EP4055626A1 - Dispositif de chargement et de déchargement pour une trémie de substrat, système de trémie de substrat - Google Patents

Dispositif de chargement et de déchargement pour une trémie de substrat, système de trémie de substrat

Info

Publication number
EP4055626A1
EP4055626A1 EP20803149.2A EP20803149A EP4055626A1 EP 4055626 A1 EP4055626 A1 EP 4055626A1 EP 20803149 A EP20803149 A EP 20803149A EP 4055626 A1 EP4055626 A1 EP 4055626A1
Authority
EP
European Patent Office
Prior art keywords
substrate
conveyor belt
loading
substrates
unloading device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP20803149.2A
Other languages
German (de)
English (en)
Inventor
Torsten Vegelahn
Jürgen Lehner
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Asys Automatisierungssysteme GmbH
Original Assignee
Asys Automatisierungssysteme GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asys Automatisierungssysteme GmbH filed Critical Asys Automatisierungssysteme GmbH
Publication of EP4055626A1 publication Critical patent/EP4055626A1/fr
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J11/00—Manipulators not otherwise provided for
    • B25J11/0095—Manipulators transporting wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/0014—Gripping heads and other end effectors having fork, comb or plate shaped means for engaging the lower surface on a object to be transported
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/06—Gripping heads and other end effectors with vacuum or magnetic holding means
    • B25J15/0616—Gripping heads and other end effectors with vacuum or magnetic holding means with vacuum
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Programme-controlled manipulators
    • B25J9/0084—Programme-controlled manipulators comprising a plurality of manipulators
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Programme-controlled manipulators
    • B25J9/02—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type
    • B25J9/023—Cartesian coordinate type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices

