EP4047945B1 - Elektronisches gerät mit einer wasserdichten akustischen leitung - Google Patents

Elektronisches gerät mit einer wasserdichten akustischen leitung Download PDF

Info

Publication number
EP4047945B1
EP4047945B1 EP22155290.4A EP22155290A EP4047945B1 EP 4047945 B1 EP4047945 B1 EP 4047945B1 EP 22155290 A EP22155290 A EP 22155290A EP 4047945 B1 EP4047945 B1 EP 4047945B1
Authority
EP
European Patent Office
Prior art keywords
electronic equipment
hole
cover
rib
thermal pad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
EP22155290.4A
Other languages
English (en)
French (fr)
Other versions
EP4047945A1 (de
Inventor
Arnaud Ferreira
Charles-Efflam MARTIN DE MONTAUDRY
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sagemcom Broadband SAS
Original Assignee
Sagemcom Broadband SAS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sagemcom Broadband SAS filed Critical Sagemcom Broadband SAS
Publication of EP4047945A1 publication Critical patent/EP4047945A1/de
Application granted granted Critical
Publication of EP4047945B1 publication Critical patent/EP4047945B1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/08—Mouthpieces; Microphones; Attachments therefor
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04L—TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
    • H04L12/00—Data switching networks
    • H04L12/66—Arrangements for connecting between networks having differing types of switching systems, e.g. gateways
    • G—PHYSICS
    • G10—MUSICAL INSTRUMENTS; ACOUSTICS
    • G10K—SOUND-PRODUCING DEVICES; METHODS OR DEVICES FOR PROTECTING AGAINST, OR FOR DAMPING, NOISE OR OTHER ACOUSTIC WAVES IN GENERAL; ACOUSTICS NOT OTHERWISE PROVIDED FOR
    • G10K11/00—Methods or devices for transmitting, conducting or directing sound in general; Methods or devices for protecting against, or for damping, noise or other acoustic waves in general
    • G10K11/16—Methods or devices for protecting against, or for damping, noise or other acoustic waves in general
    • G10K11/175—Methods or devices for protecting against, or for damping, noise or other acoustic waves in general using interference effects; Masking sound
    • G10K11/1752—Masking
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04Q—SELECTING
    • H04Q1/00—Details of selecting apparatus or arrangements
    • H04Q1/02—Constructional details
    • H04Q1/035—Cooling of active equipments, e.g. air ducts
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
    • H04R1/22—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired frequency characteristic only 
    • H04R1/28—Transducer mountings or enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means
    • H04R1/2807—Enclosures comprising vibrating or resonating arrangements
    • H04R1/2853—Enclosures comprising vibrating or resonating arrangements using an acoustic labyrinth or a transmission line
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
    • H04R1/22—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired frequency characteristic only 
    • H04R1/28—Transducer mountings or enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means
    • H04R1/2869—Reduction of undesired resonances, i.e. standing waves within enclosure, or of undesired vibrations, i.e. of the enclosure itself
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
    • H04R1/32—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired directional characteristic only
    • H04R1/34—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired directional characteristic only by using a single transducer with sound reflecting, diffracting, directing or guiding means
    • H04R1/342—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired directional characteristic only by using a single transducer with sound reflecting, diffracting, directing or guiding means for microphones
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R3/00—Circuits for transducers, loudspeakers or microphones
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/203—Cooling means for portable computers, e.g. for laptops
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2201/00—Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
    • H04R2201/003—Mems transducers or their use
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2201/00—Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
    • H04R2201/02—Details casings, cabinets or mounting therein for transducers covered by H04R1/02 but not provided for in any of its subgroups
    • H04R2201/029—Manufacturing aspects of enclosures transducers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2499/00—Aspects covered by H04R or H04S not otherwise provided for in their subgroups
    • H04R2499/10—General applications
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2499/00—Aspects covered by H04R or H04S not otherwise provided for in their subgroups
    • H04R2499/10—General applications
    • H04R2499/11—Transducers incorporated or for use in hand-held devices, e.g. mobile phones, PDA's, camera's
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2499/00—Aspects covered by H04R or H04S not otherwise provided for in their subgroups
    • H04R2499/10—General applications
    • H04R2499/15—Transducers incorporated in visual displaying devices, e.g. televisions, computer displays, laptops
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0212—Printed circuits or mounted components having integral heating means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body

