of a pair are angled away from each other, so that there is a certain catch area, thus inserting the RF coaxial connector between the spring plates 12, 14, 16, 18 is also ensured if the alignment between the RF coaxial connector and the RF coupler is not exactly aligned due to tolerances.
  • each spring plate 12, 14, 16, 18 has a contact surface 22, 24, 28 at one end facing away from the recess 20 or the RF coaxial connector, the spring plates 12, 14 of the first pair in Area of the contact surface 24 are integrally formed. These contact areas are arranged in one plane and form respective soldering areas for the electrical contacting of contacts on a printed circuit board and for mechanical connection to the printed circuit board, as will be described in more detail below.
  • Pins 28 are arranged on the side of the housing 10, which are formed in one piece with the housing 10 and extend essentially perpendicular to the plane of the contact surfaces 22, 24, 26. These pins 28 serve to engage in corresponding recesses in the printed circuit board in order to position the HF coupler exactly relative to the printed circuit board and to fix it mechanically.
  • an installation state for an RF coupler according to the invention is shown as an example.
  • the pins 28 engage in holes 30 in the printed circuit board 32.
  • This printed circuit board 32 is already installed in a housing 34.
  • This housing 34 has an opening 36 for an RF coaxial connector 38 with inner conductor 40 and outer conductor 42.
  • the housing 34 of the coaxial connectors are simply inserted from the outside through the opening 36 even after complete closure, wherein the first pair of spring plates 12, 14 the inner conductor 40 and the second pair of spring plates 16, 18 makes electrical contact with the outer conductor 42.
  • the spring plates of a pair 12, 14 and 16, 18 are spaced apart from one another in such a way that the inner conductor 40 and the outer conductor 42 press the free, resilient ends of the spring plates 12, 14, 16, 18 apart , so that there is a corresponding contact force which, together with a contact surface, makes an electrical contact.
  • a manufacturing process for printed circuit boards with a housing and opening for an HF connection is as follows: First, a solder paste is applied mechanically to the printed circuit board and all components, including the HF couplers are applied by machine (machine assembly). Then the soldering process takes place in a hot air oven (reflow soldering).
  • the contact surfaces 22, 24, 26 of the HF coupler according to the invention are soldered to corresponding contact points on the printed circuit board 32.
  • the contact surface 24 of the spring blades 12, 14 of the first pair, which contacts the center conductor 40 of the RF coaxial connector, is electrically connected to an RF signal line on the printed circuit board 32.
  • the contact surfaces 22 and 26 of the spring plates 16, 18 of the second pair are each electrically connected to ground contacts on the printed circuit board 32.
  • the soldered connection also creates a mechanical connection to the printed circuit board 32 at the same time.
  • the two pins 28 provide an additional mechanical fixation, the pins 28 absorbing the forces that occur later when the RF coaxial connector is inserted later so that they do not damage the soldered connections. Then the circuit board 32 is installed in the housing 43 and the housing 34 is closed.
  • the RF coaxial connector 38 is then inserted through the opening 36, with corresponding electrical contacts between the RF signal line on the printed circuit board 32 and the center conductor 40 of the RF coaxial connector 38 on the one hand due to the arrangement and design of the spring blades 12, 14, 16, 18 and between corresponding ground contacts on the printed circuit board 34 and the outer conductor 42 of the RF coaxial connector 38, on the other hand, are automatically produced by inserting the RF coaxial connector 38 and without further soldering via the RF coupler.
  • the RF coaxial connector 38 is pressed into the housing 34, which can also be done mechanically on a production line.
  • Fig. 5 shows a preferred development of the component for the circuit board 32.
  • the component comprises the housing 10 and the two pins 28.
  • the component is placed on the circuit board 32, each pin 28 in a metallized hole 30 in the Printed circuit board 32 engages.
  • FIG. 6 and 7 additionally illustrate the state of the attached component before a soldering process, wherein a metallization 56 of the hole 30 can be seen.
  • Solder paste 50 is applied around part of the circumference of the hole 30, and the pin 28 protrudes into the hole 30.
  • the pin 28 is at its free end a locking lug 52 is formed, the diameter of the pin 28 in the area of the locking lug 52 being smaller than the inside diameter of the hole 30.
  • the diameter of the pin 28 is also smaller than that in the remaining portion of the pin 28 which engages in the hole 30 Inner diameter of the hole 30.
  • the length of the pin 28 is selected such that when the component is completely placed on the printed circuit board 32, the detent 52 is still inside the hole 30, as can be seen in particular from FIG. 7.
  • the pin 28 is provided with recesses 53 in the longitudinal direction, as can be seen in particular from FIG. 6.
  • the smaller diameter of the pin 28 compared to the hole 30 and the recesses 54 are chosen such that an intermediate space with capillary properties is formed between the outer circumference of the pin 28 and the inner circumference of the hole 30.
  • solder 50 In a manufacturing process in which all components are first placed on the circuit board 32 by an automatic placement machine and then a soldering process takes place in a hot-air oven, the solder 50 is heated and passes into the liquid phase. The liquid solder 50 then penetrates through the capillary action into the space between the outer periphery of the pin 28 and the inner periphery of the hole 30 and essentially completely fills it.

Landscapes

  • Coupling Device And Connection With Printed Circuit (AREA)
  • Multi-Conductor Connections (AREA)

Abstract

A high-frequency coupler connects a coaxial plug to a high-frequency transmission line on a printed circuit board. The coupler comprises a first pair of spring lamellae, for electrically contacting a middle conductor of the coaxial plug, and having a second pair of spring lamellae, for electrically contacting an outer conductor of the coaxial plug. A spring lamella of the first pair has, at an end facing away from coaxial plug, a contact surface that electrically connects the coupler to the transmission line on the printed circuit board and is mechanically connected to the printed circuit board. One spring lamella of the second pair has, at an end facing away from the coaxial plug, a contact surface that electrically connects the coupler to a printed circuit board ground contact and is mechanically connected to the printed circuit board.