Definitions

  • the invention relates to a loading and unloading device for a substrate magazine, the substrate magazine having several drawers into which several substrates can be inserted for storage or temporary storage, with at least one controllable conveyor belt on which substrates can be deposited, and with at least one controllable gripper arm, the is designed to push substrates from the conveyor belt into a drawer or to push them out of the drawer onto the conveyor belt, the conveyor belt and the gripping arm being arranged on a common and movably mounted carrier.
  • the invention also relates to a substrate magazine system with at least one substrate magazine which has several drawers, into which several substrates can be inserted for storage or temporary storage, and with a loading and unloading device as described above.
  • Loading and unloading devices for substrate magazines are known from the prior art. In the production of flat substrates or electrical / electronic modules based on a flat substrate, it is known to hold substrates in a substrate magazine and to automatically feed them to the assembly line by an unloading device. It is also known to store or temporarily store substrates that have already been fitted or prepared from the assembly line during the production of a component in order to keep them ready for a later work step. Correspondingly, loading devices are known which can load the substrate magazine with substrates, for example from the assembly line. Combined loading and unloading devices are also known which enable both the unloading and loading of substrate magazines and make individual substrates available in accordance with an assembly line or remove individual substrates from the assembly line and store them temporarily in the substrate magazine.
  • Known loading and unloading devices have at least one controllable conveyor belt on which substrates can be placed.
  • the substrates can be transferred from a substrate magazine to the assembly line, for example.
  • a controllable gripper arm which is designed to push substrates from the conveyor belt into a drawer of the substrate magazine or to push them out onto the conveyor belt. If a substrate magazine is provided with a large number of drawers, the distance between adjacent drawers in terms of height is often selected to be as small as possible for reasons of installation space, so that a large number of drawers is possible. In this case it is difficult or even impossible to introduce the conveyor belt into the substrate magazine even below a substrate.
  • a gripping arm which can be made significantly narrower than the conveyor belt, can also be inserted between two drawers, for example, in order to pull a substrate out of one of the drawers.
  • the interaction of the gripper arm and the conveyor belt has the advantage that loading and unloading is possible in a cost-effective manner, and in particular also loading and unloading in a substrate magazine which offers little free space.
  • the invention is based on the object of creating an improved loading and unloading device which, in particular, also enables substrates to be separated from a substrate stack that can be stored in a substrate magazine.
  • the object on which the invention is based is achieved by a loading and unloading device having the features of claim 1.
  • This has the advantage that the loading and unloading device enables both the handling of individual substrates and the handling of substrate stacks. This increases the possibility of using the loading and unloading device and overcomes the need for an additional loading and unloading device for the substrate stack. As a result, an assembly line can be implemented in a cost-effective and space-saving manner overall.
  • the gripper arm is arranged at least essentially below the conveyor belt to grab a substrate from below, and that a movable vacuum gripper is arranged above the conveyor belt to grab a substrate in the substrate magazine or on the conveyor belt from above and move.
  • a movable vacuum gripper is arranged above the conveyor belt to grab a substrate in the substrate magazine or on the conveyor belt from above and move.
  • the vacuum gripper is designed to separate substrates from a substrate stack.
  • the vacuum gripper has, for example, a movable suction head with one or more suction points that can be placed on the surface of a substrate, in particular the uppermost substrate of a substrate stack, in order to suck up the substrate and remove or transport it from the substrate stack.
  • the vacuum gripper has retaining means, which are assigned or can be assigned to the rear side of the substrate to be gripped and ensure that a substrate underneath does not stick to the substrate being gripped.
  • the retaining means can be, for example, a compressed air device which generates an air flow in the space between the substrate to be gripped and the substrate underneath in order to reliably separate the two substrates from one another.
  • the retaining means are preferably designed mechanically and retain the lower substrate when the substrate lying above is lifted by the vacuum runner.
  • the vacuum gripper is particularly preferably designed to move into the substrate magazine. This makes it possible to isolate substrates from a substrate stack within the substrate magazine and to deposit isolated substrates on the conveyor belt for further use. Of course, this also enables the reverse process, in which individual substrates are picked up by the vacuum gripper and moved into the substrate magazine for the production or further development of a substrate stack. As an alternative to this, the vacuum gripper is preferably designed to carry out a separation of a substrate stack only on the conveyor belt.
  • the vacuum gripper is particularly preferably mounted on the carrier in a height-adjustable manner. As a result, the vacuum gripper can be optimally adapted to a substrate stack regardless of the transport height of the conveyor belt.
  • the gripping arm has at least one gripping hook which can be displaced from a gripping position for moving a substrate into a release position for moving the gripping arm independently of a substrate and back. Grasping one Substrate for moving the substrate into the substrate magazine or out of the substrate magazine is thus carried out by moving the gripping hook.
  • the gripping arm In the release position, this offers the advantage that the gripping arm is designed to be particularly low in height, so that it can, for example, also be inserted between two substrates lying one above the other in the substrate magazine. In particular, this avoids having to adjust the overall height of the gripping arm in order to grip a substrate or to be detached from it.
  • the gripping hook is particularly preferably mounted pivotably on the gripping arm.
  • the gripping arm has a plurality of such gripping hooks, which are arranged on the gripping arm at a distance from one another in the sliding direction.