Definitions

  • the invention relates to the field of electronic equipment which comprises one or more microphones.
  • some include an integrated personal voice assistant (Google, Alexa, Siri, etc.).
  • voice recognition works thanks to one or more microphones suitably placed relative to each other in order to obtain the best audio feedback.
  • Each microphone must be acoustically isolated from the others. This means that the acoustic conduit between the ambient medium and the membrane of the microphone component must be perfectly sealed.
  • This tightness is essential for the processing of the audio signal used to obtain high-performance voice recognition. It is in fact necessary to prevent a microphone picking up part of the sound signal which enters the electronic equipment through the acoustic duct of another microphone. It is also important to prevent the pick-up of a microphone from being disturbed by internal noise from the electronic equipment.
  • Prior art electronic equipment 1 comprises a casing inside which is arranged an internal frame 2 made of plastic.
  • a cover 3 made of plastic (for example made of ABS) makes it possible to close the case.
  • Electronic equipment 1 comprises two electronic cards: a mother card 4 and a daughter card 5.
  • the motherboard 4 comprises a printed circuit on which is mounted a processor 7.
  • the daughter card 5 comprises a printed circuit on which is mounted a microphone 8.
  • the electronic equipment 1 also includes a copper heat sink 9 and a thermal interface 10.
  • the heat sink 9 is fixed to the cover 3 by a layer of thermal adhesive 11.
  • the daughter card 5 is fixed to the heat sink 9 by a layer of thermal adhesive 12.
  • the thermal interface 10 is in contact with the processor 7 of the motherboard 4 and with the heat sink 9. The heat transfer from the processor 7 to the outside is thus ensured via the thermal interface 10, the heat sink 9, the thermal adhesive layer 11 and cover 3.
  • the cover 3, the heat sink 9 and the daughter board 5 each include a hole.
  • the holes are arranged coaxially to form an acoustic duct 14.
  • the microphone 8 is mounted on an internal face of the printed circuit of the daughter card 5 (by “internal” is meant here on the side of the interior of the electronic equipment when this one is assembled, and by “external”, we mean on the side of the exterior of the electronic equipment).
  • the microphone 8 is here an omnidirectional microphone of the MEMS (for “micro electromechanical system”) type, which has the particular advantage of having a smaller footprint than a microphone of the ECM (electret condenser microphone) type.
  • the microphone 8 is of the bottom port type, i.e. it has a hole, forming an entrance for the sound signals, which is placed under the housing of the microphone 8.
  • the two layers of thermal adhesive 11, 12 make it possible to ensure the sealing of the acoustic duct 14 at the interface between the cover 3 and the heat sink 9, and at the interface between the heat sink 9 and the daughter card 5 .
  • the electronic equipment 1 in this solution, comprises a first sub-assembly 15 and a second sub-assembly 16.
  • the first sub-assembly 15 comprises the cover 3, the motherboard 4, the heat sink 9 which is linked to the cover 3 via thermal adhesive layer 11, and daughter board 5 which is bonded to heat sink 9 via thermal adhesive layer 12.
  • the second sub-assembly 16 comprises only the frame 2.
  • the cover 3 constitutes the interface of the electronic equipment 1 with the exterior and, as a result, may be subjected to shocks, scratches, various projections, etc.
  • the cover represents an important part of the aesthetic character of the electronic equipment 1, and it is relatively common for such electronic equipment to be sent to the after-sales service (for “After-Sales Service”) of the manufacturer to replace the cover.
  • the cover 3 is connected both to the heat sink 9, to the motherboard 4 and to the daughter card 5, the replacement of the cover 3 involves also replacing all these elements. The operation of replacing cover 3 is therefore costly.
  • the various components mentioned cannot be dismantled due to the layers of thermal adhesive 11, 12 between the plastic and metallic materials, these various components cannot be recycled. This again poses a cost problem, but also an ecological problem.
  • the object of the invention in electronic equipment which comprises a microphone, is to ensure the acoustic sealing of the acoustic duct which connects the microphone to the outside and to allow effective heat transfer, in a small, low-volume manner. expensive and environmentally friendly.
