WO2024115478A1 - Agencement de contact et module électronique - Google Patents

Agencement de contact et module électronique Download PDF

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Publication number
WO2024115478A1
WO2024115478A1 PCT/EP2023/083347 EP2023083347W WO2024115478A1 WO 2024115478 A1 WO2024115478 A1 WO 2024115478A1 EP 2023083347 W EP2023083347 W EP 2023083347W WO 2024115478 A1 WO2024115478 A1 WO 2024115478A1
Authority
WO
WIPO (PCT)
Prior art keywords
circuit carrier
recess
shielding
contact arrangement
contact
Prior art date
Application number
PCT/EP2023/083347
Other languages
German (de)
English (en)
Inventor
Raik Model
Balint Becsei
Manuel MAUL
Roland Hellwig
Original Assignee
Robert Bosch Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch Gmbh filed Critical Robert Bosch Gmbh
Publication of WO2024115478A1 publication Critical patent/WO2024115478A1/fr

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/7005—Guiding, mounting, polarizing or locking means; Extractors
    • H01R12/7011—Locking or fixing a connector to a PCB
    • H01R12/7052—Locking or fixing a connector to a PCB characterised by the locating members
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0224—Patterned shielding planes, ground planes or power planes
    • H05K1/0225—Single or multiple openings in a shielding, ground or power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0388—Other aspects of conductors
    • H05K2201/0394—Conductor crossing over a hole in the substrate or a gap between two separate substrate parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0707—Shielding
    • H05K2201/0715—Shielding provided by an outer layer of PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09545—Plated through-holes or blind vias without lands
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09754—Connector integrally incorporated in the printed circuit board [PCB] or in housing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10189—Non-printed connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10257—Hollow pieces of metal, e.g. used in connection between component and PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10295—Metallic connector elements partly mounted in a hole of the PCB
    • H05K2201/10303—Pin-in-hole mounted pins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10325—Sockets, i.e. female type connectors comprising metallic connector elements integrated in, or bonded to a common dielectric support
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10333—Individual female type metallic connector elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10371—Shields or metal cases
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10704—Pin grid array [PGA]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/167—Using mechanical means for positioning, alignment or registration, e.g. using rod-in-hole alignment

Definitions

  • the invention relates to a contact arrangement and an electronic module comprising the contact arrangement according to the preambles of the independent claims.
  • EMC electromagnetic compatibility
  • the entire circuit board or parts of the electronic device are surrounded by an EMC-tight casing.
  • This EMC sealing function is essentially implemented by a metal housing.
  • a connector in the housing is provided as an external connection for the electronic device.
  • the housing must be opened in this area so that the connector can be inserted in order to then enable a connection to the electronics shielded in the housing.
  • Known connectors including multi-pin male connectors, have a positioning element for the correct position relative to the circuit carrier to be electrically contacted, which engages in a corresponding recess in the circuit carrier.
  • Many connectors are designed as a plastic injection-molded part for insulation purposes, in which the positioning element is molded onto a connector body made of electrically insulating plastic.
  • the area where the positioning element engages in the recess of the circuit carrier represents an EMC weak point.
  • FIG. 1 such a vulnerable version of an electronic device 200' is shown schematically, in which EMC reaches its limits with increasing requirements with the aforementioned EMC weak point.
  • the electronic device 200' comprises a metallic housing 210, for example a multi-part housing 210, in which a circuit carrier 10 with an electrical circuit 20 (not shown) designed according to the application is accommodated.
  • a part of the circuit carrier protrudes from the housing 210 such that a carrier side 15 of the circuit carrier 10 is still substantially or completely covered by the housing 210.
  • the circuit carrier 10 is only covered over a first area 16a.
  • the remaining area 16b of the carrier side 16, on the other hand, is free for the arrangement of the connector 100'.
  • a positioning element 111' formed on a connector body 110 of the connector 100' engages, in particular with a precise fit, in a corresponding recess 11 in the remaining area of the circuit carrier 10.
  • the housing 210 is electrically connected to the circuit carrier 10 in the remaining area 16b from both carrier sides 15, 16 by means of an otherwise known EMC seal 220.