Description

HF-Kuppler zum Verbinden eines Koaxialsteckers mit einer HF-Übertragungsleitung auf einer Leiterplatte RF coupler for connecting a coaxial connector to an RF transmission line on a circuit board
Die vorliegende Erfindung betrifft einen HF-Kuppler zum Verbinden eines Koaxialsteckers mit einer HF-Übertragungsleitung auf einer Leiterplatte, gemäß dem Oberbegriff des Anspruchs 1.The present invention relates to an RF coupler for connecting a coaxial connector to an RF transmission line on a printed circuit board, according to the preamble of claim 1.
Bei der Herstellung von in einem Metallgehäuse zur Abschirmung angeordneten Leiterplatten mit einem HF-Anschluß, welcher durch das Gehäuse hindurch geführt ist, wird zunächst die bestückte und in einem Heißluftofen verlötete Leiterplatte in dem offenen Gehäuse montiert und in einem nachfolgenden manuellen Arbeitsschritt ein HF-Koaxialstecker durch einen Gehäusedurchbruch eingeschoben. Entsprechende Lötfahnen am HF-Koaxialstecker müssen nun separat mit der Leiterplatte verlötet werden, bevor ein das Gehäuse verschließender Deckel montiert werden kann. Dieser Herstellungsprozeß ist dahingehend nachteilig, daß der zusätzliche, manuelle Lötvorgang einen hohen Aufwand erfordert und keine so hohe Prozeßsicherheit bietet wie das Löten der Bauteile im Heißluftofen. Zusätzlich können Leiterplatte bzw. HF-Koaxialstecker bei etwaigen Schäden nicht einfach ausgetauscht werden.In the manufacture of printed circuit boards arranged in a metal housing for shielding with an HF connection, which is led through the housing, the assembled and soldered circuit board in a hot-air oven is first mounted in the open housing and, in a subsequent manual work step, an HF coaxial connector inserted through a housing opening. Corresponding soldering tags on the RF coaxial connector must now be soldered separately to the circuit board before a cover closing the housing can be installed. This manufacturing process is disadvantageous in that the additional, manual soldering process requires a great deal of effort and does not offer as high process reliability as the soldering of the components in the hot-air oven. In addition, the circuit board or RF coaxial connector cannot be easily replaced in the event of damage.
Der Erfindung liegt die Aufgabe zugrunde, einen HF-Kuppler der o.g. Art dahinge- hend zu verbessern, daß ein automatisierter Herstellungsprozeß prozeßsicher und mit weniger Aufwand ausgeführt werden kann.The invention has for its object to provide an RF coupler of the above. Type to improve in such a way that an automated manufacturing process can be carried out reliably and with less effort.
Diese Aufgabe wird erfindungsgemäß durch einen HF-Kuppler der o.g. Art mit den in Anspruch 1 gekennzeichneten Merkmalen gelöst. Vorteilhafte Ausgestaltungen der Erfindung sind in den weiteren Ansprüchen beschrieben. Bei einem HF-Kuppler der o.g. Art ist es erfindungsgemäß vorgesehen, daß der HF-Kuppler wenigstens ein erstes Paar Federlamellen, welches zum elektrischen Kontaktieren eines Mittelleiters des Koaxialsteckers angeordnet und ausgebildet ist, sowie wenigstens ein zweites Paar Federlamellen, welches zum elektrischen Kontaktieren eines Außenleiters des Koaxialsteckers angeordnet und ausgebildet ist, aufweist, wobei wenigstens eine Federlamelle des ersten Paares an einem dem Koaxiaistecker abgewandten Ende eine Kontaktfläche zum elektrischen Verbinden des HF-Kupplers mit der HF-Übertragungsleitung auf der Leiterplatte sowie zum mechanischen Verbinden mit der Leiterplatte und wenigstens eine Federlamelle des zweiten Paares an einem dem Koaxialstecker abgewandten Ende eine Kontaktfläche zum elektrischen Verbinden des HF-Kupplers mit einem Massekontakt auf der Leiterplatte sowie zum mechanischen Verbinden mit der Leiterplatte aufweist.This object is achieved according to the invention by an RF coupler of the type mentioned above with the features characterized in claim 1. Advantageous embodiments of the invention are described in the further claims. In an RF coupler of the type mentioned above, it is provided according to the invention that the RF coupler has at least a first pair of spring plates, which is arranged and designed for electrically contacting a central conductor of the coaxial connector, and at least a second pair of spring plates, which are used for electrically contacting an outer conductor of the coaxial connector is arranged and formed, wherein at least one spring plate of the first pair at one end facing away from the coaxial connector has a contact surface for electrically connecting the RF coupler to the RF transmission line on the circuit board and for mechanical connection to the circuit board and at least one spring plate of the second pair has at one end facing away from the coaxial connector a contact surface for electrically connecting the RF coupler to a ground contact on the printed circuit board and for mechanical connection to the printed circuit board.
Dies hat den Vorteil, daß gleichzeitig mit dem Bestücken und Verlöten von Bauteilen auf der Leiterplatte auch der HF-Kuppler bestückt und verlötet werden kann, wobei zur Herstellung einer HF-Verbindung bzw. elektrischen Kontaktierung mit der Leiterplatte, beispielsweise durch ein Gehäuse hindurch, lediglich der Koaxial- stecker in die Federlamellen eingeschoben werden muß, ohne daß zur Herstellung der elektrischen Kontakte zwischen HF-Koaxialstecker und Leiterplatte zusätzliche Lötarbeiten erforderlich sind. Dadurch kann zusätzlich der Koaxialstecker jederzeit entfernt bzw. ausgetauscht werden, ohne dazu ein die Leiterplatte umgebendes Gehäuse öffnen und Lötarbeiten durchführen zu müssen.This has the advantage that the RF coupler can also be equipped and soldered simultaneously with the fitting and soldering of components on the circuit board, only for establishing an RF connection or electrical contact with the circuit board, for example through a housing the coaxial connector must be inserted into the spring lamellae without additional soldering work being required to establish the electrical contacts between the RF coaxial connector and the printed circuit board. As a result, the coaxial connector can also be removed or replaced at any time without having to open a housing surrounding the circuit board and having to carry out soldering work.