  • a electronic equipment comprising a first sub-assembly and a second separable sub-assembly, the first sub-assembly comprising a cover comprising a first hole, the second sub-assembly comprising a printed circuit on which is mounted at least one microphone and comprising a second hole, and a heat sink comprising a third hole, the electronic equipment further comprising a thermal pad comprising a fourth hole, and a compression element, the electronic equipment being arranged such that, when the electronic equipment is assembled, the heat sink is positioned between the cover and the circuit board, the thermal pad is positioned between the cover and the heat sink, the first hole, the second hole, the third hole and the fourth hole define an acoustic conduit arranged to allow the microphone to pick up sound signals coming from outside the electronic equipment, and the compression element compresses the thermal pad around the acoustic duct to ensure an acoustic seal of the acoustic duct at an interface between the cover and the
  • the electronic equipment according to the invention therefore comprises a thermal pad positioned between the cover and the heat sink.
  • the thermal pad ensures efficient thermal transfer between the heat sink and the exterior of the electronic equipment (via the cover). Compression by the compression element of the thermal pad around the acoustic duct makes it possible to seal the acoustic duct.
  • the assembly of the electronic equipment according to the invention does not require screwing to the cover the printed circuit on which the microphone is mounted, so that the electronic equipment is not bulky.
  • the compression element is a rib formed on the cover or on the heat sink.
  • the rib has an annular shape, and in which a width l of the rib equal to a difference between an outer radius and an inner radius of the rib, and a height h of the rib, are such that: I ⁇ 3 xh .
  • a height h of the rib and a thickness e of the thermal pad are such that: h ⁇ 0.5 xed .
  • D is an average diameter of the first hole
  • C is an average diameter of the third hole
  • B is an average diameter of the fourth hole
  • A is an inside diameter of the rib.
  • thermal pad comprises graphite
  • the electronic equipment being a residential gateway or a decoder box.
  • the electronic equipment according to the invention 20 is here a residential gateway which incorporates a voice assistant.
  • the electronic equipment 20 comprises two separable sub-assemblies: a first sub-assembly 21 and a second sub-assembly 22.
  • the first sub-assembly 21 comprises a cover 23 made of plastic.
  • Cover 23 includes a first hole 24.
  • the second subassembly 22 comprises a chassis 25, a motherboard 26, a thermal interface 27, a daughter card 28 and a heat sink 29.
  • Frame 25 is made of plastic.
  • the motherboard 26 comprises a printed circuit 30 on which is mounted a processor 31.
  • the daughter card 28 comprises a printed circuit 32 on which is mounted a microphone 33.
  • the daughter card 28 is here a flexible sheet, that is to say that the printed circuit 32 is a flexible printed circuit. This technology makes it possible to reduce the thickness of the printed circuit 32.
  • the microphone 33 which is mounted on the internal face of the printed circuit 32, is an omnidirectional microphone of the MEMS type, with a bottom port.
  • Printed circuit 32 includes a second hole 34.
  • the heat sink 29 is a copper plate.
  • the heat sink 29 includes a third hole 35.
  • the electronic equipment 20 further comprises a pre-cut thermal pad 37.
  • thermal pad is meant a thermally conductive interface, which is for example in the form of a sheet or a film. Sometimes referred to as a thermal interface pad to refer to a thermal pad.
  • the thermal pad 37 is compressible.
  • the thermal pad 37 comprises for example graphite.
  • the thermal pad 37 has a fourth hole 38.
  • the heat sink 29 is positioned between the cover 23 and the printed circuit 32 of the daughter board 28, and the thermal pad 37 is positioned between the cover 23 and the heat sink 29.
  • the first hole 24, the second hole 34, the third hole 35 and the fourth hole 38 define an acoustic conduit 40 arranged to allow the microphone 33 to pick up sound signals coming from outside the electronic equipment 20.
  • the first hole 24, the second hole 34, the third hole 35 and the fourth hole 38 are arranged coaxially, in the following order from the outside: first hole 24, fourth hole 38, third hole 35, second hole 34.