  • the circuit carrier 10 In the connection area A, B with the EMC seal 220, the circuit carrier 10 has a ground line 14. This is continued in the remaining area 16b of the circuit carrier 10, for example through an inner layer, and thus connects the respective connection areas A, B with the EMC seal 220 in an electrically conductive manner via an actually closed metal layer.
  • the closed metal layer 14 thus bridges the lack of coverage by the housing 210 in the remaining area 16b of the circuit carrier. However, the metal layer in the area of the recess 11 for inserting the positioning element 111 ' of the Connector 100' is opened.
  • the invention is based on the object of increasing the EMC for electronic modules in the area of connectors.
  • the starting point is a contact arrangement of a circuit carrier with a plug connector, the plug connector comprising at least one electrically insulating plug body in which a plurality of conductor wires spaced apart in a pattern arrangement form a plug contact pattern for a mating connector with one end and a connection contact pattern for corresponding contact points of the circuit carrier with their opposite end.
  • the conductor wires are oriented in their arrangement relative to one another at least on the side of the connection contact pattern by an electrically insulating positioning and/or alignment plate.
  • the positioning and/or alignment plate comprises at least one positioning element which penetrates a recess in the circuit carrier at least in some areas and where the positioning element defines a relative position of the circuit carrier and the plug connector to one another by forming a form, force and/or material connection.
  • the contact arrangement also comprises at least one shielding element for shielding electromagnetic radiation.
  • the shielding element is connected to the circuit carrier and the recess in the circuit carrier penetrated at least in part by the positioning element is completely covered by the shielding element. Complete coverage is present in particular when, in each radial section through a centering axis of the positioning element, cut edges in the region of the recess on both sides of the centering axis are continuously bridged by the shielding element.
  • a projection surface of the shielding element obtained perpendicularly onto one of the carrier sides of the circuit carrier, it extends at least as far as the edge of the recess.
  • the shielding element is made of a shielding material, in particular metal or metal particles embedded in a base matrix.
  • a shielding material therefore means a material which attenuates the transmission of electromagnetic radiation, in particular with an attenuation of >50%, preferably >75%, for example >90%.
  • the positioning and/or alignment plate is mechanically connected to the connector body, for example by a snap-in connection, a clamp connection, a plug connection or by other types of detachable or non-detachable connections.
  • the plug body now comprises at least one positioning element, which is designed to determine a relative position of the circuit carrier and the plug connector to one another by at least partially penetrating a recess in the circuit carrier.
  • the positioning element forms a form, force and/or material connection in the region of the recess.
  • the contact arrangement also comprises at least one shielding element for shielding electromagnetic radiation, wherein the shielding element is connected to the circuit carrier. is connected and the recess in the circuit carrier, which is at least partially penetrated by the positioning element, is completely covered by the shielding element.
  • the shape geometry of the recess in the circuit carrier is adapted to the external geometry of the positioning element.
  • the geometric shapes adapted to each other can preferably have a circular cross-sectional shape in a section made perpendicular to a joining axis of the positioning element. This makes it very easy to design the recess and the positioning element with a cylindrical or conical outer surface.
  • other geometric shapes in section are also conceivable, such as an oval, rectangular, triangular, star-shaped or other shapes.
  • the correspondingly shaped positioning element is accommodated in the joining direction at least partially or completely in the correspondingly shaped recess, in such a way that at least in a plane parallel to one of the carrier sides of the circuit carrier, no position change or only a position change with a specified small tolerance can take place.
  • This is particularly achieved by forming a fit between the positioning element and the recess.
  • a clearance fit results in a form fit, which allows for very small, still permissible positional movements due to a clearance dimension. With a transition fit, such positional movements are even smaller and can even form a form and force fit with a corresponding dimension pairing. With a press fit, there is no longer any freedom of movement.
  • the joining direction of the position The positioning element is preferably inserted into the recess perpendicular to one of the carrier sides of the circuit carrier.
  • the joining is preferably carried out without any undercuts, in particular in order to keep the joining forces low.
  • the shielding element advantageously closes the recess on a side of the circuit carrier facing away from the connector like a lid, thus completely eliminating an EMC gap that would otherwise exist.
  • a gap between the end section of the positioning element and the shielding element so that the correct joining of the conductor wires to the corresponding contact points of the circuit carrier in the joining direction is not limited to a depth dimension by a stop of the positioning element with the shielding element.