  • the gripping hooks are designed in particular as described above and mounted on the gripping arm. This results in the advantage that several substrates can be gripped and displaced simultaneously by means of the gripping hooks without the substrates hitting one another.
  • the gripping hooks are preferably arranged on the gripping arm in such a way that at least one gripping hook can be inserted between adjacent substrates in a drawer by shifting, and that, as a result, all substrates can be pulled out onto the conveyor belt at the same time by moving or pulling out the gripping arm. This ensures safe handling of several substrates at the same time, which prevents substrates from being damaged by bumping into one another or being pushed over one another during transport.
  • one of the gripping hooks is mounted on the gripping arm so as to be longitudinally displaceable. This enables the spacing of adjacent gripping hooks to be adapted to one another, so that the gripping arm can be adapted, for example, to different substrates stored in a drawer of the substrate magazine, which substrates are of different lengths when viewed in the sliding direction. The same naturally also applies to the insertion of several different substrates into the substrate magazine.
  • the gripping arm has at least one sensor for detecting a substrate. Because the sensor is assigned to the gripper arm, the sensor is moved along with the gripper arm. In particular, the sensor is arranged on the upper side of the gripping arm, that is to say assigned to a substrate to be gripped. If the gripper arm is now moved past a substrate, in particular the beginning and the end of a substrate are detected by means of the sensor during the movement and thereby the substrate contour and position in the substrate magazine and / or on the substrate, for example, with the help of a control device Conveyor belt determined. This ensures that the substrate can be transported easily and safely.
  • the data from the sensor are used to determine the position at which the gripping hook is to be or can be shifted into the gripping position without hitting the substrate from below.
  • the gripper arm is pushed into the substrate magazine, the beginning of a substrate is detected and either the end of the substrate is also detected by means of the sensor or the end of the substrate is calculated depending on the data known to the control device of the substrate to be gripped, so that the gripping hook is only then in the gripping position is shifted when the gripping hook has completely passed the substrate.
  • the conveyor belt is designed in such a way that it has two conveyor belt runs which are arranged parallel at a distance from one another so that the gripper arm is arranged between the two conveyor belt runs so that the respective substrate rests on its side edges both in the substrate magazine and on the conveyor belt.
  • the distance between the conveyor belt runs does not necessarily have to correspond to the distance between sliding guides of the substrate magazine, which each form a drawer. Rather, the distance between the substrate strip runs can also be selected to be smaller.
  • At least one displacement sensor is assigned to the gripping arm.
  • the path of movement of the gripping arm can be determined by the displacement sensor and, in particular, the positioning of the gripping hook with respect to a substrate to be gripped can be optimally determined and adjusted as a function of the data from the sensor.
  • the gripping arm is assigned at least one actuator, in particular an electromotive actuator, for its displacement and / or for displacing the at least one gripping hook.
  • the gripping arm has at least one further electrically operated actuator for displacing the respective gripping hook. If the gripping arm has several gripping hooks, each gripping hook is either assigned its own actuator, or the gripping hooks are mechanically connected to one another with a common actuator, so that the gripping hooks are moved, in particular pivoted, at the same time by the actuator.
  • the loading and unloading device preferably has a control device which is connected for signaling at least to the actuator, to the sensor and to the displacement sensor and is designed to control the at least one actuator as a function of the sensor to control the recorded data to push substrates out of a certain compartment of the substrate magazine individually or together onto the conveyor belt or to push them into the drawer of the conveyor belt.
  • the control device controls the loading and unloading device to push the substrates individually or as described above simultaneously from a drawer onto the conveyor belt or otherwise inhibit them.
  • the conveyor belt is controlled by the control device, either after picking up each individual substrate, removing the respective substrate for further use by means of the conveyor belt, or first collecting individual substrates on the conveyor belt and only then forwarding them for further use.
  • the control device is designed in particular to push a single substrate from the conveyor belt to a predetermined position in the drawer or to remove it from a predetermined position from the drawer.
  • the control unit uses data from the
  • Distance measuring sensor and, for example, data recorded by the sensor of the substrate to be pushed, so that the substrate is optimally positioned in the drawer or on the conveyor belt.
  • Figure 1 shows an advantageous substrate magazine system in a perspective
  • FIG. 2 shows a push unit of the substrate magazine system in a perspective view
  • FIG. 3A shows a simplified illustration of the substrate magazine system in FIG.
  • FIG. 3B shows a simplified illustration of the substrate magazine system in FIG.
  • FIG. 1 shows, in a simplified perspective illustration, a substrate magazine system 1 for an assembly line for electrical / electronic components.
  • the substrate magazine 1 has a substrate magazine 2 which has a plurality of drawers 3 for receiving a plurality of substrates 4 in each case.
  • the substrate magazine 2 has two opposite one another horizontally arranged and vertically aligned parallel to each other, each having a plurality of guide rails 6 on mutually facing sides, two guide rails 6 arranged opposite each other forming a drawer 3 in which the respective substrate 4 rests with its side edges.
  • substrate stacks can also be arranged in the substrate magazine 2, that is to say a multiplicity of individual substrates stacked on top of one another, which form a package or a stack.
  • the substrate magazine 1, 2 also has a loading and unloading device 7 which is used to move substrates 4 into the substrate magazine 2 or to remove them from the substrate magazine 2 and, for example, to feed them to an equipping device of the equipping line.
  • the loading and unloading device 7 has a conveyor belt 8, which has two conveyor belt runs 9 which are aligned parallel to one another and arranged at a distance from one another.