  • the motherboard 26 is fixed to the chassis 25.
  • the external face of the daughter card 28 is glued to the internal face of the heat sink 29 by a layer of thermal adhesive 41.
  • the heat sink 29 and the thermal interface 27 are arranged so that the thermal interface 27 is positioned between the printed circuit 30 of the motherboard 26 and the heat sink 29.
  • the thermal interface 27 is in contact with the processor 31 and with the heat sink 29.
  • the thermal pad 37 is placed on the heat sink 29.
  • the cover 23 is positioned on the heat sink 29.
  • cover 23 and the heat sink 29 There is no adhesive layer between the cover 23 and the heat sink 29.
  • the cover 23 and the heat sink 29 are separated and are separable (by “separable”, we mean that the cover 23 and the heat sink 29 can be separated easily, quickly, without risk of degrading one or other of these elements). Consequently, the first sub-assembly 21 and the second sub-assembly 22 are separated and separable.
  • the thermal pad 37 is compressed between the cover 23 and the heat sink 29.
  • the thermal pad 37 matches the shape of the heat sink 29.
  • the outline of the thermal pad 37 allows for an offset of 0.5mm inward relative to the outline of the heat sink 29, in order to anticipate manufacturing tolerances and thus prevent the thermal pad 37 from overflowing the heatsink 29.
  • the thermal pad 37 has a thickness greater than a maximum clearance between the cover 23 and the heat sink 29 when the electronic equipment 20 is assembled.
  • the thickness of the thermal pad 37 is for example equal to twice the thickness of the maximum air clearance in the worst case of the manufacturing tolerances.
  • the chain of dimensions of the electronic equipment 20 can form an air gap of approximately 0.2 to 0.3 mm in the worst case.
  • the thermal pad 37 therefore here has a thickness equal to 0.5 mm.
  • the thermal pad 37 has viscosity properties which allow the attachment of the thermal pad 37 both to the heat sink 29 and to the cover 23, while allowing the removal of the cover 23.
  • the transfer of heat between the processor 31 and the exterior of the electronic equipment 20 takes place by conduction via the thermal interface 27, the heat sink 29, the thermal pad 37 and the cover 23. It is noted that the cover 23 , although made of plastic, allows the heat to be evacuated to the outside.
  • the thermal pad 37 is compressed between the cover 23 and the heat sink 29.
  • the surface of the heat sink 29 is large, and the only compression of the thermal pad 37 between the internal face of the cover 23 and the outer face of the heat sink 29 is not sufficient to provide acoustic sealing.
  • the electronic equipment 20 therefore comprises a compression element which, when the electronic equipment 20 is assembled, compresses the thermal pad 37 around the acoustic conduit 40.
  • the compression element makes it possible to ensure acoustic sealing of the acoustic conduit 40 to the level of the fourth hole 38, that is to say both at the level of the outer end of the fourth hole 38 (and therefore at the level of the interface between the cover 23 and the thermal pad 37), and at the level from the internal end of the fourth hole 38 (and therefore at the level of the interface between the thermal pad 37 and the heat sink 29).
  • the compression element here is a rib 42 (one could also speak of a gadroon) which is formed on the internal face of the cover 23.
  • the rib 42 and the cover 23 therefore form one and the same piece here.
  • the rib 42 is therefore formed at the time of the manufacture of the cover 23.
  • the mold used for the manufacture of the cover 23 comprises a complementary groove making it possible to obtain the rib 42.
  • the rib 42 which has an annular shape with axis X0, extends around the first hole 24 made in the cover 23.
  • the rib 42 and the first hole 24 are arranged coaxially, that is to say that the axis X0 and axis X1 coincide, axis X1 being the axis of the first hole 24 but also of the acoustic duct 40 when the electronic equipment 20 is assembled.
  • the thermal pad 37 is positioned on the heat sink 29, then the cover 23 is placed on the thermal pad 37.
  • the cover 23 compresses the thermal pad 37.
  • the compression is greater at the level of the rib 42, which makes it possible to guarantee the acoustic seal of the acoustic conduit 40 at the level of the thermal pad 37.
  • the dimensions of the rib 42 are chosen so as to meet several constraints.