  • the shield element has a receiving opening with a shape geometry that is adapted to the external geometry of the positioning element and the positioning element is received in the receiving opening in the joining direction at least partially or completely, in particular with the formation of a fit.
  • the possible fit formation the conceivable geometric shapes, the spacing of an end section of the positioning element facing the shield element and the resulting advantages, the same statements can be used as were already mentioned in the previous embodiment.
  • the positioning element first penetrates the recess and then the receiving opening in the joining direction.
  • the shielding element is arranged completely on a carrier side of the circuit carrier facing away from the connector.
  • the shielding element can be connected to this carrier side facing away from the connector very easily, for example, using a solder, sinter or adhesive contact. With the connection, the shielding element can be positioned very precisely relative to the circuit carrier. This can be done, for example, using a mechanical and/or optical measuring system, which determines the position of the shielding element in relation to the later
  • the connectors to be joined are checked and appropriate position corrections are made within a permissible tolerance.
  • the positioning element first penetrates the receiving opening and then the recess in the joining direction.
  • at least part of the shielding element is also arranged on the carrier side of the circuit carrier facing the connector, while another part protrudes at least partially into the recess of the circuit carrier.
  • the position of the shielding element in relation to the circuit carrier can be held very precisely within a permissible tolerance by preferably forming a solder, sintered or adhesive contact between the carrier side facing the connector and the part of the shielding element arranged there.
  • the recess in the circuit carrier is dimensioned sufficiently large so that no contact with the system occurs during the position correction within the permissible tolerance.
  • the recess formed in the circuit carrier can be used for the correct positioning of the shielding element itself.
  • the shape geometry of the recess in the circuit carrier is then adapted to the external geometry of the shielding element and the shielding element is accommodated in the recess, in particular by forming a fit. Since such recesses can be formed in the circuit carrier with a very precise position, the recess can be used as a mechanical system reference for the correct positioning of the shielding element. In this way, the position accuracy can be set as precisely as required, from a clearance fit to a transition fit to a press fit.
  • the shielding element is arranged with a part on a carrier side of the circuit carrier facing away from the connector and within the recess of the circuit carrier and is flush with the carrier side facing the connector, side flush, the positioning element penetrates the receiving opening in the shield element and the geometrically radial recess in the circuit carrier at the same time during joining. This ensures that a fitting length between the positioning element and the shield element in the joining direction can be maximized, with no disruptive contours of the shield element restricting the design freedom of the connector on the carrier side facing the connector.
  • a joining axis of the receiving opening in the shield element and a joining axis of the recess in the circuit carrier are arranged so as to overlap one another.
  • the recess in the circuit carrier can have a centering phase starting from the carrier side facing the connector to facilitate the insertion of the positioning element into the receiving opening of the shield element, which is arranged on the carrier side of the circuit carrier facing away from the connector.
  • the recess and the receiving opening are designed to be congruent in the joining direction of the positioning element, so that it is received in sections by both the recess and the shield element.
  • the shielding element has a sleeve shape with a one-sided opening closure to form a sleeve base, wherein the sleeve base is arranged opposite a free end of the positioning element received in the recess and/or in the receiving opening of the shielding element.
  • the shielding element here resembles a thimble in particular and can be manufactured very easily and inexpensively in this form, for example by means of an extrusion process, a cup-drawing process, a deep-drawing process or other processes, if necessary for example by means of a machining process.
  • the shielding element has a circumferential collar, for example with the basic shape of a thimble.
  • the circumferential collar offers a connection surface that can be closed on all sides and is connected to one of the carrier sides of the circuit carrier in the area of the recess, in particular by a solder, sinter or adhesive layer. Furthermore, a further closed shielding surface can be continued very easily on the circumferential collar - electrically contacting the collar - and thus ensuring a larger shielding surface extending beyond the recess.
  • Such a further closed shielding surface is provided, for example, by the circuit carrier having a closed-surface metallization on at least one of the carrier sides and/or in the inner layer, which is at least indirectly electrically conductively contacted with the shielding element.
  • the metallization preferably corresponds in terms of its type of design and material to the conductor structure of the circuit carrier.
  • the positioning element is a press-in pin or a soldering pin.
  • the positioning element is mechanically connected using a solder after insertion.