Ein einfaches und maschinelles Bestücken von Leiterplatten mit dem HF-Kuppler in Form eines oberflächenmontierbaren Bauteils erzielt man dadurch, daß die Kontaktflächen der Federlamellen in einer Ebene parallel zur Leiterplatte angeordnet sind.A simple and mechanical assembly of printed circuit boards with the RF coupler in the form of a surface-mountable component is achieved in that the contact surfaces of the spring blades are arranged in one plane parallel to the printed circuit board.
Zweckmäßigerweise weist der Koaxialstecker einen Gehäusedurchführungsabschnitt für ein die Leiterplatte umgebendes Gehäuse auf. In einer bevorzugten Ausführungsform erstrecken sich alle Federlamellen in einer Ebene parallel zur Leiterplatte.The coaxial connector expediently has a housing bushing section for a housing surrounding the printed circuit board. In a preferred embodiment, all spring lamellae extend in one plane parallel to the printed circuit board.
Für eine gute und sichere Signaiübertragung sind die Federlamellen des ersten Paares im Bereich der Kontaktfläche einstückig ausgebildet.For good and secure signal transmission, the spring blades of the first pair are formed in one piece in the area of the contact surface.
Zum Ausbilden eines vorbestimmten Fangbereiches für einen Kontaktbereich des Koaxialsteckers sind die Federlamellen eines Paares an ihrem dem Koaxialstecker zugewandten Ende voneinander weg abgewinkelt.To form a predetermined catch area for a contact area of the coaxial connector, the spring blades of a pair are angled away from one another at their end facing the coaxial connector.
Um das automatische Anordnen des HF-Kupplers auf einer Leiterplatte in einem Bestückungsautomat zu erleichtern, weist der HF-Kuppler ein Gehäuse auf, welches alle Federlamellen trägt. Dadurch muß eine Greifspitze des Bestückungsautomaten lediglich das Gehäuse fassen und auf der Leiterplatte positionieren, wo- durch automatisch alle Federlamellen korrekt angeordnet und positioniert sind. Das Gehäuse ist zweckmäßigerweise als ebenes Bauteil ausgebildet und weist bevorzugt wenigstens einen Zapfen auf, welcher sich von dem Gehäuse weg zum Eingriff in die Leiterplatte erstreckt.In order to facilitate the automatic arrangement of the HF coupler on a printed circuit board in an automatic placement machine, the HF coupler has a housing which carries all spring plates. As a result, a gripping tip of the pick-and-place machine only has to grip the housing and position it on the printed circuit board, which means that all the spring blades are automatically arranged and positioned correctly. The housing is expediently designed as a flat component and preferably has at least one pin which extends away from the housing for engagement in the printed circuit board.
Zweckmäßigerweise weist das Gehäuse eine Ausnehmung auf, in die freie, dem Koaxialstecker zugewandte Enden der Federlamellen hinein ragen. Hierdurch kann der Koaxialstecker ohne wesentliche Anpassungen an das Gehäuse des HF-Kupplers zwischen die Federlamellen eingeschoben werden.The housing expediently has a recess into which free ends of the spring lamellae which face the coaxial plug project. As a result, the coaxial connector can be inserted between the spring plates without significant adjustments to the housing of the HF coupler.
In einer bevorzugten Weiterbildung der Erfindung ist der Zapfen zum Eingriff in ein Loch der Leiterplatte ausgebildet, wobei der Zapfen wenigstens eine Rastnase aufweist, welche in radialer Richtung bzgl. des Zapfens über dessen Außenumfang hinausragt, wobei die Rastnase am Zapfen derart angeordnet und ausgebildet ist, daß der Außenumfang des Zapfens im Bereich der Rastnase kleiner ist als der Durchmesser des Loches in der Leiterplatte, wobei der Außenumfang des in das Loch der Leiterplatte hinein ragendem Abschnittes des Zapfens derart ausgebildet ist, daß sich zwischen dem Außenumfang dieses Abschnittes und der Innenwandung des Loches der Leiterplatte über wenigstens einen Teil des Außen- umfangs ein derartiger Zwischenraum mit Kapillarität für Lot ergibt, daß während eines Lötvorgangs auf einer Oberfläche der Leiterplatte befindliches Lot durch Kapillarwirkung in den Zwischenraum hinein und diesen ausfüllend eindringt.In a preferred development of the invention, the pin is designed to engage in a hole in the printed circuit board, the pin having at least one locking lug which projects beyond the outer circumference of the pin in the radial direction, the locking lug being arranged and designed on the pin in such a way that that the outer circumference of the pin in the area of the locking lug is smaller than the diameter of the hole in the printed circuit board, the outer circumference of the section of the pin projecting into the hole in the printed circuit board being designed such that there is between the outer circumference of this section and the inner wall of the hole the circuit board over at least part of the outer circumference results in such a gap with capillarity for solder that during a soldering process, solder located on a surface of the printed circuit board by capillary action into the intermediate space and penetrating it completely.
Dies hat den Vorteil, daß zum Bestücken und Verrasten des Bauteils auf der Lei- terplatte keine besonders hohe Kraft notwendig ist, so daß diese Arbeit automatisiert maschinell auf einer Fertigungsstraße für Leiterplatten mit Bestückungsautomat und Heißluftofen durchgeführt werden kann, wobei nach dem Lötvorgang im Heißluftofen automatisch eine Verrastung des Bauteils mit dem in das Loch der Leiterplatte eingedrungenen Lot hergestellt ist. Gleichzeitig ergibt sich ein tole- ranzfreier Formschluß zwischen Zapfen und Innenumfang des Loches der Leiterplatte in einer Ebene der Leiterplatte. Die Bestückung von Bauteilen mit Verrastung kann dadurch sehr kostengünstig bei gleichzeitig hohen Haltekräften und wenig Toleranz erfolgen.This has the advantage that no particularly high force is required to assemble and latch the component on the printed circuit board, so that this work can be carried out automatically by machine on a production line for printed circuit boards with an automatic assembly machine and a hot air oven, and automatically after the soldering process in the hot air oven a locking of the component with the solder penetrated into the hole of the circuit board is made. At the same time, there is a tolerance-free form fit between the pin and the inner circumference of the hole in the circuit board in one plane of the circuit board. This means that components can be fitted with latching at very low cost with high holding forces and little tolerance.