  • the conveyor belt runs 9 can be controlled as endless drives in order to set the conveyor belt in a circular motion, whereby objects lying on the conveyor belt 8 can be transported with the conveyor belt 8.
  • the conveyor belt runs 9 are arranged so close to one another that substrates from the substrate magazine 2 rest on both conveyor belt runs 9 at their side edges and can thus be transported through the conveyor belt 8.
  • a sliding unit 10 is arranged between the conveyor belt runs 9.
  • the sliding unit 10 has a gripping arm 11 which is designed as a telescopic arm.
  • the gripping arm 11 lies below the support surface 12 of the conveyor belt 8 and is aligned parallel to it.
  • the gripping arm 11 has a gripping hook 13 which can be displaced.
  • the gripping hook 13 can be pivoted by pivoting the gripping arm 11 about its longitudinal axis of the gripping arm 11, as shown by a double arrow 14 in FIG. As a result, the gripping hook 13 can be pivoted from the release position shown in FIG. 1 into an erected gripping position shown in dashed lines in FIG.
  • the gripping arm 11 is also assigned an electromotive actuator 15 which enables the gripping hook 13 to be pivoted according to arrow 14 as shown by a double arrow 16.
  • the gripping arm 11 can be displaced longitudinally with the gripping hook 13 parallel to the conveyor belt 8 by the actuator 15.
  • the sliding unit 10 and the conveyor belt 8 are arranged on the same carrier 17 of the loading and unloading device 7.
  • FIG. 2 shows the sliding unit 10 in a perspective view detached from the rest of the loading and unloading device 7.
  • the gripping arm 11 has a first arm part 20 and a second arm part 21.
  • the arm part 20 is mounted so as to be longitudinally displaceable according to the double arrow 16 on a support carrier 22 fastened to the carrier 17.
  • the shifting takes place by means of a belt drive 23 which can be driven by an electric motor by an actuator 24.
  • the gripping arm part 21 is pivotably mounted about its longitudinal center axis and is firmly connected to the gripping hook 13 in order to pivot it from the loose position into the gripping position and vice versa through its rotational movement caused by the actuator 15.
  • the gripping arm part 21 is pivotably or rotatably mounted on the gripping arm part 20 by a plurality of radial bearings 25.
  • the loading and unloading device 7 has a vacuum gripper 18, as shown in FIG.
  • the vacuum gripper 18 has a movable suction head 19 which is arranged above the gripping arm 11 and is mounted so that it can be displaced longitudinally at least parallel to the gripping arm 11 according to the double arrow 16.
  • the suction head 19 lies above the support surface 12 of the conveyor belt 8 and is optionally mounted on the carrier 17 adjustable in height so that the distance between the suction head 19 or the vacuum device 18 and the conveyor belt 8 can be changed.
  • the vacuum device 18 makes it possible to suck in substrates 4 from above and to transport them.
  • At least one control unit 34 controls the actuators of the loading and unloading device 7.
  • the control unit 34 is connected for signaling purposes to all actuators and sensors, which are explained in more detail below, in order to control the actuators in a targeted manner, in particular depending on information from the sensors to carry out a loading and / or unloading process by means of the loading and unloading device 7 on the substrate magazine 2.
  • control device 34 has, for example, a computing unit, in particular a microcontroller, and a data memory, with a computer program being stored in the data memory, which is used by the computing unit to operate the loading and unloading device 7 as described below.
  • FIG. 3A shows an application example of the substrate magazine system 1 in which individual substrates are handled.
  • individual substrates 4 are arranged in drawers 3 of the substrate magazine 2.
  • the substrate magazine system is shown here in a simplified manner. In some drawers there are several substrates 4 next to one another at a distance from one another, while in other drawers 3 only one substrate 4 can be arranged.
  • the gripping arm 11 is now pushed into the substrate magazine 2 with the aid of the actuator 24.
  • the gripping arm 11 has at least one sensor 26 on its upper side, which is designed, for example, as an optical sensor or a distance sensor.
  • the senor 26 is arranged close to the gripping hook 13 on the gripping arm 11, in particular on the second gripping arm part 21.
  • the sensor 26 is thus also pushed past the substrates 4 located therein, which are located above the gripping arm 11 in the drawer 3.
  • a distance measuring device 27, which monitors the movement path of the gripper arm 11, is also assigned to the gripper arm 11. The beginning and the end of a substrate 4 above the gripping arm 11 can now be detected with the sensor 26, and the position of the gripping arm 11 can be determined with the aid of the displacement measuring device 27.
  • the movement of the gripping arm 11 is stopped and the gripping hook 13 is pivoted into the gripping position, as shown in FIG. 3, so that the gripping hook 13 engages behind the substrate 4 to be gripped. If the gripping arm 11 is now moved out of the substrate magazine 2, the gripping hook 13 pushes the substrate 4 onto the conveyor belt 8 or onto the support surface 12 of the conveyor belt 8. In this way, several substrates 4 can be moved one after the other from a drawer 3 onto the conveyor belt 8.
  • the height of the carrier 17 is advantageously adjustable, as indicated by a double arrow 28 in FIG. 3, so that all drawers 3 of the substrate magazine 2 can be reached with the aid of the gripper arm 11 by adjusting the height of the carrier 17.
  • FIG. 3B shows the same substrate magazine system 1 in an operation in which substrates 4 are separated from a substrate stack 29 or the substrate stack 29 is produced from individual substrates 4.
  • the substrate stack 29 is stored in the substrate magazine 2.
  • an adapter plate 30, for example has been pushed into a drawer 3 on which the substrate stack 29 lies.
  • the vacuum device 18 is now used to grip the top substrate 4 of the substrate stack 29.
  • the suction head 19 is moved into the substrate magazine 2 so that it is positioned above the substrate stack 29.
  • a further sensor 33 is preferably assigned to the suction head 19, which sensor 33 points downwards in order, for example, to detect the beginning of the substrate stack and optionally also the end of the substrate stack.
  • the suction head 19 can be optimally positioned over the substrate 4 to be gripped using simple means.