  • the soldering agent ensures that any gaps between the positioning element and the recess in the circuit carrier or the receiving opening of the shielding element are completely closed. Gas-tight joints can thus be achieved with both a press-in pin and a soldering pin, which also ensures closed shielding in the area of the recess in the circuit carrier.
  • the conductor wires are designed in the same way, so that both the at least one positioning element and the conductor wires can be joined in a common joining process. It is generally advantageous that a joining axis of the at least one positioning element is oriented parallel to the line wires on the side of the connection contact scheme.
  • Both the recess or the receiving opening and the press-in pin or the soldering pin have a material pairing which which facilitates pressing or soldering. A material can also simply be applied as a coating on a base material.
  • the positioning element has a tapered insertion area at its free end for insertion into the recess in the circuit carrier and/or into the receiving opening of the shielding element.
  • the insertion area is further away from the connector in the direction of the joining axis of the positioning element than the ends of the conductor wires on the side of the connection contact scheme.
  • the tapered insertion area can, for example, be conical, in particular as a cone or truncated cone. This makes threading at the beginning of a joining process much easier.
  • the shielding element is preferably designed as a deep-drawn sheet metal part, a stamped part, a turned and/or milled part or an injection-molded part. Formation by means of an additive manufacturing process is also conceivable.
  • the connector has at least two positioning elements, with the conductor wires being arranged between the two positioning elements in a plan view in the direction of the centering axes of the positioning elements.
  • the connector can be positioned very precisely in a plane position perpendicular to the centering axis, so that a joining process can be carried out reliably, especially for the conductor wires.
  • the conductor wires on the side of the contact connection diagram are electrically connected to the circuit carrier within the contact arrangement.
  • the invention also leads to an electronic module comprising a contact arrangement according to at least one of the aforementioned embodiments.
  • the circuit carrier of the contact arrangement is essentially accommodated in an EMC-tight housing, in particular made of metal, for example a sheet metal or injection-molded housing.
  • the plug connector of the contact arrangement is arranged outside the housing to form an external contact connection of the electronic module.
  • that part of the circuit carrier in the area of the plug connector is then arranged outside the shielding effect of the housing.
  • the said surface area of the circuit carrier is at least partially or completely EMC-tightly shielded by the closed EMC-tight shielding surface of the shielding element.
  • at least another part of the EMC-tight shielding surface can also be designed as part of the circuit carrier, in particular as a closed or essentially closed surface in the form of a metallization on at least one of the carrier sides or as at least one inner layer of the circuit carrier.
  • Such a metallization can be formed very easily, preferably as part of the formation of a metallic conductor structure on the carrier side or the inner layer. It is particularly advantageous to provide that this part of the EMC-tight shielding surface comprises at least one closed surface area made of a material capable of shielding electromagnetic radiation on both sides of the circuit carrier, in particular as the aforementioned metallization, which is at least indirectly electrically conductively contacted with the shielding element.
  • the metallization surfaces then represent simple contact surfaces for the continuation of the EMC-tight shielding surface by means of further elements in system contact with the contact surfaces, for example a metal housing.
  • EMC gaps can advantageously be prevented by the housing and the previously described closed EMC-tight shielding surface being at least indirectly electrically conductively contacted with one another.
  • an EMC-tight seal is arranged between the housing and the closed EMC-tight shielding surface, which at least indirectly electrically conductively contacts the housing and/or the EMC-tight shielding surface.
  • the EMC-tight seal is clamped directly between the housing and the part of the EMC-tight shielding surface formed as the metallization on the carrier sides of the circuit carrier or the shielding element itself. This results in a very simple, holistic shielding effect with the partial inclusion of the circuit carrier in the housing.
  • the connector has at least one conductor wire within the contact arrangement as a data line for data transmission in the Gbit/s range. In this way, a significantly improved data signal is ensured due to the reduced susceptibility to interference as a result of the particularly good E MV properties.
  • Such electronic modules are therefore suitable for use in partially or fully autonomous driving, for example as a control unit, a vehicle computer or similar.