Eine formschlüssige Verbindung ohne Toleranzen in Richtung entlang einer Längsachse des Loches der Leiterplatte erzielt man dadurch, daß die Rastnase am Zapfen derart angeordnet und ausgebildet ist, daß bei vollständig auf die Leiterplatte aufgesetztem Bauteil die Rastnase innerhalb des Loches der Leiterplatte angeordnet ist.A positive connection without tolerances in the direction along a longitudinal axis of the hole in the circuit board is achieved in that the latching lug on the pin is arranged and designed such that the latching lug is arranged within the hole in the circuit board when the component is completely placed on the circuit board.
Zum weiteren Unterstützen der Kapillarwirkung ist der Umfang des Zapfens in Längsrichtung über den gesamten im Loch der Leiterplatte befindlichen Abschnitt mit wenigstens einer Ausnehmung ausgebildet.To further support the capillary action, the circumference of the pin is formed with at least one recess in the longitudinal direction over the entire section located in the hole in the printed circuit board.
Einen besonders guten Formschluß zwischen dem in das Loch der Leiterplatte eindringenden Lot und der Leiterplatte erzielt man dadurch, daß das Loch in der Leiterplatte metallisiert ist.A particularly good interlock between the solder penetrating into the hole in the circuit board and the circuit board is achieved in that the hole in the circuit board is metallized.
Die Erfindung wird im folgenden anhand der Zeichnung näher erläutert. Diese zeigt in:The invention is explained in more detail below with reference to the drawing. This shows in:
Fig. 1 eine bevorzugte Ausführungsform eines erfindungsgemäßen HF-Kupplers in perspektivischer Darstellung von oben, Fig. 2 den HF-Kuppler gemäß Fig. 1 in perspektivischer Darstellung von unten,1 shows a preferred embodiment of an RF coupler according to the invention in a perspective view from above, 2 the RF coupler according to FIG. 1 in a perspective view from below,
Fig. 3 den HF-Kuppler gemäß Fig. 1 in eingebautem Zustand und mit aufgeschobenem HF-Koaxialstecker in perspektivischer Darstellung von oben,3 shows the RF coupler according to FIG. 1 in the installed state and with the RF coaxial plug pushed on in a perspective view from above,
Fig. 4 den HF-Kuppler gemäß Fig. 1 in eingebautem Zustand und mit aufgeschobenem HF-Koaxialstecker in teilweise geschnittener Ansicht von unten,4 shows the RF coupler according to FIG. 1 in the installed state and with the RF coaxial plug pushed on in a partially sectioned view from below,
Fig. 5 eine bevorzugte Ausführungsform eines Bauteils aufgesetzt auf eine Leiterplatte in Aufsicht,5 shows a preferred embodiment of a component placed on a printed circuit board in supervision,
Fig. 6 eine Ansicht von Detail X von Fig. 5 vor einem Lötvorgang,6 is a view of detail X of FIG. 5 before a soldering process,
Fig. 7 eine Schnittansicht entlang Linie A-A von Fig. 6,Fig. 7 is a sectional view taken along line A-A of Fig. 6,
Fig. 8 eine Ansicht von Detail X von Fig. 5 nach einem Lötvorgang undFig. 8 is a view of detail X of Fig. 5 after a soldering process and
Fig. 9 eine Schnittansicht entlang Linie B-B von Fig. 8.FIG. 9 is a sectional view taken along line B-B of FIG. 8.
Die in Fig. 1 und 2 dargestellte, bevorzugte Ausführungsform eines erfindungsgemäßen HF-Kupplers ist als oberflächenmontierbares Bauteil (SMD - Surface Mount Devide)) ausgebildet und umfaßt ein Gehäuse 10, in dem ein erstes Paar Federlamellen 12, 14 und ein zweites Paar Federlamellen 16, 18 angeordnet sind. Das Gehäuse 10 weist an einer Seite eine Ausnehmung 20 auf, in der die Federlamellen 12, 14, 16, 18 frei liegen. Die Federlamellen 12, 14, 16, 18 sind derart angeordnet und federnd elastisch, daß das erste Paar Federlamellen 12, 14 einen Innenleiter eines HF-Koaxialsteckers und das zweite Paar Federlamellen 16, 18 einen Außenleiter des HF-Koaxialsteckers mit jeweiligen freien Enden im Bereich der Ausnehmung 20 elektrisch kontaktiert, wie später noch genauer beschrieben wird. An den jeweiligen freien Enden in der Ausnehmung 20 sind die Federlamellen 12, 14 bzw. 16, 18 eines Paares voneinander weg abgewinkelt, so daß sich ein gewisser Fangbereich ergibt, damit ein Einschieben des HF-Koaxialsteckers zwischen die Federlamellen 12, 14, 16, 18 auch dann gewährleistet ist, wenn die Ausrichtung zwischen HF-Koaxialstecker und HF-Kuppler toleranzbedingt nicht exakt fluchtet.1 and 2, the preferred embodiment of an RF coupler according to the invention is designed as a surface-mountable component (SMD - Surface Mount Devide)) and comprises a housing 10 in which a first pair of spring plates 12, 14 and a second pair of spring plates 16 , 18 are arranged. The housing 10 has a recess 20 on one side, in which the spring plates 12, 14, 16, 18 are exposed. The spring plates 12, 14, 16, 18 are arranged and resiliently elastic that the first pair of spring plates 12, 14 an inner conductor of an RF coaxial connector and the second pair of spring blades 16, 18 an outer conductor of the RF coaxial connector with respective free ends in the area the recess 20 electrically contacted, as will be described in more detail later. At the respective free ends in the recess 20, the spring blades 12, 14 and 16, 18 of a pair are angled away from each other, so that there is a certain catch area, thus inserting the RF coaxial connector between the spring plates 12, 14, 16, 18 is also ensured if the alignment between the RF coaxial connector and the RF coupler is not exactly aligned due to tolerances.