  • an excessively protruding rib 42 can lead to a puncturing phenomenon of the thermal pad 37 due to its ultra-compressible material.
  • a partially or entirely punched portion 43 may then appear in the thermal pad 37 causing the loss of the acoustic seal.
  • the rib 42 is designed so that a width l of the rib, equal to a difference between an outer radius and an inner radius of the rib 42, and a height h of the rib 42, are such that: I ⁇ 3 xh .
  • the height h is such that: h ⁇ 0.5 xed , where e is the thickness of the thermal pad 37.
  • the acoustic conduit 40 is therefore in the form of a tube closed at one end by the membrane of the microphone 33 and open to the outside of the electronic equipment 20 at the other end.
  • the acoustic duct 40 constitutes a medium conducive to the formation of standing waves.
  • L being the length of the acoustic duct, d its diameter and v the speed of sound in the ambient environment.
  • This frequency can be a source of significant disturbances in the sound signals received by the microphone 33 and must be outside the useful frequency range, ie, in the case of voice recognition, beyond 8 kHz.
  • the diameter of the acoustic duct 40 and its length must be chosen accordingly.
  • an inlet diameter of the acoustic duct 40 equal to 1 mm will be chosen, and a length L of the acoustic duct 40 which does not exceed 10 mm.
  • the entrance diameter of the acoustic conduit 40 is the diameter of the outer end of the first hole 24.
  • the various constituent parts of the acoustic duct 40 are drilled so that D ⁇ C ⁇ B ⁇ A , where D is an average diameter of the first hole 24 made in the cover 23 (that is to say the average diameter of the inlet orifice of the acoustic duct 40), C is the average diameter of the third hole 35 (c′ that is to say the hole in the heat sink 29), B is the average diameter of the fourth hole 38 made in the thermal pad 37, and A is the inside diameter of the annular rib 42.
  • D is an average diameter of the first hole 24 made in the cover 23 (that is to say the average diameter of the inlet orifice of the acoustic duct 40)
  • C is the average diameter of the third hole 35 (c′ that is to say the hole in the heat sink 29)
  • B is the average diameter of the fourth hole 38 made in the thermal pad 37
  • A is the inside diameter of the annular rib 42.
  • the first hole 24 comprises a conical inlet portion 45 (which opens onto the outer face of the cover 23), a central conical portion 46 and a flared portion 47 (which opens onto the inner face of the cover 23).
  • a conical inlet portion 45 which opens onto the outer face of the cover 23
  • a central conical portion 46 which opens onto the central conical portion 46
  • a flared portion 47 which opens onto the inner face of the cover 23.
  • There shape of the first hole 24 is due to the manufacturing process of the cover 23 (by plastic injection).
  • the sub-assemblies of the electronic equipment 20 can therefore be dismantled to guarantee optimum recycling of the various elements, in particular the plastic elements (including the cover 23).
  • the electronic equipment according to the invention makes it possible to respond, in a reliable, economical and ecological manner, to the problems of after-sales service and recycling, while ensuring excellent thermal and acoustic performance (and in particular at the level of the interfaces of the mechanical parts impacted by the solution).
  • the compression element is a rib formed on an internal face of the cover. This solution is in no way limiting.
  • the compression element could for example be a rib formed on the external face of the heat sink. The rib then extends around the third hole in the heat sink.
  • the compression element could also be a separate part from the cover and from the heat sink, for example a ring positioned between the thermal pad and the cover when assembling the electronic equipment.
  • a single microphone has been mentioned here, but the electronic equipment can of course comprise a plurality of microphones and therefore a plurality of acoustic ducts arranged like the one described here.
  • the electronic equipment is of course not necessarily a residential gateway, but can be any electronic equipment including a microphone: connected speaker, voice assistant, set-top box, tablet, smartphone, etc.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Signal Processing (AREA)
  • Acoustics & Sound (AREA)
  • Health & Medical Sciences (AREA)
  • Otolaryngology (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Multimedia (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Claims (10)