  • Fig. 1 a schematic representation of an exemplary electronic module according to the prior art with a circuit carrier and with an EMC gap in the area of a recess in the circuit carrier engaged by a positioning element of a connector,
  • Fig. 2a a side view of the contact connection diagram of a known connector as part of a contact arrangement with at least one circuit carrier,
  • Fig. 2b a side view of the contact connection diagram of an exemplary connector as part of a contact arrangement according to the invention with at least one circuit carrier
  • Fig. 2c a side view of the contact connection diagram of another exemplary connector in another contact arrangement according to the invention with at least one circuit carrier
  • Fig. 3a a schematic sectional view of a section of the contact arrangement from Fig. 2b or 2c through a positioning element of the connector
  • Fig. 3b a schematic sectional view of a section of the contact arrangement from Fig. 2b or 2c of another exemplary shielding element
  • Fig. 3c a schematic sectional view of a section of the contact arrangement from Fig. 2b or 2c of another exemplary shielding element
  • Fig. 3d a schematic sectional view of a section of the contact arrangement from Fig. 2b or 2c of another exemplary shielding element
  • Fig. 4 a schematic representation of shielding surfaces in the top view of the contact arrangement in the area of the connector.
  • FIG. 2a A known embodiment of a plug connector 100' is shown in Fig. 2a.
  • the plug connector 100' has a plug body 110 made of an electrically insulating polymer material.
  • the plug body 110 is penetrated by a plurality of conductor wires 120 spaced apart in a pattern arrangement, so that a respective end protrudes on two sides of the plug body 110.
  • a perspective view is shown from the side of a connection contact scheme S2 of the plug connector 100', so that one end of the respective conductor wires 120 is visible, which can be contacted with a corresponding contact point 12 of a circuit carrier 10.
  • the conductor wires 120 form a plug contact pattern for a contactable mating connector.
  • the correct spacing of the conductor wires 120 on the connection side S2 from one another is ensured by a positioning and/or alignment plate 130' made of an insulating polymer material and is part of the connector 100'.
  • This has a plate-like base body 131 in which continuous feedthroughs corresponding to the connection contact pattern are formed.
  • the positioning and/or alignment plate 130' is connected to the connector body 110, for example by a snap-in connection or a plug connection. This maintains a relative arrangement to the connector body 110.
  • a positioning element 111' is formed in one piece on opposite end regions of the positioning and/or alignment plate 130' on the side of the contact connection diagram S2.
  • the positioning elements 111' can be used to position the positioning and/or alignment plate 130' or thus the connector 100' as such relative to a circuit carrier 10 to be connected and/or an assembly tool.
  • the positional positioning is achieved, for example, by a positive connection of at least one positioning element 111' of the positioning and/or alignment plate 130' with a complementary recess formed accordingly in the circuit carrier 10.
  • one of the positioning elements 111' has positioning surfaces for this purpose, which are designed, for example, as cylinder jacket surfaces and to which walls can be referenced corresponding to complementarily shaped recesses in the circuit carrier 10.
  • the positioning elements 111' and recesses thus formed complementarily to one another are therefore part of a positioning device within a contact arrangement 150 that can be formed by the plug connector 100 or the positioning and/or alignment plate 130' and the circuit carrier 10.
  • Fig. 2b shows a schematic view with a vertical view of the connection side S2 of a plug connector 100 within a contact arrangement 150 according to the invention. Also shown is a positioning and/or alignment plate 130, similar to that already known from Fig. 2a.
  • the contact arrangement 150 also comprises at least one circuit carrier 10 with which the plug connector 100 is electrically contacted.
  • the contact arrangement 150 is accommodated in a housing 210, for example in the manner already shown in Fig. 1. In this way, an electronic module 200 according to the invention is then present with an increased EMC compared to an embodiment according to Fig. 1.
  • the circuit carrier 10 has correspondingly complementary contact points 12, for example in the form of particularly metallized recesses 11a. All of the conductor wires 120 on the connection side S2 are electrically connected to the complementary contact points 12. This can be done, for example, by means of a solder contact 121.
  • the end of the conductor wire 120 is then designed as a solder pin 111 b, which penetrates the metallized recess 11 a and is connected to the metallization 11 a in the area of the recess 11 with a solder material.
  • the end of each conductor wire 120 has a press-in zone, which - pressed into the metallic recess 11 a, which has a correspondingly adapted diameter - forms a press-in contact 122.
  • the contact arrangement 150 also has a positioning device 140. This comprises at least one positioning element 111, which is arranged on the positioning and/or alignment plate 130. The positioning element 111 penetrates at least indirectly through a recess 13 formed in the circuit carrier 10.