Wie insbesondere aus Fig. 2 ersichtlich, weist jede Federlamelle 12, 14, 16, 18 an einem der Ausnehmung 20 bzw. dem HF-Koaxialstecker abgewandten Ende eine Kontaktfläche 22, 24, 28 auf, wobei die Federlamellen 12, 14 des ersten Paares im Bereich der Kontaktfläche 24 einstückig ausgebildet sind. Diese Kontaktflächen sind in einer Ebene angeordnet und bilden jeweilige Lötflächen zum elektrischen Kontaktieren von Kontakten auf einer Leiterplatte und zum mechanischen Verbinden mit der Leiterplatte, wie nachfolgend noch genauer beschrieben wird. Seitlich am Gehäuse 10 sind Zapfen 28 angeordnet, welche einstückig mit dem Gehäuse 10 ausgebildet sind und sich im wesentlichen senkrecht zur Ebene der Kontaktflächen 22, 24, 26 erstrecken. Diese Zapfen 28 dienen zum Eingriff in ent- sprechende Ausnehmungen in der Leiterplatte, um den HF-Kuppler relativ zur Leiterplatte exakt zu positionieren und mechanisch zu fixieren.As can be seen in particular from FIG. 2, each spring plate 12, 14, 16, 18 has a contact surface 22, 24, 28 at one end facing away from the recess 20 or the RF coaxial connector, the spring plates 12, 14 of the first pair in Area of the contact surface 24 are integrally formed. These contact areas are arranged in one plane and form respective soldering areas for the electrical contacting of contacts on a printed circuit board and for mechanical connection to the printed circuit board, as will be described in more detail below. Pins 28 are arranged on the side of the housing 10, which are formed in one piece with the housing 10 and extend essentially perpendicular to the plane of the contact surfaces 22, 24, 26. These pins 28 serve to engage in corresponding recesses in the printed circuit board in order to position the HF coupler exactly relative to the printed circuit board and to fix it mechanically.
In den Fig. 3 und 4 ist beispielhaft ein Einbauzustand für einen erfindungsgemäßen HF-Kuppler dargestellt. Die Zapfen 28 greifen in Löcher 30 in der Leiterplatte 32. Diese Leiterplatte 32 ist bereits in ein Gehäuse 34 eingebaut. Dieses Gehäuse 34 weist einen Durchbruch 36 für einen HF-Koaxialstecker 38 mit Innenleiter 40 und Außenleiter 42 auf. Wie insbesondere" aus Fig. 4 ersichtlich, kann auch nach vollständigem Verschließen des Gehäuses 34 der Koaxialstecker einfach von außen durch den Durchbruch 36 eingeschoben werden, wobei das erste Paar Feder- lamellen 12, 14 den Innenleiter 40 und das zweite Paar Federlamellen 16, 18 den Außenleiter 42 elektrisch kontaktiert. Hierbei sind die Federlamellen eines Paares 12, 14 bzw. 16, 18 derart voneinander beanstandet, daß der Innenleiter 40 bzw. der Außenleiter 42 die freien, federnd elastischen Enden der Federlamellen 12, 14, 16, 18 auseinander drückt, so daß sich eine entsprechende Kontaktkraft er- gibt, die zusammen mit einer Kontaktfläche einen elektrischen Kontakt herstellt.3 and 4, an installation state for an RF coupler according to the invention is shown as an example. The pins 28 engage in holes 30 in the printed circuit board 32. This printed circuit board 32 is already installed in a housing 34. This housing 34 has an opening 36 for an RF coaxial connector 38 with inner conductor 40 and outer conductor 42. As can be seen in particular "of Fig. 4, the housing 34 of the coaxial connectors are simply inserted from the outside through the opening 36 even after complete closure, wherein the first pair of spring plates 12, 14 the inner conductor 40 and the second pair of spring plates 16, 18 makes electrical contact with the outer conductor 42. The spring plates of a pair 12, 14 and 16, 18 are spaced apart from one another in such a way that the inner conductor 40 and the outer conductor 42 press the free, resilient ends of the spring plates 12, 14, 16, 18 apart , so that there is a corresponding contact force which, together with a contact surface, makes an electrical contact.
Ein Herstellungsverfahren für Leiterplatten mit Gehäuse und Durchbruch für einen HF-Anschluß stellt sich wie folgt dar: Zuerst wird auf die Leiterplatte maschinell eine Lotpaste aufgetragen und alle Bauteile einschließlich des erfindungsgemä- ßen HF-Kupplers werden maschinell aufgebracht (maschinelle Bestückung). Anschließend erfolgt der Lötprozeß in einem Heißluftofen (reflow löten). Hierbei werden die Kontaktflächen 22, 24, 26 des erfindungsgemäßen HF-Kupplers mit entsprechenden Kontaktstellen auf der Leiterplatte 32 verlötet. Die Kontaktfläche 24 der Federlamellen 12, 14 des ersten Paares, welches den Mittelleiter 40 des HF-Koaxialsteckers kontaktiert, wird dabei mit einer HF-Signalleitung auf der Leiterplatte 32 elektrisch verbunden. Die Kontaktflächen 22 und 26 der Federlamellen 16, 18 des zweiten Paares werden dabei jeweils mit Massekontakten auf der Leiterplatte 32 elektrisch verbunden. Wie bei SMD-Bauteilen üblich, schafft die Löt- Verbindung auch gleichzeitig eine mechanische Verbindung mit der Leiterplatte 32. Eine zusätzlich mechanische Fixierung stellen die beiden Zapfen 28 zur Verfügung, wobei die Zapfen 28 die beim späteren Einstecken des HF-Koaxialsteckers seitlich auftretenden Kräfte abfangen, so daß diese nicht die Lötverbindungen beschädigen. Anschließend wird die Leiterplatte 32 in das Gehäuse 43 eingebaut und das Gehäuse 34 verschlossen. Durch den Durchbruch 36 wird dann der HF-Koaxialstecker 38 eingeschoben, wobei durch die Anordnung und Ausbildung der Federlamellen 12, 14, 16, 18 entsprechende elektrische Kontakte zwischen der HF-Signalleitung auf der Leiterplatte 32 und dem Mittelleiter 40 des HF-Koaxialsteckers 38 einerseits sowie zwischen entsprechenden Massekontak- ten auf der Leiterplatte 34 und dem Außenleiter 42 des HF-Koaxialsteckers 38 andererseits automatisch durch das Einschieben des HF-Koaxialsteckers 38 und ohne weitere Lötarbe ten über den HF-Kuppler hergestellt werden. Der HF-Koaxialstecker 38 wi rd in das Gehäuse 34 eingepreßt, wobei dies ebenfalls maschinell auf einer Fert gungsstraße erfolgen kann.A manufacturing process for printed circuit boards with a housing and opening for an HF connection is as follows: First, a solder paste is applied mechanically to the printed circuit board and all components, including the HF couplers are applied by machine (machine assembly). Then the soldering process takes place in a hot air oven (reflow soldering). Here, the contact surfaces 22, 24, 26 of the HF coupler according to the invention are soldered to corresponding contact points on the printed circuit board 32. The contact surface 24 of the spring blades 12, 14 of the first pair, which contacts the center conductor 40 of the RF coaxial connector, is electrically connected to an RF signal line on the printed circuit board 32. The contact surfaces 22 and 26 of the spring plates 16, 18 of the second pair are each electrically connected to ground contacts on the printed circuit board 32. As is usual with SMD components, the soldered connection also creates a mechanical connection to the printed circuit board 32 at the same time. The two pins 28 provide an additional mechanical fixation, the pins 28 absorbing the forces that occur later when the RF coaxial connector is inserted later so that they do not damage the soldered connections. Then the circuit board 32 is installed in the housing 43 and the housing 34 is closed. The RF coaxial connector 38 is then inserted through the opening 36, with corresponding electrical contacts between the RF signal line on the printed circuit board 32 and the center conductor 40 of the RF coaxial connector 38 on the one hand due to the arrangement and design of the spring blades 12, 14, 16, 18 and between corresponding ground contacts on the printed circuit board 34 and the outer conductor 42 of the RF coaxial connector 38, on the other hand, are automatically produced by inserting the RF coaxial connector 38 and without further soldering via the RF coupler. The RF coaxial connector 38 is pressed into the housing 34, which can also be done mechanically on a production line.