  • a displacement measuring device 27 is also assigned to the suction head 19, which detects the path of the suction head 19 and, for example, determines the center point of the substrate stack 29 depending on the beginning and end of the substrate stack 29 and positions the suction head 19 centrally above the substrate stack 29 for removing a substrate 4 . Then the suction head 19 is guided down to the uppermost substrate 4 and the uppermost substrate 4 is sucked onto the suction head 19 by the vacuum device 18. The suction head 19 is then preferably raised a little in order to detach the substrate 4 from the substrate 4 underneath. The suction head 19 is then moved out of the substrate magazine 2, as shown by an arrow 32. As a result, the substrate 4 is separated from the substrate stack 29 and, in particular, is deposited on the conveyor belt 8 by the suction head 19.
  • the removal of the individual substrates from the substrate magazine 2 begins from below, i.e. with the substrate 4, which is located in the lowest drawer 3 of the substrate magazine 2, so that the gripping arm 11 is given the greatest possible free space when it is inserted into the substrate magazine 2.
  • the substrate 4 which is located in the lowest drawer 3 of the substrate magazine 2
  • the gripping arm 11 is given the greatest possible free space when it is inserted into the substrate magazine 2.
  • This also prevents dirt particles or the like from falling onto a substrate 4 below when a substrate 4 is displaced in the substrate magazine. In this way, advantages with regard to the purity of the substrates 4 and with regard to the freedom of movement of the gripping arm 11 are achieved.
  • the advantageous substrate magazine system 1 enables different loading and unloading processes to be implemented.
  • the present design of the substrate magazine system 1 allows the substrates to be pushed specifically to predetermined positions within a drawer.
  • the insertion position is freely programmable or, for example, can be set by the control device 34 as a function of the size of the respective substrate.
  • several end positions of the gripping arm 11 can be programmed and set.
  • the position of the gripping hook 13 and thus the position of a moving substrate is monitored with the aid of the displacement measuring device 27, so that the substrate 4 remains in a desired position.
  • gripping hooks 13 are pivotably mounted on the gripping arm.
  • the gripping hooks 13 are arranged at a fixed distance from one another, which corresponds to a desired distance between adjacent substrates 4 in the substrate magazine 2. If the gripping arm 11 is completely retracted into the substrate magazine 2, all substrates 4 lying in the relevant drawer 3 can be pulled simultaneously by the gripping hooks 13 out of the drawer onto the conveyor belt 8 or onto the support surface 12 of the conveyor belt 8.
  • the substrates 4 are first positioned on the conveyor belt 8 according to the spacing of the gripping hooks or insertion fingers, and then all substrates 4 are pushed simultaneously by the gripping arm 11 into the desired magazine slot or into the desired drawer 3.
  • a force sensor is also assigned to the gripper arm 11, which monitors the movement force of the gripper arm 11, so that if the force exceeds an expected value, for example if a substrate jams in the respective drawer 3, the process is interrupted to prevent damage to substrates 4 to avoid.
  • the sensor 26, 33 is designed in particular as an optical sensor or as a distance sensor.
  • the following options also arise: On the one hand, it is possible that each individual item can be placed on the Conveyor belt 8 pushed substrate 4 is immediately moved further by the conveyor belt 8 and made available for further use. In addition, it is possible for all substrates 4 from a drawer 3 to be positioned one after the other on the conveyor belt 8 by the gripper arm. In particular, after each positioning of a substrate, the conveyor belt 8 is operated, so that the gripping arm always deposits a substrate removed from the substrate magazine 2 at the same point from which the respective substrate is then conveyed by the conveyor belt 8 until all substrates 4 are removed from the drawer 3 lie on the conveyor belt 8.
  • the advantageous substrate magazine system 1 makes it possible, as already mentioned above, to pull several substrates 4 out of a drawer 3 at the same time with the aid of several gripping hooks 13 and to place them next to one another on the conveyor belt 8.
  • the procedure in accordance with the exemplary embodiment in FIG. 3B is used to separate the substrate stack 29.
  • the dimensions of the substrates 4 present in the substrate magazine 2 as a substrate stack 29 are usually known. These values are used to determine the position of the gripper arm and for the suction head 19. Although it is generally known what length the substrates 4 have in the sliding direction, it is not necessarily known at which point the substrate stack 29 is located in the substrate magazine 2. Because the substrate stack 29 is usually inserted into the magazine by hand, it can be assumed that the substrate stack 29 is not present in the substrate magazine 2 in a position-controlled manner. For the safe removal of a substrate 4 or for the separation of the substrates 4, the position of the substrate stack 29 must first be determined.
  • a sensor 33 is assigned to the suction head 19, which looks from above at the substrates to be removed and which, in particular, is designed like the sensor 26. If the suction head 19 is moved over the substrate stack 29, the sensor 33 detects the front edge of the substrate stack 29.
  • the control device 34 automatically adds half of the substrate length known to the control device 34 and thus positions the suction head 19 in the center above the top substrate 4 of the substrate stack 29. Subsequently, the substrate 4 is gripped as described above and guided out of the substrate magazine 2. Loading of the substrate magazine 2 with the aid of the vacuum device 18 is also possible, in which case For example, the position of the substrate on the conveyor belt 8 is detected by means of the sensor 33 and the vacuum head 19 is optionally controlled for gripping the substrate 4.
  • the substrate magazine system 1 preferably has a plurality of substrate magazines 2, of which at least two are preferably designed differently. For example, one is designed to receive individual substrates, the other to receive substrate stacks.
  • the substrate magazines 2 preferably each have at least one readable identification element, such as, for example, a printed one-dimensional or two-dimensional code, in particular a QR code, or a readable chip, in particular an RFID chip.
  • the loading and unloading device 7 then preferably has a read-out device for capturing the respective code or chip and, depending on the captured code, determines the operation of the captured substrate magazine 2, in particular its type, and optionally its occupancy with substrates. It is thereby achieved that the loading and unloading device 2 can handle any type of substrate magazine in an automated manner and can be fully utilized at any time.