  • the positioning element 111 forms a positive, force and/or material connection in the area of the recess 13.
  • the positioning device 140 thus determines the relative position of the connector 100 and the circuit carrier 10 to one another.
  • a shielding element 145 is arranged in the area of the recess 13 and connected to the circuit carrier 10 in such a way that it completely covers the recess 13 penetrated at least in part by the positioning element 111 on a carrier side 15 of the circuit carrier 10 facing away from the connector 100.
  • the shield element 145 thus closes the opening created by the recess 13 in the necting carrier 10 otherwise present EMC gap in a lid-like manner.
  • the lead wires 120 are arranged between two positioning elements 111 formed on the outside of the positioning and/or alignment plate 130. Alternatively, individual or multiple lead wires 120 can also be arranged on the other side of one or both positioning elements 111 than is shown in Fig. 2b.
  • FIG. 2c an alternative embodiment of the connector 100 within a contact arrangement 150 or an electronic module 200 is shown.
  • the positioning elements 111 are now arranged on the plug body 110 and protrude from it in the direction of the circuit carrier 10 and each penetrate at least partially the recess 13 formed in the circuit carrier 10.
  • the embodiment can also be designed without a positioning and/or alignment plate 130.
  • a variant of the plug connector 100 is also conceivable which has at least one positioning element 111 both on the plug body 110 and on a comprehensive positioning and/or alignment plate 130.
  • a closed EMC-tight shielding surface 160 is arranged, through which a continuous shielding effect is now possible without an EMC gap otherwise present in this area.
  • a projection surface obtained from the shielding surface 160 perpendicular to a carrier side of the circuit carrier 10 completely covers at least a similarly obtained projection surface of the recess 13.
  • Fig. 3a - 3d show a schematically reduced section of Fig. 2b or Fig. 2c in the area of the recess 13 with a section through a positioning relement 111.
  • the positioning element 111 and the shielding element 145 are shown.
  • the positioning element 111 engages in a shape-complementary recess 13, 145.13 to form an engagement region 146.
  • a joining direction for interlocking is oriented in particular perpendicular to a carrier side 15, 16 of the circuit carrier 10.
  • the engagement region 146 has in particular a fit of the shape geometry dimensions of the positioning element 111 and the corresponding recess 13, 145.13, for example a clearance fit, a transition fit or preferably a press fit.
  • the positioning element 111 can consist of a polymer material or of a metal or a metal alloy.
  • the positioning element 111 is designed, for example, as a press-in pin 111 a with a press-in zone formed at the end.
  • the press-in pin 111 a is accommodated within the complementary recess 13, 145.13 in such a way that the press-in zone is pressed by it to form a press-in contact 112a.
  • the positioning element 111 is designed, for example, as a solder pin 111 b to form a solder contact 112b.
  • the press-in contact 112a or the solder contact 112b determine the position of the connector 100 relative to the circuit carrier 10.
  • the press-in pin 111 a is designed in particular as a sheet metal part, alternatively from a round semi-finished product, for example a round material.
  • the press-in zone can be present, for example, as an embossed formation.
  • the press-in pin 111 a is formed from exactly one layer material 116, for example from copper or a copper alloy.
  • a coating layer 115 can be applied, for example a tin (Sn) or tin-silver coating (SnAg), particularly in the area of the press-in zone.
  • the coating layer 115 has material properties that promote press-in.
  • the complementary recess 13, 145.13 has in particular a metallization 11 a, which allows a favorable press material pairing.
  • an additional coating layer 115 can also be provided, which then has material properties that promote soldering, for example tin (Sn).
  • the coating layer 115 is provided in particular in the soldering area.
  • the press-in pin 111 a and/or the soldering pin 111 b can be designed as inserts, which are inside- During an injection molding process, the plug body 110 is at least partially enclosed by the insulating polymer material.
  • the positioning element 111 is received in the recess 13 formed in the circuit carrier 10.
  • a shielding element 145 is arranged on the carrier side 15 of the circuit carrier 10 facing away from the connector.
  • the shielding element 145 is connected to the circuit carrier 10 via a closed, circumferential collar 145.a by means of a connecting layer 118, for example by means of a solder, sintered or adhesive layer.