Fig. 5 zeigt eine bevorzugte Weiterbildung des Bauteils für die Leiterplatte 32. Das Bauteil umfaßt das Gehäuse 10 und die zwei Zapfen 28. In Fig. 1 ist das Bauteil auf die Leiterplatte 32 aufgesetzt, wobei jeder Zapfen 28 in ein metallisiertes Loch 30 in der Leiterplatte 32 greift.Fig. 5 shows a preferred development of the component for the circuit board 32. The component comprises the housing 10 and the two pins 28. In Fig. 1, the component is placed on the circuit board 32, each pin 28 in a metallized hole 30 in the Printed circuit board 32 engages.
Fig. 6 und 7 veranschaulichen zusätzlich den Zustand des aufgesetzten Bauteils vor einem Lötvorgang, wobei eine Metallisierung 56 des Loches 30 ersichtlich ist. Um einen Teil des Umfanges des Loches 30 ist Lotpaste 50 aufgetragen, und der Zapfen 28 ragt in das Loch 30 hinein. Der Zapfen 28 ist an seinem freien Ende mit einer Rastnase 52 ausgebildet, wobei der Durchmesser des Zapfens 28 im Bereich der Rastnase 52 kleiner ist als der Innendurchmesser des Loches 30. Auch im restlichen Abschnitt des Zapfens 28, der in das Loch 30 eingreift, ist der Durchmesser des Zapfens 28 kleiner ausgebildet als der Innendurchmesser des Loches 30. Zusätzlich ist die Länge des Zapfens 28 derart gewählt, daß sich bei vollständig auf die Leiterplatte 32 aufgesetztem Bauteil die Rastnase 52 noch innerhalb des Loches 30 befindet, wie insbesondere aus Fig. 7 ersichtlich. Zusätzlich ist der Zapfen 28 in Längsrichtung mit Ausnehmungen 53 versehen, wie insbesondere aus Fig. 6 ersichtlich. Der geringere Durchmesser des Zapfens 28 im Vergleich zum Loch 30 und die Ausnehmungen 54 sind derart gewählt, daß zwischen dem Außenumfang des Zapfens 28 und dem Innenumfang des Loches 30 ein Zwischenraum mit kapillaren Eigenschaften ausgebildet ist.6 and 7 additionally illustrate the state of the attached component before a soldering process, wherein a metallization 56 of the hole 30 can be seen. Solder paste 50 is applied around part of the circumference of the hole 30, and the pin 28 protrudes into the hole 30. The pin 28 is at its free end a locking lug 52 is formed, the diameter of the pin 28 in the area of the locking lug 52 being smaller than the inside diameter of the hole 30. The diameter of the pin 28 is also smaller than that in the remaining portion of the pin 28 which engages in the hole 30 Inner diameter of the hole 30. In addition, the length of the pin 28 is selected such that when the component is completely placed on the printed circuit board 32, the detent 52 is still inside the hole 30, as can be seen in particular from FIG. 7. In addition, the pin 28 is provided with recesses 53 in the longitudinal direction, as can be seen in particular from FIG. 6. The smaller diameter of the pin 28 compared to the hole 30 and the recesses 54 are chosen such that an intermediate space with capillary properties is formed between the outer circumference of the pin 28 and the inner circumference of the hole 30.
In einem Herstellungsverfahren, bei dem zunächst alle Bauteile von einem Bestü- ckungsautomaten auf die Leiterplatte 32 aufgesetzt werden und anschließend ein Lötvorgang in einem Heißluftofen erfolgt, wird das Lot 50 erwärmt und geht in die flüssige Phase über. Das flüssige Lot 50 dringt dann durch die Kapillarwirkung in den Zwischenraum zwischen dem Außenumfang des Zapfens 28 und dem Innenumfang des Loches 30 ein und füllt diesen im wesentlichen vollständig aus.In a manufacturing process in which all components are first placed on the circuit board 32 by an automatic placement machine and then a soldering process takes place in a hot-air oven, the solder 50 is heated and passes into the liquid phase. The liquid solder 50 then penetrates through the capillary action into the space between the outer periphery of the pin 28 and the inner periphery of the hole 30 and essentially completely fills it.