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  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Warehouses Or Storage Devices (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

L'invention concerne un dispositif de chargement et de déchargement (7) pour une trémie de substrat (2), la trémie de substrat (2) comprenant une pluralité de tiroirs (3) dans chacun desquels une pluralité de substrats (4) pouvent être insérés pour le stockage ou le stockage temporaire, comprenant au moins une bande transporteuse pouvant être commandée (8) sur laquelle des substrats (4) pouvent être déposés et présentent au moins un bras de préhension pouvant être commandé (11) qui est conçu pour insérer des substrats (4) à partir de la bande transporteuse (8) dans un tiroir (3) de la trémie de substrat ou pour tirer des substrats hors du tiroir (3) sur la bande transporteuse (8), la bande transporteuse (8) et le bras de préhension (11) étant disposés sur un support commun et monté mobile (17). Selon l'invention, le bras de préhension (11) est au moins sensiblement disposé au-dessous de la bande transporteuse (8) afin de saisir un substrat (4) par le bas et un dispositif de préhension à vide mobile (18) est disposé au-dessus de la bande transporteuse (8), lequel dispositif de préhension à vide mobile est conçu pour saisir un substrat (4) dans la trémie de substrat (2) ou sur la bande transporteuse (8) depuis le dessus et pour déplacer ledit substrat.
EP20803149.2A 2019-11-05 2020-11-05 Dispositif de chargement et de déchargement pour une trémie de substrat, système de trémie de substrat Pending EP4055626A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102019217033.1A DE102019217033B4 (de) 2019-11-05 2019-11-05 Be- und Entladeeinrichtung für ein Substratmagazin, Substratmagazinsystem
PCT/EP2020/081191 WO2021089735A1 (fr) 2019-11-05 2020-11-05 Dispositif de chargement et de déchargement pour une trémie de substrat, système de trémie de substrat