  • the shielding element 145 completely covers the recess 13 like a lid. Since the shielding element 145 is made of a material capable of shielding electromagnetic radiation, for example of a metal material, an EMC-tight shielding surface 160 is formed by it in the region of the recess 13.
  • a joining axis F1 of the positioning element 111 and a center axis M1 of the shielding element 145 are preferably arranged congruently.
  • the shielding element 145 can also be arranged with its central axis M2 with an offset V relative to the joining axis F1 of the positioning element 111 on the circuit carrier 10. In its final position in the joining direction, the positioning element 111 still has a gap distance D from the shielding element 145.
  • a metallization 14 arranged on one of the carrier sides 15, 16 of the circuit carrier 10 and/or in an inner layer - in particular in the form of a ground line - can also continue the EMC-tight shielding surface 160 in a closed manner.
  • the metallization 14 is preferably designed in the same way as a conductor structure of the circuit carrier 10. In this case, the metallization 14 preferably contacts the shielding element 145 at least indirectly in an electrically conductive manner, for example in the area of the circumferential collar 145.a.
  • the metallization 14 can also be arranged on both carrier sides 15, 16 of the circuit carrier 10.
  • the embodiment according to Fig. 3b differs from the embodiment shown in Fig. 3a in that the shield element 145 has a receiving opening 145.13 which is congruent with the recess 13 in the switchgear. device carrier 10.
  • the receiving opening 145.13 thus continues the recess 13 in the joining direction with the same cross-sectional shape and the same cross-sectional dimension. Accordingly, the positioning element 111 first penetrates the recess 13 and then at least partially the receiving opening 145.13.
  • the recess 13 can be made larger in cross-section, so that a defined fit is only formed between the positioning element 111 and the receiving opening 145.13.
  • the shielding element 145 is designed in particular in the form of a cylindrical sleeve with a one-sided opening closure.
  • the opening closure is then provided by a sleeve base 145.b, which is arranged opposite the free end of the positioning element 111 with a gap distance D.
  • Fig. 3c shows a further possible embodiment. It differs from the embodiment according to Fig. 3b in that a closed, circumferential collar is missing. Instead, the shape geometry of the recess 13 in the circuit carrier 10 and the external geometry of the shielding element 145 are adapted to one another.
  • the shielding element 145 is accommodated in the recess 13 - in particular by forming a fit - and preferably ends flush with the carrier side 16 facing the connector 100. Accordingly, the positioning element 11 simultaneously penetrates the recess 13 and the receiving opening 145.13 of the shielding element 145.
  • the shielding element 145 can be pressed into the recess 13 or soldered, sintered or glued to it. In both cases, the recess 13 then has in particular a metallization 11 a, which promotes a press-in and/or is wettable for a connecting material 118.
  • Fig. 3d incorporates aspects of the embodiments shown in Figs. 3b and 3c in a partially combined manner.
  • a closed, circumferential collar is formed on the shielding element 145.
  • the collar is now arranged on the carrier side facing the connector 100 on the circuit carrier 10 and is preferably connected to it. Accordingly, the positioning element 111 first penetrates the receiving opening 145.13 before it also penetrates the recess 13.
  • Fig. 4 also shows, depending on the previously explained embodiments, possible boundaries E14 or E145 of an effective EMC-tight shielding surface 160 in relation to a viewing direction oriented vertically to the carrier sides 15, 16 of the circuit carrier 10.
  • the boundary E14 results from the obtained projection area of the metallization 14 arranged on the carrier side 15, 16 or in an inner layer of the circuit carrier 10.
  • the boundary E145 results from the obtained projection area of the shielding element 145.
  • a boundary E13 obtained from the recess 13, which is completely covered by the EMC-tight shielding surface 160.
  • the EMC-tight shielding surface 160 therefore results from an overlap or a seamless transition between the metallization 14 and the shielding element 145. Designs are also conceivable in which the EMC-tight shielding surface 160 is provided solely by the shielding element 145.
  • the boundaries E14 and/or E145 also surround at least that area of the circuit carrier 10 which is arranged in the area of the connector 100 outside the housing 210 of an electronic module 200 and is shielded there in an EMC-tight manner by the EMC-tight shielding surface 160 of the contact arrangement 150.
  • the housing 210 and the closed EMC-tight shielding surface 160 of the contact arrangement 150 are at least indirectly electrically conductively contacted with one another.