Fig. 8 und 9 zeigen den Zustand nach dem Abkühlen und Aushärten des Lotes 50. Der Zwischenraum ist vom Lot 50 gefüllt, und das Lot 50 hat sich mit der Metallisierung 56 des Loches 30 formschlüssig verbunden. Dies ergibt bereits eine formschlüssige Verbindung zwischen der Leiterplatte 32 und dem Zapfen 28 in einer Ebene der Leiterplatte 32. Zusätzlich ergibt sich durch die Rastnase 52 ein Formschluß in Richtung der Längsachse des Loches 30, d.h. in eine Richtung senkrecht zur Leiterplatte 32. Insgesamt ist somit der Zapfen 28 in allen drei Richtungen des Raumes fest mit der Leiterplatte 32 verbunden bzw. verrastet. Hierfür mußte, wie unmittelbar ersichtlich, keine Einsteckkraft oder Verrastkraft aufge- wendet werden. Die Verrastung wurde automatisch im Lötvorgang hergestellt. Zusätzlich ist offensichtlich, daß die Verbindung zwischen Zapfen 28 und Leiterplatte 32 toleranzfrei ist. 8 and 9 show the state after the solder 50 has cooled and hardened. The intermediate space is filled with solder 50, and the solder 50 has positively connected to the metallization 56 of the hole 30. This already results in a positive connection between the printed circuit board 32 and the pin 28 in one plane of the printed circuit board 32. In addition, the locking lug 52 results in a positive connection in the direction of the longitudinal axis of the hole 30, i.e. in a direction perpendicular to the circuit board 32. Overall, the pin 28 is thus firmly connected or latched to the circuit board 32 in all three directions of the space. As can be seen immediately, no insertion force or locking force had to be used for this. The latching was made automatically in the soldering process. In addition, it is obvious that the connection between pin 28 and circuit board 32 is tolerance-free.

Claims

Patentansprüche: claims:
1. HF-Kuppler zum Verbinden eines Koaxialsteckers (38) mit einer HF-Übertragungsleitung auf einer Leiterplatte (32), d a d u r c h g e k e n n z e i c h n e t , daß der HF-Kuppler wenigstens ein erstes Paar Federlamellen (12, 14), welches zum elektrischen Kontaktieren eines Mittelleiters (40) des Koaxialsteckers (38) angeordnet und ausgebildet ist, sowie wenigstens ein zweites Paar Federlamellen (16, 18), welches zum elektrischen Kontaktieren eines Außenleiters (42) des Koaxialsteckers (38) angeordnet und ausgebildet ist, aufweist, wobei wenigstens eine Federlamelle (12, 14) des ersten Paares an einem dem Koaxialstecker (38) abgewandten Ende eine Kontaktfläche (24) zum elektrischen Verbinden des HF-Kupplers mit der HF-Übertragungsleitung auf der Leiterplatte (32) sowie zum mechanischen Verbinden mit der Leiterplatte (32) und wenigstens eine Federlamelle (16, 18) des zweiten Paares an einem dem Koaxialstecker (38) abgewandten Ende eine Kontaktfläche (22, 26) zum elektrischen Verbinden des HF-Kupplers mit einem Massekontakt auf der Leiterplatte (32) sowie zum mechanischen Verbinden mit der Leiterplatte (32) aufweist.1. RF coupler for connecting a coaxial connector (38) to an RF transmission line on a printed circuit board (32), characterized in that the RF coupler has at least a first pair of spring plates (12, 14), which is used to electrically contact a center conductor (40 ) of the coaxial plug (38) is arranged and designed, and has at least one second pair of spring plates (16, 18) which is arranged and designed for electrically contacting an outer conductor (42) of the coaxial plug (38), at least one spring plate (12 , 14) of the first pair at one end facing away from the coaxial connector (38) has a contact surface (24) for electrically connecting the RF coupler to the RF transmission line on the printed circuit board (32) and for mechanically connecting the printed circuit board (32) and at least a spring plate (16, 18) of the second pair has a contact surface (22, 26) for electrical connection at an end facing away from the coaxial connector (38) ends of the RF coupler with a ground contact on the printed circuit board (32) and for mechanical connection to the printed circuit board (32).
2. HF-Kuppler nach Anspruch 1 , dadurch gekennzeichnet, daß die Kontaktflächen (22, 24, 26) der Federlamellen (12, 14, 16, 18) in einer Ebene parallel zur Leiterplatte (32) angeordnet sind.2. RF coupler according to claim 1, characterized in that the contact surfaces (22, 24, 26) of the spring plates (12, 14, 16, 18) are arranged in one plane parallel to the printed circuit board (32).
3. HF-Kuppler nach Anspruch 1 oder 2, dadurch gekennzeichnet, daß der Koaxialstecker (38) einen Gehäusedurchführungsabschnitt für ein die Leiterplatte (32) umgebendes Gehäuse (34) aufweist.3. RF coupler according to claim 1 or 2, characterized in that the coaxial connector (38) has a housing lead-through section for a housing (34) surrounding the printed circuit board (32).
4. HF-Kuppler nach wenigstens einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, daß sich alle Federlamellen (12, 14, 16, 18) in ei- ner Ebene parallel zur Leiterplatte (32) erstrecken. 4. RF coupler according to at least one of the preceding claims, characterized in that all spring plates (12, 14, 16, 18) extend in one plane parallel to the printed circuit board (32).
HF-Kuppler nach wenigstens einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, daß die Federlamellen (12, 14) des ersten Paares im Bereich der Kontaktfläche (24) einstückig ausgebildet sind. HF coupler according to at least one of the preceding claims, characterized in that the spring plates (12, 14) of the first pair are formed in one piece in the region of the contact surface (24).
HF-Kuppler nach wenigstens einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, daß die Federlamellen (12, 14 bzw. 16, 18) eines Paares an ihrem dem Koaxialstecker (38) zugewandten Ende voneinander weg abgewinkelt sind.HF coupler according to at least one of the preceding claims, characterized in that the spring plates (12, 14 or 16, 18) of a pair are angled away from one another at their end facing the coaxial connector (38).
HF-Kuppler nach wenigstens einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, daß dieser ein Gehäuse (10) aufweist, welches alle Federlamellen (12, 14, 16, 18) trägt.HF coupler according to at least one of the preceding claims, characterized in that it has a housing (10) which carries all the spring plates (12, 14, 16, 18).