Publications (1)

Publication Number Publication Date
EP4055626A1 true EP4055626A1 (fr) 2022-09-14

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EP20803149.2A Pending EP4055626A1 (fr) 2019-11-05 2020-11-05 Dispositif de chargement et de déchargement pour une trémie de substrat, système de trémie de substrat

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EP (1) EP4055626A1 (fr)
KR (1) KR20220098173A (fr)
CN (1) CN114641854A (fr)
DE (1) DE102019217033B4 (fr)
WO (1) WO2021089735A1 (fr)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN217349507U (zh) * 2022-02-21 2022-09-02 上海世禹精密机械有限公司 半导体元件转运设备
CN114904796B (zh) * 2022-07-14 2022-12-27 前海晶方云(深圳)测试设备有限公司 一种测试设备
DE102022129638B3 (de) 2022-11-09 2024-05-02 Asys Automatisierungssysteme Gmbh Entladeeinrichtung für ein Substratmagazin, Substratmagazinsystem

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Publication number Priority date Publication date Assignee Title
CA1234924A (fr) 1984-01-21 1988-04-05 Hideo Sakamoto Systeme de chargement-dechargement de cartes de circuits imprimes avec voie de contournement
JPH0672508A (ja) 1992-08-28 1994-03-15 Kiyoshi Takahashi ウエハ入替え装置
EP0735573B1 (fr) 1995-03-28 2004-09-08 BROOKS Automation GmbH Station de chargement et de déchargement pour installations de traitement de semi-conducteurs
KR100555620B1 (ko) 2003-10-28 2006-03-03 주식회사 디엠에스 기판 운반시스템 및 운반방법
US20070018469A1 (en) * 2005-07-25 2007-01-25 Multimetrixs, Llc Contamination-free edge gripping mechanism with withdrawable pads and method for loading/unloading and transferring flat objects
DE102006014136C5 (de) * 2006-03-28 2017-01-12 Rena Gmbh Maschine zum Entstapeln von scheibenförmigen Substraten
TWI354345B (en) * 2006-07-24 2011-12-11 Semes Co Ltd Apparatus and method for transferring substrate
JP4854427B2 (ja) * 2006-08-11 2012-01-18 東京エレクトロン株式会社 基板移載装置，基板処理装置，基板移載用アーム
DE102007061410A1 (de) * 2007-12-11 2009-06-18 Gebr. Schmid Gmbh & Co. Verfahren und Vorrichtung zum Vereinzeln von Wafern von einem Waferstapel
EP2318322A1 (fr) * 2009-09-15 2011-05-11 RENA GmbH Dispositif et procede pour recevoir sans contact et maintenir et egalement pour transporter des objets plats
DE102016214184A1 (de) * 2016-08-01 2018-02-01 Asys Automatisierungssysteme Gmbh Transportsystem und Bearbeitungssystem für Substrate

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CN114641854A (zh) 2022-06-17
DE102019217033B4 (de) 2022-06-30
KR20220098173A (ko) 2022-07-11
WO2021089735A1 (fr) 2021-05-14
DE102019217033A1 (de) 2021-05-06

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