  • an EMC-tight seal 220 is also arranged between the housing 210 and the EMC-tight shielding surface 160 - at least indirectly electrically contacting it.
  • the connector 100 has at least one conductor wire 120 as a data line for data transmission in the Gbit/s range. In this way, a significantly improved data signal is ensured due to the reduced susceptibility to interference as a result of the particularly good E MV properties.
  • Such electronic devices 200 are therefore suitable for use, for example, in partially autonomous or fully autonomous driving, for example a control unit, a vehicle computer or similar.

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  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Details Of Connecting Devices For Male And Female Coupling (AREA)

Abstract

L'invention concerne un agencement de contact d'un support de circuit comprenant un connecteur enfichable, le connecteur enfichable comprenant au moins un corps de fiche électriquement isolant dans lequel un grand nombre de fils conducteurs espacés les uns des autres forment, par une extrémité dans chaque cas, un motif de contact de fiche pour une fiche correspondante et, par l'extrémité opposée dans chaque cas, un motif de contact de connexion pour des points de contact correspondants du support de circuit. Dans ce cas, les fils conducteurs, au moins du côté du motif de contact de connexion, sont orientés en termes de disposition les uns vis-à-vis des autres par une plaque de positionnement et/ou d'alignement électriquement isolante. La plaque de positionnement et/ou d'alignement comprend au moins un élément de positionnement qui traverse une découpe du support de circuit au moins dans certaines régions et l'élément de positionnement délimite une position relative du support de circuit et du connecteur l'un par rapport à l'autre en formant une liaison par emboîtement, par ajustement serré et/ou par liaison d'un seul tenant. L'agencement de contact comprend également au moins un élément de blindage pour la protection contre les rayonnements électromagnétiques, l'élément de blindage étant relié au support de circuit et la découpe du support de circuit par laquelle l'élément de positionnement passe au moins en partie étant entièrement recouverte par l'élément de blindage.
PCT/EP2023/083347 2022-11-29 2023-11-28 Agencement de contact et module électronique WO2024115478A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102022212814.1A DE102022212814A1 (de) 2022-11-29 2022-11-29 Kontaktanordnung und Elektronikmodul
DE102022212814.1 2022-11-29

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WO2024115478A1 true WO2024115478A1 (fr) 2024-06-06

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040166705A1 (en) * 2003-02-21 2004-08-26 Koehler David F. Electrical connector with a terminal pin alignment plate
WO2019073224A1 (fr) * 2017-10-10 2019-04-18 Den Automation Limited Prise de courant
DE102018000940A1 (de) * 2018-02-05 2019-08-08 Robert Bosch Gmbh Steckverbinder und Kontaktanordnung
WO2020239624A1 (fr) * 2019-05-24 2020-12-03 Robert Bosch Gmbh Système de connecteur enfichable
EP3930104A1 (fr) * 2020-06-24 2021-12-29 Rosenberger Hochfrequenztechnik GmbH & Co. KG Module de câbles extérieurs, connecteur enfichable électrique et agencement de raccordement électrique

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19939582A1 (de) 1999-08-20 2001-03-29 Tyco Electronics Logistics Ag Zur Montage auf eine Leiterplatte ausgelegtes Bauteil
US6511348B1 (en) 2001-10-19 2003-01-28 Tyco Electronics Corporation Modular jack assembly with signal conditioning
CN203415750U (zh) 2013-08-05 2014-01-29 东莞建冠塑胶电子有限公司 结构改良的层迭式网络连接器

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040166705A1 (en) * 2003-02-21 2004-08-26 Koehler David F. Electrical connector with a terminal pin alignment plate
WO2019073224A1 (fr) * 2017-10-10 2019-04-18 Den Automation Limited Prise de courant
DE102018000940A1 (de) * 2018-02-05 2019-08-08 Robert Bosch Gmbh Steckverbinder und Kontaktanordnung
WO2020239624A1 (fr) * 2019-05-24 2020-12-03 Robert Bosch Gmbh Système de connecteur enfichable
EP3930104A1 (fr) * 2020-06-24 2021-12-29 Rosenberger Hochfrequenztechnik GmbH & Co. KG Module de câbles extérieurs, connecteur enfichable électrique et agencement de raccordement électrique

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