  1. Elektronisches Gerät (20), umfassend eine erste Untereinheit (21) und eine zweite Untereinheit (22), die trennbar sind, wobei die erste Untereinheit eine Abdeckung (23) umfasst, die ein erstes Loch (24) enthält, wobei die zweite Untereinheit eine Leiterplatte (32) umfasst, auf der mindestens ein Mikrofon (33) montiert ist und die ein zweites Loch (34) enthält, und einen Kühlkörper (29), der ein drittes Loch (35) enthält, wobei das elektronische Gerät (20) ferner ein Wärmeleitpad (37) umfasst, das ein viertes Loch (38) enthält, und ein Kompressionselement (42), wobei das elektronische Gerät derart ausgebildet ist, dass, wenn das elektronische Gerät zusammengesetzt ist, der Kühlkörper zwischen der Abdeckung und der Leiterplatte positioniert ist, das Wärmeleitpad zwischen der Abdeckung und dem Kühlkörper positioniert ist, das erste Loch, das zweite Loch, das dritte Loch und das vierte Loch einen Akustikkanal (40) definieren, der so ausgebildet ist, dass er dem Mikrofon das Aufnehmen von Tonsignalen ermöglicht, die von außerhalb des elektronischen Geräts stammen, und das Kompressionselement das Wärmeleitpad um den Akustikkanal herum komprimiert, um eine akustische Dichtheit des Akustikkanals im Bereich einer Schnittstelle zwischen der Abdeckung und dem Wärmeleitpad und im Bereich einer Schnittstelle zwischen dem Wärmeleitpad und dem Kühlkörper sicherzustellen.
  2. Elektronisches Gerät nach Anspruch 1, bei dem das Kompressionselement (42) eine Rippe ist, die auf der Abdeckung (23) oder auf dem Kühlkörper (29) ausgebildet ist.
  3. Elektronisches Gerät nach Anspruch 2, bei dem die Rippe (42) auf einer Innenfläche der Abdeckung (23) ausgebildet ist und sich um das erste Loch (24) herum erstreckt.
  4. Elektronisches Gerät nach Anspruch 2, bei dem die Rippe auf einer Außenfläche des Kühlkörpers (29) ausgebildet ist und sich um das dritte Loch (35) herum erstreckt.
  5. Elektronisches Gerät nach Anspruch 2, bei dem die Rippe (42) eine ringförmige Form aufweist und bei dem eine Breite l der Rippe gleich der Differenz zwischen einem Außenradius und einem Innenradius der Rippe und eine Höhe h der Rippe derart sind, dass: I ≥ 3 xh .
    Figure imgb0011
  6. Elektronisches Gerät nach Anspruch 2, bei dem eine Höhe h der Rippe und eine Dicke e des Wärmeleitpads (37) derart sind, dass: h ≥ 0,5 xe .
    Figure imgb0012
  7. Elektronisches Gerät nach Anspruch 2, bei dem man hat: D < C < B < A ,
    Figure imgb0013
     wobei D ein mittlerer Durchmesser des ersten Lochs (24), C ein mittlerer Durchmesser des dritten Lochs (35), B ein mittlerer Durchmesser des vierten Lochs (38) und A ein Innendurchmesser der Rippe (42) ist.
  8. Elektronisches Gerät nach einem der vorhergehenden Ansprüche, bei dem das Wärmeleitpad (37) Graphit umfasst.
  9. Elektronisches Gerät nach einem der vorhergehenden Ansprüche, bei dem die Leiterplatte (32) an dem Kühlkörper (29) über eine Thermoklebstoffschicht (41) befestigt ist.
  10. Elektronisches Gerät nach einem der vorhergehenden Ansprüche, wobei das elektronische Gerät (20) ein Residential Gateway oder eine Set-Top-Box ist.
EP22155290.4A 2021-02-22 2022-02-04 Elektronisches gerät mit einer wasserdichten akustischen leitung Active EP4047945B1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR2101685A FR3120152A1 (fr) 2021-02-22 2021-02-22 Equipement électronique comportant un conduit acoustique étanche