8. HF-Kuppler nach Anspruch 7, dadurch gekennzeichnet, daß das Gehäuse (10) als ebenes Bauteil ausgebildet ist.8. RF coupler according to claim 7, characterized in that the housing (10) is designed as a flat component.
9. HF-Kuppler nach Anspruch 7 oder 8, dadurch gekennzeichnet, daß das Gehäuse (10) wenigstens einen Zapfen (28) aufweist, welcher sich von dem Gehäuse (10) weg zum Eingriff in die Leiterplatte (32) erstreckt.9. RF coupler according to claim 7 or 8, characterized in that the housing (10) has at least one pin (28) which extends away from the housing (10) for engagement in the circuit board (32).
10. HF-Kuppler nach Anspruch 9, dadurch gekennzeichnet, daß der Zapfen (28) zum Eingriff in ein Loch (30) der Leiterplatte (32) ausgebildet ist, wobei der Zapfen (28) wenigstens eine Rastnase (52) aufweist, welche in radialer Richtung bzgl. des Zapfens (28) über dessen Außenumfang hinausragt, wobei die Rastnase (52) am Zapfen (28) derart angeordnet und ausgebildet ist, daß der Außenumfang des Zapfens (28) im Bereich der Rastnase (52) kleiner ist als der Durchmesser des Loches (30) in der Leiterplatte (32), wobei der Außenumfang des in das Loch (30) in der Leiterplatte (32) hinein ragenden Abschnittes des Zapfens (28) derart ausgebildet ist, daß sich zwischen dem Außenumfang dieses Abschnittes und der Innenwandung des Loches (30) der Leiterplatte (32) über wenigstens einen Teil des Außenum- fangs ein derartiger Zwischenraum mit Kapillarität für Lot ergibt, daß während eines Lötvorgangs auf der Oberfläche der Leiterplatte (32) befindliches Lot (50) durch Kapillarwirkung in den Zwischenraum hinein und diesen ausfüllend eindringt.10. RF coupler according to claim 9, characterized in that the pin (28) is designed to engage in a hole (30) of the circuit board (32), wherein the pin (28) has at least one latching lug (52) which in Radial direction with respect to the pin (28) protrudes beyond its outer circumference, the locking lug (52) on the pin (28) being arranged and designed such that the outer circumference of the pin (28) in the region of the locking lug (52) is smaller than that Diameter of the hole (30) in the printed circuit board (32), the outer circumference of the portion of the pin (28) projecting into the hole (30) in the printed circuit board (32) being designed such that there is between the outer circumference of this section and the The inner wall of the hole (30) of the printed circuit board (32) over at least part of the outer circumference results in such a gap with capillarity for solder that there is something on the surface of the printed circuit board (32) during a soldering process Solder (50) by capillary action into the space and penetrates it filling.
11. HF-Kuppler nach Anspruch 10, dadurch gekennzeichnet, daß die Rastna- se (52) am Zapfen (28) derart angeordnet und ausgebildet ist, daß bei vollständig auf die Leiterplatte (32) aufgesetztem Bauteil die Rastnase (52) innerhalb des Loches (30) in der Leiterplatte (32) angeordnet ist.11. RF coupler according to claim 10, characterized in that the latching nose (52) on the pin (28) is arranged and designed such that when the component is completely mounted on the printed circuit board (32), the latching nose (52) within the hole (30) is arranged in the printed circuit board (32).
12. HF-Kuppler nach Anspruch 10 oder 11 , dadurch gekennzeichnet, daß der Umfang des Zapfens (28) in Längsrichtung über den gesamten im Loch (30) der Leiterplatte (32) befindlichen Abschnitt mit wenigstens einer Ausnehmung (54) ausgebildet ist.12. RF coupler according to claim 10 or 11, characterized in that the circumference of the pin (28) is formed in the longitudinal direction over the entire section in the hole (30) of the printed circuit board (32) with at least one recess (54).
13. HF-Kuppler nach wenigstens einem der Ansprüche 10 bis 12, dadurch ge- kennzeichnet, daß das Loch (30) in der Leiterplatte (32) metallisiert ist.13. RF coupler according to at least one of claims 10 to 12, characterized in that the hole (30) in the printed circuit board (32) is metallized.
14. HF-Kuppler nach wenigstens einem der Ansprüche 7 bis 13, dadurch gekennzeichnet, daß das Gehäuse (10) eine Ausnehmung (20) aufweist, in die freie, dem Koaxialstecker (38) zugewandte Enden der Federlamellen (12, 14 16, 18) hinein ragen. 14. RF coupler according to at least one of claims 7 to 13, characterized in that the housing (10) has a recess (20) into the free, the coaxial connector (38) facing ends of the spring plates (12, 14 16, 18th ) protrude into it.
EP04763118A 2003-07-14 2004-07-07 high-frequency coupler for connecting a coaxial plug to a high-frequency transmission line on a printed circuit board Not-in-force EP1645018B1 (en)

Applications Claiming Priority (2)

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DE20310786U DE20310786U1 (en) 2003-07-14 2003-07-14 RF coupler for connecting a coaxial connector to an RF transmission line on a circuit board
PCT/EP2004/007438 WO2005006501A1 (en) 2003-07-14 2004-07-07 High-frequency coupler for connecting a coaxial plug to a high-frequency transmission line on a printed circuit board

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EP1645018A1 true EP1645018A1 (en) 2006-04-12
EP1645018B1 EP1645018B1 (en) 2006-11-22

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ZA200510222B (en) 2007-02-28
CA2532171A1 (en) 2005-01-20
DE20310786U1 (en) 2003-10-09
ES2274481T3 (en) 2007-05-16
US7318728B2 (en) 2008-01-15
DK1645018T3 (en) 2007-01-22
CN100444475C (en) 2008-12-17
DE502004002110D1 (en) 2007-01-04
US20060166521A1 (en) 2006-07-27
JP2009514143A (en) 2009-04-02
CA2532171C (en) 2012-09-18
JP4767846B2 (en) 2011-09-07
EP1645018B1 (en) 2006-11-22
ATE346402T1 (en) 2006-12-15
BRPI0412070A (en) 2006-09-05
CN1823452A (en) 2006-08-23
WO2005006501A1 (en) 2005-01-20

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