Publications (2)

Publication Number Publication Date
EP4047945A1 EP4047945A1 (de) 2022-08-24
EP4047945B1 true EP4047945B1 (de) 2023-06-28

Family

ID=75539543

Family Applications (1)

Application Number Title Priority Date Filing Date
EP22155290.4A Active EP4047945B1 (de) 2021-02-22 2022-02-04 Elektronisches gerät mit einer wasserdichten akustischen leitung

Country Status (4)

Country Link
US (1) US11997453B2 (de)
EP (1) EP4047945B1 (de)
CN (1) CN115037576A (de)
FR (1) FR3120152A1 (de)

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7280855B2 (en) * 2005-06-28 2007-10-09 Research In Motion Limited Microphone coupler for a communication device
US8515113B2 (en) * 2010-08-19 2013-08-20 Apple Inc. Composite microphone boot to optimize sealing and mechanical properties
US9014394B2 (en) * 2012-09-07 2015-04-21 Apple Inc. Systems and methods for retaining a microphone
US10506719B2 (en) * 2013-01-15 2019-12-10 Blackberry Limited Thermal dissipater apparatus for use with electronic devices
JP6649854B2 (ja) * 2016-07-21 2020-02-19 レノボ・シンガポール・プライベート・リミテッド 電子機器
FR3055767B1 (fr) * 2016-09-08 2018-09-21 Sagemcom Broadband Sas Capot monobloc pour dispositif electronique
US11706563B2 (en) * 2016-09-16 2023-07-18 Gopro, Inc. Submersible speaker system with a compressible spacer
US10476136B2 (en) * 2017-07-20 2019-11-12 Apple Inc. Electronic device with speaker port aligned antennas
US10736236B2 (en) * 2018-01-16 2020-08-04 Ge Aviation Systems, Llc Power electronic conversion system
CN108494919A (zh) * 2018-02-28 2018-09-04 广东欧珀移动通信有限公司 电子设备
KR102497468B1 (ko) * 2018-08-07 2023-02-08 삼성전자주식회사 복수의 마이크로폰들을 포함하는 전자 장치
CN209283486U (zh) * 2019-01-10 2019-08-20 北京搜狗科技发展有限公司 一种语音采集设备

Also Published As

Publication number Publication date
US11997453B2 (en) 2024-05-28
EP4047945A1 (de) 2022-08-24
CN115037576A (zh) 2022-09-09
FR3120152A1 (fr) 2022-08-26
US20220272441A1 (en) 2022-08-25

Similar Documents

Publication Publication Date Title
EP0072288B1 (de) Elektroakustischer Wandler mit piezo-elektrischem Polymer
EP3917159B1 (de) Schalltrichter für allgemeine lautsprecherbox
BE1029479B1 (fr) Sous–système de protection contre les infiltrions pour les microphones dans les appareils informatiques mobile
FR2952221A1 (fr) Transducteur d&#39;ultrasons applicable a un milieu fluide
FR2837921A1 (fr) Capteur de pression et procede de fabrication de ce dernier
FR2987616A1 (fr) Dispositif transducteur micromecanique de son et son procede de realisation
EP4047945B1 (de) Elektronisches gerät mit einer wasserdichten akustischen leitung
EP3523986A1 (de) Drucksensor, insbesondere ein mikrofon mit verbessertem layout
EP0180518A1 (de) Elektroakustischer Wandler mit piezoelektrischer Membran
FR2850792A1 (fr) Filtre compact en guide d&#39;onde
EP0664633A1 (de) Einrichtung zur Erzeugung und Übertragung von akustischen Signalen über Telefonleitungen
EP3917153B1 (de) Allgemeine lautsprecherbox
EP3725136A1 (de) Träger zum formen eines flexiblen abschnitts einer flexiblen leiterplatte
CN109327772B (zh) 一种发声装置模组和电子设备
FR2943880A1 (fr) Panneau acoustique destine a recevoir, emettre ou absorber des sons.
WO2005020623A2 (fr) Transducteur de restitution de son
TWI416696B (zh) 覆蓋構件及其製法暨具覆蓋構件之封裝結構及其製法
FR3104890A1 (fr) Module d’isolation électrique pour équipement électrique haute tension
EP4336860A1 (de) Wärmesenke-entlüftung
FR3098673A1 (fr) Microphone électret omnidirectionnel avec étage adaptateur d’impédance à amplificateur opérationnel en particulier pour des applications de détection sur piles
CA3154857C (fr) Dispositif d&#39;echappement anti propagation de batteries lithium-ion d&#39;aeronef
FR2820935A1 (fr) Dispositif d&#39;emission acoustique etanche
JP2009100148A (ja) コンデンサマイクロホンユニットおよびその製造方法
WO2018096274A1 (fr) Diode ondulatoire basee sur la deformation du milieu de propagation
EP4264728A1 (de) Anordnung für eine flüssigkeitsdichte elektrische verbindung

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: REQUEST FOR EXAMINATION WAS MADE

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: EXAMINATION IS IN PROGRESS

17P Request for examination filed

Effective date: 20220204

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

17Q First examination report despatched

Effective date: 20220729

RBV Designated contracting states (corrected)

Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

GRAP Despatch of communication of intention to grant a patent

Free format text: ORIGINAL CODE: EPIDOSNIGR1

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: GRANT OF PATENT IS INTENDED

INTG Intention to grant announced

Effective date: 20230120

GRAS Grant fee paid

Free format text: ORIGINAL CODE: EPIDOSNIGR3

GRAA (expected) grant

Free format text: ORIGINAL CODE: 0009210

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE PATENT HAS BEEN GRANTED

AK Designated contracting states

Kind code of ref document: B1

Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

REG Reference to a national code

Ref country code: CH

Ref legal event code: EP

REG Reference to a national code

Ref country code: AT

Ref legal event code: REF

Ref document number: 1583799

Country of ref document: AT

Kind code of ref document: T

Effective date: 20230715

REG Reference to a national code

Ref country code: IE

Ref legal event code: FG4D

Free format text: LANGUAGE OF EP DOCUMENT: FRENCH

REG Reference to a national code

Ref country code: DE

Ref legal event code: R096

Ref document number: 602022000147

Country of ref document: DE

REG Reference to a national code

Ref country code: LT

Ref legal event code: MG9D

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: SE

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20230628

Ref country code: NO

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20230928

REG Reference to a national code

Ref country code: NL

Ref legal event code: MP

Effective date: 20230628

REG Reference to a national code

Ref country code: AT

Ref legal event code: MK05

Ref document number: 1583799

Country of ref document: AT

Kind code of ref document: T

Effective date: 20230628

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: RS

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20230628

Ref country code: NL

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20230628

Ref country code: LV

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20230628

Ref country code: LT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20230628

Ref country code: HR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20230628

Ref country code: GR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20230929

RAP4 Party data changed (patent owner data changed or rights of a patent transferred)

Owner name: SAGEMCOM BROADBAND SAS

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: FI

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20230628

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: SK

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20230628

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: ES

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20230628

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: IS

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20231028

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: SM

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20230628

Ref country code: SK

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20230628

Ref country code: RO

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20230628

Ref country code: PT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20231030

Ref country code: IS

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20231028

Ref country code: ES

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20230628

Ref country code: EE

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20230628

Ref country code: CZ

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20230628

Ref country code: AT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20230628

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: PL

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20230628

REG Reference to a national code

Ref country code: DE

Ref legal event code: R097

Ref document number: 602022000147

Country of ref document: DE

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: DK

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20230628

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: DE

Payment date: 20240123

Year of fee payment: 3

PLBE No opposition filed within time limit

Free format text: ORIGINAL CODE: 0009261

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: IT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20230628

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: FR

Payment date: 20240123

Year of fee payment: 3

26N No opposition filed

Effective date: 20240402

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: SI

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20230628

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: MC

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20230628

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: LU

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20240204